JP3696072B2 - 高周波パッケージ装置の製造方法 - Google Patents

高周波パッケージ装置の製造方法 Download PDF

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Publication number
JP3696072B2
JP3696072B2 JP2000297490A JP2000297490A JP3696072B2 JP 3696072 B2 JP3696072 B2 JP 3696072B2 JP 2000297490 A JP2000297490 A JP 2000297490A JP 2000297490 A JP2000297490 A JP 2000297490A JP 3696072 B2 JP3696072 B2 JP 3696072B2
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Japan
Prior art keywords
ceramic frame
base plate
line
package device
frequency package
Prior art date
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Expired - Fee Related
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JP2000297490A
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English (en)
Japanese (ja)
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JP2002110834A (ja
JP2002110834A5 (https=
Inventor
文朗 山本
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Toshiba Corp
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Toshiba Corp
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Priority to JP2000297490A priority Critical patent/JP3696072B2/ja
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Publication of JP2002110834A5 publication Critical patent/JP2002110834A5/ja
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  • Ceramic Products (AREA)
JP2000297490A 2000-09-28 2000-09-28 高周波パッケージ装置の製造方法 Expired - Fee Related JP3696072B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000297490A JP3696072B2 (ja) 2000-09-28 2000-09-28 高周波パッケージ装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000297490A JP3696072B2 (ja) 2000-09-28 2000-09-28 高周波パッケージ装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002110834A JP2002110834A (ja) 2002-04-12
JP2002110834A5 JP2002110834A5 (https=) 2004-09-09
JP3696072B2 true JP3696072B2 (ja) 2005-09-14

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ID=18779601

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JP2000297490A Expired - Fee Related JP3696072B2 (ja) 2000-09-28 2000-09-28 高周波パッケージ装置の製造方法

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JP (1) JP3696072B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100683164B1 (ko) 2002-12-24 2007-02-15 (주) 텔트론 초고주파 반도체 칩 실장용 패키지
JP4836760B2 (ja) * 2006-11-28 2011-12-14 京セラ株式会社 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置
CN103928447B (zh) * 2013-01-14 2016-09-28 内蒙航天动力机械测试所 一种大功率全气密半导体模块封装结构

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JP2002110834A (ja) 2002-04-12

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