JP3460667B2 - Multilayer ceramic electronic components - Google Patents

Multilayer ceramic electronic components

Info

Publication number
JP3460667B2
JP3460667B2 JP2000063781A JP2000063781A JP3460667B2 JP 3460667 B2 JP3460667 B2 JP 3460667B2 JP 2000063781 A JP2000063781 A JP 2000063781A JP 2000063781 A JP2000063781 A JP 2000063781A JP 3460667 B2 JP3460667 B2 JP 3460667B2
Authority
JP
Japan
Prior art keywords
sintered body
ceramic sintered
ceramic
conductive paste
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000063781A
Other languages
Japanese (ja)
Other versions
JP2001250736A (en
Inventor
裕司 宇熊
康信 米田
慎一郎 黒岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2000063781A priority Critical patent/JP3460667B2/en
Publication of JP2001250736A publication Critical patent/JP2001250736A/en
Application granted granted Critical
Publication of JP3460667B2 publication Critical patent/JP3460667B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、積層コンデンサな
どの積層セラミック電子部品に関し、特に、導電ペース
トの塗布・焼付けにより形成された外部電極を有する積
層セラミック電子部品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic electronic component such as a monolithic capacitor, and more particularly to a monolithic ceramic electronic component having external electrodes formed by applying and baking a conductive paste.

【0002】[0002]

【従来の技術】従来、積層コンデンサなどのセラミック
電子部品では、セラミック焼結体の外表面に導電ペース
トを塗布し、焼き付けることにより外部電極が形成され
ている。このセラミック焼結体は、通常、直方体状の形
状を有する。他方、プリント回路基板などに表面実装す
るために、上記外部電極は、セラミック焼結体の端面だ
けでなく、上面、下面及び一対の側面に至るように形成
される。ところが、導電ペーストを塗布した場合、端面
と、上面、下面及び一対の側面とのなすエッジ部におい
て、導電ペーストの厚みが薄くなり、プリント回路基板
に実装される部分、すなわち下面上の導電ペーストと、
端面上に付与されている導電ペーストとの間で断線が生
じがちであるという問題があった。
2. Description of the Related Art Conventionally, in a ceramic electronic component such as a multilayer capacitor, an external electrode is formed by applying a conductive paste on the outer surface of a ceramic sintered body and baking it. This ceramic sintered body usually has a rectangular parallelepiped shape. On the other hand, for surface mounting on a printed circuit board or the like, the external electrodes are formed not only on the end faces of the ceramic sintered body but also on the upper face, the lower face and a pair of side faces. However, when the conductive paste is applied, the thickness of the conductive paste becomes thin at the edge portion formed by the end face and the upper surface, the lower surface and the pair of side surfaces, and the portion mounted on the printed circuit board, that is, the conductive paste on the lower surface. ,
There is a problem that disconnection is likely to occur between the conductive paste applied on the end face.

【0003】そして、外部電極の断線を防止するため
に、従来、導電ペーストを、セラミック焼結体の端面か
ら付与するに際し、端面上に付与される導電ペーストの
膜厚を制御することにより、コーナー部分にも確実に導
電ペーストが付与され、断線を防止するように試みられ
ていた。しかしながら、端面上の導電ペーストの膜厚を
制御するだけでは、断線を確実に防止することはできな
かった。
In order to prevent the disconnection of the external electrodes, conventionally, when the conductive paste is applied from the end surface of the ceramic sintered body, the film thickness of the conductive paste applied on the end surface is controlled to control the corners. The conductive paste was surely applied to the portion as well, and attempts were made to prevent disconnection. However, disconnection could not be reliably prevented only by controlling the film thickness of the conductive paste on the end face.

【0004】そこで、従来、図2に示すように、積層コ
ンデンサ51のセラミック焼結体52において、端面5
2aと、上面52b及び下面52cとのなすエッジ部を
丸めるように加工が施されていた。なお、この加工は、
セラミック焼結体52をバレル研磨することにより行わ
れている。
Therefore, conventionally, in the ceramic sintered body 52 of the multilayer capacitor 51, as shown in FIG.
Processing was performed so that the edge portion formed by 2a and the upper surface 52b and the lower surface 52c was rounded. In addition, this processing is
This is performed by barrel-polishing the ceramic sintered body 52.

【0005】上記のように、セラミック焼結体52の端
面52aのエッジ部が丸められることにより、導電ペー
ストを塗布し、焼き付けてなる外部電極53の断線が抑
制される。すなわち、外部電極53の端面52a上の部
分と、下面52c上の電極延長部53aとの間の断線が
生じ難くされている。
As described above, by rounding the edge portion of the end surface 52a of the ceramic sintered body 52, disconnection of the external electrode 53 formed by applying and baking the conductive paste is suppressed. That is, disconnection between the portion on the end surface 52a of the external electrode 53 and the electrode extension 53a on the lower surface 52c is hard to occur.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、近年、
積層コンデンサなどの積層セラミック電子部品では小型
化が進んでいる。小型化が進むにつれて、溶融半田等に
よりプリント回路基板に実装される場合、半田の表面張
力によりセラミック電子部品が立ち上がるという現象、
すなわちツームストーン現象が生じがちとなっている。
However, in recent years,
Miniaturization is progressing in multilayer ceramic electronic components such as multilayer capacitors. As miniaturization progresses, when it is mounted on a printed circuit board with molten solder, etc., the surface tension of the solder causes the ceramic electronic component to start up,
That is, the tombstone phenomenon tends to occur.

【0007】他方、外部電極の連続性を確保するため
に、上記のようにエッジ部を丸めた場合、外部電極53
の外表面もセラミック焼結体52のエッジ部で丸みを帯
びるため、ツームストーン現象がより一層生じ易くなる
という問題があった。
On the other hand, in order to secure the continuity of the external electrode, when the edge portion is rounded as described above, the external electrode 53
Since the outer surface of the ceramic is also rounded at the edge portion of the ceramic sintered body 52, there is a problem that the tombstone phenomenon is more likely to occur.

【0008】また、上記のように、端面の導電ペースト
の膜厚を制御することにより、エッジ部における外部電
極の連続性を確保する方法では、エッジ部における断線
を防止することは困難であった。
Further, as described above, it is difficult to prevent disconnection at the edge portion by the method of ensuring the continuity of the external electrode at the edge portion by controlling the film thickness of the conductive paste on the end face. .

【0009】本発明の目的は、従来技術の欠点を解消
し、導電ペーストを塗布し、焼き付けてなる外部電極を
有する積層セラミック電子部品において、外部電極のエ
ッジ部における断線をより確実に防止し、かつツームス
トーン現象の発生を抑制し得る、信頼性に優れた積層セ
ラミック電子部品を提供することにある。
The object of the present invention is to solve the drawbacks of the prior art, to more reliably prevent disconnection at the edge portion of the external electrode in a laminated ceramic electronic component having the external electrode formed by applying and baking a conductive paste, Another object of the present invention is to provide a highly reliable laminated ceramic electronic component capable of suppressing the occurrence of the tombstone phenomenon.

【0010】[0010]

【課題を解決するための手段】本発明に係る積層セラミ
ック電子部品は、上面、下面、一対の側面及び一対の端
面を有するセラミック焼結体と、前記セラミック焼結体
内に形成されており、前記セラミック焼結体の一方の端
面に引き出された内部電極と、Cu粉末含有導電ペース
トの塗布・焼付けにより形成されており、かつセラミッ
ク焼結体の一方の端面を覆い、かつ上面、一対の側面及
び下面に至る電極延長部を有する外部電極とを備え、前
記セラミック焼結体の端面の外周のエッジ部曲率半径
が30〜70μmとなるように丸められており、前記外
部電極を構成している導電ペースト中のCu粉末の平均
粒径が、前記曲率半径の7%以下であることを特徴とす
る。
A monolithic ceramic electronic component according to the present invention includes a ceramic sintered body having an upper surface, a lower surface, a pair of side surfaces and a pair of end surfaces, and the ceramic sintered body. It is formed by applying and baking an internal electrode drawn to one end surface of the ceramic sintered body and a Cu powder-containing conductive paste, and covers one end surface of the ceramic sintered body, and an upper surface, a pair of side surfaces and An external electrode having an electrode extension reaching the lower surface, and a radius of curvature of an edge portion of an outer periphery of the end surface of the ceramic sintered body.
Is 30 to 70 μm, and the average particle diameter of the Cu powder in the conductive paste forming the external electrode is 7% or less of the radius of curvature.

【0011】本発明の特定の局面では、前記セラミック
焼結体内に、複数の内部電極がセラミック焼結体層を介
して重なり合うように配置されており、前記複数の内部
電極がセラミック焼結体のいずれかの端面に引き出され
ており、前記一対の端面のそれぞれを覆うように第1,
第2の外部電極がそれぞれ形成されており、それによっ
て積層コンデンサが構成されている。
In a particular aspect of the present invention, a plurality of internal electrodes are arranged in the ceramic sintered body so as to overlap with each other with a ceramic sintered body layer interposed therebetween, and the plurality of internal electrodes are made of a ceramic sintered body. It is drawn out to one of the end faces, and the first and
Second external electrodes are respectively formed, and thereby a multilayer capacitor is formed.

【0012】[0012]

【発明の実施の形態】以下、図面を参照しつつ、本発明
に係る積層セラミック電子部品の具体的な実施例を説明
する。
BEST MODE FOR CARRYING OUT THE INVENTION Specific embodiments of the laminated ceramic electronic component according to the present invention will be described below with reference to the drawings.

【0013】本実施例では、図1に示す積層コンデンサ
1を作製した。積層コンデンサ1は、直方体状のセラミ
ック焼結体2と、セラミック焼結体2内に形成された内
部電極3a〜3fと、外部電極4,5とを有する。セラ
ミック焼結体2は、適宜の誘電体セラミックスにより構
成されるが、本実施例では、チタン酸バリウムにより構
成されている。
In this example, the multilayer capacitor 1 shown in FIG. 1 was produced. The multilayer capacitor 1 has a rectangular parallelepiped ceramic sintered body 2, internal electrodes 3 a to 3 f formed in the ceramic sintered body 2, and external electrodes 4 and 5. The ceramic sintered body 2 is made of an appropriate dielectric ceramic, but in the present embodiment, it is made of barium titanate.

【0014】内部電極3a〜3fは、セラミック焼結体
2内において、セラミック焼結体層を介して厚み方向に
重なり合うように配置されている。また、内部電極3a
〜3fは、厚み方向において、交互に、セラミック焼結
体2の第1の端面2aと、第2の端面2bとに引き出さ
れている。
The internal electrodes 3a to 3f are arranged in the ceramic sintered body 2 so as to overlap each other in the thickness direction with a ceramic sintered body layer interposed therebetween. Also, the internal electrode 3a
3 f are alternately drawn out to the first end surface 2 a and the second end surface 2 b of the ceramic sintered body 2 in the thickness direction.

【0015】本実施例では、内部電極積層数が約30で
あり、セラミック焼結体の外寸が、1.6×0.8×
0.8mmのものを用意した。そして、上記のようにし
て用意されたセラミック焼結体2をバレル研磨し、エッ
ジ部2e、すなわち端面2aと上面2c、下面2d及び
一対の側面とのなす端縁を研磨した。この研磨量を種々
異ならせ、複数種のセラミック焼結体を用意した。
In this example, the number of laminated internal electrodes was about 30, and the outer size of the ceramic sintered body was 1.6 × 0.8 ×.
The thing of 0.8 mm was prepared. Then, the ceramic sintered body 2 prepared as described above was barrel-polished to polish the edge portion 2e, that is, the edge formed by the end face 2a, the upper face 2c, the lower face 2d, and the pair of side faces. A plurality of types of ceramic sintered bodies were prepared by varying the polishing amount.

【0016】そして、エッジ部2eが丸められた各セラ
ミック焼結体に、Cu粉末と、平均粒径1μmのB−S
i−Zn系ガラスフリットと、アクリル系樹脂を有機溶
剤に溶解させた有機ビヒクルとを、重量比で95:5:
25の割合で混練してなる導電ペーストを、端面2a上
における膜厚が50μmとなるように塗布し、800℃
の温度で60分間焼き付け、外部電極3,4を形成し
た。
Then, Cu powder and B--S having an average particle size of 1 .mu.m are added to each ceramic sintered body having the rounded edge portion 2e.
A weight ratio of i-Zn based glass frit and an organic vehicle in which an acrylic resin is dissolved in an organic solvent is 95: 5:
A conductive paste formed by kneading at a ratio of 25 is applied so that the film thickness on the end surface 2a is 50 μm, and the temperature is 800 ° C.
The external electrodes 3 and 4 were formed by baking at the temperature of 60 minutes.

【0017】なお、使用した導電ペーストにおいて、C
u粉末の平均粒径を、0.5μm、1.0μm、1.5
μm、2.0μm、3.0μm、4.0μm及び5.0
μmと変化させ、種々の積層コンデンサを作製した。
In the conductive paste used, C
The average particle diameter of u powder is 0.5 μm, 1.0 μm, 1.5
μm, 2.0 μm, 3.0 μm, 4.0 μm and 5.0
By changing the thickness to μm, various laminated capacitors were manufactured.

【0018】上記のようにして得られた各積層コンデン
サを、セラミック焼結体2の厚み方向と平行な方向に切
断し、断面を顕微鏡により観察した。より具体的には、
外部電極4,5がエッジ部、特に端面と上面及び下面と
のエッジ部で断線しているか否か、すなわちエッジ部で
セラミック焼結体2が露出しているか否かを確認した。
また、外部電極45が断線し、セラミック焼結体がエッ
ジ部で露出しているものを不良品と判定した。各積層コ
ンデンサ500個につきこの連続性評価を行い、500
個あたりの連続性不良品の発生割合を求めた。結果を下
記の表1〜表3に示す。
Each of the multilayer capacitors obtained as described above was cut in a direction parallel to the thickness direction of the ceramic sintered body 2, and the cross section was observed with a microscope. More specifically,
It was confirmed whether or not the external electrodes 4, 5 were broken at the edge portion, particularly at the edge portion between the end face and the upper surface and the lower surface, that is, whether the ceramic sintered body 2 was exposed at the edge portion.
In addition, the external electrode 45 was broken and the ceramic sintered body exposed at the edge was determined to be a defective product. This continuity evaluation was performed for each 500 multilayer capacitors, and
The rate of occurrence of defective continuous products per piece was determined. The results are shown in Tables 1 to 3 below.

【0019】また、導電ペーストの塗布・焼き付けて外
部電極4,5を形成した後に、外部電極3,4の表面
に、第一層がNi、第二層がSnからなるメッキ膜を湿
式メッキ法により形成し、メッキ前後の絶縁抵抗を測定
した。メッキ後に絶縁抵抗が10%以上低下しているも
のを不良品と判断した。そして、各積層コンデンサ50
0個につきメッキによる上記特性劣化評価を行い、50
0個あたりの不良品発生割合を求めた。結果を下記の表
1〜表3に示す。
After forming the external electrodes 4 and 5 by applying and baking a conductive paste, a plating film having Ni as the first layer and Sn as the second layer is formed on the surfaces of the external electrodes 3 and 4 by the wet plating method. And the insulation resistance before and after plating was measured. A product whose insulation resistance was reduced by 10% or more after plating was judged as a defective product. Then, each multilayer capacitor 50
The above-mentioned characteristic deterioration evaluation due to plating was performed for 0
The defective product generation rate per 0 pieces was obtained. The results are shown in Tables 1 to 3 below.

【0020】[0020]

【表1】 [Table 1]

【0021】[0021]

【表2】 [Table 2]

【0022】[0022]

【表3】 [Table 3]

【0023】表1〜表3から明らかなように、セラミッ
ク焼結体のエッジ部の研磨量としての曲率半径が30μ
m、50μm及び70μmのいずれの場合でも、導電ペ
ースト中のCu粉末の粒径の上記曲率半径に対する比が
0.70以下では、外部電極の連続性不良及びメッキ後
の特性劣化不良が皆無であったのに対し、0.071以
上の場合には、外部電極の連続性不良やメッキ後の絶縁
抵抗不良が生じた。従って、表1〜表3の結果から、導
電ペーストに用いる金属粉末の平均粒径のセラミック焼
結体のエッジ部の研磨量である曲率半径Rに対する比を
7%以下とすれば、外部電極の連続性を確実に確保し得
ることがわかる。
As is apparent from Tables 1 to 3, the radius of curvature as the polishing amount of the edge portion of the ceramic sintered body is 30 μm.
m, 50 μm and 70 μm, when the ratio of the particle size of the Cu powder in the conductive paste to the radius of curvature is 0.70 or less, there is no continuity defect of the external electrode and no property deterioration defect after plating. On the other hand, in the case of 0.071 or more, the continuity failure of the external electrode and the insulation resistance failure after plating occurred. Therefore, from the results of Tables 1 to 3, if the ratio of the average particle diameter of the metal powder used for the conductive paste to the radius of curvature R, which is the polishing amount of the edge portion of the ceramic sintered body, is 7% or less, the external electrode It is understood that the continuity can be surely secured.

【0024】[0024]

【0025】さらに、上記実験例では、積層コンデンサ
に適用した例を示したが、本発明は、内部電極を有し、
セラミック焼結体の外表面に内部電極と電気的に接続さ
れる外部電極を有する適宜の積層セラミック電子部品に
適用することができる。
Further, in the above experimental example, an example applied to a multilayer capacitor was shown, but the present invention has an internal electrode,
It can be applied to an appropriate multilayer ceramic electronic component having an external electrode electrically connected to the internal electrode on the outer surface of the ceramic sintered body.

【0026】[0026]

【発明の効果】本発明に係る積層セラミック電子部品で
は、セラミック焼結体の端面のエッジ部曲率半径が3
0〜70μmとなるように丸められており、外部電極を
構成しているCu粉末含有導電ペースト中の金属粉末の
平均粒径が上記曲率半径の7%以下とされているので、
セラミック焼結体のエッジ部における外部電極の連続性
が確保され、積層セラミック電子部品の信頼性を高める
ことができる。特に、積層セラミック電子部品の小型化
を進め、ツームストーン現象が生じ易くなった場合であ
っても、上記曲率半径を小さくし、しかも、本発明に従
って外部電極を形成することにより、ツームストーン現
象の抑制と、外部電極の連続性の確保を両立することが
可能となる。
In the monolithic ceramic electronic component according to the present invention, the radius of curvature of the edge portion of the end surface of the ceramic sintered body is 3
And it rounded so that 0~70Myuemu, the average particle size of the metal powder in the Cu powder containing conductive paste constituting the external electrodes is 7% or less of the radius of curvature,
The continuity of the external electrodes at the edge of the ceramic sintered body is ensured, and the reliability of the monolithic ceramic electronic component can be improved. In particular, promoting miniaturization of the multilayer ceramic electronic component, even if the tombstone phenomenon becomes prone to reduce the curvature radius, moreover, by forming the external electrodes according to the present invention, the tombstone phenomenon It is possible to achieve both suppression of the above and ensuring continuity of the external electrodes.

【0027】また、本発明の特定の局面では、セラミッ
ク焼結体内に複数の内部電極が形成されており、複数の
内部電極がセラミック焼結体の厚み方向において交互に
第1,第2の端面に引き出されており、第1,第2の端
面を覆うように第1,第2の外部電極が形成されて積層
コンデンサが構成される。従って、本発明により、外部
電極のセラミック焼結体のエッジ部における連続性が確
保された、信頼性に優れた積層コンデンサを提供するこ
とができる。
Further, according to a particular aspect of the present invention, a plurality of internal electrodes are formed in the ceramic sintered body, and the plurality of internal electrodes are alternately arranged in the thickness direction of the ceramic sintered body. And the first and second external electrodes are formed so as to cover the first and second end faces to form a multilayer capacitor. Therefore, according to the present invention, it is possible to provide a highly reliable multilayer capacitor in which continuity is secured in the edge portion of the ceramic sintered body of the external electrode.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に係る積層セラミック電子部
品としての積層コンデンサを示す断面図。
FIG. 1 is a sectional view showing a monolithic capacitor as a monolithic ceramic electronic component according to an embodiment of the present invention.

【図2】従来の積層コンデンサの問題点を説明するため
の部分切欠拡大断面図。
FIG. 2 is a partially cutaway enlarged cross-sectional view for explaining a problem of a conventional multilayer capacitor.

【符号の説明】[Explanation of symbols]

1…積層コンデンサ 2…セラミック焼結体 2a,2b…第1,第2の端面 2c…上面 2d…下面 2e…エッジ部 3a〜3f…内部電極 4,5…外部電極 1. Multilayer capacitor 2 ... Ceramic sintered body 2a, 2b ... First and second end faces 2c ... top surface 2d ... bottom surface 2e ... Edge part 3a to 3f ... internal electrodes 4, 5 ... External electrodes

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平9−7877(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01G 4/00 - 17/00 ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-9-7877 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01G 4/00-17/00

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 上面、下面、一対の側面及び一対の端面
を有するセラミック焼結体と、 前記セラミック焼結体内に形成されており、前記セラミ
ック焼結体の一方の端面に引き出された内部電極と、Cu粉末含有 導電ペーストの塗布・焼付けにより形成さ
れており、かつセラミック焼結体の一方の端面を覆い、
かつ上面、一対の側面及び下面に至る電極延長部を有す
る外部電極とを備え、 前記セラミック焼結体の端面の外周のエッジ部曲率半
が30〜70μmとなるように丸められており、前記
外部電極を構成している導電ペースト中のCu粉末の平
均粒径が、前記曲率半径の7%以下であることを特徴と
する、積層セラミック電子部品。
1. A ceramic sintered body having an upper surface, a lower surface, a pair of side surfaces, and a pair of end surfaces, and an internal electrode formed in the ceramic sintered body and extended to one end surface of the ceramic sintered body. A Cu powder-containing conductive paste is applied and baked to cover one end surface of the ceramic sintered body,
And an external electrode having an electrode extension extending to an upper surface, a pair of side surfaces, and a lower surface, and is rounded so that a radius of curvature of an edge portion of an outer periphery of an end surface of the ceramic sintered body is 30 to 70 μm. An average particle diameter of Cu powder in the conductive paste forming the external electrode is 7% or less of the radius of curvature, a laminated ceramic electronic component.
【請求項2】 前記セラミック焼結体内に、複数の内部
電極がセラミック焼結体層を介して重なり合うように配
置されており、 前記複数の内部電極がセラミック焼結体のいずれかの端
面に引き出されており、 前記一対の端面のそれぞれを覆うように第1,第2の外
部電極がそれぞれ形成されており、それによって積層コ
ンデンサが構成されている、請求項1に記載の積層セラ
ミック電子部品。
2. A plurality of internal electrodes are arranged in the ceramic sintered body so as to overlap each other with a ceramic sintered body layer interposed therebetween, and the plurality of internal electrodes are drawn out to one end surface of the ceramic sintered body. The monolithic ceramic electronic component according to claim 1, wherein the first and second external electrodes are formed so as to cover the pair of end faces, respectively, thereby forming a monolithic capacitor.
JP2000063781A 2000-03-08 2000-03-08 Multilayer ceramic electronic components Expired - Fee Related JP3460667B2 (en)

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JP2001250736A JP2001250736A (en) 2001-09-14
JP3460667B2 true JP3460667B2 (en) 2003-10-27

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Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11145463B2 (en) * 2018-09-05 2021-10-12 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH097877A (en) * 1995-04-18 1997-01-10 Rohm Co Ltd Multilayered ceramic chip capacitor and manufacture thereof

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