JP3511109B2 - Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device - Google Patents

Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device

Info

Publication number
JP3511109B2
JP3511109B2 JP19609594A JP19609594A JP3511109B2 JP 3511109 B2 JP3511109 B2 JP 3511109B2 JP 19609594 A JP19609594 A JP 19609594A JP 19609594 A JP19609594 A JP 19609594A JP 3511109 B2 JP3511109 B2 JP 3511109B2
Authority
JP
Japan
Prior art keywords
power
power failure
control device
semiconductor processing
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19609594A
Other languages
Japanese (ja)
Other versions
JPH07152401A (en
Inventor
正則 安藤
直泰 森下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP19609594A priority Critical patent/JP3511109B2/en
Publication of JPH07152401A publication Critical patent/JPH07152401A/en
Application granted granted Critical
Publication of JP3511109B2 publication Critical patent/JP3511109B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Safety Devices In Control Systems (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体処理装置の供給
電力制御方法及び半導体処理装置の供給電力制御装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling power supply to a semiconductor processing apparatus and a power supply control apparatus for semiconductor processing apparatus.

【０００２】[0002]

【従来の技術】半導体製造工場では多数の製造工程があ
り、各製造工程にはそれぞれの半導体処理装置が複数設
置され、これらの半導体処理装置によって同一処理を一
括して行ない量産態勢を整えていることが多い。そし
て、全工程の各半導体処理装置の制御装置は中央制御管
理室に統合され、各製造工程における各半導体処理装置
を中央制御管理室において全体を監視できるように構成
されている。2. Description of the Related Art A semiconductor manufacturing factory has a large number of manufacturing processes, and a plurality of semiconductor processing devices are installed in each manufacturing process. These semiconductor processing devices collectively carry out the same processing to prepare for mass production. Often. The control device for each semiconductor processing apparatus in all processes is integrated into the central control management room, and the semiconductor processing devices in each manufacturing process can be entirely monitored in the central control management room.

【０００３】半導体製造工場では各製造工程それぞれ同
一の半導体処理装置を複数備えて半導体処理装置群が構
成され、各半導体処理装置群で大量の電力を消費する。
また、各半導体処理装置群はそれぞれ制御装置を備え、
群毎に供給電力などを一括管理するようにしている。ま
た、各半導体処理装置群を構成する各半導体処理装置も
それぞれを個別に制御する制御装置を備えている。従っ
て例えば、落雷などにより一時的に停電したりすると、
それに伴って各半導体処理装置群への電力の供給が停止
して被処理体の処理が中断し、場合によっては処理中の
被処理体を駄目にしてしまうことがある。しかし、落雷
などによる短時間の停電の場合には、電源は通常早期に
回復し、その後継続して被処理体を処理すれば処理中の
被処理体を救済できることがある。In a semiconductor manufacturing factory, a semiconductor processing device group is provided with a plurality of semiconductor processing devices that are the same for each manufacturing process, and each semiconductor processing device group consumes a large amount of electric power.
Further, each semiconductor processing device group includes a control device,
The power supply etc. is managed collectively for each group. Further, each semiconductor processing device forming each semiconductor processing device group is also provided with a control device for individually controlling each semiconductor processing device group. Therefore, for example, if there is a temporary power outage due to a lightning strike,
Along with that, the supply of electric power to each semiconductor processing device group is stopped, the processing of the object to be processed is interrupted, and in some cases, the object to be processed is ruined. However, in the case of a short-term power failure due to a lightning strike or the like, the power source usually recovers early, and if the object to be processed is continuously processed thereafter, the object to be processed may be salvaged.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、停電
後、電力供給が開始されると、停電時における処理温
度、真空度などの条件を短時間で回復しようとして半導
体処理装置群に対して大容量の電力を同時に供給するた
め、電流制限器が作動して電力の供給を停止してしま
い、この停止後直ぐに時電流制限器を投入して電力供給
を開始しても、また同様の理由から電流制限器が作動
し、この電流制限器の操作を繰り返していると処理の中
断時間が長引き、電源が短時間で回復しても半導体処理
装置群での本来の処理をそのまま継続できず、処理中の
被処理体を駄目にする虞があり、特に被処理体をバッチ
処理を行なっている場合には特にその損失が甚大になる
などという課題があった。However, when the power supply is started after the power failure, a large capacity is applied to the semiconductor processing apparatus group in order to recover the conditions such as the processing temperature and the vacuum degree at the time of the power failure in a short time. Since the power is supplied at the same time, the current limiter is activated to stop the power supply, and even if the current limiter is turned on to start the power supply immediately after this stop, the current limiter is also activated for the same reason. If the device operates and the operation of this current limiter is repeated, the interruption time of the process will be prolonged, and even if the power supply is restored in a short time, the original process in the semiconductor processing device group cannot be continued as it is, There is a problem that the object to be processed may be ruined, and especially when the object to be processed is subjected to batch processing, there is a problem in that the loss becomes extremely large.

【０００５】本発明は、上記課題を解決するためになさ
れたもので、停電後、瞬時停電のように短時間で電源が
回復した場合、電流制限器を作動させることなく半導体
処理装置へ電力を供給して半導体処理装置を円滑に立ち
上げて処理を再開、継続し、処理中の被処理体を救済で
きる半導体処理装置の電力供給制御方法及び半導体処理
装置の電力供給制御装置を提供することを目的としてい
る。The present invention has been made to solve the above problems, and when the power is restored in a short time after a power failure such as an instantaneous power failure, power is supplied to the semiconductor processing apparatus without operating the current limiter. To provide a power supply control method for a semiconductor processing device and a power supply control device for a semiconductor processing device, which can supply the semiconductor processing device, smoothly start up the semiconductor processing device, restart and continue the processing, and relieve an object being processed. Has an aim.

【０００６】また、本発明は、停電時も電流制限器を作
動させることなく複数の半導体処理装置へ電力を供給し
て各半導体処理装置による処理を円滑に継続し、しかも
電源回復後もそのまま処理を継続して処理中の被処理体
を救済できる半導体処理装置の電力供給制御方法及び半
導体処理装置の電力供給制御装置を提供することを目的
としている。Further, according to the present invention, power is supplied to a plurality of semiconductor processing devices without operating the current limiter even during a power failure so that the processing by each semiconductor processing device can be smoothly continued, and further, the processing is performed as it is even after the power is restored. It is an object of the present invention to provide a power supply control method for a semiconductor processing device and a power supply control device for a semiconductor processing device capable of continuously relieving an object being processed.

【０００７】[0007]

【課題を解決するための手段】本発明の請求項１に記載
の半導体処理装置の供給電力制御方法は、制御装置によ
り電力操作部を制御しながら半導体処理装置によって被
処理体を処理している最中に、停電により中断した被処
理体の処理を電源の回復後にそのまま継続させる半導体
処理装置の供給電力制御方法であって、停電時にバック
アップ装置により上記制御装置の電源をバックアップす
ると共に上記制御装置へ停電に関する停電検出信号を送
信するステップと、上記停電検出信号に基づいて上記制
御装置から上記電力操作部へ電力制限信号を送信するス
テップと、上記電力制限信号に基づいて上記電力操作部
を操作して回復後の上記電源からの供給電力を停電直前
の供給電力の一定割合に制限して上記処理装置本体へ供
給するステップを有するものである。According to a supply power control method of a semiconductor processing apparatus according to a first aspect of the present invention, a semiconductor processing apparatus processes an object to be processed while controlling a power operating section by the control apparatus. A method for controlling the power supply of a semiconductor processing device in which the processing of an object to be processed interrupted by a power failure is continued as it is after the power is restored, wherein the backup device backs up the power source of the control device and the control device A step of transmitting a power failure detection signal related to a power failure to the power controller, a step of transmitting a power limit signal from the control device to the power operation unit based on the power failure detection signal, and a step of operating the power operation unit based on the power limit signal. Then, the step of supplying the electric power from the power source after the recovery to the main body of the processing device by limiting the electric power supplied from the power source to a fixed ratio of the electric power immediately before the power failure It is intended to.

【０００８】また、本発明の請求項２に記載の半導体処
理装置群の供給電力制御方法は、制御装置により電力操
作部を制御しながら半導体処理装置によって被処理体を
処理している最中に、停電により中断した被処理体の処
理を電源の回復後にそのまま継続させる半導体処理装置
の供給電力制御方法であって、停電時にバックアップ装
置により上記制御装置の電源をバックアップすると共に
上記制御装置へ停電に関する停電検出信号を送信するス
テップと、上記停電検出信号に基づいて上記電力操作部
を操作して回復後の上記電源からの供給電力をランピン
グ増加させながら上記処理装置本体へ供給するステップ
を有するものである。According to a second aspect of the present invention, there is provided a method for controlling power supply to a semiconductor processing apparatus group, wherein the semiconductor processing apparatus is processing an object to be processed while controlling the electric power operating section by the control apparatus. A method for controlling power supply of a semiconductor processing device for continuing processing of an object to be processed interrupted by a power failure after power recovery, wherein a backup device backs up the power source of the control device at the time of power failure and relates to the power failure to the control device. And a step of transmitting a power failure detection signal and a step of operating the power operation unit based on the power failure detection signal to increase the power supplied from the power source after recovery by ramping to the processing apparatus main body. is there.

【０００９】また、本発明の請求項３に記載の半導体処
理装置の供給電力制御方法は、制御装置のＰＩＤ調節器
により電力操作部を制御しながら半導体処理装置によっ
て被処理体を処理している最中に、停電により中断した
被処理体の処理を電源の回復後にそのまま継続させる半
導体処理装置の供給電力制御方法であって、停電時にバ
ックアップ装置により上記制御装置の電源をバックアッ
プすると共に制御装置へ停電に関する停電検出信号を送
信するステップと、上記制御装置を介して上記ＰＩＤ調
節器の積分値を停電直前の積分値にセットするステップ
と、停電直前の積分値に従って上記電力操作部を操作し
て上記処理装置本体へ電力を供給するステップを有する
ものである。According to a third aspect of the present invention, there is provided a method for controlling power supply to a semiconductor processing apparatus, in which a semiconductor processing apparatus processes an object to be processed while controlling a power operating unit by a PID controller of the control apparatus. A method for controlling the power supply of a semiconductor processing device in which the processing of an object to be processed interrupted by a power failure is continued as it is after the power is restored. A step of transmitting a power failure detection signal regarding a power failure, a step of setting the integrated value of the PID controller to an integrated value immediately before the power failure via the control device, and a step of operating the power operation unit according to the integrated value immediately before the power failure. It has a step of supplying electric power to the processing apparatus main body.

【００１０】また、本発明の請求項４に記載の半導体処
理装置の供給電力制御装置は、制御装置により電力操作
部を制御しながら半導体処理装置によって被処理体を処
理している最中に、停電により中断した被処理体の処理
を電源の回復後にそのまま継続させる半導体処理装置の
供給電力制御装置において、停電時に上記制御装置の電
源をバックアップすると共に上記制御装置へ停電に関す
る停電検出信号を送信するバックアップ装置を設けると
共に、このバックアップ装置の停電検出信号を受信した
上記制御装置を介して電力制限信号を上記電力操作部へ
送信する電力制限素子を設け、電源回復後には上記電力
制限素子の電力制限信号に基づいて上記電力操作部を操
作して半導体処理装置本体へ供給する電力を制限するも
のである。According to a fourth aspect of the present invention, there is provided a power supply controller for a semiconductor processing apparatus, wherein the semiconductor processing apparatus is processing an object to be processed while controlling the power operating section by the controller. In a power supply control device of a semiconductor processing device that continues processing of an object to be processed interrupted by a power failure after recovery of power, in a power failure, the power supply of the control device is backed up and a power failure detection signal related to the power failure is transmitted to the control device. In addition to providing a backup device, a power limiting element that transmits a power limiting signal to the power operating unit via the control device that receives a power failure detection signal of the backup device is provided, and after the power is restored, power limiting of the power limiting element is performed. The power operating unit is operated based on a signal to limit the power supplied to the semiconductor processing apparatus main body.

【００１１】また、本発明の請求項５に記載の半導体処
理装置の供給電力制御方法は、制御装置による制御下で
複数の半導体処理装置によって被処理体をそれぞれ処理
している最中に停電により電源が切れた時に、各半導体
処理装置による処理をそのまま継続させる半導体処理装
置の供給電力制御方法であって、停電時に電源を自家発
電装置の電源に切り替えると共に自家発電装置から上記
制御装置へ停電に関する停電検出信号を送信するステッ
プと、上記停電検出信号を受信した上記制御装置を介し
て電力制限信号を同時に送信して上記各半導体処理装置
を同時に稼動させるステップと、上記電源の回復後に上
記自家発電装置を上記電源に切り替えて上記各半導体処
理装置を順次稼動させるステップとを有するものであ
る。Further, according to a fifth aspect of the present invention, there is provided a power supply control method for a semiconductor processing apparatus, wherein a power failure occurs during processing of an object to be processed by a plurality of semiconductor processing apparatuses under the control of the control apparatus. A power supply control method for a semiconductor processing device that continues processing by each semiconductor processing device as it is when the power is cut off, and switches the power supply to the power supply of the private power generation device during a power failure and also relates to the power failure from the private power generation device to the control device. A step of transmitting a power failure detection signal, a step of simultaneously transmitting a power limitation signal via the control device that has received the power failure detection signal to operate the semiconductor processing devices at the same time, and the private power generation after restoration of the power supply Switching the apparatus to the power source and sequentially operating the respective semiconductor processing apparatuses.

【００１２】また、本発明の請求項６に記載の半導体処
理装置の供給電力制御装置は、制御装置による制御下で
複数の半導体処理装置によって被処理体をそれぞれ処理
している最中に停電により電源が切れた時に、各半導体
処理装置による処理をそのまま継続させる半導体処理装
置の供給電力制御装置であって、停電時に上記電源をバ
ックアップすると共に上記制御装置へ停電に関する停電
検出信号を送信する自家発電装置を設けると共にこの自
家発電装置の停電検出信号を受信した上記制御装置を介
して電力制限信号を上記各半導体処理装置へ同時に送信
する電力制限素子を設け、且つ上記制御装置には電源回
復後に上記各半導体処理装置を同時に順次稼動させるシ
ーケンス制御装置を設けたものである。Further, according to a sixth aspect of the present invention, there is provided a power supply control device for a semiconductor processing apparatus, which is operated by a plurality of semiconductor processing apparatuses under the control of the control apparatus to process an object to be processed. A power supply control device for a semiconductor processing device that continues processing by each semiconductor processing device when the power is turned off, which is a self-generated power source that backs up the power supply in the event of a power failure and sends a power failure detection signal related to the power failure to the control device. A power limiting element for simultaneously transmitting a power limiting signal to each of the semiconductor processing devices is provided through the control device that receives the power failure detection signal of the private power generation device, and the control device is provided with A sequence control device for simultaneously operating each semiconductor processing device is provided.

【００１３】[0013]

【作用】本発明の請求項１に記載の発明によれば、制御
装置により電力操作部を制御しながら複数の半導体処理
装置それぞれによって被処理体を同時に処理している最
中に、停電により被処理体の処理が中断した場合には、
停電時にバックアップ装置により制御装置の電源をバッ
クアップすると共にバックアップ装置から停電に関する
停電検出信号を制御装置へ送信する。制御装置では停電
検出信号を受信し、電力制限信号を電力操作部へ送信す
ると、電力操作部が電力制限信号に基づいて電源の供給
電力を操作して停電直前の供給電力の一定割合に制限し
て処理装置本体へ電力を供給すると、電源回復後には電
源を切らすことなく処理装置による停電前の処理をその
まま継続することができる。According to the first aspect of the present invention, while the object to be processed is simultaneously processed by each of the plurality of semiconductor processing devices while controlling the electric power operation unit by the control device, the object to be processed due to the power failure is generated. If the processing of the processing object is interrupted,
When a power failure occurs, the backup device backs up the power supply of the control device, and the backup device sends a power failure detection signal related to the power failure to the control device. When the control device receives the power failure detection signal and transmits the power limit signal to the power operation unit, the power operation unit operates the power supply of the power supply based on the power limit signal to limit the power supply to a certain ratio immediately before the power failure. When the power is supplied to the processing apparatus main body by the processing, the processing before the power failure by the processing apparatus can be continued as it is without powering off after the power is restored.

【００１４】また、本発明の請求項２に記載の発明によ
れば、制御装置により電力操作部を制御しながら半導体
処理装置によって被処理体を処理している最中に、停電
により被処理体の処理が中断した場合には、停電時にバ
ックアップ装置により制御装置の電源をバックアップす
ると共にバックアップ装置から停電に関する停電検出信
号を制御装置へ送信する。制御装置では停電検出信号を
受信し、電力制限信号を電力操作部へ送信すると、電力
操作部が電力制限信号に基づいて電源の供給電力を操作
して回復後の上記電源からの供給電力をランピング増加
させながら上記処理装置本体へ供給すると、電源回復後
には電源を切らすことなく処理装置による停電前の処理
を継続することができる。According to the second aspect of the present invention, the object to be processed is caused by a power failure while the object to be processed is being processed by the semiconductor processing apparatus while controlling the electric power operation unit by the controller. If the processing of (1) is interrupted, the backup device backs up the power supply of the control device at the time of a power failure, and the backup device transmits a power failure detection signal related to the power failure to the control device. When the control device receives the power failure detection signal and transmits the power limit signal to the power operation unit, the power operation unit operates the power supply of the power source based on the power limit signal to ramp the power supplied from the power source after recovery. When the power is supplied to the main body of the processing apparatus while increasing the number, it is possible to continue the processing before the power failure by the processing apparatus without turning off the power after the power is restored.

【００１５】また、本発明の請求項３に記載の発明によ
れば、制御装置のＰＩＤ調節器により電力操作部を制御
しながら半導体処理装置によって被処理体を処理してい
る最中に、停電により中断した場合には、停電時にバッ
クアップ装置により制御装置の電源をバックアップする
と共に制御装置へ停電に関する停電検出信号を送信す
る。制御装置では停電検出信号を受信し、電力制限信号
を電力操作部へ送信すると、電力操作部が電力制限信号
に基づいて電源の供給電力を操作して回復後の上記電源
からの供給電力をランピング増加させながら上記処理装
置本体へ供給すると、電源を切らすことなく処理装置に
よる停電前の処理をそのまま継続することができる。制
御装置では停電検出信号を受信し、この制御装置を介し
てＰＩＤ調節器の積分値を停電直前の積分値にセットす
る。その後、ＰＩＤ調節器の積分値により電力操作部を
操作して処理装置本体へ電力を供給すると、電源回復後
には電源を切らすことなく処理装置による停電前の処理
を継続することができる。According to the third aspect of the present invention, a power failure occurs while the semiconductor processing apparatus is processing the object to be processed while controlling the power operating unit by the PID controller of the control apparatus. In the case of interruption due to, the power supply of the control device is backed up by the backup device at the time of power failure, and a power failure detection signal related to the power failure is transmitted to the control device. When the control device receives the power failure detection signal and transmits the power limit signal to the power operation unit, the power operation unit operates the power supply of the power source based on the power limit signal to ramp the power supplied from the power source after recovery. When the power is supplied to the processing apparatus main body while increasing the number, the processing before the power failure by the processing apparatus can be continued as it is without shutting off the power. The control device receives the power failure detection signal and sets the integral value of the PID controller to the integral value immediately before the power failure via this controller. After that, when the power operation unit is operated by the integrated value of the PID controller to supply power to the processing apparatus main body, after the power is restored, the processing before the power failure by the processing apparatus can be continued without shutting off the power.

【００１６】また、本発明の請求項４に記載の発明によ
れば、制御装置により電力操作部を制御しながら半導体
処理装置によって被処理体を処理している最中に、停電
により処理が中断した場合には、バックアップ装置によ
り制御装置の電源をバックアップすると共にバックアッ
プ装置から制御装置へ停電に関する停電検出信号を送信
する。制御装置では停電検出信号を受信し、電力制限信
号を電力操作部へ送信すると、電力操作部が電力制限信
号に基づいて電源の供給電力を操作して回復後の上記電
源からの供給電力を制限しながら上記処理装置本体へ供
給すると、電源回復後には電源を切らすことなく処理装
置による停電前の処理を継続することができる。According to the fourth aspect of the present invention, the processing is interrupted due to a power failure while the semiconductor processing apparatus is processing the object to be processed while controlling the power operation unit by the control apparatus. In such a case, the backup device backs up the power supply of the control device, and the backup device transmits a power failure detection signal regarding the power failure to the control device. When the control device receives the power failure detection signal and transmits the power limit signal to the power operation unit, the power operation unit operates the power supply of the power source based on the power limit signal to limit the power supply from the power source after recovery. However, when the power is supplied to the main body of the processing apparatus, it is possible to continue the processing before the power failure by the processing apparatus without turning off the power after the power is restored.

【００１７】また、本発明の請求項５及び請求項６に記
載の発明によれば、制御装置による制御下で複数の半導
体処理装置によって被処理体をそれぞれ処理している最
中に停電により電源が切れた時には、停電時には電源を
自家発電装置の電源に切り替えると共に自家発電装置か
ら制御装置へ停電に関する停電検出信号を送信する。こ
れにより制御装置では停電検出信号を受信した後、各半
導体処理装置へ電力制限信号を同時に送信して自家発電
装置の電源を切らすことなく上記各半導体処理装置を同
時に稼動させることができる。そして、電源が回復した
後には自家発電装置を電源に切り替えて各半導体処理装
置を順次稼動させるため、電源を切らすことなく、被処
理体の処理を停電の前後に拘りなく継続することができ
る。Further, according to the fifth and sixth aspects of the present invention, the power supply is generated by a power failure while each of the plurality of semiconductor processing devices is processing the object under the control of the control device. When the power is cut off, the power source is switched to the power source of the private power generation device at the time of power failure, and a power failure detection signal related to the power failure is transmitted from the private power generation device to the control device. As a result, after receiving the power failure detection signal, the control device can simultaneously operate the semiconductor processing devices without turning off the power of the private power generation device by simultaneously transmitting the power limit signal to the semiconductor processing devices. Then, after the power source is restored, the private power generator is switched to the power source and the semiconductor processing devices are sequentially operated, so that the processing of the object to be processed can be continued regardless of the power failure without shutting off the power source.

【００１８】[0018]

【実施例】以下、図１〜図６に示す実施例に基づいて本
発明を説明する。 実施例１.本実施例の半導体処理装置の供給電力制御方
法は、例えば図１に示すように半導体処理装置に好まし
く適用することができる。そこでまず、この半導体処理
装置の全体構成について説明する。この半導体処理装置
は、一点鎖線で囲まれた部分により構成され、半導体処
理装置本体（以下、熱ＣＶＤ装置など反応炉のような
「熱処理装置本体１」で代表する。）と、熱処理装置本
体１へ電力を供給する工場主電源（以下、「電源」を称
す。）２と、この電源２からの電力の供給状態を操作す
る電力操作部（例えば「サイリスタ３」）と、このサイ
リスタ３へ制御信号Ｓ1を送信してサイリスタ３を制御
する制御装置４と、この制御装置４をバックアップする
バックアップ装置５とを備え、制御装置４によりサイリ
スタ３から熱処理装置本体１への供給電力を制御するよ
うに構成されている。また、上記制御装置４はＰＩＤ調
節器（図１では図示せず）を備え、このＰＩＤ調節器か
ら制御信号Ｓ1を送信するように構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in FIGS. Embodiment 1. The method for controlling the supply power of a semiconductor processing apparatus according to this embodiment can be preferably applied to a semiconductor processing apparatus as shown in FIG. Therefore, first, the overall configuration of this semiconductor processing apparatus will be described. This semiconductor processing apparatus is composed of a portion surrounded by a chain line, and includes a semiconductor processing apparatus main body (hereinafter referred to as “heat treatment apparatus main body 1” such as a reaction furnace such as a thermal CVD apparatus) and a heat treatment apparatus main body 1. A factory main power supply (hereinafter, referred to as "power supply") 2 for supplying power to the power supply, a power operation unit (for example, "thyristor 3") that operates a power supply state from the power supply 2, and a control for the thyristor 3. A control device 4 for transmitting the signal S 1 to control the thyristor 3 and a backup device 5 for backing up the control device 4 are provided, and the control device 4 controls the power supplied from the thyristor 3 to the heat treatment apparatus main body 1. Is configured. Further, the control device 4 includes a PID adjuster (not shown in FIG. 1), and is configured to transmit the control signal S 1 from the PID adjuster.

【００１９】また、この半導体処理装置のバックアップ
装置５は、図２に示すように、落雷などによる停電時に
制御装置４の電源をバックアップするバックアップ電源
５Ａと、停電を検出してその停電検出信号Ｓ2を送信す
る停電検出回路６と、この停電検出回路６から停電検出
信号Ｓ2を受信し且つ停電開始時から電源回復時までの
時間を測定してその測定信号Ｓ3を送信する停電時間測
定回路７と、この停電時間測定回路７からの測定信号Ｓ
3に基づいて落雷などによる瞬時停電か否かを判定し、
その判定信号Ｓ4を所定時間経過後（時間Ｔ3の時点）に
制御装置４へ送信する停電判定回路８とを備え、停電時
でもバックアップ電源５Ａにより制御装置４を継続して
作動できるように構成されている。従って、この熱処理
装置は、電源２が回復した後には、停電検出信号Ｓ2に
基づいて制御装置４内に設けられた電力制限素子例えば
リミッタ回路４Ａから電力制限信号Ｓ5を送信し、この
電力制限信号Ｓ5に基づいてサイリスタ３を操作して熱
処理装置本体１への供給電力を停電直前の稼動電力の一
定の割合（例えば停電直前の供給電力がフルパワーの５
０％とすれば、その８割の４０％）に制限した電力を供
給して熱処理装置本体１を立ち上げて中断した処理を継
続するように構成されている。上記停電判定回路８は測
定信号Ｓ3に基づいて落雷などによる瞬時停電か、ある
いはその他の原因でより長時間の停電であるかを判定す
る回路であり、この停電判定回路８により処理続行可能
な範囲の時間であれば所定時間だけ判定信号Ｓ4を出力
し、長時間停電であると判定すれば、その判定信号Ｓ6
（時間Ｔ4）に基づいて熱処理装置本体１による処理を
停止するように構成されている。また、上記電力制限信
号Ｓ5による制御内容は、制御装置４内のメモリ（図示
せず）に予め設定登録されており、電力制限信号Ｓ5に
基づいてサイリスタ３を操作して各熱処理装置本体１へ
の供給電力を上述のように例えば停電直前の稼動電力の
一定の割合に制限したり、ランピング状に漸増したりす
るようになされている。ここでいう所定時間とは、制御
装置４内のメモリ（図示せず）に予め登録された値、ま
たは制御装置４に指示される目標温度に対する測定温度
との差が小さくなり停電直前の状態まで収束したと看做
されるまでの時間である。As shown in FIG. 2, the backup device 5 of the semiconductor processing apparatus includes a backup power source 5A for backing up the power source of the control device 4 in case of a power failure due to a lightning strike, and a power failure detection signal S for detecting the power failure. A power failure detection circuit 6 that transmits 2 and a power failure time measurement that receives the power failure detection signal S 2 from the power failure detection circuit 6 and measures the time from the start of the power failure to the power recovery and transmits the measurement signal S 3. Circuit 7 and measurement signal S from this power failure time measuring circuit 7
Based on 3 , determine whether there is an instantaneous power failure due to lightning, etc.
A power failure determination circuit 8 for transmitting the determination signal S 4 to the control device 4 after a lapse of a predetermined time (at time T 3 ) is provided so that the control device 4 can be continuously operated by the backup power supply 5A even during a power failure. It is configured. Therefore, this heat treatment apparatus transmits the power limiting signal S 5 from the power limiting element such as the limiter circuit 4A provided in the control apparatus 4 based on the power failure detection signal S 2 after the power source 2 is recovered, and the power limiting signal S 5 is transmitted. The thyristor 3 is operated based on the limit signal S 5 so that the power supplied to the heat treatment apparatus main body 1 is at a fixed ratio of the operating power immediately before the power failure (for example, the power supplied immediately before the power failure is 5% of the full power).
If it is set to 0%, 40% of that 80%) is supplied, and the heat treatment apparatus main body 1 is started up to continue the interrupted processing. The power outage determination circuit 8 is a circuit that determines based on the measurement signal S 3 whether an instantaneous power outage due to a lightning strike or a longer power outage due to other causes, and the processing can be continued by the power outage determination circuit 8. If the time is within the range, the determination signal S 4 is output only for a predetermined time, and if it is determined that there is a long power failure, the determination signal S 6 is output.
The processing by the heat treatment apparatus body 1 is stopped based on (time T 4 ). Further, the control contents by the power limit signal S 5 are preset and registered in a memory (not shown) in the controller 4, and the thyristor 3 is operated based on the power limit signal S 5 to operate each heat treatment apparatus main body. As described above, the electric power supplied to No. 1 is limited to a certain ratio of the operating electric power immediately before the power failure, or gradually increased in a ramping manner. The predetermined time referred to here is a value registered in advance in a memory (not shown) in the control device 4 or a difference between the measured temperature and a target temperature instructed to the control device 4 becomes small until the state immediately before the power failure. It is the time until it is considered that it has converged.

【００２０】上記制御装置４は、図２に示すように、リ
ミッタ回路４Ａ、ＲＳフリップフロップ回路９及びオア
回路１０を備え、停電検出回路６からの停電検出信号Ｓ
2に基づいてサイリスタ３での制御信号を通常の状態と
停電時の状態とを適宜選択できるように構成されてい
る。このＲＳフリップフロップ回路９は、停電検出信号
Ｓ2及び測定信号Ｓ3をセット入力及びリセット入力とし
て受信し、それぞれの入力信号に対応した信号を送信す
る論理回路である。即ち、ＲＳフリップフロップ回路９
は、停電検出信号Ｓ2、判定信号Ｓ4のいずれも受信しな
ければ初期設定状態の信号をオア回路１０へ送信し、停
電検出信号Ｓ2のみを受信すればセット信号をオア回路
へ送信し、判定信号Ｓ4のみを受信すればリセット信号
をオア回路へ送信し、また、停電検出信号Ｓ2及び判定
信号Ｓ4の双方を同時に受信すれば使用禁止状態になる
ように構成されている。As shown in FIG. 2, the control unit 4 includes a limiter circuit 4A, an RS flip-flop circuit 9 and an OR circuit 10, and a power failure detection signal S from the power failure detection circuit 6 is provided.
Based on 2 , the control signal in the thyristor 3 can be appropriately selected from the normal state and the state at the time of power failure. The RS flip-flop circuit 9 is a logic circuit that receives the power failure detection signal S 2 and the measurement signal S 3 as a set input and a reset input, and transmits a signal corresponding to each input signal. That is, the RS flip-flop circuit 9
Sends an initial setting signal to the OR circuit 10 if neither the power failure detection signal S 2 nor the judgment signal S 4 is received, and sends the set signal to the OR circuit if only the power failure detection signal S 2 is received. When only the judgment signal S 4 is received, the reset signal is transmitted to the OR circuit, and when both of the power failure detection signal S 2 and the judgment signal S 4 are received at the same time, the use is prohibited.

【００２１】つまり、停電時点（時間Ｔ1時点）から電
源の回復時点（時間Ｔ2時点）までの間に、制御装置４
では、ＲＳフリップフロップ回路９で停電検出信号Ｓ2
のみを受信してセット信号をオア回路１０へ送信し、更
にオア回路１０を介してリミッタ回路４Ａからの電力制
限信号Ｓ5をサイリスタ３に送信するが、この間は停電
状態にあるため、サイリスタ３でリミッタ回路４Ａから
の電力制限信号Ｓ5を受信してもサイリスタ３の操作は
行なわれない。また時間Ｔ2の時点を期して電源２が回
復し、この時点から所定時間経過後の時間Ｔ3までの間
に、制御装置４では、ＲＳフリップフロップ回路９での
受信信号が途絶えてもＲＳフリップフロップ回路９が時
間Ｔ2直前の状態をそのまま維持し、オア回路１０を介
して電力制限信号Ｓ5をサイリスタ３へ送信し、時間Ｔ2
から所定時間経過後の時間Ｔ3までの間は電力制限信号
Ｓ5によってサイリスタ３を操作して供給電力を制限し
ながら各熱処理装置本体１を徐々に立ち上げる。所定時
間経過すると制御装置４に指示される目標温度に対する
測定温度との差が小さくなり停電直前の状態まで収束し
ている。そして、時間Ｔ3の時点で、制御装置４では、
ＲＳフリップフロップ回路９で判定回路８からの判定信
号Ｓ4を受信してリセット信号をオア回路１０へ送信
し、オア回路１０を介して電力制限信号Ｓ5を解除して
本来の制御信号Ｓ1にし、この制御信号Ｓ1によってサイ
リスタ３を操作して停電時までの本来の処理を再開して
そのまま処理を継続する。That is, the control device 4 operates between the power failure time (time T 1 time) and the power recovery time (time T 2 time).
Then, the RS flip-flop circuit 9 outputs the power failure detection signal S 2
Only the received signal is transmitted to the OR circuit 10, and the set signal is transmitted to the OR circuit 10. Further, the power limiting signal S 5 from the limiter circuit 4A is transmitted to the thyristor 3 via the OR circuit 10, but during this period, the thyristor 3 is in a power failure state. Therefore, even if the power limiting signal S 5 is received from the limiter circuit 4A, the thyristor 3 is not operated. Also for the sake of the point of time T 2 recovers power supply 2, during the period from the time point to time T 3 after a predetermined time, the control unit 4, also ceased the received signal at the RS flip-flop circuit 9 RS The flip-flop circuit 9 maintains the state immediately before the time T 2 as it is, and transmits the power limit signal S 5 to the thyristor 3 via the OR circuit 10, and the time T 2
Between to time T 3 after a predetermined time gradually raising the respective heating apparatus main body 1 while limiting the electric power supplied by operating the thyristor 3 by the power limit signal S 5. After a lapse of a predetermined time, the difference between the target temperature instructed to the control device 4 and the measured temperature becomes small, and the state just before the power failure is converged. Then, at time T 3 , the control device 4
The RS flip-flop circuit 9 receives the judgment signal S 4 from the judgment circuit 8 and transmits a reset signal to the OR circuit 10, and releases the power limit signal S 5 via the OR circuit 10 to release the original control signal S 1 Then, the thyristor 3 is operated by the control signal S 1 to restart the original processing until the power failure and continue the processing.

【００２２】従って、落雷などによる瞬時停電の場合に
は、例えば図３で示すように、停電により主電源２から
の通電状態が時間Ｔ1で遮断され、時間Ｔ2で回復する。
一方、制御電源はバックアップ装置５に切り替わってそ
のまま時間Ｔ1から時間Ｔ2間も制御装置４による制御動
作を継続する。この際、時間Ｔ1で停電検出信号Ｓ2によ
りサイリスタ３の制御信号を電力制限信号Ｓ5としてセ
ットし、そのまま時間Ｔ2まで電力制限信号Ｓ5を制御装
置４からサイリスタ３へ送信し続け、更に主電源２の回
復後、時間Ｔ3まではその電力制限信号Ｓ5を送信し続
け、時間Ｔ3で制御装置４が判定信号Ｓ4を受信すると、
サイリスタ３の制御信号をリセットして電力制限信号Ｓ
5から元の制御信号Ｓ1に戻して停電時の制御状態にす
る。Therefore, in the case of an instantaneous power failure due to a lightning strike, for example, as shown in FIG. 3, the power supply from the main power source 2 is interrupted at time T 1 and recovered at time T 2 due to the power failure.
On the other hand, the control power supply is switched to the backup device 5 and the control operation by the control device 4 is continued during the time T 1 to the time T 2 as it is. At this time, it continues to send set as the power limit signal S 5 a control signal of the thyristor 3 through the power failure detection signal S 2 at time T 1, the control unit 4 a power limit signal S 5 as to the time T 2 to the thyristor 3, after addition of the main power supply 2 recovery, until time T 3 continues to send its power limit signal S 5, the control device 4 at time T 3 receives the judgment signal S 4,
The power limit signal S is reset by resetting the control signal of the thyristor 3.
The control signal S 1 is returned from 5 to the control state at the time of power failure.

【００２３】次に、動作について説明する。本半導体処
理装置では、制御装置４によりサイリスタ３を制御しな
がら熱処理装置本体１によって半導体ウエハを同時にバ
ッチ処理している最中に、停電により半導体ウエハの処
理が中断した場合には、停電時に制御装置４の電源をバ
ックアップ装置５の電源５Ａによってバックアップする
と同時に停電時の停電検出信号Ｓ2をバックアップ装置
５の停電検出回路６から制御装置４のＲＳフリップフロ
ップ回路９及びオア回路１０それぞれで受信する。一
方、この停電検出信号Ｓ2に基づいて停電時間測定回路
７により停電時間を測定し、更にこの測定信号Ｓ3に基
づいて停電判定回路８により落雷などによる瞬時停電で
あるか否かを判定し、瞬時停電であればその判定信号Ｓ
4を制御装置４へ送信する。この間、制御装置４では停
電検出信号Ｓ2に基づいた電力制限信号Ｓ5をサイリスタ
３へ送信し、その後、電源２が回復すると同時に電力制
限信号Ｓ5に基づいてサイリスタ３を操作して停電直前
の稼動電力の一定の割合に制限した電力を供給したり、
ランピング状に供給電力を漸増させ、熱処理装置本体１
を停電直前の供給電力より小さな電力で立ち上げて半導
体ウエハの処理を再開して継続し、電源２の過負荷を防
止する。そして、電源２の回復時点から所定時間経過
後、停電判定回路８から判定信号Ｓ4を送信し、これを
ＲＳフリップフロップ回路９で受信すると、ＲＳフリッ
プフロップ回路９をリセットし、オア回路１０を介して
停電時の電力制御状態に戻り、半導体ウエハの処理をそ
のまま継続することができる。また、停電判定回路８に
より長時間停電であると判定すれば、半導体処理装置の
立ち上げを中止する。Next, the operation will be described. In the present semiconductor processing apparatus, if the semiconductor wafer processing is interrupted due to a power failure while the heat processing apparatus main body 1 is simultaneously batch processing semiconductor wafers while controlling the thyristor 3 by the control apparatus 4, control is performed at the time of power failure. The power supply of the device 4 is backed up by the power supply 5A of the backup device 5, and at the same time, the power failure detection signal S 2 at the time of power failure is received from the power failure detection circuit 6 of the backup device 5 by the RS flip-flop circuit 9 and the OR circuit 10 of the control device 4, respectively. . On the other hand, to measure the power failure time by the power failure time measurement circuit 7 on the basis of the power failure detection signal S 2, further whether lightning an instantaneous power failure due judged by the power failure detection circuit 8 on the basis of the measurement signal S 3 , If there is an instantaneous power failure, the judgment signal S
4 is transmitted to the control device 4. During this period, the control device 4 transmits the power limit signal S 5 based on the power failure detection signal S 2 to the thyristor 3, and then the power source 2 is restored and at the same time, the thyristor 3 is operated based on the power limit signal S 5 to immediately before the power failure. Supply a limited amount of the operating power of
The power supply is gradually increased in a ramping manner, and the heat treatment apparatus main body 1
Is started with a power smaller than the power supplied immediately before the power failure, the processing of the semiconductor wafer is restarted and continued, and the overload of the power supply 2 is prevented. Then, after a lapse of a predetermined time from the point of time when the power supply 2 is restored, the judgment signal S 4 is transmitted from the power failure judgment circuit 8, and when this is received by the RS flip-flop circuit 9, the RS flip-flop circuit 9 is reset and the OR circuit 10 is turned on. Through this, the power control state at the time of power failure is returned, and the processing of the semiconductor wafer can be continued as it is. If the power failure determination circuit 8 determines that there is a power failure for a long time, the startup of the semiconductor processing device is stopped.

【００２４】以上説明したように本実施例によれば、停
電検出回路６により停電を検出し、この停電検出回路６
からの停電検出信号Ｓ2を制御装置４へ取り込み、この
停電検出信号Ｓ2に基づいた電力制限信号Ｓ5によってサ
イリスタ３を制御するようにしたため、停電後、短時間
で電源が回復した場合、電力制限信号Ｓ5によって熱処
理装置本体１への電力の供給量を停電直前の稼動電力の
一定の割合に制限したり、ランピング状に漸増させ、熱
処理装置本体１を停電直前の供給電力より小さな電力で
立ち上げて半導体ウエハの処理を再開して継続し、電源
２の過負荷を防止し、電流制限器を作動させることなく
熱処理装置本体１をそれぞれ円滑に立ち上げて半導体ウ
エハの処理を再開、継続し、処理中の半導体ウエハを救
済することができる。特に、本実施例の供給電力の制御
方法は、停電時から電源回復時までに熱処理装置本体１
内の温度が大きく下がってＰＩＤ調節器の積分値を電源
復帰時に停電直前の積分値（即ち、停電直前の稼動状態
における供給電力）にセットするだけでは供給電力が過
大になってしまう場合に効果的である。As described above, according to this embodiment, the power failure detection circuit 6 detects a power failure, and the power failure detection circuit 6
Since the power failure detection signal S 2 from the power supply is taken into the control device 4 and the thyristor 3 is controlled by the power limit signal S 5 based on the power failure detection signal S 2 , when the power is restored in a short time after the power failure, The power limit signal S 5 limits the amount of electric power supplied to the heat treatment apparatus main body 1 to a certain ratio of the operating power immediately before the power failure, or gradually increases it in a ramping manner so that the heat treatment apparatus main body 1 has a power smaller than the power supply immediately before the power failure. , The semiconductor wafer processing is restarted and continued, the power source 2 is prevented from being overloaded, and the heat treatment apparatus main body 1 is smoothly started up without restarting the current limiter to restart the semiconductor wafer processing. The semiconductor wafer being processed can be rescued continuously. In particular, the method for controlling the power supply of this embodiment is such that the heat treatment apparatus main body 1 is operated from the time of power failure to the time of power recovery.
This is effective when the temperature inside is greatly decreased and the integrated value of the PID controller is set to the integrated value immediately before the power failure (that is, the power supplied in the operating state immediately before the power failure) when the power is restored. Target.

【００２５】実施例２.本実施例の半導体処理装置の供
給電力制御方法は、例えば図４に示すように制御装置４
のＰＩＤ調節器１１を介してサイリスタを制御する以外
は実施例１に準じて構成されている。従って、本実施例
の供給電力制御方法を適用する半導体処理装置も実施例
１のものと同様に停電検出回路５、停電時間測定回路７
及び停電判定回路８を備え、電源２が回復した時、上記
制御装置４が上記停電判定回路８から判定信号Ｓ4を受
信すると、この判定信号Ｓ4が積分値リセット信号とし
て上記ＰＩＤ調節器１１に作用してその積分値を電源復
帰時に停電直前の積分値にセットするように構成されて
いる。Embodiment 2. The method of controlling the power supply of the semiconductor processing apparatus of this embodiment is, for example, as shown in FIG.
The configuration is similar to that of the first embodiment except that the thyristor is controlled via the PID adjuster 11. Therefore, the semiconductor processing apparatus to which the power supply control method of this embodiment is applied also has the power failure detection circuit 5 and the power failure time measurement circuit 7 as in the first embodiment.
And comprising a power failure detection circuit 8, when the power supply 2 is restored, when the control unit 4 receives the determination signal S 4 from the power failure detection circuit 8, the PID controller 11 the determination signal S 4 as the integrated value reset signal To set the integral value to the integral value immediately before the power failure when the power is restored.

【００２６】そして、本実施例の場合には、制御装置４
のＰＩＤ調節器１１によりサイリスタ３を制御しながら
熱処理装置によって半導体ウエハを同時にバッチ処理し
ている最中に、停電により処理が中断すると、停電時
（時間Ｔ1）に制御装置４、即ちＰＩＤ調節器１１の電
源をバックアップ装置５の電源５Ａによりバックアップ
すると共にバックアップ装置５からの停電に関する検出
信号、即ち停電検出信号Ｓ2を制御装置４で受信した
後、電源２が回復した時間Ｔ2で停電検出信号Ｓ2を受信
しなくなると同時に停電判定回路８から判定信号Ｓ4を
制御装置４で受信する。この判定信号Ｓ4によってＰＩ
Ｄ調節器１１の積分値を停電検知時の値にリセットする
と、ＰＩＤ調節器１１は停電中の増大した積分値を含ん
だ制御操作から始動せず、停電開始時の定常時の電力に
近い状態でサイリスタ３を制御操作して停電発生時と略
同じの小さな電力、即ち定常時電力を供給し、電流制限
器を作動させることなく電力を徐々に増加して半導体処
理装置を円滑に立ち上げて半導体ウエハの処理を再開、
継続し、処理中の半導体ウエハを救済することができ
る。In the case of this embodiment, the control device 4
If the processing is interrupted by a power failure while simultaneously batch processing the semiconductor wafers by the heat treatment apparatus while controlling the thyristor 3 by the PID controller 11 of the above, the controller 4, that is, the PID adjustment, is performed at the time of the power failure (time T 1 ). detection signals relating to the power failure from the backup device 5 as well as back up power vessel 11 by the power supply 5A of the backup device 5, i.e. after receiving the power failure detection signal S 2 by the control unit 4, a power failure at the time the power source 2 is restored T 2 At the same time that the detection signal S 2 is no longer received, the control device 4 receives the determination signal S 4 from the power failure determination circuit 8. PI is determined by this determination signal S 4 .
When the integrated value of the D controller 11 is reset to the value at the time of power failure detection, the PID controller 11 does not start from the control operation including the increased integrated value during the power failure, and is close to the steady-state power at the start of the power failure. The thyristor 3 is controlled to supply a small amount of power that is almost the same as when a power failure occurs, that is, steady-state power, and the power is gradually increased without operating the current limiter to smoothly start up the semiconductor processing apparatus. Restart processing of semiconductor wafers,
The semiconductor wafer being processed can be rescued continuously.

【００２７】実施例３.本実施例では熱処理装置が複数
設置され、これらの熱処理装置群の供給電力を制御する
方法に関するものである。つまり、上記各実施例が個々
の熱処理装置に対する停電対策であるのに対し、本実施
例では熱処理装置群に対する停電対策である。即ち、本
実施例の半導体処理装置の供給電力制御装置は、図６に
示すように、制御装置４０による制御下で複数の熱処理
装置１０によって半導体ウエハをそれぞれ処理している
最中に停電により電源２０が切れた時に、各熱処理装置
１０による処理をそのまま継続させる電力を供給制御す
るように構成されている。この供給電力制御装置には、
停電時に電源２０をバックアップする自家発電装置５０
が設けられている。更に、この自家発電装置５０は、停
電を検出して停電に関する停電検出信号Ｓ7を制御装置
４０へ送信し、停電下で制御装置４０を継続的に作動さ
せようにしてある。即ち、制御装置４０は電力制限素子
としてのリミッタ回路（図示せず）を有し、制御装置４
０において停電検出信号Ｓ7を受信すると、リミッタ回
路を介して各熱処理装置１０へ電力制限信号Ｓ8を同時
に送信し、各熱処理装置１０へ停電直前の稼動電力の一
定の割合（例えば停電直前の供給電力がフルパワーの５
０％とすれば、その８割の４０％）に制限した電力を自
家発電装置４０から供給して各熱処理装置１０を同時に
立ち上げて停電前の処理を継続するように構成されてい
る。Embodiment 3 In this embodiment, a plurality of heat treatment apparatuses are installed, and the present invention relates to a method of controlling the electric power supplied to these heat treatment apparatus groups. In other words, while the above-mentioned respective embodiments are measures against power failure for individual heat treatment devices, this embodiment is measures against power failure for the heat treatment devices. That is, as shown in FIG. 6, the power supply control device for the semiconductor processing apparatus according to the present embodiment supplies power to the semiconductor wafer under the control of the control device 40 due to a power failure during the processing of each semiconductor wafer by the plurality of heat treatment apparatuses 10. When 20 is cut off, the supply of electric power to continue the processing by each heat treatment apparatus 10 is controlled. This power supply control device,
Private power generator 50 that backs up the power supply 20 in the event of a power failure
Is provided. Further, the private power generation device 50 detects a power failure and transmits a power failure detection signal S 7 regarding the power failure to the control device 40 so that the control device 40 is continuously operated under the power failure. That is, the control device 40 has a limiter circuit (not shown) as a power limiting element, and the control device 4
When the power failure detection signal S 7 is received at 0, the power limit signal S 8 is simultaneously transmitted to each heat treatment apparatus 10 via the limiter circuit, and a fixed ratio of the operating power immediately before the power failure is transmitted to each heat treatment apparatus 10 (for example, immediately before the power failure). 5 of full power supply
If it is 0%, 40% of that 80%) is supplied from the private power generation device 40 to start up each heat treatment device 10 at the same time to continue the process before the power failure.

【００２８】また、制御装置４０には電力２の回復後に
各熱処理装置１０を同時に順次立ち上げて稼動させるシ
ーケンス制御装置（図示せず）が設けられており、この
シーケンス制御回路により各熱処理装置１０を順次立ち
上げ、電源２０からの供給電力を順次大きくして行き、
電流制限器を作動させることなく供給電力を徐々に増加
して各熱処理装置１０をそれぞれ円滑に立ち上げて半導
体ウエハの処理を再開、継続し、処理中の半導体ウエハ
を救済することができるようにしてある。電源２０の回
復後に各熱処理装置１０へ供給する電力としてはリミッ
タ回路を介して上述のように制限された電力が好ましい
が、電源２０に余裕のある場合には停電直前の電力と同
レベルの電力であっても良い。Further, the control device 40 is provided with a sequence control device (not shown) for simultaneously starting and operating each heat treatment device 10 after the electric power 2 is restored, and each heat treatment device 10 is operated by this sequence control circuit. Sequentially, increase the power supply from the power source 20 in sequence,
It is possible to gradually increase the supply power without operating the current limiter and smoothly start up each heat treatment apparatus 10 to restart and continue the processing of semiconductor wafers and to rescue the semiconductor wafers being processed. There is. The electric power supplied to each heat treatment apparatus 10 after the power source 20 is recovered is preferably the electric power limited as described above via the limiter circuit. However, when the electric power source 20 has a margin, the electric power is at the same level as the electric power immediately before the power failure. May be

【００２９】従って、本実施例によれば、制御装置４０
による制御下で複数の熱処理装置１０によって半導体ウ
エハをそれぞれ処理している最中に停電により電源が切
れた時には、停電時には電源２０を自家発電装置５０の
電源に切り替えると共に自家発電装置５０から制御装置
４０へ停電に関する停電検出信号Ｓ7を送信する。これ
により制御装置４０では停電検出信号Ｓ7を受信した
後、リミッタ回路を介して各熱処理装置１０へ電力制限
信号Ｓ8を同時に送信して自家発電装置５０の電源を切
らすことなく各熱処理装置１０を同時に稼動させること
ができる。そして、電源２０が回復した後には自家発電
装置５０を電源２０に切り替えて各熱処理装置１０を順
次稼動させるため、電源２０からの供給電力をフルパワ
ーにすることがなく、電流制限器を作動させて給電を止
める虞がなく、被処理体の処理を停電の前後に拘りなく
継続することができる。Therefore, according to the present embodiment, the control device 40
When the power is cut off due to a power failure while the semiconductor wafers are being respectively processed by the plurality of heat treatment apparatuses 10 under the control by, the power source 20 is switched to the power source of the private power generation apparatus 50 and the control apparatus from the private power generation apparatus 50 during the power failure. A power failure detection signal S 7 related to a power failure is transmitted to 40. As a result, the control device 40 receives the power failure detection signal S 7 and then simultaneously transmits the power limit signal S 8 to each heat treatment device 10 via the limiter circuit so that each heat treatment device 10 does not have to be powered off. Can be operated simultaneously. After the power source 20 is recovered, the private power generator 50 is switched to the power source 20 to sequentially operate each heat treatment apparatus 10, so that the current limiter is activated without making the power supplied from the power source 20 full power. Therefore, there is no fear of stopping the power supply, and the processing of the object to be processed can be continued regardless of before and after the power failure.

【００３０】尚、上記実施例では半導体処理装置として
熱処理装置を例に挙げて説明したが、本発明は上記各実
施例に制限されるものではなく、その他、真空処理装置
などに広く適用することができる。また、上記各実施例
をそれぞれ組み合わせたものであっても上記各実施例と
同様またはそれ以上の作用効果を期することができる。In the above embodiments, the heat treatment apparatus was described as an example of the semiconductor processing apparatus, but the present invention is not limited to the above embodiments, and can be widely applied to other vacuum processing apparatuses. You can Even if the above-mentioned respective embodiments are combined, the same or higher operational effects as those of the above-mentioned respective embodiments can be expected.

【００３１】[0031]

【発明の効果】以上説明したように本発明の請求項１、
請求項２及び請求項４に記載の発明によれば、停電の検
出信号に基づいた電力制限信号を制御装置の電力制限素
子からサイリスタ等の電力操作部に送信し、この電力制
限信号に基づいて電源回復後に電力操作部を操作して供
給電力を停電直前の供給電力の一定割合に制限して供給
するようにしたため、停電後、瞬時停電のように短時間
で電源が回復した場合、電流制限器を作動させることな
く半導体処理装置へ電力を供給して半導体処理装置を円
滑に立ち上げて処理を再開、継続し、処理中の被処理体
を救済できる半導体処理装置の電力供給制御方法及び半
導体処理装置の電力供給制御装置を提供することができ
る。As described above, claim 1 of the present invention,
According to the invention described in claims 2 and 4, a power limiting signal based on the power failure detection signal is transmitted from the power limiting element of the control device to the power operating unit such as a thyristor, and based on the power limiting signal. After the power is restored, the power operation unit is operated to limit the power supply to a fixed ratio of the power immediately before the power failure, so if the power is restored in a short time after a power failure, such as an instantaneous power failure, the current limit will be applied. Power supply control method for semiconductor processing device capable of supplying power to the semiconductor processing device to smoothly start up the semiconductor processing device and restarting and continuing the processing without operating the container A power supply control device for a processing device can be provided.

【００３２】また、本発明の請求項３及び請求項４に記
載の発明によれば、停電の検出信号に基づいてＰＩＤ調
節器の積分値を電源復帰時に停電直前の積分値にセット
するようにしたため、停電後、瞬時停電のように短時間
で電源が回復した場合、電流制限器を作動させることな
くＰＩＤ調節器によって停電直前の安定した状態の積分
値に当る電力を半導体処理装置へ供給して半導体処理装
置を円滑に立ち上げて処理を再開、継続し、処理中の被
処理体を救済できる半導体処理装置の電力供給制御方法
及び半導体処理装置の電力供給制御装置を提供すること
ができる。According to the third and fourth aspects of the present invention, the integrated value of the PID controller is set to the integrated value immediately before the power failure when the power is restored, based on the power failure detection signal. Therefore, if the power supply recovers in a short time after a power failure, such as an instantaneous power failure, the PID controller does not operate the current limiter to supply power to the semiconductor processing equipment, which is the stable integrated value immediately before the power failure. Accordingly, it is possible to provide a power supply control method for a semiconductor processing device and a power supply control device for a semiconductor processing device that can smoothly start up a semiconductor processing device, restart and continue the processing, and rescue the object being processed.

【００３３】また、本発明の請求項５及び請求項６に記
載の発明によれば、制御装置による制御下で複数の半導
体処理装置によって被処理体をそれぞれ処理している最
中に停電により電源が切れた時に、停電時には電源を自
家発電装置の電源に切り替えると共に自家発電装置から
制御装置へ停電に関する停電検出信号を送信し、制御装
置の電力制限素子を介して各半導体処理装置へ電力制限
信号を同時に送信して自家発電装置の電源を切らすこと
なく上記各半導体処理装置を同時に稼動させ、電源が回
復した後には自家発電装置を電源に切り替えて各半導体
処理装置を順次稼動させるため、停電時も電流制限器を
作動させることなく複数の半導体処理装置へ電力を供給
して各半導体処理装置による処理を円滑に継続し、しか
も電源回復後もそのまま処理を継続して処理中の被処理
体を救済できる半導体処理装置の電力供給制御方法及び
半導体処理装置の電力供給制御装置を提供することがで
きる。According to the fifth and sixth aspects of the present invention, the power source is cut off due to a power failure while each of the plurality of semiconductor processing devices is processing the object under the control of the control device. When the power is cut off, the power supply is switched to the power supply of the private power generator at the time of power failure, and a power failure detection signal related to the power failure is transmitted from the private power generator to the control device, and the power limit signal is sent to each semiconductor processing device via the power limiting element of the control device. To simultaneously operate each of the above semiconductor processing devices without turning off the power of the in-house power generation device, and after power is restored, switch the in-house power generation device to the power supply to operate each semiconductor processing device in sequence, so there is a power failure. Power is supplied to a plurality of semiconductor processing devices without operating the current limiter to smoothly continue the processing by each semiconductor processing device, and even after the power is restored. It is possible to provide a power supply device for controlling a power supply control method and a semiconductor processing apparatus of a semiconductor processing device processing can be repaired workpiece ongoing and handle remains.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の半導体処理装置の供給電力制御装置の
一実施例を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of a power supply control device for a semiconductor processing device of the present invention.

【図２】図１に示す半導体処理装置の供給電力制御装置
の制御系を示す構成図である。FIG. 2 is a configuration diagram showing a control system of a power supply control device of the semiconductor processing device shown in FIG.

【図３】図２に示す電力制御系のタイムチャートを示す
図である。FIG. 3 is a diagram showing a time chart of the power control system shown in FIG.

【図４】本発明の半導体処理装置の供給電力制御装置の
他の実施例の要部を示す構成図である。FIG. 4 is a configuration diagram showing a main part of another embodiment of the power supply control device for a semiconductor processing device of the present invention.

【図５】図４に示す電力制御系のタイムチャートを示す
図である。5 is a diagram showing a time chart of the power control system shown in FIG.

【図６】本発明の半導体処理装置の供給電力制御装置の
更に他の実施例を示す構成図である。FIG. 6 is a configuration diagram showing still another embodiment of the supply power control device of the semiconductor processing device of the present invention.

【符号の説明】[Explanation of symbols]

１ 熱処理装置（半導体処理装置） ２ 電源 ３ サイリスタ（電力操作部） ４ 制御装置 ５ バックアップ装置 ６ 停電検出回路 １０ 熱処理装置（半導体処理装置） ２０ 電源 ４０ 制御装置 ５０ 自家発電装置 Ｓ1 制御信号 Ｓ2 停電検出信号 Ｓ3 停電時間測定信号 Ｓ4 判定信号（電力制限信号解除） Ｓ5 電力制限信号 Ｓ6 判定信号（処理中断指示） Ｓ7 停電検出信号 Ｓ8 電力制限信号1 Heat Treatment Device (Semiconductor Processing Device) 2 Power Supply 3 Thyristor (Power Operation Unit) 4 Control Device 5 Backup Device 6 Power Failure Detection Circuit 10 Heat Treatment Device (Semiconductor Processing Device) 20 Power Supply 40 Control Device 50 Private Power Generation Device S 1 Control Signal S 2 Power failure detection signal S 3 Power failure time measurement signal S 4 Judgment signal (power limit signal cancellation) S 5 Power limit signal S 6 Judgment signal (processing interruption instruction) S 7 Power failure detection signal S 8 Power limit signal

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−170619（ＪＰ，Ａ) 特開 平４−242027（ＪＰ，Ａ) 特開 平３−293941（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) G05B 9/02 H01L 21/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-170619 (JP, A) JP-A-4-242027 (JP, A) JP-A-3-293941 (JP, A) (58) Field (Int.Cl. 7 , DB name) G05B 9/02 H01L 21/02

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 制御装置により電力操作部を制御しなが
ら半導体処理装置によって被処理体を処理している最中
に、停電により中断した被処理体の処理を電源の回復後
にそのまま継続させる半導体処理装置の供給電力制御方
法であって、停電時にバックアップ装置により上記制御
装置の電源をバックアップすると共に上記制御装置へ停
電に関する停電検出信号を送信するステップと、上記停
電検出信号に基づいて上記制御装置から上記電力操作部
へ電力制限信号を送信するステップと、上記電力制限信
号に基づいて上記電力操作部を操作して回復後の上記電
源からの供給電力を停電直前の供給電力の一定割合に制
限して上記処理装置本体へ供給するステップを有するこ
とを特徴とする半導体処理装置の供給電力制御方法。1. A semiconductor process for continuing processing of an object to be processed interrupted by a power failure while the object is being processed by a semiconductor processing apparatus while controlling a power operating unit by a control device, after power is restored. A method for controlling power supply to a device, comprising a step of transmitting a power failure detection signal related to a power failure to the control device while backing up the power source of the control device by a backup device at the time of power failure, and the control device based on the power failure detection signal. Transmitting a power limiting signal to the power operating unit, and operating the power operating unit based on the power limiting signal to limit the power supplied from the power source after recovery to a fixed ratio of the power supplied immediately before the power failure. And a step of supplying the power to the processing apparatus main body. 【請求項２】 制御装置により電力操作部を制御しなが
ら半導体処理装置によって被処理体を処理している最中
に、停電により中断した被処理体の処理を電源の回復後
にそのまま継続させる半導体処理装置の供給電力制御方
法であって、停電時にバックアップ装置により上記制御
装置の電源をバックアップすると共に上記制御装置へ停
電に関する停電検出信号を送信するステップと、上記停
電検出信号に基づいて上記電力操作部を操作して回復後
の上記電源からの供給電力をランピング増加させながら
上記処理装置本体へ供給するステップを有することを特
徴とする半導体処理装置の供給電力制御方法。2. A semiconductor process for continuing processing of an object to be processed interrupted by a power failure while the object is being processed by a semiconductor processing apparatus while controlling a power operation unit by a control device, after power is restored. A power supply control method for a device, comprising a step of backing up the power supply of the control device by a backup device at the time of a power failure and transmitting a power failure detection signal related to the power failure to the control device, and the power operation unit based on the power failure detection signal. And a step of supplying the power supplied from the power supply after recovery to the main body of the processing apparatus while increasing the power supply by ramping. 【請求項３】 制御装置のＰＩＤ調節器により電力操作
部を制御しながら半導体処理装置によって被処理体を処
理している最中に、停電により中断した被処理体の処理
を電源の回復後にそのまま継続させる半導体処理装置の
供給電力制御方法であって、停電時にバックアップ装置
により上記制御装置の電源をバックアップすると共に制
御装置へ停電に関する停電検出信号を送信するステップ
と、上記制御装置を介して上記ＰＩＤ調節器の積分値を
停電直前の積分値にセットするステップと、停電直前の
積分値に従って上記電力操作部を操作して上記処理装置
本体へ電力を供給するステップを有することを特徴とす
る半導体処理装置の供給電力制御方法。3. The PID controller of the control device controls the power operation unit while the semiconductor processing device is processing the object to be processed, and the processing of the object to be interrupted due to the power failure is directly performed after the power is restored. A method of controlling power supply to a semiconductor processing device to continue, comprising: a step of backing up the power source of the control device by a backup device at the time of a power failure and transmitting a power failure detection signal related to the power failure to the control device; and the PID via the control device. Semiconductor processing characterized by including the step of setting the integral value of the regulator to the integral value immediately before the power failure, and the step of operating the power operation unit according to the integral value immediately before the power failure to supply power to the processing apparatus body. A power supply control method for a device. 【請求項４】 制御装置により電力操作部を制御しなが
ら半導体処理装置によって被処理体を処理している最中
に、停電により中断した被処理体の処理を電源の回復後
にそのまま継続させる半導体処理装置の供給電力制御装
置において、停電時に上記制御装置をバックアップする
と共に上記制御装置へ停電に関する停電検出信号を送信
するバックアップ装置を設けると共に、このバックアッ
プ装置の停電検出信号を受信した上記制御装置を介して
電力制限信号を上記電力操作部へ送信する電力制限素子
を設け、電源回復後には上記電力制限素子の電力制限信
号に基づいて上記電力操作部を操作して半導体処理装置
本体へ供給する電力を制限することを特徴とする半導体
処理装置の供給電力制御装置。4. A semiconductor process for continuing the processing of an object to be processed interrupted by a power failure while the object is being processed by the semiconductor processing apparatus while controlling the power operation unit by the control device, after the power is restored. In the power supply control device of the device, a backup device for backing up the control device at the time of power failure and transmitting a power failure detection signal regarding the power failure to the control device is provided, and via the control device that receives the power failure detection signal of the backup device. A power limiting element for transmitting a power limiting signal to the power operating section by means of the power limiting section, and after power is restored, the power operating section is operated based on the power limiting signal of the power limiting element to supply power to the semiconductor processing apparatus body. A power supply control device for a semiconductor processing device, which is limited. 【請求項５】 制御装置による制御下で複数の半導体処
理装置によって被処理体をそれぞれ処理している最中に
停電により電源が切れた時に、各半導体処理装置による
処理をそのまま継続させる半導体処理装置の供給電力制
御方法であって、停電時に電源を自家発電装置の電源に
切り替えると共に自家発電装置から上記制御装置へ停電
に関する停電検出信号を送信するステップと、上記停電
検出信号を受信した上記制御装置を介して電力制限信号
を同時に送信して上記各半導体処理装置を同時に稼動さ
せるステップと、上記電源の回復後に上記自家発電装置
を上記電源に切り替えて上記各半導体処理装置を順次稼
動させるステップとを有することを特徴とする半導体処
理装置の供給電力制御方法。5. A semiconductor processing apparatus for continuing the processing by each semiconductor processing apparatus when the power is cut off due to a power failure while each of the plurality of semiconductor processing apparatuses is processing the object under the control of the control apparatus. In the power supply control method, the step of switching the power source to the power source of the private power generation device at the time of power failure and transmitting a power failure detection signal related to the power failure from the private power generation device to the control device, and the control device having received the power failure detection signal. Via a power limiting signal at the same time to operate the semiconductor processing device at the same time, and after the recovery of the power supply, switching the private power generator to the power supply to sequentially operate the semiconductor processing device. A method for controlling power supply of a semiconductor processing apparatus, which comprises: 【請求項６】 制御装置による制御下で複数の半導体処
理装置によって被処理体をそれぞれ処理している最中に
停電により電源が切れた時に、各半導体処理装置による
処理をそのまま継続させる半導体処理装置の供給電力制
御装置であって、停電時に上記電源をバックアップする
と共に上記制御装置へ停電に関する停電検出信号を送信
する自家発電装置を設けると共にこの自家発電装置の停
電検出信号を受信した上記制御装置を介して電力制限信
号を上記各半導体処理装置へ同時に送信する電力制限素
子を設け、且つ上記制御装置には電源回復後に上記各半
導体処理装置を同時に順次稼動させるシーケンス制御装
置を設けたことを特徴とする半導体処理装置の供給電力
制御装置。6. A semiconductor processing apparatus for continuing the processing by each semiconductor processing apparatus when the power is cut off due to a power failure while each of the plurality of semiconductor processing apparatuses is processing the object under the control of the control apparatus. In the power supply control device of, the power supply is backed up at the time of a power failure, and a private power generation device that transmits a power failure detection signal regarding the power failure to the control device is provided, and the control device that receives the power failure detection signal of the private power generation device A power limiting element for simultaneously transmitting a power limiting signal to each of the semiconductor processing devices via the power controlling device is provided, and the control device is provided with a sequence control device for simultaneously operating the semiconductor processing devices after power is restored. Supply power control device for semiconductor processing equipment.
JP19609594A 1993-08-05 1994-07-27 Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device Expired - Fee Related JP3511109B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19609594A JP3511109B2 (en) 1993-08-05 1994-07-27 Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21487093 1993-08-05
JP5-214870 1993-08-05
JP19609594A JP3511109B2 (en) 1993-08-05 1994-07-27 Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device

Publications (2)

Publication Number Publication Date
JPH07152401A JPH07152401A (en) 1995-06-16
JP3511109B2 true JP3511109B2 (en) 2004-03-29

Family

ID=26509537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19609594A Expired - Fee Related JP3511109B2 (en) 1993-08-05 1994-07-27 Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device

Country Status (1)

Country Link
JP (1) JP3511109B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030054587A (en) * 2001-12-26 2003-07-02 동부전자 주식회사 System for supplying power source

Also Published As

Publication number Publication date
JPH07152401A (en) 1995-06-16

Similar Documents

Publication Publication Date Title
US5770895A (en) Operation control device and method for a plurality of electric power consuming systems
WO1991007796A1 (en) Ups-computer system and method of powering and controlling a computer
JPH11285167A (en) Device and method for manufacturing semiconductor device or the like, and power supply system
US12007744B2 (en) Abatement system, abatement device, and system control device
JP3511109B2 (en) Supply power control method for semiconductor processing device and supply power control device for semiconductor processing device
KR100331975B1 (en) Supply Power Control Method of Semiconductor Processing Device and Supply Power Control Device of Semiconductor Processing Device
US7242562B2 (en) Fan protection method and apparatus
KR102194385B1 (en) Energy Storage System Associated With Standby Generator During Power Failure and Power Recovery
JPH10307635A (en) Computer system and temperature monitoring method applied to the same system
JP5211717B2 (en) Power management device
KR101951370B1 (en) Reactor device that provides the function to automatically shut off the main breaker
EP1353271A2 (en) Controller with fail-safe function
JPH0956068A (en) Method and device for controlling operation of a plurality of power using systems
JP2004088912A (en) Excitation controller of generator
JPH04332009A (en) Temperature abnormality detection system for computer system
JPS58132833A (en) Information transmitting method
JP2004363506A (en) Method and device for protecting electronic component mounting equipment in power failure
JPH0759263A (en) Emergency stand-by power supply
JP2529707B2 (en) Blackout detection method
JPH0833187A (en) Power distributor
JPH06189442A (en) Short-circuit protective circuit and method of resetting power source
JP3505029B2 (en) Power supply apparatus and substrate processing apparatus having the same
JPH0984279A (en) Uninterruptible power source system
JP2001337702A (en) Operation control-system of installation equipment
JPH01231622A (en) Power source control system

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100116

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130116

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees