JP3665517B2

JP3665517B2 - Chip type variable resistor

Info

Publication number: JP3665517B2
Application number: JP25526199A
Authority: JP
Inventors: 利之大内
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 1999-09-09
Filing date: 1999-09-09
Publication date: 2005-06-29
Anticipated expiration: 2019-09-09
Also published as: JP2001076910A

Description

【０００１】
【発明の属する技術分野】
本発明は、音響機器等に使用して好適なチップ型可変抵抗器に関する。
【０００２】
【従来の技術】
従来のチップ型可変抵抗器の一形態として本願出願人が特願平１１−１０４１９２号（出願中）で提案したものを図８〜図１２に基づいて説明すると、図８〜図１２は何れも従来のチップ型可変抵抗器を示し、図８は分解斜視図、図９は断面図、図１０は要部の拡大斜視図、図１１は要部の拡大断面図、図１２はチップ型可変抵抗器のプリント基板への取付状態を示す断面図である。
【０００３】
図８〜図１２に示すように、絶縁基板３１は、セラミック材から成り、略矩形に焼成加工され、約２ｍｍ角と極めて小型の大きさで構成され、上面３１ａから下面３１ｂに貫通する中心部に設けられた円形の貫通孔３１ｃと、貫通孔３１ｃを囲むように上面３１ａに設けられたへこみ部３１ｄと、側面３１ｅから突出する一対の突部３１ｆとを有している。
【０００４】
抵抗体３２は、例えば、サーメット系のペーストなどから成り、絶縁基板３１の上面３１ａのへこみ部３１ｄの周囲に略円弧状に印刷等によって形成されている。
一対の電極３３は、例えば、銀とガラスフリットから成り、略矩形で、絶縁基板３１の上面３１ａの突部３１ｆ上にわたって設けられ、抵抗体３２の両端部にそれぞれ接続され、一対が印刷等によって形成されている。
【０００５】
また、端子３４は、金属板からなり、略矩形の底板３４ａと、底板３４ａと直交し、隣り合う２つの側縁からそれぞれ上方に折り曲げられた一対の脚部３４ｂとを有する。
【０００６】
そして、端子３４は、底板３４ａが絶縁基板３１の下面３１ｂに当接され、脚部３４ｂが絶縁基板３１の角部に直交して、隣り合う２つの側面３１ｅに沿って配置され、更に、脚部３４ｂの先端部が、絶縁基板３１の上面３１ａ側に折り曲げられて、端子３４が絶縁基板３１に取り付けられている。
そして、電極３３と端子３４とを半田３５付けして、互いに接続、固定している。
【０００７】
また、中間端子３６は、略長方形の底板３６ａと、底板３６ａの一方の端部に上方に切り起こされた折り曲げ部３６ｂと、底板３６ａの中間部に上方に絞り加工にて設けられた円筒状の鳩目部３６ｃとを有する。
また、中間端子３６は、底板３６ａが絶縁基板３１の下面３１ｂに当接し、鳩目部３６ｃが絶縁基板３１の貫通孔３１ｃに挿通され、折り曲げ部３６ｂが絶縁基板３１の側面３１ｅに設けられた切り欠き部に沿って上面３１ａ方向に延びた状態で配置されている。
【０００８】
摺動子３７は、金属板から成り、円板状部に絞り加工にて形成され、孔３７ａを設けた底壁部３７ｂを有するお椀状の筒状部３７ｃと、筒状部３７ｃの上端の一部から折り曲げられて、筒状部３７ｃの上方に配置された十字状のドライバー溝３７ｄを有する操作部３７ｅと、筒状部３７ｃの外周から下方に延設された略Ｕ字状の摺動部３７ｆとを有している。
【０００９】
この摺動子３７の筒状部３７ｃは、図１１に示すように、絶縁基板３１のへこみ部３１ｄ内に配置されると共に、中間端子３６の鳩目部３６ｃが、絶縁基板３１の貫通孔３１ｃに挿通された状態で、鳩目部３６ｃの先端部が摺動子３７の孔３７ａに挿通されて、鳩目部３６ｃの先端部３６ｄがカシメ付けられ、平坦な先端部３６ｄで摺動子３７の底壁部３７ｂを絶縁基板３１に押し付けて、摺動子３７は、絶縁基板３１に対して回動可能に保持されている。
この時、中間端子３６の底板３６ａは、絶縁基板３１の下面３１ｂに当接すると共に、摺動子３７の摺動部３７ｆは、絶縁基板３１の上面３１ａに設けられた抵抗体３２に弾接され、摺動子３７の回動に対応して、摺動部３７ｆが抵抗体３２上を摺動するようになっている。
【００１０】
そして、このような構成を有するチップ型可変抵抗器の動作は、ドライバー溝３７ｄに操作具であるドライバー３８（図１１参照）を挿入して、操作部３７ｅを回転すると、筒状部３７ｃと摺動部３７ｆが同時に回転して、摺動部３７ｆが抵抗体３２上を摺動して抵抗値の調整を行うようになっている。
しかし、平坦な先端部３６ｄで摺動子３７を取り付けた構成だと、摺動子３７と先端部３６ｄの摩擦力が弱く、ドライバー３８の回転トルクが小さくなる。
また、このような構成だと、鳩目部３６ｃの孔が小さく、このため、ドライバー３８の先端部の挿入が浅くなって、ドライバー３８とドライバー溝３７ｄとの係合度合いが小さくなって、ドライバー３８の回転時、ドライバー３８がドライバー溝３７ｄとの係合が外れて、調整作業に手間がかかるものであった。
【００１１】
次に、従来のチップ型可変抵抗器のプリント配線基板への取付方法を図１２に基づいて説明すると、プリント配線基板４０は、例えば、ガラス入り合成樹脂材料などから成り平板状で、プリント配線基板４０の少なくとも一方の面には、所望の導電パターン（図示せず）が形成されている。このプリント配線基板４０の導電パターン（図示せず）上に上述のチップ型可変抵抗器を載置する。
この時、所定の導電パターン上にクリーム半田（図示せず）を塗布しておき、このクリーム半田に接続するようにチップ型可変抵抗器の端子３４と中間端子３６とを載置する。
【００１２】
この状態で、チップ型可変抵抗器が載置されたプリント配線基板４０をリフロー炉内に搬送して、チップ型可変抵抗器の端子３４と中間端子３６とプリント配線基板４０の導電パターンとを半田４１接続する。
【００１３】
【発明が解決しようとする課題】
従来のチップ型可変抵抗器は、鳩目部３６ｃをカシメて平坦な先端部３６ｄで、摺動子３７を押し付けて取り付けるため、先端部３６ｄと摺動子３７との摩擦力が小さく、ドライバー３８の回転トルクを大きくできないという問題がある。
また、鳩目部３６ｃの孔が小さく、このため、ドライバー３８の先端部の挿入が浅くなって、ドライバー３８とドライバー溝３７ｄとの係合度合いが小さくなって、ドライバー３８の回転時、ドライバー３８がドライバー溝３７ｄとの係合が外れて、調整作業に手間がかかるという問題がある。
そこで、本発明は、ドライバーによる回転トルクが大きく、調整作業が容易なチップ型可変抵抗器を提供するものである。
【００１４】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、中央部に貫通孔を有し、上面に抵抗体を形成した絶縁基板と、前記絶縁基板の上面に配設され、前記抵抗体上を摺動する摺動子と、前記絶縁基板に前記摺動子を回転可能に取り付ける鳩目部とを備え、前記摺動子は、略お椀状をなし、孔を設けた底壁部を有する筒状部と、ドライバー溝を備えた操作部とを有し、前記鳩目部には、その先端部に広がった傾斜状部が設けられており、前記摺動子は、前記鳩目部より硬い金属材で形成され、前記底壁部の前記孔には、前記鳩目部が挿入され、前記鳩目部の前記傾斜状部の外周面に前記底壁部の前記孔のエッジ部を食い込ませて、前記摺動子を回転可能に取り付けた構成とした。
【００１５】
また、第２の解決手段として、前記傾斜状部の根本部が前記底壁部の前記絶縁基板への当接位置よりも前記絶縁基板の下面側に位置した構成とした。
【００１６】
【発明の実施の形態】
本発明のチップ型可変抵抗器を図１〜図７に基づいて説明する。
【００１７】
図１〜図７は何れも本発明のチップ型可変抵抗器を示し、図１は斜視図、図２は平面図、図３は側面図、図４は下面図、図５は図２の５−５線における断面図、図６は要部の拡大断面図、図７はチップ型可変抵抗器のプリント基板への取付状態を示す断面図である。
【００１８】
図１〜図７に示すように、絶縁基板１は、セラミック材から成り、略矩形に焼成加工され、約２ｍｍ角と極めて小型の大きさで構成され、上面１ａから下面１ｂに貫通する中心部に設けられた円形の貫通孔１ｃと、側面１ｅから突出する一対の突部１ｆと、突部１ｆの下面に設けられた凹部１ｇと、貫通孔１ｃの位置を含んで下面１ｂに設けられた矩形状の凹部１ｈとを有している。
【００１９】
抵抗体２は、例えば、サーメット系のペーストなどから成り、絶縁基板１の上面１ａの貫通孔１ｃの周囲に略円弧状に印刷等によって形成されている。
一対の電極３は、例えば、銀とガラスフリットから成り、略矩形で、従来と同様に、絶縁基板１の上面１ａの突部１ｆ上にわたって設けられ、抵抗体２の両端部にそれぞれ接続され、一対が印刷等によって形成されている。
【００２０】
また、端子４は、金属板からなり、略矩形の底板４ａと、底板４ａと直交し、隣り合う２つの側縁からそれぞれ上方に折り曲げられた一対の脚部４ｂとを有する。
【００２１】
そして、端子４は、底板４ａが絶縁基板１の凹部１ｇの下面１ｂに当接され、脚部４ｂが絶縁基板１の角部に直交して、隣り合う２つの側面１ｅに沿って配置され、更に、脚部４ｂの先端部が、絶縁基板１の上面１ａ側に折り曲げられて、端子４が絶縁基板１に取り付けられている。
そして、電極３と端子４とを半田５付けして、互いに接続、固定している。
【００２２】
また、中間端子６は、比較的柔らかい鋼等の金属板からなり、たたき加工によって形成された薄肉部からなる略矩形のフランジ部６ａと、このフランジ部６ａに繋がって延出され、フランジ部６ａよりも肉厚の接続部６ｂと、この接続部６ｂの一端から上方に切り起こされた折り曲げ部６ｃと、フランジ部６ａの中間部に上方に絞り加工にて設けられた円筒状の鳩目部６ｄとを有する。
また、中間端子６は、フランジ部６ａと接続部６ｂが絶縁基板１の下面１ｂの凹部１ｈ内に位置して、下面１ｂに当接し、鳩目部６ｄが絶縁基板１の貫通孔１ｃに挿通され、折り曲げ部６ｃが絶縁基板１の側面１ｅに設けられた切り欠き部に沿って上面１ａ方向に延びた状態で配置されている。
【００２３】
摺動子７は、中間端子６より硬いステンレス等の金属板から成り、円板状部に絞り加工にて形成され、孔７ａを設けた底壁部７ｂを有するお椀状の筒状部７ｃと、筒状部７ｃの上端の一部から折り曲げられて、筒状部７ｃの上方に配置された十字状のドライバー溝７ｄを有する操作部７ｅと、筒状部７ｃの外周から下方に延設された略Ｕ字状の摺動部７ｆとを有している。
【００２４】
この摺動子７の筒状部７ｃは、絶縁基板１の上面１ａに配置されると共に、中間端子６の鳩目部６ｄが、絶縁基板１の貫通孔１ｃに挿通された状態で、鳩目部６ｄの先端部が摺動子７の孔７ａに挿通されて、鳩目部６ｃの先端部を押し広げて傾斜状部６ｅを設ける。
すると、摺動子７より軟らかい材料からなる傾斜状部６ｅの外周面には、底壁部７ｂの孔７ａのエッジ部が食い込んで、摺動子７は、絶縁基板１に対して回動可能に保持されている。
【００２５】
そして、鳩目部６ｄの傾斜状部６ｅによって摺動子７が絶縁基板１に取り付けられた際、図６に示すように、傾斜状部６ｅの根本部６ｆは、底壁部７ｂの絶縁基板１への当接位置よりも、絶縁基板１の下面１ｂ側に位置させて、鳩目部６ｄの孔６ｇの上方部を大きく、且つ深くすると共に、鳩目部６ｄの軸方向における操作部７ｅの上面と傾斜状部６ｅの頂部６ｈとの間の長さＬ１よりも、軸方向と直交する方向におけるドライバー溝７ｄの最外周部と傾斜状部６ｅの頂部６ｈとの間の長さＬ２を小さくして、ドライバー８のドライバー溝７ｄに対する係合度合いを良くしたものである。
【００２６】
この時、中間端子６のフランジ部６ａの薄肉部は、絶縁基板１の凹部１ｈ内に位置して、薄肉部の表面が絶縁基板１の下面１ｂより凹部１ｈ内側に凹んだ状態となると共に、摺動子７の摺動部７ｆは、絶縁基板１の上面１ａに設けられた抵抗体２に弾接され、摺動子７の回動に対応して、摺動部７ｆが抵抗体２上を摺動するようになっている。
【００２７】
そして、このような構成を有するチップ型可変抵抗器の動作は、ドライバー溝７ｄに操作具であるドライバー８（図６参照）を挿入して、操作部７ｅを回転すると、筒状部７ｃと摺動部７ｆが同時に回転して、摺動部７ｆが抵抗体２上を摺動して抵抗値の調整を行うようになっている。
この調整時、傾斜状部６ｅの外周面には、底壁部７ｂの孔７ａのエッジ部が食い込んでいるため、ドライバー８の回転トルクを大きくできて、その調整が容易となるばかりか、傾斜状部６ｅの存在によって、鳩目部６ｄの孔６ｇの上方部が広く、且つ深くなって、ドライバー８の挿入を深くできて、ドライバー８とドライバー溝７ｄとの係合度合いを深くできると共に、長さＬ１を長さＬ２よりも大きくすることによって、頂部６ｈに当接することなくドライバー８の挿入を深くできて、ドライバー８とドライバー溝７ｄとの係合度合いを良好にできる。
【００２８】
次に、本発明のチップ型可変抵抗器のプリント配線基板への取付方法を図７に基づいて説明すると、プリント配線基板１０は、例えば、ガラス入り合成樹脂材料などから成り平板状で、プリント配線基板１０の少なくとも一方の面には、所望の導電パターン（図示せず）が形成されている。このプリント配線基板１０の導電パターン（図示せず）上に上述のチップ型可変抵抗器を載置する。
この時、所定の導電パターン上にクリーム半田（図示せず）を塗布しておき、このクリーム半田に接続するようにチップ型可変抵抗器の端子４と中間端子６とを載置する。
【００２９】
この状態で、チップ型可変抵抗器が載置されたプリント配線基板１０をリフロー炉内に搬送して、チップ型可変抵抗器の端子４と中間端子６とプリント配線基板１０の導電パターンとを半田１１接続する。
【００３０】
なお、上記実施例においては、中間端子６と一体に鳩目部６ｄを設けたもので説明したが、鳩目部６ｄを中間端子６と別体に形成したものでも良い。
また、本実施例において、ドライバー溝７ｄを設けた操作部７ｅは、筒状部７ｃと一体の板材を折り曲げて形成したが、筒状部７ｃに直接ドライバー溝７ｄを設けて形成しても良い。
【００３１】
【発明の効果】
以上のように本発明のチップ型可変抵抗器において、摺動子７は、鳩目部６ｄより硬い金属材で形成され、底壁部７ｂの孔７ａには、鳩目部６ｄが挿入され、鳩目部６ｄの外周面に底壁部７ｂの孔７ａのエッジ部を食い込ませて、摺動子７を回転可能に取り付けたため、摺動子７と鳩目部６ｄとの間の摩擦力を大きくでき、ドライバー８の回転トルクが大きくなって、調整の容易なチップ型可変抵抗器を提供できる。
【００３２】
また、鳩目部６ｄは、その先端部に広がった傾斜状部６ｅを設け、この傾斜状部６ｅの外周面に底壁部７ｂの孔７ａのエッジ部を食い込ませたため、鳩目部６ｄの孔６ｇの上方部が広く、且つ深くなって、ドライバー８の挿入を深くできて、ドライバー８とドライバー溝７ｄとの係合度合いを深くできて、調整作業が容易で、確実なチップ型可変抵抗器を提供できる。
【００３３】
また、傾斜状部６ｅの根本部６ｆが底壁部７ｂの絶縁基板１への当接位置よりも絶縁基板１の下面１ｂ側に位置したため、ドライバー８の挿入を一層深くできて、一層調整作業が容易で、確実なチップ型可変抵抗器を提供できる。
【図面の簡単な説明】
【図１】本発明のチップ型可変抵抗器の斜視図。
【図２】本発明のチップ型可変抵抗器の平面図。
【図３】本発明のチップ型可変抵抗器の側面図。
【図４】本発明のチップ型可変抵抗器の下面図。
【図５】図２の５−５線における断面図。
【図６】本発明のチップ型可変抵抗器の要部の拡大断面図。
【図７】本発明のチップ型可変抵抗器のプリント基板への取付状態を示す断面図。
【図８】従来のチップ型可変抵抗器の分解斜視図。
【図９】従来のチップ型可変抵抗器の要部断面図。
【図１０】従来のチップ型可変抵抗器の要部の拡大斜視図。
【図１１】従来のチップ型可変抵抗器の要部の拡大断面図。
【図１２】従来のチップ型可変抵抗器のプリント基板への取付状態を示す断面図。
【符号の説明】
１絶縁基板
１ａ上面
１ｂ下面
１ｃ貫通孔
１ｅ側面
１ｆ突部
１ｇ凹部
１ｈ凹部
２抵抗体
３電極
４端子
４ａ底板
４ｂ脚部
５半田
６中間端子
６ａフランジ部
６ｂ接続部
６ｃ折り曲げ部
６ｄ鳩目部
６ｅ傾斜状部
６ｆ根本部
６ｇ孔
６ｈ頂部
７摺動子
７ａ孔
７ｂ底壁部
７ｃ筒状部
７ｄドライバー溝
７ｅ操作部
７ｆ摺動部
８ドライバー
１０プリント基板
１１半田[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type variable resistor suitable for use in audio equipment and the like.
[0002]
[Prior art]
As an example of a conventional chip type variable resistor, what the applicant of the present application has proposed in Japanese Patent Application No. 11-104192 (pending) will be described with reference to FIGS. 8 to 12. FIGS. FIG. 8 is an exploded perspective view, FIG. 9 is a sectional view, FIG. 10 is an enlarged perspective view of the main part, FIG. 11 is an enlarged sectional view of the main part, and FIG. 12 is a chip type variable resistor. It is sectional drawing which shows the attachment state to the printed circuit board of a container.
[0003]
As shown in FIGS. 8 to 12, the insulating substrate 31 is made of a ceramic material, fired into a substantially rectangular shape, has a very small size of about 2 mm square, and has a central portion that penetrates from the upper surface 31 a to the lower surface 31 b. A circular through hole 31c provided on the upper surface 31d, a recess 31d provided on the upper surface 31a so as to surround the through hole 31c, and a pair of protrusions 31f protruding from the side surface 31e.
[0004]
The resistor 32 is made of, for example, a cermet paste, and is formed by printing or the like in a substantially arc shape around the recessed portion 31 d of the upper surface 31 a of the insulating substrate 31.
The pair of electrodes 33 is made of, for example, silver and glass frit, is substantially rectangular, is provided on the protrusion 31f of the upper surface 31a of the insulating substrate 31, is connected to both ends of the resistor 32, and the pair is formed by printing or the like. Is formed.
[0005]
The terminal 34 is made of a metal plate, and includes a substantially rectangular bottom plate 34a and a pair of leg portions 34b that are orthogonal to the bottom plate 34a and bent upward from two adjacent side edges.
[0006]
The terminal 34 has a bottom plate 34a abutted against the lower surface 31b of the insulating substrate 31, and leg portions 34b orthogonal to the corners of the insulating substrate 31 along two adjacent side surfaces 31e. The tip of the portion 34 b is bent toward the upper surface 31 a of the insulating substrate 31, and the terminal 34 is attached to the insulating substrate 31.
The electrodes 33 and the terminals 34 are soldered 35 to be connected and fixed to each other.
[0007]
The intermediate terminal 36 has a substantially rectangular bottom plate 36a, a bent portion 36b that is cut and raised upward at one end of the bottom plate 36a, and a cylindrical shape that is provided at the middle portion of the bottom plate 36a by drawing. Eyelet part 36c.
Further, the intermediate terminal 36 has a bottom plate 36a that contacts the lower surface 31b of the insulating substrate 31, a eyelet portion 36c that is inserted into the through hole 31c of the insulating substrate 31, and a bent portion 36b that is provided on the side surface 31e of the insulating substrate 31. It arrange | positions in the state extended in the upper surface 31a direction along the notch.
[0008]
The slider 37 is made of a metal plate, is formed by drawing into a disk-shaped portion, has a bowl-shaped tubular portion 37c having a bottom wall portion 37b provided with a hole 37a, and an upper end of the tubular portion 37c. An operation portion 37e having a cross-shaped driver groove 37d which is bent from a part and arranged above the cylindrical portion 37c, and a substantially U-shaped slide extending downward from the outer periphery of the cylindrical portion 37c Part 37f.
[0009]
As shown in FIG. 11, the cylindrical portion 37 c of the slider 37 is disposed in the recessed portion 31 d of the insulating substrate 31, and the eyelet portion 36 c of the intermediate terminal 36 is inserted into the through hole 31 c of the insulating substrate 31. In the inserted state, the tip of the eyelet part 36c is inserted into the hole 37a of the slider 37, the tip part 36d of the eyelet part 36c is crimped, and the bottom wall of the slider 37 is fixed by the flat tip part 36d. The slider 37 is held so as to be rotatable with respect to the insulating substrate 31 by pressing the portion 37 b against the insulating substrate 31.
At this time, the bottom plate 36a of the intermediate terminal 36 contacts the lower surface 31b of the insulating substrate 31, and the sliding portion 37f of the slider 37 is elastically contacted with the resistor 32 provided on the upper surface 31a of the insulating substrate 31. Corresponding to the rotation of the slider 37, the sliding portion 37f slides on the resistor 32.
[0010]
The operation of the chip-type variable resistor having such a configuration is as follows. When a driver 38 (see FIG. 11) as an operating tool is inserted into the driver groove 37d and the operating portion 37e is rotated, the sliding operation with the cylindrical portion 37c is performed. The moving portion 37f rotates at the same time, and the sliding portion 37f slides on the resistor 32 to adjust the resistance value.
However, when the slider 37 is attached to the flat tip portion 36d, the frictional force between the slider 37 and the tip portion 36d is weak, and the rotational torque of the driver 38 is reduced.
Further, with such a configuration, the hole of the eyelet portion 36c is small, so that the insertion of the tip of the driver 38 becomes shallow, the degree of engagement between the driver 38 and the driver groove 37d becomes small, and the driver 38 During the rotation, the driver 38 was disengaged from the driver groove 37d, and the adjustment work was troublesome.
[0011]
Next, a method for attaching the conventional chip type variable resistor to the printed wiring board will be described with reference to FIG. 12. The printed wiring board 40 is made of a synthetic resin material containing glass and has a flat plate shape. A desired conductive pattern (not shown) is formed on at least one surface of 40. On the conductive pattern (not shown) of the printed wiring board 40, the above-described chip type variable resistor is placed.
At this time, cream solder (not shown) is applied on a predetermined conductive pattern, and the terminal 34 and the intermediate terminal 36 of the chip type variable resistor are placed so as to be connected to the cream solder.
[0012]
In this state, the printed wiring board 40 on which the chip-type variable resistor is mounted is transported into the reflow furnace, and the terminal 34, the intermediate terminal 36, and the conductive pattern of the printed wiring board 40 of the chip-type variable resistor are soldered. 41 connections.
[0013]
[Problems to be solved by the invention]
Since the conventional chip type variable resistor is attached by pressing the slider 36 with the flat tip portion 36d by crimping the eyelet portion 36c, the friction force between the tip portion 36d and the slider 37 is small, and the driver 38 There is a problem that the rotational torque cannot be increased.
Also, the hole of the eyelet portion 36c is small, so that the insertion of the tip of the driver 38 is shallow, the degree of engagement between the driver 38 and the driver groove 37d is reduced, and the driver 38 is rotated when the driver 38 rotates. There is a problem that the engagement with the driver groove 37d is disengaged and the adjustment work is troublesome.
Therefore, the present invention provides a chip-type variable resistor that has a large rotational torque by a driver and can be easily adjusted.
[0014]
[Means for Solving the Problems]
As a first means for solving the above problems, an insulating substrate having a through-hole at the center and having a resistor formed on the upper surface thereof, disposed on the upper surface of the insulating substrate, and sliding on the resistor. And a cylindrical portion having a bottom wall portion provided with a hole. The slider includes a moving eyelet and a eyelet portion that rotatably attaches the slider to the insulating substrate. And an operation part provided with a driver groove, the eyelet part is provided with an inclined part extending to the tip part, and the slider is made of a metal material harder than the eyelet part. The eyelet portion is inserted into the hole of the bottom wall portion, and the edge portion of the hole of the bottom wall portion is bitten into the outer peripheral surface of the inclined portion of the eyelet portion, and the slider It was set as the structure attached so that rotation was possible.
[0015]
As a second solution, the base portion of the inclined portion is positioned on the lower surface side of the insulating substrate with respect to the contact position of the bottom wall portion with the insulating substrate .
[0016]
DETAILED DESCRIPTION OF THE INVENTION
A chip type variable resistor according to the present invention will be described with reference to FIGS.
[0017]
1 to 7 both show the chip type variable resistor of the present invention, FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a side view, FIG. 4 is a bottom view, 5 in FIG. 5 FIG. 2 FIG. 6 is a cross-sectional view taken along line -5, FIG. 6 is an enlarged cross-sectional view of a main part, and FIG.
[0018]
As shown in FIGS. 1 to 7, the insulating substrate 1 is made of a ceramic material, is fired into a substantially rectangular shape, has a very small size of about 2 mm square, and has a central portion that penetrates from the upper surface 1 a to the lower surface 1 b. A circular through hole 1c provided in the upper surface, a pair of protrusions 1f protruding from the side surface 1e, a recess 1g provided on the lower surface of the protrusion 1f, and the position of the through hole 1c are provided on the lower surface 1b. And a rectangular recess 1h.
[0019]
The resistor 2 is made of, for example, a cermet paste, and is formed by printing or the like in a substantially arc shape around the through-hole 1 c on the upper surface 1 a of the insulating substrate 1.
The pair of electrodes 3 is made of, for example, silver and glass frit, is substantially rectangular, and is provided over the protrusion 1f of the upper surface 1a of the insulating substrate 1 and is connected to both ends of the resistor 2, respectively, A pair is formed by printing or the like.
[0020]
The terminal 4 is made of a metal plate and includes a substantially rectangular bottom plate 4a and a pair of leg portions 4b that are orthogonal to the bottom plate 4a and bent upward from two adjacent side edges.
[0021]
And the terminal 4 is arrange | positioned along two side surfaces 1e which the bottom plate 4a contact | abuts to the lower surface 1b of the recessed part 1g of the insulated substrate 1, and the leg part 4b is orthogonal to the corner | angular part of the insulated substrate 1, Further, the distal end portion of the leg portion 4 b is bent toward the upper surface 1 a side of the insulating substrate 1, and the terminal 4 is attached to the insulating substrate 1.
The electrode 3 and the terminal 4 are connected to each other and fixed by soldering 5.
[0022]
Further, the intermediate terminal 6 is made of a relatively soft metal plate such as steel, and has a substantially rectangular flange portion 6a formed of a thin portion formed by tapping, and is extended to be connected to the flange portion 6a. The flange portion 6a A thicker connecting portion 6b, a bent portion 6c cut and raised upward from one end of the connecting portion 6b, and a cylindrical eyelet portion 6d provided by drawing at the middle portion of the flange portion 6a. And have.
Further, the intermediate terminal 6 has a flange portion 6a and a connection portion 6b located in the recess 1h of the lower surface 1b of the insulating substrate 1, abutted against the lower surface 1b, and an eyelet portion 6d inserted through the through hole 1c of the insulating substrate 1. The bent portion 6c is arranged in a state extending in the direction of the upper surface 1a along the notch provided in the side surface 1e of the insulating substrate 1.
[0023]
The slider 7 is made of a metal plate such as stainless steel that is harder than the intermediate terminal 6, is formed by drawing into a disk-shaped portion, and has a bowl-shaped cylindrical portion 7c having a bottom wall portion 7b provided with a hole 7a. An operation portion 7e having a cross-shaped driver groove 7d that is bent from a part of the upper end of the cylindrical portion 7c and disposed above the cylindrical portion 7c, and extends downward from the outer periphery of the cylindrical portion 7c. And a substantially U-shaped sliding portion 7f.
[0024]
The cylindrical portion 7 c of the slider 7 is disposed on the upper surface 1 a of the insulating substrate 1, and the eyelet portion 6 d in a state where the eyelet portion 6 d of the intermediate terminal 6 is inserted into the through hole 1 c of the insulating substrate 1. Is inserted into the hole 7a of the slider 7, and the tip portion of the eyelet portion 6c is expanded to provide an inclined portion 6e.
Then, the edge part of the hole 7a of the bottom wall part 7b bites into the outer peripheral surface of the inclined part 6e made of a softer material than the slider 7, and the slider 7 can rotate with respect to the insulating substrate 1. Is held in.
[0025]
When the slider 7 is attached to the insulating substrate 1 by the inclined portion 6e of the eyelet portion 6d, as shown in FIG. 6, the root portion 6f of the inclined portion 6e is the insulating substrate 1 of the bottom wall portion 7b. The upper part of the hole 6g of the eyelet part 6d is made larger and deeper than the position of contact with the lower surface 1b of the insulating substrate 1, and the upper surface of the operation part 7e in the axial direction of the eyelet part 6d The length L2 between the outermost peripheral portion of the driver groove 7d and the top portion 6h of the inclined portion 6e in the direction orthogonal to the axial direction is made smaller than the length L1 between the inclined portion 6e and the top portion 6h. The degree of engagement of the driver 8 with the driver groove 7d is improved.
[0026]
At this time, the thin portion of the flange portion 6a of the intermediate terminal 6 is located in the recessed portion 1h of the insulating substrate 1, and the surface of the thin portion is recessed from the lower surface 1b of the insulating substrate 1 to the inside of the recessed portion 1h. The sliding portion 7 f of the slider 7 is elastically contacted with the resistor 2 provided on the upper surface 1 a of the insulating substrate 1, and the sliding portion 7 f is on the resistor 2 in response to the rotation of the slider 7. It comes to slide.
[0027]
The operation of the chip-type variable resistor having such a configuration is as follows. When a driver 8 (see FIG. 6) as an operating tool is inserted into the driver groove 7d and the operating portion 7e is rotated, the cylindrical variable resistor 7c slides. The moving portion 7f rotates simultaneously, and the sliding portion 7f slides on the resistor 2 to adjust the resistance value.
At the time of this adjustment, the edge portion of the hole 7a of the bottom wall portion 7b bites into the outer peripheral surface of the inclined portion 6e, so that the rotational torque of the driver 8 can be increased and the adjustment becomes easy. Due to the presence of the shaped part 6e, the upper part of the hole 6g of the eyelet part 6d becomes wider and deeper, the insertion of the driver 8 can be deepened, the degree of engagement between the driver 8 and the driver groove 7d can be deepened, and By making the length L1 larger than the length L2, the driver 8 can be inserted deeply without contacting the top 6h, and the degree of engagement between the driver 8 and the driver groove 7d can be improved.
[0028]
Next, the mounting method of the chip type variable resistor of the present invention to the printed wiring board will be described with reference to FIG. 7. The printed wiring board 10 is made of, for example, a synthetic resin material containing glass and has a flat plate shape. A desired conductive pattern (not shown) is formed on at least one surface of the substrate 10. On the conductive pattern (not shown) of the printed wiring board 10, the above-described chip type variable resistor is placed.
At this time, cream solder (not shown) is applied on a predetermined conductive pattern, and the terminal 4 and the intermediate terminal 6 of the chip type variable resistor are placed so as to be connected to the cream solder.
[0029]
In this state, the printed wiring board 10 on which the chip type variable resistor is placed is transported into the reflow furnace, and the terminal 4 and the intermediate terminal 6 of the chip type variable resistor and the conductive pattern of the printed wiring board 10 are soldered. 11 connections.
[0030]
In the embodiment described above, the eyelet portion 6d is provided integrally with the intermediate terminal 6. However, the eyelet portion 6d may be formed separately from the intermediate terminal 6.
Further, in this embodiment, the operation portion 7e provided with the driver groove 7d is formed by bending a plate material integrated with the cylindrical portion 7c, but may be formed by providing the driver groove 7d directly on the cylindrical portion 7c. .
[0031]
【The invention's effect】
As described above, in the chip type variable resistor of the present invention, the slider 7 is formed of a metal material harder than the eyelet portion 6d, and the eyelet portion 6d is inserted into the hole 7a of the bottom wall portion 7b. Since the edge portion of the hole 7a of the bottom wall portion 7b is bitten into the outer peripheral surface of 6d and the slider 7 is rotatably attached, the frictional force between the slider 7 and the eyelet portion 6d can be increased. As a result, the chip-type variable resistor can be easily adjusted.
[0032]
Further, the eyelet portion 6d is provided with an inclined portion 6e spreading at the tip thereof, and the edge portion of the hole 7a of the bottom wall portion 7b is bitten into the outer peripheral surface of the inclined portion 6e. The upper part of the chip is wider and deeper, the insertion of the driver 8 can be deepened, the degree of engagement between the driver 8 and the driver groove 7d can be deepened, and the adjustment work is easy and reliable. Can be provided.
[0033]
Further, since the root portion 6f of the inclined portion 6e is located on the lower surface 1b side of the insulating substrate 1 with respect to the contact position of the bottom wall portion 7b with the insulating substrate 1, the driver 8 can be inserted deeper and further adjustment work can be performed. Therefore, it is possible to provide a reliable chip type variable resistor.
[Brief description of the drawings]
FIG. 1 is a perspective view of a chip type variable resistor of the present invention.
FIG. 2 is a plan view of a chip type variable resistor of the present invention.
FIG. 3 is a side view of the chip type variable resistor of the present invention.
FIG. 4 is a bottom view of the chip type variable resistor of the present invention.
5 is a cross-sectional view taken along line 5-5 of FIG.
FIG. 6 is an enlarged cross-sectional view of a main part of the chip type variable resistor of the present invention.
FIG. 7 is a cross-sectional view showing a state where the chip-type variable resistor of the present invention is attached to a printed circuit board.
FIG. 8 is an exploded perspective view of a conventional chip type variable resistor.
FIG. 9 is a cross-sectional view of a main part of a conventional chip type variable resistor.
FIG. 10 is an enlarged perspective view of a main part of a conventional chip type variable resistor.
FIG. 11 is an enlarged cross-sectional view of a main part of a conventional chip type variable resistor.
FIG. 12 is a cross-sectional view showing a state in which a conventional chip-type variable resistor is attached to a printed circuit board.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 1a Upper surface 1b Lower surface 1c Through-hole 1e Side surface 1f Protrusion part 1g Concave part 1h Concave part 2 Resistor 3 Electrode 4 Terminal 4a Bottom plate 4b Leg part 5 Solder 6 Intermediate terminal 6a Flange part 6b Connection part 6c Bending part 6d Eyelet part 6e Inclination 6f Root portion 6g Hole 6h Top portion 7 Slider 7a Hole 7b Bottom wall portion 7c Tubular portion 7d Driver groove 7e Operation portion 7f Sliding portion 8 Driver 10 Printed circuit board 11 Solder

Claims

An insulating substrate having a through hole in the central portion and having a resistor formed on the upper surface, a slider disposed on the upper surface of the insulating substrate and sliding on the resistor, and the sliding on the insulating substrate An eyelet portion for rotatably attaching the child, the slider has a substantially bowl-like shape, a cylindrical portion having a bottom wall portion provided with a hole, and an operation portion provided with a driver groove, The eyelet portion is provided with an inclined portion extending at the tip thereof, the slider is formed of a metal material harder than the eyelet portion, and the eyelet in the bottom wall portion has the eyelet. A chip-type variable, wherein the slider is rotatably mounted by inserting an edge portion into the outer peripheral surface of the inclined portion of the eyelet portion and biting the edge portion of the hole in the bottom wall portion Resistor.

2. The chip type variable resistor according to claim 1, wherein a base portion of the inclined portion is located on a lower surface side of the insulating substrate with respect to a position where the bottom wall portion is in contact with the insulating substrate .