JP3741748B2

JP3741748B2 - Substrate transport cassette

Info

Publication number: JP3741748B2
Application number: JP15633095A
Authority: JP
Inventors: 省二小松; 教行平田
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 1995-06-22
Filing date: 1995-06-22
Publication date: 2006-02-01
Anticipated expiration: 2021-02-01
Also published as: JPH092566A

Description

【０００１】
【産業上の利用分野】
本発明は、基板を収納して搬送するための基板搬送用カセットに関する。
【０００２】
【従来の技術】
従来、たとえば、液晶表示器の製造工程においては、液晶表示器の基板を基板搬送用カセット内に多段に収納し、この基板搬送用カセットによって各工程の製造装置の間を移動させている。その各製造装置には、基板搬送用カセット内の基板を１枚ずつ製造装置側に取り出したり、挿入するための基板移載機を備えている。
【０００３】
従来の基板搬送用カセットは、たとえば、特開平２−２９５１５０号公報に記載されているように、カセット本体を備え、このカセット本体の内部に基板をほぼ水平に収納する収納部が形成されるとともに、この収納部の前面に基板を出し入れする開口部が形成されている。カセット本体の収納部の両側には基板の両側縁部を載置して支持する側縁支持部が配設され、収納部の後側に基板の後方への移動を規制する円柱状のストッパが配設されている。
【０００４】
側縁支持部は、基板の側縁部を載置する載置面を有するとともに、この載置面の外端から立ち上げられ基板の側縁方向への移動を規制する規制面を備えている。両側の側縁支持部の規制面の対向間隔は、基板の出し入れの際に基板の側縁部が規制面に当接しないように、基板の横幅よりも広く形成されている。
【０００５】
そして、基板搬送用カセットから基板を取り出すときには、基板移載機のハンドが基板の下側に侵入し、基板を上方へ多少持ち上げて載置面から離反させた後、そのまま基板を前方へ水平移動させて取り出す。また、基板搬送用カセット内に基板を収納するときには、基板移載機によって基板を水平移動させて収納部内に挿入させた後、基板を下降させて載置面に載置させる。
【０００６】
【発明が解決しようとする課題】
しかしながら、従来の基板搬送用カセットでは、カセット搬送時の振動などにより基板が移動して一方の側縁支持部に片寄ることがあり、その状態から基板を上方へ多少持ち上げて載置面から離反させた後に、基板を前方へ水平移動させて取り出すとき、基板移載機の横ぶれによっては基板の一側縁部が一方の側縁支持部の規制面を擦り、規制面からの発塵や基板にマイクロクラックが生じる問題がある。
【０００７】
また、基板搬送用カセットの両側の側縁支持部によって両側縁のみが支持される基板は、横幅が広い程、その中央部分が下方へ大きく湾曲するたわみが生じる。そのため、基板の出し入れの際、出し入れする基板の下側に侵入しようとする基板移載機のハンドがその基板の前縁に接触したり、基板移載機のハンドが基板の下面を擦り、発塵やマイクロクラックが生じる問題がある。
【０００８】
しかも、カセット搬送時の振動によって基板が移動したり基板自体が大きく振動して側縁支持部の載置面との間で擦れが生じ、発塵する問題がある。
【０００９】
本発明は、上記のような点に鑑みなされたもので、基板を出し入れする際の基板とカセット側との擦れを防止するとともに基板との接触面からの発塵や基板の帯電を防止し、また、基板の下方へのたわみを低減し、カセット搬送時の基板の振動を低減できる基板搬送用カセットを提供することを目的とする。
【００１０】
【課題を解決するための手段】
本発明の基板搬送用カセットは、カセット本体の収納部の両側に側縁支持部を配設し、この側縁支持部に、基板の側縁部が係合する第１の段部を設けるとともに、この第１の段部の上部外側に両側の第１の段部の対向間隔より広い間隔があけられる第２の段部を設ける。第１の段部の基板との接触面は非導電材にて形成し、その接触面以外は導電材にて形成する。
【００１１】
また、カセット本体の収納部の後側に、基板の後縁部を支持する後縁支持部を配設する。
【００１２】
【作用】
本発明の基板搬送用カセットでは、側縁支持部の第１の段部によってカセット搬送時の振動などによる基板の移動を規制し、第１の段部より間隔が広い第２の段部によって基板の出し入れ時の横ぶれに対応可能とする。基板との接触面を非導電材として、その接触面を導電材で形成した場合のカーボンなどの発塵を防止し、その接触面以外を導電材として基板に静電気が帯電するのを防止する。
【００１３】
また、後縁支持部によって、両側の側縁支持部で両側縁部が支持される基板が下方へのたわむのを低減し、カセット搬送時の基板の振動を抑える。
【００１４】
【実施例】
以下、本発明の基板搬送用カセットの一実施例の構成を図面を参照して説明する。
【００１５】
なお、本実施例では、液晶表示器の製造工程において、液晶表示器の基板を基板搬送用カセット内に多段に収納し、この基板搬送用カセットによって各工程の製造装置の間を移動させ、各製造装置では基板移載機によって基板搬送用カセット内の基板を１枚ずつ製造装置側に取り出したり、挿入するものとする。
【００１６】
図１および図２において、１は基板で、この基板１は、たとえば、液晶表示器に使用されるものであり、無アルカリケイ酸塩ガラスにて、横幅ｂ1 が５５０mm、前後幅（縦）ｂ2 が６５０mm、厚さｔが０．７mmの直方体形状に形成されている。
【００１７】
11は基板搬送用カセットで、この基板搬送用カセット11は、カセット本体12を有し、このカセット本体12は、上板13、底板14、両側の複数の側板15によって箱状に形成され、内部に基板１がほぼ水平で上下方向に沿って多段に収納される収納部16が形成されているとともに、この収納部16の前面に基板１が出し入れされる開口部17が形成されている。なお、このカセット本体12は導電材にて形成されている。
【００１８】
側板15は上板13および底板14の前部、中間部および後部に配設され、その各側板15の内面に側縁支持体18が一体に形成されている。この側縁支持体18は、側板15と一体の上下方向に長い基板19を備え、この基板19に上下方向に沿って複数段の側縁支持部20が形成されている。
【００１９】
各側縁支持部20は、基板１の両側縁部を載置するほぼ水平な載置面21およびこの載置面21の外端からほぼ垂直に立ち上げられた規制面22を設けた第１の段部23を有するとともに、この第１の段部23の規制面22の上端から外方へ向けてほぼ水平な逃げ面24およびこの逃げ面24の外端から立ち上げられた立上面25を設けた第２の段部26を有している。
【００２０】
なお、第１の段部23の載置面21および規制面22すなわち基板１との接触面は、基板１との摩擦係数が０．５以上となる材質、たとえば熱可塑性ポリエステルエラストマなどの非導電材にて形成されている。また、その第１の段部23の載置面21および規制面22以外は導電材にて形成されている。
【００２１】
そして、両側の対向する側縁支持部20において、載置面21の先端間の間隔をＬ1 、第１の段部23の規制面22の間隔をＬ2 、第２の段部26の立上面25の間隔をＬ3 とすると、基板１の横幅ｂ1 に対して、第１の段部23の規制面22の間隔Ｌ2 が９mm程度、第２の段部26の立上面25の間隔Ｌ3 が１４mm程度広く形成されている。
【００２２】
すなわち、第１の段部23の規制面22の間隔Ｌ2 は、基板１の外形精度：±０．５mm、カセット本体12の精度：±１．０mm、カセット本体12の側板15の垂直度（経時変化含む）：±１．５mm、カセットゲージング精度：±０．２mm、基板移載機の停止精度：±０．５mmにマージン：±０．８mmを加えた±４．５mmから、基板１の横幅ｂ1 より９mm程度広く形成されている。また、第２の段部26の立上面25の間隔Ｌ3 は、下段の±４．５mmに、基板移載機の動作時左右振れ：±２．０mm、マージン：±０．５mmを加えた±７．０mmから、基板１の横幅ｂ1 より１４mm程度広く形成されている。
【００２３】
しかも、それら各精度の向上により、第１の段部23の規制面22の間隔Ｌ2 は基板１の横幅ｂ1 より５mm以上とすることができ、また、第２の段部26の立上面25の間隔Ｌ3 は基板１の横幅ｂ1 より７mm以上とすることが可能である。
【００２４】
また、規制面22の高さＨは、基板移載機による出し入れ時に基板１が昇降される高さよりも低く設定される。
【００２５】
基板搬送用カセット11の上板13および底板14の後縁部間には、一対の後縁支持体28が配設されている。この後縁支持体28は、上下方向に長い基板29を備え、この基板29に上下方向に沿って各側縁支持部20に対応する複数段の後縁支持部30が形成されている。各後縁支持部30は、基板１の後縁部を載置するほぼ水平な載置面31およびこの載置面31からほぼ垂直に立ち上げられた規制面32を備えている。
【００２６】
なお、載置面31および規制面32すなわち基板１との接触面は、基板１との摩擦係数が０．５以上となる材質、たとえば熱可塑性ポリエステルエラストマなどの非導電材にて形成されている。また、その載置面31および規制面32以外は導電材にて形成されている。
【００２７】
また、後縁支持体28は、両側の側縁支持体20間に支持される基板１の自重によるたわみ量が均一となる両側の側縁支持部20間の等間隔Ｌ4 の位置に一対配設されている。すなわち、両側の側縁支持部20間の間隔Ｌ1 を５４０mmとすれば、間隔Ｌ4 は１８０mmとなる。
【００２８】
また、後縁支持部30は対応する両側の側縁支持部20とともに基板１を載置して支持するものであるが、後縁支持部30は側縁支持部20より３〜６mm下方に位置する。
【００２９】
ここで、後縁支持部30が側縁支持部20より３〜６mm下方に位置する理由について説明する。図３に示すように、後縁支持部30の載置面31の高さと側縁支持部20の載置面21の高さとの相対的な高低差を横軸に、基板１の最大たわみ量を縦軸にプロットすると、後縁支持部30と側縁支持部20が同じ高さのときに最大たわみ量の最大値を示すとともに、後縁支持部30が基板１から下方へ離れた状態で最大たわみ量の最小値を示す。これは、基板１の自重によるたわみ量が後縁支持部30により基板１の後縁部だけ強制的に規制されるために、基板１の前縁部がより下方へたわむことによって生じる。
【００３０】
この場合、後縁支持部30の近傍の最も後側の側縁支持部20に対して基板１は浮く現象を示す。図４の実線に示すように、後縁支持部30と側縁支持部20との高低差に対して浮き量をプロットすると、後縁支持部30と側縁支持部20が同じ高さのときに浮き量の最大値を示すとともに、後縁支持部30が側縁支持部20よりも３mm以上下がったときに浮き量が０になる。基板１が側縁支持部20から浮き上がっている場合、この側縁支持部20は機能しないことになり、このような状態で基板搬送用カセット11に基板１を収納して移動すれば、側縁支持部20と基板１とが浮いている箇所では基板１が移動等の振動により大きな振れを生じ、結果として基板１と側縁支持部20との擦れを生じ、基板１にマイクロクラックなどを発生させる。よって、後縁支持部30は側縁支持部20に対し、３mm以上低く設定する必要がある。
【００３１】
一方、加速度ピックアップを取り付けた基板１を基板搬送用カセット11に収納し、この基板搬送用カセット11を台車などに搭載して段差のついた床上を移動させ、後縁支持部30と側縁支持部20との高低差の値ごとに、加速度ピックアップによって基板１に作用する振動加速度を測定する振動試験を実施した。その結果を、図４の破線に示す。この結果から、後縁支持部30と側縁支持部20との高低差が３〜６mmの位置が最適であることがわかる。
【００３２】
よって、横幅が５５０mm、前後幅が６５０mm、厚さが０．７mmの基板１を対象とする場合、後縁支持部30を側縁支持部20より３〜６mm下方に位置させることにより、基板１の振動を最も低減できる。
【００３３】
そして、その後縁支持部30と側縁支持部20の高低差の値は、両側の側縁支持部20のみによって基板１の両側縁部のみを支持するときの基板１のたわみ量の１／３以下となる。
【００３４】
以上のように構成された基板搬送用カセット11により、液晶表示器の製造工程において、基板１を基板搬送用カセット11内に多段に収納し、この基板搬送用カセット11によって各工程の製造装置の間を移動させ、各製造装置では基板移載機によって基板搬送用カセット11内の基板１が１枚ずつ製造装置側に取り出されたり、挿入される。
【００３５】
基板搬送用カセット11から基板１を取り出すときには、基板移載機のハンドが基板１の下側に侵入し、基板１を上方へ多少持ち上げて側縁支持部20の載置面21および後縁支持部30の載置面31から離反させた後、そのまま基板１を前方へ水平移動させて取り出す。また、基板搬送用カセット11内に基板１を収納するときには、基板移載機によって基板１を水平移動させて収納部16内に挿入させた後、基板１を下降させて各載置面21，31に載置させる。
【００３６】
そして、側縁支持部20には、第１の段部23と第２の段部26が形成されている。この第１の段部23によって、カセット搬送時の振動などにより収納されている基板１が大きく移動してしまうのを規制できる。第２の段部26によって、基板１の出し入れ時に、基板１の側縁部が側縁支持体18に接触するのを防止できる。これは、たとえば、基板１を取り出すとき、基板移載機によって基板１を上方へ多少持ち上げて載置面21，31から離反させた状態で、基板１は第１の段部23から第２の段部26の高さ位置に上昇され、この状態から基板１が前方へ水平移動されて取り出されるため、基板移載機の横ぶれによって基板１の側縁部が側縁支持体18に擦ることがない。そのため、基板１の出し入れ時において、発塵や基板１にマイクロクラックが生じるのを防止できる。
【００３７】
また、両側の側縁支持部20によって両側縁が支持される基板１は、その横幅が広い程、その中央部分が下方へ大きく湾曲するたわみが生じるが、後縁支持部30によって基板１の中央部分が下方へのたわむのを低減できる。そのため、基板の出し入れの際には、従来のように出し入れする基板１の下側に侵入しようとする基板移載機のハンドがその基板１の前縁に接触したり、基板移載機のハンドが基板１の下面を擦り、発塵やマイクロクラックが生じるような問題を解消できる。カセット搬送時には、基板１が振動するのを低減できる。
【００３８】
また、側縁支持部20の第１の段部23によってカセット搬送時の基板１の移動を規制できるとともに、後縁支持部30によってカセット搬送時の基板１の振動を低減でき、載置面21，31と基板１との間の擦れを低減して、発塵を減少させることができる。
【００３９】
また、後縁支持体28の後縁支持部30が両側の側縁支持部20間の等間隔位置に一対配設されるため、両側の側縁支持体20間に支持される基板１の自重によるたわみ量を均一にできる。
【００４０】
また、横幅が５５０mm、前後幅が６５０mm、厚さが０．７mmの基板１を対象とする場合に、後縁支持部30は側縁支持部20より３〜６mm下方に位置することにより、基板１の振動を最も低減できる。
【００４１】
この後縁支持部30と側縁支持部20の高低差の値は、両側の側縁支持部20のみによって基板１の両側縁部のみを支持するときの基板１のたわみ量の１／３以下とすることにより、基板１の振動を低減できる。
【００４２】
また、載置面21，31および規制面22，32すなわち基板１との接触面が非導電材にて形成されるため、その接触面を導電材で形成した場合に基板１と接触面との擦れによってカーボンなどが発塵するのを防止できる。その接触面以外は導電材にて形成されるため、基板１に静電気が帯電するのを防止できる。
【００４３】
しかも、載置面21，31および規制面22，32すなわち基板１との接触面の材質を基板１との摩擦係数が０．５以上となる材質、たとえば熱可塑性ポリエステルエラストマとすることにより、カセット搬送時の振動などによる基板１の移動を防止し、発塵を低減できる。
【００４４】
【発明の効果】
本発明の基板搬送用カセットによれば、側縁支持部の第１の段部によってカセット搬送時の振動などによる基板の移動を規制でき、第１の段部より間隔が広い第２の段部によって基板の出し入れ時の横ぶれに対応でき、さらに、基板との接触面を非導電材とするとともに、その接触面以外を導電材として、接触面からの発塵や基板の帯電を防止できる。
【００４５】
また、後縁支持部によって、両側の側縁支持部で両側縁部が支持される基板の下方へのたわみを低減できるとともに、カセット搬送時の基板の振動を低減できる。
【図面の簡単な説明】
【図１】本発明の一実施例を示す基板搬送用カセットの一部を切り欠いた斜視図である。
【図２】同上実施例の基板搬送用カセットの一部を拡大した正面図である。
【図３】側板支持部と後縁支持部の高低差に対する基板最大たわみ量を示すグラフである。
【図４】側板支持部と後縁支持部の高低差に対する基板浮き量および振動加速度を示すグラフである。
【符号の説明】
１基板
11 基板搬送用カセット
12 カセット本体
16 収納部
17 開口部
20 側縁支持部
21 接触面を構成する載置面
22 接触面を構成する規制面
23 第１の段部
26 第２の段部
30 後縁支持部[0001]
[Industrial application fields]
The present invention relates to a substrate transfer cassette for storing and transferring a substrate.
[0002]
[Prior art]
Conventionally, for example, in a manufacturing process of a liquid crystal display, substrates of the liquid crystal display are stored in multiple stages in a substrate transfer cassette, and are moved between manufacturing apparatuses in each process by the substrate transfer cassette. Each of the manufacturing apparatuses includes a substrate transfer machine for taking out and inserting the substrates in the substrate transport cassette one by one to the manufacturing apparatus side.
[0003]
A conventional substrate transport cassette includes a cassette body as described in, for example, Japanese Patent Laid-Open No. 2-295150, and a storage portion for storing a substrate substantially horizontally is formed inside the cassette body. An opening through which the substrate is taken in and out is formed on the front surface of the storage unit. Side edge support parts for placing and supporting both side edges of the substrate are arranged on both sides of the storage part of the cassette body, and columnar stoppers for restricting rearward movement of the substrate are provided on the rear side of the storage part. It is arranged.
[0004]
The side edge support portion has a placement surface for placing the side edge portion of the substrate, and a restriction surface that rises from the outer end of the placement surface and restricts movement of the substrate in the side edge direction. . The spacing between the regulation surfaces of the side edge support portions on both sides is formed wider than the lateral width of the substrate so that the side edge portions of the substrate do not contact the regulation surface when the substrate is put in and out.
[0005]
When removing the substrate from the substrate transport cassette, the substrate transfer machine hand enters the lower side of the substrate, lifts the substrate slightly upward and moves away from the mounting surface, and then moves the substrate horizontally as it is. Let it out. When the substrate is stored in the substrate transfer cassette, the substrate is moved horizontally by the substrate transfer machine and inserted into the storage unit, and then the substrate is lowered and placed on the placement surface.
[0006]
[Problems to be solved by the invention]
However, in the conventional substrate transport cassette, the substrate may move due to vibration during the cassette transport and be shifted to one side edge support portion. From this state, the substrate is lifted slightly upward and separated from the mounting surface. After that, when the substrate is horizontally moved forward and taken out, depending on the lateral movement of the substrate transfer machine, one side edge portion of the substrate rubs against the restriction surface of one side edge support portion, and dust is generated from the restriction surface or the substrate. There is a problem that microcracks occur.
[0007]
In addition, the substrate whose only side edges are supported by the side edge support portions on both sides of the substrate transport cassette is warped such that the central portion thereof is greatly curved downward as the lateral width increases. Therefore, when a substrate is taken in or out, the hand of the substrate transfer machine that tries to enter the lower side of the substrate to be taken in or out comes into contact with the front edge of the substrate, or the hand of the substrate transfer device rubs the lower surface of the substrate. There is a problem that dust and microcracks occur.
[0008]
In addition, there is a problem in that the substrate moves due to vibration during cassette conveyance, or the substrate itself vibrates greatly, resulting in rubbing with the mounting surface of the side edge support portion and generating dust.
[0009]
The present invention has been made in view of the above points, and prevents friction between the substrate and the cassette side when the substrate is taken in and out, and prevents dust generation from the contact surface with the substrate and charging of the substrate, Another object of the present invention is to provide a substrate carrying cassette that can reduce the downward deflection of the substrate and reduce the vibration of the substrate during the carrying of the cassette.
[0010]
[Means for Solving the Problems]
The cassette for transporting a substrate of the present invention is provided with side edge support portions on both sides of the storage portion of the cassette body, and the side edge support portion is provided with a first step portion with which the side edge portion of the substrate is engaged. A second step portion is provided outside the upper portion of the first step portion so as to have a wider interval than the opposing interval between the first step portions on both sides. The contact surface of the first step portion with the substrate is formed of a non-conductive material, and other than the contact surface is formed of a conductive material.
[0011]
In addition, a rear edge support portion that supports the rear edge portion of the substrate is disposed on the rear side of the storage portion of the cassette body.
[0012]
[Action]
In the substrate transport cassette according to the present invention, the first step portion of the side edge support portion restricts the movement of the substrate due to vibration during the cassette transport, and the second step portion having a wider interval than the first step portion provides the substrate. It is possible to cope with the lateral shaking when putting in and out. When the contact surface with the substrate is made of a non-conductive material and the contact surface is made of a conductive material, dust generation such as carbon is prevented, and other than the contact surface is used as a conductive material to prevent static electricity from being charged on the substrate.
[0013]
Further, the trailing edge support portion reduces the downward bending of the substrate whose side edge portions are supported by the side edge support portions on both sides, and suppresses the vibration of the substrate when the cassette is transported.
[0014]
【Example】
Hereinafter, the configuration of an embodiment of the substrate carrying cassette of the present invention will be described with reference to the drawings.
[0015]
In this embodiment, in the manufacturing process of the liquid crystal display, the substrates of the liquid crystal display are accommodated in multiple stages in the substrate transfer cassette, and the substrate transfer cassette is used to move between the manufacturing apparatuses in each process. In the manufacturing apparatus, the substrates in the substrate transfer cassette are taken out and inserted one by one into the manufacturing apparatus side by the substrate transfer machine.
[0016]
1 and 2, reference numeral 1 denotes a substrate. This substrate 1 is used for, for example, a liquid crystal display, and is made of non-alkali silicate glass and has a lateral width b1 of 550 mm and a longitudinal width (vertical) b2. Is 650 mm and the thickness t is 0.7 mm.
[0017]
Reference numeral 11 denotes a substrate transfer cassette. The substrate transfer cassette 11 has a cassette body 12. The cassette body 12 is formed in a box shape by an upper plate 13, a bottom plate 14, and a plurality of side plates 15 on both sides. In addition, a storage portion 16 is formed in which the substrate 1 is substantially horizontal and is stored in multiple stages along the vertical direction, and an opening portion 17 in which the substrate 1 is taken in and out is formed on the front surface of the storage portion 16. The cassette body 12 is made of a conductive material.
[0018]
The side plates 15 are disposed at the front, middle and rear portions of the top plate 13 and the bottom plate 14, and side edge supports 18 are integrally formed on the inner surfaces of the side plates 15. The side edge support 18 includes a substrate 19 that is long in the vertical direction and integrated with the side plate 15, and a plurality of side edge support portions 20 are formed on the substrate 19 along the vertical direction.
[0019]
Each side edge support portion 20 is provided with a substantially horizontal placement surface 21 on which both side edges of the substrate 1 are placed and a regulation surface 22 raised substantially vertically from the outer end of the placement surface 21. A step surface 23 of the first step portion 23, a substantially horizontal flank 24 extending outward from the upper end of the regulating surface 22 of the first step portion 23, and a rising surface 25 raised from the outer end of the flank 24. A second step portion 26 is provided.
[0020]
The mounting surface 21 and the regulating surface 22 of the first step portion 23, that is, the contact surface with the substrate 1, are nonconductive such as a material having a friction coefficient of 0.5 or more with the substrate 1, for example, a thermoplastic polyester elastomer. It is made of material. The first step portion 23 is formed of a conductive material except for the placement surface 21 and the regulation surface 22.
[0021]
In the opposite side edge support portions 20 on both sides, the interval between the tips of the mounting surface 21 is L1, the interval between the regulating surfaces 22 of the first step portion 23 is L2, and the rising surface 25 of the second step portion 26 is. If the distance L3 is L3, the distance L2 between the regulating surfaces 22 of the first step portion 23 is about 9 mm and the distance L3 between the rising surfaces 25 of the second step portion 26 is about 14 mm wider than the width b1 of the substrate 1. Is formed.
[0022]
That is, the distance L2 between the regulating surfaces 22 of the first step portion 23 is as follows: the external accuracy of the substrate 1: ± 0.5 mm, the accuracy of the cassette body 12: ± 1.0 mm, and the verticality of the side plate 15 of the cassette body 12 (time (Including change): ± 1.5 mm, cassette gauging accuracy: ± 0.2 mm, substrate transfer machine stop accuracy: ± 0.5 mm plus margin: ± 0.8 mm, width of substrate 1 It is about 9 mm wider than b1. Further, the interval L3 of the rising surface 25 of the second step portion 26 is ± 4.5 mm obtained by adding ± 2.0 mm to the left and right runout during operation of the substrate transfer machine: ± 2.0 mm and margin: ± 0.5 mm. The width of the substrate 1 is about 14 mm wider than 7.0 mm.
[0023]
Moreover, due to the improvement of each accuracy, the distance L2 between the regulating surfaces 22 of the first step portion 23 can be set to 5 mm or more from the lateral width b1 of the substrate 1, and the rising surface 25 of the second step portion 26 can be increased. The distance L3 can be set to 7 mm or more from the lateral width b1 of the substrate 1.
[0024]
Further, the height H of the regulation surface 22 is set lower than the height at which the substrate 1 is moved up and down during loading and unloading by the substrate transfer machine.
[0025]
A pair of rear edge supports 28 are disposed between the rear edge portions of the upper plate 13 and the bottom plate 14 of the substrate transport cassette 11. The trailing edge support 28 includes a substrate 29 that is long in the vertical direction, and a plurality of stages of trailing edge support portions 30 corresponding to the side edge support portions 20 are formed on the substrate 29 in the vertical direction. Each rear edge support portion 30 includes a substantially horizontal placement surface 31 on which the rear edge portion of the substrate 1 is placed, and a regulation surface 32 that is raised substantially vertically from the placement surface 31.
[0026]
The mounting surface 31 and the regulation surface 32, that is, the contact surface with the substrate 1, are formed of a nonconductive material such as a material having a friction coefficient of 0.5 or more with the substrate 1, for example, a thermoplastic polyester elastomer. . Further, except for the placement surface 31 and the regulation surface 32, they are made of a conductive material.
[0027]
A pair of trailing edge supports 28 are arranged at equal intervals L4 between the side edge support portions 20 on both sides where the amount of deflection due to the weight of the substrate 1 supported between the side edge supports 20 on both sides becomes uniform. Has been. That is, if the distance L1 between the side edge support portions 20 on both sides is 540 mm, the distance L4 is 180 mm.
[0028]
In addition, the trailing edge support portion 30 is to place and support the substrate 1 together with the corresponding side edge support portions 20 on both sides, but the trailing edge support portion 30 is located 3 to 6 mm below the side edge support portion 20. To do.
[0029]
Here, the reason why the rear edge support portion 30 is located 3 to 6 mm below the side edge support portion 20 will be described. As shown in FIG. 3, the maximum amount of deflection of the substrate 1 with the relative height difference between the height of the placement surface 31 of the trailing edge support portion 30 and the height of the placement surface 21 of the side edge support portion 20 as the horizontal axis. When the trailing edge support portion 30 and the side edge support portion 20 have the same height, the maximum value of the maximum deflection is shown and the trailing edge support portion 30 is separated from the substrate 1 downward. Indicates the minimum value of maximum deflection. This occurs because the amount of deflection due to the weight of the substrate 1 is forcibly regulated only by the trailing edge support portion 30 at the trailing edge portion of the substrate 1, and the leading edge portion of the substrate 1 bends further downward.
[0030]
In this case, the substrate 1 exhibits a phenomenon of floating with respect to the rearmost side edge support portion 20 in the vicinity of the rear edge support portion 30. As shown by the solid line in FIG. 4, when the floating amount is plotted against the height difference between the trailing edge support portion 30 and the side edge support portion 20, the trailing edge support portion 30 and the side edge support portion 20 have the same height. Indicates the maximum value of the floating amount, and the floating amount becomes zero when the trailing edge support portion 30 is lowered by 3 mm or more from the side edge support portion 20. When the substrate 1 is lifted from the side edge support portion 20, the side edge support portion 20 does not function. If the substrate 1 is accommodated and moved in the substrate transport cassette 11 in this state, the side edge Where the support portion 20 and the substrate 1 are floating, the substrate 1 is greatly shaken due to vibration such as movement, resulting in rubbing between the substrate 1 and the side edge support portion 20 and generating microcracks or the like in the substrate 1. Let Therefore, it is necessary to set the trailing edge support part 30 lower than the side edge support part 3 by 3 mm or more.
[0031]
On the other hand, the substrate 1 to which the acceleration pickup is attached is stored in the substrate transport cassette 11, and this substrate transport cassette 11 is mounted on a carriage and moved on a stepped floor to support the trailing edge support 30 and the side edges. A vibration test for measuring the vibration acceleration acting on the substrate 1 with an acceleration pickup was performed for each value of the height difference from the unit 20. The result is shown by the broken line in FIG. From this result, it is understood that the position where the height difference between the trailing edge support portion 30 and the side edge support portion 20 is 3 to 6 mm is optimal.
[0032]
Therefore, when the substrate 1 having a lateral width of 550 mm, a front-rear width of 650 mm, and a thickness of 0.7 mm is targeted, the rear edge support portion 30 is positioned 3 to 6 mm below the side edge support portion 20 to thereby provide the substrate 1. Vibration can be reduced most.
[0033]
The value of the height difference between the trailing edge support portion 30 and the side edge support portion 20 is 1/3 of the deflection amount of the substrate 1 when only the side edge portions of the substrate 1 are supported only by the side edge support portions 20 on both sides. It becomes as follows.
[0034]
With the substrate transport cassette 11 configured as described above, the substrate 1 is stored in multiple stages in the substrate transport cassette 11 in the manufacturing process of the liquid crystal display. In each manufacturing apparatus, the substrates 1 in the substrate transport cassette 11 are taken out one by one to the manufacturing apparatus side or inserted by the substrate transfer machine in each manufacturing apparatus.
[0035]
When the substrate 1 is taken out from the substrate transport cassette 11, the hand of the substrate transfer machine enters the lower side of the substrate 1 and lifts the substrate 1 slightly upward to support the placement surface 21 and the rear edge of the side edge support portion 20. After separating from the mounting surface 31 of the part 30, the substrate 1 is moved horizontally and taken out as it is. Further, when the substrate 1 is stored in the substrate transfer cassette 11, the substrate 1 is horizontally moved by the substrate transfer machine and inserted into the storage unit 16, and then the substrate 1 is lowered to move each mounting surface 21, Place on 31.
[0036]
The side edge support portion 20 is formed with a first step portion 23 and a second step portion 26. By the first step portion 23, it is possible to restrict the substrate 1 stored therein from being largely moved due to vibration during cassette conveyance. The second step portion 26 can prevent the side edge portion of the substrate 1 from coming into contact with the side edge support 18 when the substrate 1 is put in and out. For example, when the substrate 1 is taken out, the substrate 1 is slightly lifted upward by the substrate transfer machine and separated from the placement surfaces 21 and 31, and the substrate 1 is moved from the first step portion 23 to the second step. The substrate 1 is raised to the height position of the stepped portion 26, and the substrate 1 is horizontally moved forward and taken out from this state. Therefore, the side edge of the substrate 1 rubs against the side edge support 18 due to the lateral movement of the substrate transfer machine. There is no. Therefore, it is possible to prevent dust generation and microcracks from being generated in the substrate 1 when the substrate 1 is taken in and out.
[0037]
Further, the substrate 1 whose both side edges are supported by the side edge support portions 20 on both sides is bent such that the central portion thereof is greatly curved downward as the lateral width is increased. It is possible to reduce the downward deflection of the portion. Therefore, when the substrate is taken in and out, the hand of the substrate transfer machine which is going to enter the lower side of the substrate 1 to be taken in and out as in the prior art comes into contact with the front edge of the substrate 1 or the hand of the substrate transfer machine. Can rub the lower surface of the substrate 1 to solve the problem of generating dust and microcracks. When the cassette is transported, the vibration of the substrate 1 can be reduced.
[0038]
Further, the movement of the substrate 1 at the time of cassette conveyance can be restricted by the first step portion 23 of the side edge support portion 20, and the vibration of the substrate 1 at the time of cassette conveyance can be reduced by the rear edge support portion 30. , 31 and the substrate 1 can be reduced, and dust generation can be reduced.
[0039]
Further, since the rear edge support portions 30 of the rear edge support body 28 are arranged in pairs at equal intervals between the side edge support portions 20 on both sides, the weight of the substrate 1 supported between the side edge support bodies 20 on both sides is set. The amount of deflection due to the can be made uniform.
[0040]
Further, when the substrate 1 having a lateral width of 550 mm, a front-rear width of 650 mm, and a thickness of 0.7 mm is targeted, the trailing edge support portion 30 is positioned 3 to 6 mm below the side edge support portion 20, whereby the substrate 1 vibration can be reduced most.
[0041]
The difference in height between the trailing edge support portion 30 and the side edge support portion 20 is 1/3 or less of the amount of deflection of the substrate 1 when only the side edge portions of the substrate 1 are supported only by the side edge support portions 20 on both sides. By doing so, the vibration of the substrate 1 can be reduced.
[0042]
Further, since the mounting surfaces 21 and 31 and the regulation surfaces 22 and 32, that is, the contact surface with the substrate 1 are formed of a non-conductive material, when the contact surface is formed of a conductive material, the substrate 1 and the contact surface It is possible to prevent carbon and the like from being generated by rubbing. Since the portion other than the contact surface is formed of a conductive material, it is possible to prevent the substrate 1 from being charged with static electricity.
[0043]
In addition, the cassettes can be made by setting the material of the mounting surfaces 21 and 31 and the regulating surfaces 22 and 32, that is, the contact surface with the substrate 1, to a material having a friction coefficient of 0.5 or more with the substrate 1, for example, a thermoplastic polyester elastomer. The movement of the substrate 1 due to vibration during transportation can be prevented, and dust generation can be reduced.
[0044]
【The invention's effect】
According to the cassette for transporting a substrate of the present invention, the first step portion of the side edge support portion can restrict the movement of the substrate due to vibration during the cassette transport, and the second step portion having a wider interval than the first step portion. Therefore, it is possible to cope with lateral shaking when the substrate is taken in and out, and further, the contact surface with the substrate is made of a non-conductive material, and other than the contact surface is made of a conductive material, so that dust generation from the contact surface and charging of the substrate can be prevented.
[0045]
Further, the trailing edge support portion can reduce the downward deflection of the substrate whose side edge portions are supported by the side edge support portions on both sides, and can reduce the vibration of the substrate when the cassette is transported.
[Brief description of the drawings]
FIG. 1 is a perspective view in which a part of a substrate carrying cassette according to an embodiment of the present invention is cut away.
FIG. 2 is an enlarged front view of a part of the substrate carrying cassette according to the embodiment.
FIG. 3 is a graph showing a maximum substrate deflection with respect to a height difference between a side plate support portion and a trailing edge support portion.
FIG. 4 is a graph showing a substrate floating amount and vibration acceleration with respect to a height difference between a side plate support portion and a trailing edge support portion.
[Explanation of symbols]
1 Substrate
11 Substrate transport cassette
12 Cassette body
16 compartment
17 opening
20 Side edge support
21 Placement surface constituting contact surface
22 Regulatory surfaces that make up the contact surface
23 First step
26 Second step
30 Trailing edge support

Claims

A cassette main body formed of a conductive material having a storage portion for storing the substrate substantially horizontally inside, an opening for taking the substrate in and out of the front of the storage portion, and
The cassette body has a first step portion which is disposed opposite to both sides of the storage portion of the cassette body and engages with a side edge portion of the substrate, and the first step portions on both sides outside the upper portion of the first step portion. The second stepped portion is spaced wider than the facing interval of the first stepped portion, the contact surface of the first stepped portion with the substrate is formed of a non-conductive material, and the other contact surface is formed of a conductive material. A cassette for transporting a substrate, comprising: a side edge support portion.

A cassette body having a storage portion for storing the substrate substantially horizontally inside, and an opening for taking the substrate in and out of the front surface of the storage portion;
A side edge support part that is disposed on both sides of the storage part of the cassette body and supports both side edges of the substrate;
A pair of rear edge support portions that are disposed at equal intervals between the side edge support portions on both sides on the rear side of the storage portion of the cassette body, and support the rear edge portion of the substrate;
Features and to that board transport cassette that comprises a.

The trailing edge support portion is located below the side edge support portion, and the difference in height between the trailing edge support portion and the side edge support portion is that the substrate edge when supporting only the both edge portions of the substrate only by the side edge support portions on both sides. claim 2 Symbol mounting substrate transfer cassette, characterized in that a third or less of the amount of deflection.

Breadth 550 mm, the front and rear width of 650 mm, when the thickness is directed to a substrate of 0.7 mm, the rear edge support portion mounting Claim 2 Symbol, characterized in that located 3~6mm downward from the side edge support portion Cassette for substrate transport.

Contact surface with the substrate, according to claim 1 to 4 substrate transfer cassette according to any one of friction coefficient between the substrate and characterized by forming at a material to be 0.5 or more.

6. The substrate transport cassette according to claim 5 , wherein the material having a coefficient of friction with the substrate of 0.5 or more is a thermoplastic polyester elastomer.