JP3574570B2 - Processing unit - Google Patents

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Publication number
JP3574570B2
JP3574570B2 JP23366498A JP23366498A JP3574570B2 JP 3574570 B2 JP3574570 B2 JP 3574570B2 JP 23366498 A JP23366498 A JP 23366498A JP 23366498 A JP23366498 A JP 23366498A JP 3574570 B2 JP3574570 B2 JP 3574570B2
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JP
Japan
Prior art keywords
screw
filter
plate
foreign matter
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23366498A
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Japanese (ja)
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JP2000061878A (en
Inventor
泰一郎 青木
彰彦 中村
和馬 寺本
泰之 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP23366498A priority Critical patent/JP3574570B2/en
Publication of JP2000061878A publication Critical patent/JP2000061878A/en
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Publication of JP3574570B2 publication Critical patent/JP3574570B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【0001】
【発明の属する技術分野】
本発明は半導体ウェーハやガラス基板等に一連の処理を施す処理ユニットに関する。
【0002】
【従来の技術】
半導体ウェーハに集積回路を形成したり、ガラス基板にTFT等の素子を形成するには、多くの工程を必要とする。
例えば、基板表面にエキシマレジスト膜を形成する工程の一例を挙げると、デハイドレーションベーク、BARC(ボトム・アンチ・リフレクション・コーティング)塗布、ベーク、レジスト前処理、レジスト塗布、プリベーク、露光、露光後ベーク(PEB)、現像及びポストベークの工程を経るようにしている。
【0003】
従来にあっては、上記の如き工程を連続して行うため、各工程を行う装置を水平方向に離間してライン状に工程順に配置している。このため、占有面積が大きくなり、また工程の省略、追加が困難である。
【0004】
そこで、一箇所において集中的に処理を行う装置として特開平9−205047号公報に開示されるものが知られている。
この先行技術に開示された装置は、図6及びその要部拡大図である図7に示すように、処理ブロック100,200を左右に配設し、中央を移し換えゾーン300とし、前記処理ブロック100はポストベーキング装置101、プリベーキング装置102、クーリング装置103等を積層して構成され、前記処理ブロック200は塗布装置201,202及びフィルタ203を積層して構成される。
【0005】
そして、前記移し換えゾーン300には、処理ブロック100,200間及び処理ブロック100,200を構成する各装置間において被処理物の受け渡しを行うロボット301を設けている。
【0006】
上記ロボット301を昇降動せしめる手段としては、上記公報には具体的に記載されていないが、例えば、隔壁302にて囲まれた内部にスクリューネジ303を配置し、このスクリューネジ303にロボット301の一部を螺合せしめ、スクリューネジ303の正逆回転に応じて昇降動せしめることが考えられる。
【0007】
また、移し換えゾーン300の天井部からはフィルタ304を介して清浄な空気をゾーン内に供給し、床はパンチングメタル305とし、この下に排気ファン306を配置することで移し換えゾーン300内に上下方向の気流を形成し、異物が処理ブロック100,200を構成する各装置に入り込みにくくしている。尚、排気ファン306からの空気は天井部のフィルタ304の上に配置されるケミカルフィルタ307を介してフィルタ304に供給され再利用される。
【0008】
【発明が解決しようとする課題】
処理ユニットにおいて、微細な金属粉等の異物が最も発生しやすい箇所は、摺動、回転動などの動きを伴うロボット部分である。
しかしながら、上述した従来の処理ユニットにあっては、移し換えゾーン300内で単に上下方向の気流を形成しているだけであるので、ロボット301から発生した異物を十分に除去できない。
【0009】
このため、同公報では、ロボット301の下部にファンを設け、このファンで発生した異物をスクリューネジ303を収納する隔壁302の内側に排出する提案がなされている。
しかしながら、上記提案は狭いスリットを介して異物を含む空気を隔壁302の内側に排出しようとするものであり、発生した異物を十分に除去できない。逆にスリットの幅を大きくすれば、隔壁内側に空気を排出しやすくはなるが、隔壁内側からの異物発生がある。
また、ファンによって横方向の気流の流れが発生し、せっかく上下方向の気流を形成して異物を床下に送り込むようにした構成に乱れが生じ、却って歩留まりの低下を招く。
【0010】
【課題を解決するための手段】
上記課題を解決すべく本発明は、複数の処理装置を積層して構成される処理ブロックに隣接して移し換えゾーンを設けて処理ユニットを構成し、前記移し換えゾーンには移し換えロボットを昇降動可能に配置するとともに天井部には清浄なエアの吹出部を、床部にはエアの排出部を設け、更に前記移し換えロボットにはロボット等から発生した異物を捕捉するためのフィルタとこのフィルタに上方からエアを送り込むファンを設けた。
【0011】
また、具体的な構成として、前記移し換えゾーンに隔壁を設け、この隔壁の内側に移し換えロボットを昇降動せしめるための駆動部材を配置し、この駆動部材にはベースを結合し、このベースを隔壁に形成されたスリットを介して移し換えゾーン内に臨ませ、更に前記ベースにはロボットを垂直軸を中心として旋回せしめるヘッド、被処理物を出し入れするためのアーム、異物を捕捉するためのフィルタ及びフィルタにエアを送り込むファンを支持する構成とすることが可能である。
【0012】
以上の如き構成とすることで、ロボットの動作に伴って発生する異物を確実に捕獲することができ、また移し換えゾーン内に形成した上下方向の気流の流れをゾーンの中間部で更に助長することで、効果的な異物対策がなされる。
【0013】
【発明の実施の形態】
以下に本発明の実施の形態を添付図面に基づいて説明する。ここで、図1は本発明に係る処理ユニットの全体図、図2は本発明に係る処理ユニットの移し換えゾーンの詳細を示す図、図3は図2の要部拡大図、図4は図3のA部(プレート基端部周辺)の断面図、図5は図4のA’ーA’線断面図である。
【0014】
処理ユニット1は一対の処理ブロック2,3と、これら一対の処理ブロック2,3間に設けられる移し換えゾーン4にて構成され、この処理ユニット1が複数連設して処理ユニット構築体Mが構成されている。
尚、各処理ブロック2,3には前記した先行技術と同様に、ベーキング装置、クーリング装置、回転カップを用いた塗布装置、露光装置、現像装置等が上下方向に積層されるように組込まれるが、図1にあっては移し換えゾーン4内を透視するため、各装置は外した状態で示している。
【0015】
移し換えゾーン4のコーナ部には隔壁5を設け、この隔壁5には上下方向のスリット6を形成している。
そして、隔壁5内には上下方向のスクリューネジ7を回転自在に保持し、このスクリューネジ7を底部のモータ8にて回転せしめるようにしている。
【0016】
前記スクリューネジ7には移し換えロボット10が支持されている。即ち、移し換えロボット10は支持体11に進退動可能に取り付けられたハンド12と、前記支持体11を垂直軸を中心として回転せしめるヘッド13と、このヘッド13を支持するプレート14からなり、プレート14の基端部はナット15を覆う形でナット15と一体化され、ナット15の上下部のプレート14基端部はスクリューネジ7との間に隙間を設け、この隙間は後述のファン16に連通する空間を設けている。
而して、モータ8にてスクリューネジ7を回転せしめることで移し換えロボット10は昇降動する。
【0017】
また、プレート14の下面にはファン16及びフィルタ17が取り付けられ、更に、移し換えゾーン4の天井部にはファン18及びフィルタ19が配置され、移し換えゾーン4の床部にはファン20及びフィルタ21が配置されている。
【0018】
而して、処理中は天井部のファン18(フィルタ19)及び床部のファン20(フィルタ21)によって移し換えゾーン4内には上下方向の気流が形成される。
また、プレート14下面のファン16を駆動することで、図3の矢印でに示すように、ハンド12の摺動によって発生した異物、スクリューネジ7とナット15との螺合部で発生した異物をフィルタ17に送り込み、フィルタ17で捕捉する。
【0019】
【発明の効果】
以上に説明したように本発明に係る処理ユニットによれば、処理ブロックに隣接して設けられる移し換えゾーンにロボットを昇降自在に設け、このロボット自体に発生した異物を捕捉するためのフィルタとこのフィルタに上方からエアを送り込むファンを設けたので、異物の最大の発生源であるロボットからの異物を有効に回収できる。
【0020】
特に、本発明にあってはファンによって移し換えゾーン内の気流の向きを乱すことがないので、除塵効果は更に向上する。
【図面の簡単な説明】
【図1】本発明に係る処理ユニットの全体図
【図2】本発明に係る処理ユニットの移し換えゾーンの詳細を示す図
【図3】図2の要部拡大図
【図4】図3のA部(プレート基端部周辺)の断面図
【図5】図4のA’ーA’線断面図
【図6】従来の処理ユニットの全体図
【図7】図6の要部拡大図
【符号の説明】
1…処理ユニット、2,3…処理ブロック、4…移し換えゾーン、5…隔壁、6…スリット、7…スクリューネジ、8…モータ、10…移し換えロボット、11…支持体、12…ハンド、13…ヘッド、14…プレート、15…ナット、16,18,20…ファン、17,19,21…フィルタ。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a processing unit that performs a series of processing on a semiconductor wafer, a glass substrate, and the like.
[0002]
[Prior art]
Many steps are required to form an integrated circuit on a semiconductor wafer or to form an element such as a TFT on a glass substrate.
For example, examples of steps for forming an excimer resist film on a substrate surface include dehydration bake, BARC (bottom anti-reflection coating) application, bake, resist pretreatment, resist application, pre-bake, exposure, and post-exposure bake. (PEB), development and post-baking steps.
[0003]
Conventionally, in order to continuously perform the above-described steps, apparatuses for performing the respective steps are arranged in a line shape in the order of the steps while being horizontally separated from each other. For this reason, the occupied area increases, and it is difficult to omit or add steps.
[0004]
Therefore, an apparatus disclosed in Japanese Patent Application Laid-Open No. 9-205047 is known as an apparatus that performs processing intensively at one place.
As shown in FIG. 6 and FIG. 7 which is an enlarged view of a main part thereof, the apparatus disclosed in the prior art has processing blocks 100 and 200 disposed on the left and right sides, and a transfer zone 300 at the center, and the processing block 100 is configured by stacking a post-baking device 101, a pre-baking device 102, a cooling device 103, and the like. The processing block 200 is configured by stacking coating devices 201 and 202 and a filter 203.
[0005]
The transfer zone 300 is provided with a robot 301 for transferring the workpiece between the processing blocks 100 and 200 and between the devices constituting the processing blocks 100 and 200.
[0006]
As means for moving the robot 301 up and down, although not specifically described in the above-mentioned publication, for example, a screw screw 303 is arranged inside a partition 302 and the robot screw 301 is attached to the screw screw 303. It is conceivable that a part of the screw is screwed and the screw is moved up and down according to the forward / reverse rotation of the screw 303.
[0007]
Also, clean air is supplied from the ceiling of the transfer zone 300 through the filter 304 into the zone, the floor is made of perforated metal 305, and an exhaust fan 306 is disposed below the floor, so that the inside of the transfer zone 300 A vertical airflow is formed to make it difficult for foreign matter to enter each device constituting the processing blocks 100 and 200. Note that the air from the exhaust fan 306 is supplied to the filter 304 via a chemical filter 307 disposed on the filter 304 on the ceiling and is reused.
[0008]
[Problems to be solved by the invention]
In the processing unit, a portion where foreign matter such as fine metal powder is most likely to be generated is a robot portion accompanied by movement such as sliding and rotation.
However, in the above-described conventional processing unit, foreign matter generated from the robot 301 cannot be sufficiently removed because only the vertical airflow is formed in the transfer zone 300.
[0009]
For this reason, the same publication proposes to provide a fan below the robot 301 and discharge foreign matter generated by the fan to the inside of the partition wall 302 in which the screw screw 303 is stored.
However, the above proposal attempts to discharge air containing foreign matter into the inside of the partition 302 through a narrow slit, and cannot sufficiently remove the generated foreign matter. Conversely, if the width of the slit is increased, the air can be easily discharged to the inside of the partition, but foreign matter is generated from the inside of the partition.
In addition, the flow of the airflow in the horizontal direction is generated by the fan, and the configuration in which the airflow in the vertical direction is formed and the foreign matter is sent under the floor is disturbed, and the yield is rather lowered.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a processing unit by providing a transfer zone adjacent to a processing block configured by stacking a plurality of processing devices, and moving a transfer robot up and down in the transfer zone. It is movably arranged and has a clean air blowing section on the ceiling, an air discharging section on the floor, and a filter for capturing foreign matter generated from the robot and the like in the transfer robot. A fan for feeding air from above to the filter was provided.
[0011]
Further, as a specific configuration, a partition is provided in the transfer zone, a drive member for moving the transfer robot up and down is arranged inside the partition, a base is connected to the drive member, and the base is connected to the drive member. A head for turning the robot around a vertical axis, an arm for taking in and out the object to be processed, and a filter for catching foreign matter are provided on the base so as to face the transfer zone through a slit formed in the partition wall. It is also possible to support the fan that sends air to the filter.
[0012]
With the above-described configuration, it is possible to reliably capture the foreign matter generated due to the operation of the robot, and to further promote the vertical airflow formed in the transfer zone in the middle part of the zone. As a result, effective countermeasures against foreign substances are taken.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Here, FIG. 1 is an overall view of a processing unit according to the present invention, FIG. 2 is a view showing details of a transfer zone of the processing unit according to the present invention, FIG. 3 is an enlarged view of a main part of FIG. 2, and FIG. 3 is a cross-sectional view of the portion A (around the base end of the plate), and FIG. 5 is a cross-sectional view taken along the line A'-A 'of FIG.
[0014]
The processing unit 1 is composed of a pair of processing blocks 2 and 3 and a transfer zone 4 provided between the pair of processing blocks 2 and 3. It is configured.
As in the above-described prior art, a baking device, a cooling device, a coating device using a rotating cup, an exposure device, a developing device, and the like are incorporated in each of the processing blocks 2 and 3 so as to be vertically stacked. In FIG. 1, each device is shown in a detached state in order to see through the transfer zone 4.
[0015]
A partition 5 is provided at a corner of the transfer zone 4, and a vertical slit 6 is formed in the partition 5.
A vertical screw screw 7 is rotatably held in the partition wall 5, and the screw screw 7 is rotated by a motor 8 at the bottom.
[0016]
A transfer robot 10 is supported on the screw 7. That is, the transfer robot 10 comprises a hand 12 attached to a support 11 so as to be able to move forward and backward, a head 13 for rotating the support 11 about a vertical axis, and a plate 14 for supporting the head 13. The base end of 14 is integrated with the nut 15 so as to cover the nut 15, and the base end of the plate 14 above and below the nut 15 is provided with a gap between the screw and the screw 7. A communicating space is provided.
The transfer robot 10 moves up and down by rotating the screw 7 with the motor 8.
[0017]
Further, a fan 16 and a filter 17 are mounted on the lower surface of the plate 14, a fan 18 and a filter 19 are arranged on the ceiling of the transfer zone 4, and a fan 20 and a filter are mounted on the floor of the transfer zone 4. 21 are arranged.
[0018]
Thus, during processing, a vertical airflow is formed in the transfer zone 4 by the fan 18 (filter 19) on the ceiling and the fan 20 (filter 21) on the floor.
By driving the fan 16 on the lower surface of the plate 14, as shown by the arrow in FIG. 3, foreign matter generated by sliding of the hand 12 and foreign matter generated by a screwing portion between the screw 7 and the nut 15 are removed. It is sent to the filter 17 and captured by the filter 17.
[0019]
【The invention's effect】
As described above, according to the processing unit of the present invention, a robot is provided in a transfer zone provided adjacent to a processing block so as to be able to move up and down, and a filter for capturing foreign matter generated in the robot itself and a filter for capturing the foreign matter. Since the filter is provided with a fan for sending air from above, foreign matter from the robot, which is the largest source of foreign matter, can be effectively collected.
[0020]
In particular, in the present invention, since the direction of the air flow in the transfer zone is not disturbed by the fan, the dust removing effect is further improved.
[Brief description of the drawings]
FIG. 1 is an overall view of a processing unit according to the present invention; FIG. 2 is a view showing details of a transfer zone of the processing unit according to the present invention; FIG. 3 is an enlarged view of a main part of FIG. 2 FIG. FIG. 5 is a cross-sectional view taken along line A′-A ′ of FIG. 4; FIG. 6 is an overall view of a conventional processing unit; FIG. 7 is an enlarged view of a main part of FIG. 6; Explanation of code]
DESCRIPTION OF SYMBOLS 1 ... Processing unit, 2, 3 ... Processing block, 4 ... Transfer zone, 5 ... Partition wall, 6 ... Slit, 7 ... Screw screw, 8 ... Motor, 10 ... Transfer robot, 11 ... Support body, 12 ... Hand, 13: Head, 14: Plate, 15: Nut, 16, 18, 20: Fan, 17, 19, 21: Filter.

Claims (1)

複数の処理装置を積層して構成される処理ブロックに隣接して移し換えゾーンを設け、この移し換えゾーンには移し換えロボットを昇降動可能に配置するとともに天井部には清浄なエアの吹出部を、床部にはエアの排出部を設けた処理ユニットにおいて、前記移し換えロボットは、ハンドを進退可能に取り付けた支持体と、この支持体を回転せしめるヘッドをプレート上に支持し、更にこのプレート下面にファン及びフィルタが取り付けられ、前記プレートにはナットが一体化し、このナットは上下方向のスクリューネジに螺合するとともにスクリューネジとプレートとの間に間隙が設けられ、この隙間を前記ファンに連通せしめる空間が前記プレートに形成され、この空間を介してハンドの摺動によって発生した異物またはスクリューネジから発生した異物をファンを駆動することでフィルタに送り込んで捕捉することを特徴とする処理ユニット。A transfer zone is provided adjacent to a processing block configured by stacking a plurality of processing devices, and a transfer robot is arranged in the transfer zone so as to be able to move up and down, and a clean air blowing unit is provided on a ceiling portion. In a processing unit provided with an air discharge unit on the floor, the transfer robot supports a support on which a hand is mounted so as to be able to move forward and backward, and a head for rotating the support on a plate. A fan and a filter are mounted on the lower surface of the plate, and a nut is integrated with the plate. The nut is screwed into a screw screw in a vertical direction, and a gap is provided between the screw screw and the plate. A space is formed in the plate to allow communication with a foreign matter or a screw screw generated by sliding of the hand through the space. Processing unit, characterized in that the capture by feeding the filter al generating foreign matter by driving the fan.
JP23366498A 1998-08-20 1998-08-20 Processing unit Expired - Fee Related JP3574570B2 (en)

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JP3574570B2 true JP3574570B2 (en) 2004-10-06

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Publication number Priority date Publication date Assignee Title
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) * 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
JP5569544B2 (en) * 2012-01-31 2014-08-13 株式会社安川電機 Transfer robot
JP5928185B2 (en) * 2012-06-19 2016-06-01 東京エレクトロン株式会社 Board transfer equipment
JP7316104B2 (en) * 2019-06-14 2023-07-27 株式会社日立ハイテク Wafer transfer device

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