JP3399474B2 - Electronic component manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component in which an electronic component body is inserted into a cylindrical insulating case.

[0002]

2. Description of the Related Art As a conventional example of a method of manufacturing an electronic component, a case of manufacturing a ceramic oscillator will be described with reference to FIG. In the figure, 1 is a cylindrical insulating case, 2a, 2
Reference numeral b is a metal cap, 3 is a conductive adhesive, 4 is a ceramic piezoelectric element, and 5 is a rib of a metal cap. Rib 5
Is provided in an annular shape on the bottoms of the metal caps 2a and 2b in order to give elasticity to the metal caps 2a and 2b and to position the ceramic piezoelectric element 4 at the center of the metal caps 2a and 2b. The rib 5 is designed so that the apex of the rib 5 is located slightly outside the inner side surface of the tubular insulating case 1.

First, the conductive adhesive 3 is applied to the metal cap 2a, and then the metal cap 2a is press-fitted and fixed in one opening of the cylindrical insulating case 1. Next, the plate-shaped ceramic piezoelectric element 4 is inserted from the other opening of the cylindrical insulating case 1. Then, another metal cap 2b coated with the conductive adhesive 3 is press-fitted and fixed in the other opening of the cylindrical insulating case 1.

[0004]

In this prior art, as shown in FIG. 4, when the ceramic piezoelectric element 4 is inserted into a cylindrical insulating case 1 whose one opening is sealed with a metal cap 2a. The tip portion of the ceramic piezoelectric element 4 is located on the annular rib 5 of the metal cap 2a, and as a result, it may protrude from the cylindrical insulating case 1 or come close to the inner surface of the cylindrical insulating case 1. It was In this case, if another metal cap 2b is press-fitted into the other opening of the cylindrical insulating case 1, an unreasonable force is applied to the ceramic piezoelectric element 4 and the ceramic piezoelectric element 4 is damaged as indicated by the broken line. was there. Further, when the tip portion of the ceramic piezoelectric element 4 is located on the rib 5 of the metal cap 2a in this way, the conductive adhesive 3 causes the inner surface of the cylindrical insulating case 1 and the ceramic piezoelectric element 4 due to the capillary phenomenon. Sometimes flowed between the side surfaces of the electrode and short-circuited with the counter electrode.

Therefore, an object of the present invention is to position the electronic component body inserted in the tubular insulating case on the central bottom surface of the metal cap to prevent damage or short circuit of the electronic component body.
It is to provide a manufacturing method of an electronic component.

[0006]

To achieve the above object, a first invention of the present invention is to apply a conductive adhesive to the bottom of a metal cap, and to install the metal cap in one of a cylindrical insulating case. The step of press-fitting and fixing in the opening, the step of inserting the main body of the electronic component having the same length as the case length of the tubular insulating case from the other opening of the tubular insulating case, and the electronic component in the tubular insulating case With the main body inserted, the vibrator vibrates the entire tubular insulation case, and the vibrator is oscillated from the other opening of the tubular insulation case to the electronic component body. The process of moving the inner surface to position the end of the electronic component body at the center of the bottom of the metal cap, and a metal cap with a conductive adhesive applied to the bottom of the other opening of the tubular insulating case. Type fixed to the step of holding the electronic component body at both ends in the press-fitted metal cap of the cylindrical insulating case, characterized by comprising more.

To achieve the above object, a second aspect of the present invention is a step of applying a conductive adhesive to the bottom of a metal cap, and press-fitting and fixing the metal cap into one opening of a cylindrical insulating case. In the step, the step of inserting the electronic component body having a length substantially the same as the case length of the tubular insulating case from the other opening of the tubular insulating case, and with the electronic component body inserted in the tubular insulating case, By vibrating the electronic component body from the other opening of the tubular insulating case with the vibrator, the inner surface of the metal cap is moved to the electronic component body, and the end of the electronic component body is positioned at the center of the bottom of the metal cap. In the process and the other opening of the cylindrical insulating case,
The method comprises the steps of press-fitting and fixing a metal cap coated with a conductive adhesive on the bottom, and holding the electronic component body with the metal caps press-fitting and fixed to both ends of the cylindrical insulating case.

In order to achieve the above object, a third aspect of the present invention is a step of applying a conductive adhesive to the bottom of a metal cap, and the metal cap is press-fitted and fixed in one opening of a cylindrical insulating case. In the step, the step of inserting the electronic component body having a length substantially the same as the case length of the tubular insulating case from the other opening of the tubular insulating case, and with the electronic component body inserted in the tubular insulating case, A motor is applied from the other opening of the tubular insulating case to the end of the electronic component body inserted in the tubular insulating case to rotate it in a plane substantially perpendicular to the axial direction of the tubular insulating case. The process of positioning the end of the electronic component body at the center of the bottom of the metal cap, and the metal cap with the conductive adhesive applied to the bottom is press-fitted into the other opening of the cylindrical insulation case, Metals press-fitted on both ends of A step of holding the electronic component body in cap, characterized by comprising more.

[0009]

According to the method of manufacturing an electronic component of the present invention, the end portion of the electronic component main body moves within the surface of the metal cap by a force such as vibration applied from the outside, and is settled at the most stable bottom central portion. .

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing an electronic component of the present invention will be described below with reference to the drawings by taking a ceramic oscillator as an example.

FIGS. 1A and 1B are sectional views showing the first embodiment. In the figure, 6 is a base plate on which the tubular insulating case 1 is placed, and 8 is a vibrator that gives vibration to the tubular insulating case 1 via the base plate 6. Since the other parts are the same as the conventional ones, the same numbers are given and the description thereof is omitted.

In manufacturing a ceramic oscillator, first, an epoxy-based conductive adhesive 3 is used, and then a conductive metal cap 2 is used.
The rib 5 is applied to the inside of a so that the rib 5 is buried. After that, the metal cap 2a is press-fitted and fixed into one opening of the cylindrical insulating case 1 made of alumina ceramic. next,
The flat plate-shaped ceramic piezoelectric element 4 is inserted into the cylindrical insulating case 1. Next, vibration is applied to the entire tubular insulating case 1 by the vibrator 8 through the base plate 6 on which the tubular insulating case 1 is placed. Due to this vibration, the ceramic piezoelectric element 4 moves on the inner surface of the metal cap 2a and is located at the most stable bottom central portion in the metal cap 2a. Further, the ceramic piezoelectric element 4 is temporarily fixed by the viscosity of the conductive adhesive 3 and is held substantially vertically. After that, the metal caps 2b similarly coated with the conductive adhesive 3 on the bottom are press-fitted and fixed to the other opening of the tubular insulating case 1, and the metal caps 2a and 2b are press-fitted and fixed to both ends of the tubular insulating case 1. Holds the ceramic piezoelectric element 4.

2 (a) and 2 (b) are sectional views showing a second embodiment. In the figure, 7 is a flat plate that holds down the ceramic piezoelectric element 4, and 8 is a vibrator that transmits vibration to the ceramic piezoelectric element 4 via the flat plate 7.
Since the other parts are the same as the conventional ones, the same numbers are given and the description thereof is omitted.

Similar to the first embodiment, the ceramic piezoelectric element 4 is inserted into the cylindrical insulating case 1 whose one opening is sealed with the metal cap 2a. Next, the ceramic piezoelectric element 4 protruding from the opening of the cylindrical insulating case 1
On top of this, place the flat plate 7 whose surface is coated with an elastic material such as rubber,
Vibration is applied to the ceramic piezoelectric element 4 via the flat plate 7 by the vibrator 8. Due to this vibration, the ceramic piezoelectric element 4 moves on the inner surface of the metal cap 2a and is located at the most stable bottom central portion in the metal cap 2a.
After that, the metal caps 2b similarly coated with the conductive adhesive 3 on the bottom are press-fitted and fixed to the other opening of the tubular insulating case 1, and the metal caps 2a and 2b are press-fitted and fixed to both ends of the tubular insulating case 1. Holds the ceramic piezoelectric element 4.

3 (a) and 3 (b) are sectional views showing a third embodiment. In the figure, 9 is a motor for rotating the ceramic piezoelectric element 4 via the flat plate 7. Since the other parts are the same as the conventional ones, the same numbers are given and the description thereof is omitted.

Similar to the first embodiment, the ceramic piezoelectric element 4 is inserted into the cylindrical insulating case 1 whose one opening is sealed with the metal cap 2a. Next, the ceramic piezoelectric element 4 protruding from the opening of the cylindrical insulating case 1
On top of this, place the flat plate 7 whose surface is coated with an elastic material such as rubber,
A motor 9 applies a force to the portion of the ceramic piezoelectric element 4 on the other opening side of the tubular insulating case 1 through a flat plate 7 to rotate in a plane substantially perpendicular to the axis of the tubular insulating case 1. Due to this force, in the ceramic piezoelectric element 4, the incident angle of the force applied to the ceramic piezoelectric element 4 along the axial direction of the tubular insulating case 1 to the inner surface of the metal cap 2a changes, and the ceramic piezoelectric element 4 is changed. Element 4 and metal cap 2a
A slip occurs between them, and the metal cap 2a is located at the most stable bottom center portion. After that, the metal caps 2b similarly coated with the conductive adhesive 3 on the bottom are press-fitted and fixed to the other opening of the tubular insulating case 1, and the metal caps 2a and 2b are press-fitted and fixed to both ends of the tubular insulating case 1. Holds the ceramic piezoelectric element 4.

As described above, according to the methods shown in the first, second, and third embodiments, the ceramic piezoelectric element 4 has a cylindrical shape in which one opening is sealed with the metal cap 2a. After being inserted into the insulating case 1, the tip portion of the ceramic piezoelectric element 4 is located at the annular rib 5 portion of the metal cap 2a and protrudes from a predetermined position in the cylindrical insulating case 1 as in the prior art. Alternatively, it does not come close to the inner surface of the cylindrical insulating case 1. Therefore, when the metal cap 2b is press-fitted into the other opening of the cylindrical insulating case 1, it is possible to prevent the ceramic piezoelectric element 4 from being damaged, and further, to prevent the ceramic adhesive element 3 from being opposed to the counter electrode due to the capillary phenomenon of the conductive adhesive 3. Short circuit can also be prevented.

The conductive adhesive 3 has a high viscosity at room temperature. Therefore, in the first embodiment, the ceramic piezoelectric element 4 may not be positioned only by the vibration of the vibrator 8. Therefore, by applying a flat plate (not shown) to the ceramic piezoelectric element 4 protruding from the opening of the tubular insulating case 1 and applying a force in the axial direction of the tubular insulating case 1, the positioning becomes more reliable. In addition to this, the means of FIGS. 2 and 3 may be used in combination in the first embodiment.

Further, in the third embodiment, the rotating force is applied to the end portion of the ceramic piezoelectric element 4, but a substantially linear force in front, rear, left and right may be used.

In the second and third embodiments, the flat plate 7 for suppressing the ceramic piezoelectric element 4 prevents the ceramic piezoelectric element 4 from being chipped, and the ceramic piezoelectric element 4 and the flat plate 7 are combined. In order to suppress slippage and transmit vibration efficiently, the surface is coated with an elastic material, but this is not essential.

Needless to say, the cylindrical insulating case 1 can be aligned by using a transfer jig or the like so that a plurality of them can be processed simultaneously. Furthermore, before the metal cap 2b is press-fitted into the tubular insulating case 1, the metal cap 2b may be used to apply vibration to dispose the electronic component main body in the central portion.

[0022]

As is apparent from the above description, according to the method of manufacturing an electronic component of the present invention, the electronic component main body can be positioned at the central portion of the bottom of the metal cap by vibration, and the electronic component main body It is possible to greatly reduce the damage and short circuit of the electronic component body that occur when it is located at the rib portion of the metal cap.

[Brief description of drawings]

FIG. 1A is a cross-sectional view showing a first embodiment of a method for manufacturing an electronic component of the present invention. (B) An assembled sectional view of a first embodiment of a method for manufacturing an electronic component of the present invention.

FIG. 2A is a sectional view showing a second embodiment of the method for manufacturing an electronic component of the present invention. (B) It is an assembled sectional view of a second embodiment of the method for manufacturing an electronic component of the present invention.

FIG. 3A is a sectional view showing a third embodiment of the method for manufacturing an electronic component of the present invention. (B) It is an assembled sectional view of the third embodiment of the method for manufacturing an electronic component of the present invention.

FIG. 4 is a cross-sectional view showing a conventional method of manufacturing an electronic component.

[Explanation of symbols]

1 Cylindrical insulation case 2a, 2b Metal cap 3 Conductive adhesive 4 Ceramic piezoelectric element 5 ribs 6 base plate 7 flat plate 8 vibrators 9 motors

Claims (3)

(57) [Claims] 1. A step of applying a conductive adhesive to a bottom portion of a metal cap, a step of press-fitting and fixing the metal cap into one opening of the cylindrical insulating case, and a step of opening the other side of the cylindrical insulating case. inserting a substantially electronic component body having the same length as the casing length of the cylindrical insulating case, in a state of inserting the electronic component body into the cylindrical insulating case, by
Applying vibration to the entire cylindrical insulating case by Bureta, or
From the other opening of the tubular insulation case to the vibrator
By giving more vibration to the electronic component body,
Moving the inner surface of the metal cap to the main body so that the end of the electronic component main body is located at the center of the bottom of the metal cap, and the bottom of the cylindrical insulating case is coated with a conductive adhesive on the other opening. A method of manufacturing an electronic component, comprising the steps of press-fitting and fixing a cap, and holding the electronic component body with metal caps that are press-fitting and fixed to both ends of a cylindrical insulating case. 2. A conductive adhesive is applied to the bottom of the metal cap.
And the metal cap is press-fitted into one opening of the cylindrical insulation case.
Setting process, and from the other opening of the tubular insulation case,
The process of inserting the electronic component body that is almost the same length as the case
With the electronic component body inserted in the tubular insulation case,
From the other opening of the insulating case, the electronic
By applying vibration to the component body,
Move the inner surface of the metal cap, and
The step of locating the metal cap at the center of the bottom, and the conductive adhesive on the bottom of the other opening of the cylindrical insulating case.
A metal cap coated with is fixed by press fitting, and a cylindrical insulating case
Hold the electronic parts body with metal caps that are press-fitted and fixed at both ends of
A method of manufacturing an electronic component , which includes a holding step and a holding step . 3. A step of applying a conductive adhesive to the bottom of the metal cap, a step of press-fitting and fixing the metal cap into one opening of the cylindrical insulating case, and a step of opening the other side of the cylindrical insulating case. inserting a substantially electronic component body having the same length as the casing length of the cylindrical insulating case, in a state of inserting the electronic component body into the cylindrical insulating case, tubular
A motor is applied from the other opening of the insulating case to the end of the electronic component body inserted in the tubular insulating case to rotate in a plane substantially perpendicular to the axial direction of the tubular insulating case, thereby Position the end of the main body at the center of the bottom of the metal cap, and press the metal cap with the conductive adhesive applied to the bottom into the other opening of the tubular insulation case to secure it at both ends. A method of manufacturing an electronic component, which comprises a step of holding the electronic component main body with a metal cap press-fitted and fixed to.