JP3782523B2 - 基板吸着部材および装置 - Google Patents

基板吸着部材および装置 Download PDF

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Publication number
JP3782523B2
JP3782523B2 JP24214196A JP24214196A JP3782523B2 JP 3782523 B2 JP3782523 B2 JP 3782523B2 JP 24214196 A JP24214196 A JP 24214196A JP 24214196 A JP24214196 A JP 24214196A JP 3782523 B2 JP3782523 B2 JP 3782523B2
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JP
Japan
Prior art keywords
suction
substrate
pad
glass substrate
suction pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24214196A
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English (en)
Japanese (ja)
Other versions
JPH1086086A5 (enrdf_load_stackoverflow
JPH1086086A (ja
Inventor
一也 伊藤
幸彦 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP24214196A priority Critical patent/JP3782523B2/ja
Publication of JPH1086086A publication Critical patent/JPH1086086A/ja
Publication of JPH1086086A5 publication Critical patent/JPH1086086A5/ja
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Publication of JP3782523B2 publication Critical patent/JP3782523B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP24214196A 1996-09-12 1996-09-12 基板吸着部材および装置 Expired - Fee Related JP3782523B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24214196A JP3782523B2 (ja) 1996-09-12 1996-09-12 基板吸着部材および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24214196A JP3782523B2 (ja) 1996-09-12 1996-09-12 基板吸着部材および装置

Publications (3)

Publication Number Publication Date
JPH1086086A JPH1086086A (ja) 1998-04-07
JPH1086086A5 JPH1086086A5 (enrdf_load_stackoverflow) 2004-09-30
JP3782523B2 true JP3782523B2 (ja) 2006-06-07

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Family Applications (1)

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JP24214196A Expired - Fee Related JP3782523B2 (ja) 1996-09-12 1996-09-12 基板吸着部材および装置

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JP (1) JP3782523B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3227912A4 (en) * 2014-12-06 2018-08-01 Kla-Tencor Corporation Chucking warped wafer with bellows
US11148258B2 (en) 2018-05-29 2021-10-19 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3937979B2 (ja) * 2002-08-23 2007-06-27 株式会社明電舎 吸着ハンド
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
CN100362643C (zh) * 2003-05-06 2008-01-16 奥林巴斯株式会社 基板吸附装置
CN101426957A (zh) * 2004-05-28 2009-05-06 得克萨斯州大学系统董事会 基片支承系统和方法
JP4574453B2 (ja) * 2005-06-02 2010-11-04 株式会社安川電機 基板吸着装置と基板支持体および基板搬送装置
JP4899357B2 (ja) * 2005-07-01 2012-03-21 株式会社Ｉｈｉ 基板吸着装置
JP4519743B2 (ja) * 2005-09-20 2010-08-04 株式会社安川電機 基板吸着装置、基板支持体、基板搬送装置、およびガラス基板搬送用ロボット。
JP2008078304A (ja) * 2006-09-20 2008-04-03 Olympus Corp 基板保持機構およびそれを用いた基板検査装置
JP4962903B2 (ja) * 2006-12-28 2012-06-27 株式会社ニコン 用力供給装置、移動体システム及びパターン形成装置、並びに移動体装置
JP4811882B2 (ja) * 2009-03-27 2011-11-09 東京エレクトロン株式会社 基板熱処理装置
JP5352329B2 (ja) * 2009-04-13 2013-11-27 株式会社日立ハイテクノロジーズ 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン
JP5379589B2 (ja) * 2009-07-24 2013-12-25 東京エレクトロン株式会社 真空吸着パッド、搬送アーム及び基板搬送装置
JP5494369B2 (ja) * 2010-09-07 2014-05-14 株式会社デンソー 吸着装置および搬送装置
JP2012146783A (ja) * 2011-01-11 2012-08-02 Murata Mfg Co Ltd 基板吸着装置
DE102013222377B3 (de) * 2013-11-04 2015-02-19 J. Schmalz Gmbh Sauggreifvorrichtung
JP6224437B2 (ja) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 基板搬送装置
JP6535206B2 (ja) * 2014-05-08 2019-06-26 株式会社ブイ・テクノロジー 露光方法及び露光装置
JP6316181B2 (ja) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 基板保持ステージ
JP6327374B2 (ja) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
CN108666251B (zh) * 2017-03-31 2020-11-20 上海微电子装备（集团）股份有限公司 硅片吸附装置、硅片传送装置、硅片传输系统及传送方法
GB2572016A (en) 2018-03-16 2019-09-18 Maxwell Wade Colin Vacuum plate
JP6519897B2 (ja) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
JP6882698B2 (ja) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート
KR20210007327A (ko) * 2019-07-11 2021-01-20 미래에이티 주식회사 플렉시블 회로기판 공정용 흡착 장치
WO2021070265A1 (ja) * 2019-10-08 2021-04-15 株式会社日立ハイテク 試料ステージ及び光学式検査装置
EP3851916A1 (en) * 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus
JP7641187B2 (ja) * 2021-06-23 2025-03-06 株式会社ダイヘン ワーク搬送用ハンド
TWI841309B (zh) * 2023-03-21 2024-05-01 盛詮科技股份有限公司 吸嘴及具有該吸嘴的運送裝置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3227912A4 (en) * 2014-12-06 2018-08-01 Kla-Tencor Corporation Chucking warped wafer with bellows
US11148258B2 (en) 2018-05-29 2021-10-19 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate
US11504825B2 (en) 2018-05-29 2022-11-22 Suss Microtec Lithography Gmbh Holding apparatus and method for holding a substrate

Also Published As

Publication number Publication date
JPH1086086A (ja) 1998-04-07

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