JP3550472B2 - Ceramic wiring board - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a ceramic wiring board, and more particularly to a ceramic wiring board having a mark formed on a surface.
[0002]
[Prior art]
Generally, a mark for indicating a product number or a direction of the board may be formed on an outer surface of the ceramic wiring board. Conventionally, a metallized layer in the shape of a sign is printed on a ceramic green sheet, and after firing, nickel plating or gold plating is applied to enable recognition of the sign by the color difference between the formed plating layer and the ceramic wiring board. Had been.
[0003]
In this case, for example, when the sign is composed of a plurality of characters, a connector for connecting the sign metal members to each other is also formed because the metallized layer in the sign shape is subjected to electrolytic plating at a stroke.
[0004]
With reference to FIGS. 2 (a) to 2 (c) and FIG. 3, a description will be given of a conventional technique for forming three character markers "ABC" on one main surface of the ceramic wiring board 11. FIG. In FIG. 2A, each of the sign metal members 12 is connected to each other by a connecting member 13 formed between the sign metal members 12, and further, an external member brazed to a side surface via a conductor 14. The case where the output terminal 15 is electrically connected is shown. In FIG. 2B, a connection body 13 derived from each of the sign metal bodies 12 is connected to a conductor 14.
[0005]
FIG. 2C shows an example of a ceramic wiring board 11 in which a metal body for marking and an internal wiring are electrically connected to each other by using a via 16. In some cases, a via 16 is provided at a predetermined location and connected to an internal wiring 19.
[0006]
In addition, as shown in FIG. 3, in order to apply electrolytic plating to a plurality of markers, after providing a metallization layer 24 for conduction on the entire surface of a predetermined region on the ceramic wiring board 21, a portion serving as a marker is left. The other part is covered with a coating layer 28. Next, an example has been proposed in which the marking portion 20 is formed by performing electroplating on the uncovered conductive metallization layer 24 (see Japanese Utility Model Application Laid-Open No. 3-13742). Here, the conduction metallization layer 24 is connected to the internal wiring 29 via the via 26.
[0007]
[Problems to be solved by the invention]
However, in the example shown in FIGS. 2A to 2C, since the plating layers are formed on both the sign metal body 12 and the connection body 13 , the sign shape is visually observed, and particularly, in the image recognition. In some cases, recognition became difficult or a person misunderstood.
[0008]
Also, without connecting the respective labeling metal body 1 2 with connector, internal wiring to the case of separately connected in via a respective character portion, without providing a large number of vias 1 6 in the ceramic wiring substrate no longer must In addition to manufacturing difficulty, defects such as cracks and chips may occur.
[0009]
Further, in the substrate shown in FIG. 3, it is necessary to form a metallized layer or a coating layer having an electrical insulating property on a wide portion other than the sign portion, so that the metallized material and the insulating coating material are wasteful and costly. In general, when printing only the periphery so as to leave a mark portion, defects such as bleeding are likely to occur, and it is difficult to form a clear mark. In addition, since the wide metallized layer is covered with the insulating layer, defects such as sharpening and pinholes occur, and if a plating layer is formed on such a portion, the sign is likely to be erroneously recognized .
[0010]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a ceramic wiring board in which easily recognizable signs are formed relatively inexpensively and easily.
[0011]
[Means for Solving the Problems]
2. The means according to claim 1, wherein a plurality of metal markings for identifying said ceramic wiring board are provided on one main surface of the ceramic wiring board, and a connecting body connecting said plurality of metal markings to each other. The invention further provides a ceramic wiring board comprising: a connector coating layer that covers the connector and has electrical insulating properties; and a plating layer that is applied on the sign metal body.
[0012]
Here, the metal body for a sign refers to a metal layer formed in substantially the same shape as a sign when forming a sign such as a character, a number, or a symbol. For example, a metallized layer of W, Mo, Ag, Cu, or the like formed by printing and firing may be used. The connecting body coating layer covers the connecting body formed of a metallized layer for connecting and electrically connecting the metal objects for marking. In this way, when the electrolytic plating is performed, the connecting portion is covered with the connecting member coating layer, so that the plating layer is formed only on the metal body for the sign, so that the sign can be easily recognized and misidentification can be avoided. it can.
[0013]
3. The means according to claim 2, further comprising a conductor extending from said metal sign or said connection body to a side surface of said ceramic wiring board and connected to an internal wiring or an external connection terminal, at least on said one main surface. 2. A ceramic wiring board according to claim 1, wherein a conductor coating layer is provided on the conductor near the metal body for marking or the connector.
[0014]
A conductor can be formed at the same time as a connector, and a connector coating layer and a conductor coating layer can be formed at the same time. Therefore, there is no need to form a via and processing is easy, and there are no defects such as cracks or chips. There is [0015]
According to a third aspect of the present invention, there is provided a ceramic wiring board according to the first aspect, wherein the conductor or the connection body is connected to an internal wiring through a via. In this case, the number of vias can be reduced as compared with the case where vias are formed in all the sign metal bodies and each sign metal body is connected to the internal wiring, so that cracks and chipping are less likely to occur. .
[0016]
According to a fourth aspect of the present invention, there is provided a ceramic wiring board according to any one of the first to third aspects, wherein the connecting body has a pattern having a width smaller than that of the marking metal body. In this case, when the connecting body is covered with the coating layer made of an electrically insulating material, even if it protrudes slightly, it is not conspicuous, so that the sign can be easily recognized.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 of the present invention will be described with reference to FIGS. 1 (a) to 1 (c). In the present embodiment, three character markers "ABC" are formed on the ceramic wiring board. In FIG. 1A, a metal sign 2 having the same shape as the character mark “ABC” and a connecting body 3 for connecting the metal signs 2 to each other are formed on the outer surface of the ceramic substrate 1. ing. Further, the connection body 3 is connected to the external output terminal 5 via the conductor 4. The sign metal member 2, the connection member 3, and the conductor 4 are formed from a conductive material such as W, Mo, Ag, Cu, and Ag-Pd.
[0018]
Further, the connector 3 and the conductor 4 are covered with a connector coating layer 7 and a conductor coating layer 8 made of an insulating material, respectively. As the insulating material, preferably formed with the same insulating material as the ceramic substrate 1. A plating layer is formed on the metal body for marking 2 by electrolytic plating. As the plating layer, for example, gold or nickel is used.
[0019]
The following procedure was used to form such a label. A tungsten paste is printed in a predetermined shape on the alumina ceramic green sheet serving as the surface of the ceramic wiring board 1 so as to form the metal body for marking 2, the connecting body 3 and the conductor 4. Note that the ceramic green sheet contains an additive such as tungsten oxide which is adjusted to be black-brown after firing. An alumina paste having a composition substantially the same as that of the green sheet is screen-printed on the pattern to be the connection body 3 and the conductor 4 to form an alumina paste layer to be the connection body coating layer 7 and the conductor coating layer 8. After that, the green sheets are laminated and fired to form the ceramic wiring board 1. Next, if necessary, after a terminal (not shown) is brazed, an electric current is passed through the terminal and the internal wiring, and further to the exposed metal body for the sign via the conductor 2 and the connector 3. To form an electrolytic plating layer. Note that an Au plating layer on the Ni plating layer was formed as a Ni layer as a plating layer. At this time, since the coating is covered with the insulating coating layer, no plating layer is formed on the connection body 3 and the conductor 4, and a plating layer is formed only on the sign metal body 2. In this way, the gold Au plating is formed on the metal marking body 2, but the connection body 3 and the conductor 4 are black, which is the color of W, and the alumina coating layer 7 , 8 are also formed in black, so that they have a color difference from the Au plating layer and can be easily identified.
[0020]
FIG. 1B shows a second embodiment in which each of the marking metal members 2 is led out to a conductor 4 via a connection member 3. In this case, there is no need to secure a gap between the signs, as compared with the first embodiment in which the connecting body 3 is formed between the signs. In addition, since the connector coating layer 7 and the conductor coating layer 8 are printed at a time, the printing pattern can be simplified.
[0021]
Further, FIG. 1C shows a third embodiment in which each of the sign metal members 2 is connected by a connector 3 and is electrically connected to the internal wiring 9 through the via 6. The connectors 3 are each covered with a connector coating layer 7. In this case, a separate step of providing a through-hole in the ceramic green sheet and filling the through-hole with a conductive paste is required. However, the first and second conductive members are likely to have poor conduction at the corners of the substrate 1. This embodiment, in which the connection is made by the via 6, is more secure than the embodiment.
[0022]
In each of the above embodiments, an example of a character sign of "ABC" of three alphabets has been described. However, it is needless to say that the sign may have any shape such as a character, a numeral, and a symbol.
[0023]
【The invention's effect】
As described above, according to the present invention, the plating layer is formed only on the sign metal layer, so that the sign is clearly formed, the recognition becomes easy, and the recognition difficulty and the erroneous recognition are eliminated.
[0024]
Further, when the connecting body and the conductor are formed of wiring thinner than the metal body for marking, when the connecting body and the conductor are coated with the coating layer, they can be easily covered and can be prevented from protruding from the coating layer.
[Brief description of the drawings]
FIG. 1 (a) is a perspective view of a ceramic wiring board 1 in which a connector coating layer 7 and a conductor coating layer 8 are formed on a connector 3 and a conductor 4, respectively.
(B) A perspective view of the ceramic wiring board 1 in which the connector coating layer 7 and the conductor coating layer 8 are collectively formed on the connector 3 and the conductor 4.
(C) A perspective view of the ceramic wiring board 1 in which the metal body for marking 2 and the internal wiring are connected via the via 6 and the connecting body coating layer 7 is formed on the connecting body 3.
FIG. 2 (a) is a view of a ceramic wiring board 11 electrically connected to a metal body 12 for marking by a connecting body 13 between the metal bodies 12 for marking and further connected to an external output terminal 15 via a conductive body 14. Perspective view.
(B) Perspective view of the conductive body 14 that conducts to the external output terminal 15 and the ceramic wiring board 11 connected to the conductive body 14 by the connecting body 13, respectively.
(C) The perspective view of the ceramic wiring board 11 in which the metal body 12 for marking is electrically connected by the connecting body 13 between the metal bodies 12 for marking and connected to the internal wiring via the via.
FIG. 3 shows a ceramic in which a marking portion 20 is formed on a conductive metallization layer 24 on a ceramic wiring board 21 with a coating layer 28, leaving a mark portion. FIG. 3 is a perspective view of the wiring board 21.
[Explanation of symbols]
1, 11, 21: ceramic wiring board 2, 12: metal sign 3, 13: connector 4, 14: conductor 5, 15: external output terminal 6, 16, 26: via 7: connector coating layer 8 : conductive material coating layer 9, 19, 29: internal wiring 20: labeling unit 24: conducting metallization layer 28: quotes I ing layer

Claims (3)

In order to identify the ceramic wiring board on one main surface of the ceramic wiring board, a plurality of metal objects for marking that are printed and fired in the form of letters, numbers or symbols ,
The plurality of sign metal bodies are connected to each other, and a connection body for energization formed by a thinner wiring than the sign metal bodies ,
A connection body coating layer covering the connection body and having electrical insulation properties,
Having an electrolytic plating layer adhered on the metal body for marking ,
The ceramic wiring board, wherein the connection body coating layer is formed of a ceramic having the same composition as the ceramic constituting the one main surface, and is integrated with the connection body by firing . A conductor extending from the metal body for labeling or the connecting body to a side surface of the ceramic wiring board and connected to an internal wiring or an external connection terminal,
2. The ceramic wiring board according to claim 1, further comprising a conductor coating layer on at least one of the main surface and the conductor near the marker metal body or the connection body. 2. The ceramic wiring board according to claim 1, wherein the conductor or the connection body is connected to an internal wiring through a via.

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