JP3394842B2 - Wafer processing apparatus - Google Patents

Wafer processing apparatus

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Publication number
JP3394842B2
JP3394842B2 JP11262895A JP11262895A JP3394842B2 JP 3394842 B2 JP3394842 B2 JP 3394842B2 JP 11262895 A JP11262895 A JP 11262895A JP 11262895 A JP11262895 A JP 11262895A JP 3394842 B2 JP3394842 B2 JP 3394842B2
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JP
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11262895A
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Japanese (ja)
Other versions
JPH08283993A (en )
Inventor
治毅 園田
Original Assignee
島田理化工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】本発明はウエハをメッキ或は化学処理するウエハ処理装置に関するものである。 BACKGROUND OF THE INVENTION [0001] Field of the Invention The present invention relates to a wafer processing apparatus for plating or chemical treatment of the wafer. 【0002】 【従来の技術】従来の此種処理装置は本願出願人が特開平4−258897号として提案している [0002] Conventional此種processor present applicant has proposed as Japanese Patent Laid-Open No. 4-258897. 即ち、図4 That is, FIG. 4
に示すように、箱形をした上部カップ1の下面が開放され、天板2にバルブ3を有する処理液供給管4と、処理液リターン管5とを設け、上部カップ1の内部には上部メッシュ電極6と被覆コンタクトピン電極7とを設けている。 As shown in the lower surface of the upper cup 1 in which the box-shaped is opened, the process liquid supply pipe 4 to the top plate 2 having a valve 3, and a processing liquid return pipe 5 is provided, the upper inside of the upper cup 1 It is provided with a mesh electrode 6 and covering the contact pin electrode 7. この被覆コンタクトピン電極7は図示を省略した非電性の被覆カバーで覆われ、ウエハ8の一端に接続し、上部メッシュ電極に通電することにより処理液供給管4から供給された例えばメッキ液によりウエハ8に電解メッキが行われる。 The coated contact pin electrode 7 is covered with a coating covering a non-conductive, not shown, connected to one end of the wafer 8, for example, a plating liquid supplied from the treatment liquid supply pipe 4 by energizing the upper mesh electrode electrolytic plating is performed on the wafer 8 by. 【0003】尚、この際、昇降自在に設けた下部カップ9は上昇位置にあり孔10上にウエハ8が位置し、上部カップ1の下面は下部カップ9の底壁11に密着シールされている。 [0003] At this time, the lower cup 9 provided vertically movable is a wafer 8 positioned on the located holes 10 in the raised position, the lower surface of the upper cup 1 is in close contact sealed to the bottom wall 11 of the lower cup 9 . 尚、図中12はバルブ13を有する処理液ドレーン管、14はドレンカバー、15はウエハ8を吸着する吸着保持部、16は洗浄ドレン、17は純水ノズルである。 In the drawing, 12 is the processing liquid drain pipe having a valve 13, 14 is a drain cover, 15 suction holding unit for attracting the wafer 8, the cleaning drain 16, 17 is a pure water nozzle. 【0004】 【発明が解決しようとする課題】従来技術は前記のように構成したもので、処理液供給管から供給される処理液 [0004] [Problems that the Invention is to Solve The prior art is constructed as described above, the processing liquid supplied from the treatment liquid supply pipe
について、ウエハ8にメッキ或は化学処理を行う際に、 For, when performing the plating or chemical treatment on the wafer 8,
処理液の流れ均等化は特に配慮されておらず、 そのま Equalization of the flow of the treatment liquid is not particularly friendly to Orazu, its or
処理液リターン管へ排出される構成になっているため、ウエハに対する面内においての処理の均一性が悪いという問題があった。 Since that is configured to be discharged to or the processing liquid return pipe, the uniformity of treatment in the plane with respect to the wafer is poor. そこで、本願発明においてはメッキ液或は化学液の処理液がウエハに均等に当たるようにするものである。 Therefore, in the present invention is intended to allow the processing solution in the plating solution or the chemical liquid hits the uniformly wafer. 【0005】 【課題を解決するための手段】本発明は前記課題を解決するために、下面を開放し、天板に処理液供給管と処理液リターン管を設けた箱形の上部カップと、上面を開放し、底壁の中央部にウエハを載置する孔を設けた昇降自在の下部カップとからなり、上部カップに上下面板で仕切った整流室を設け、下面板に多数の連通孔を設け、各連通孔間に上下面板を貫通する整流筒を多数設け、前記処理液供給管を整流室と連通せしめると共に、前記処理 [0005] According to an aspect of the present invention is to solve the above problem, by opening the lower surface, the upper cup box shape in which a processing liquid return pipe and the treatment liquid supply pipe to the top plate, top opening and consists of a vertically movable lower cup holes for mounting the wafer was provided in the central portion of the bottom wall, a rectifying chamber at the top cup partitioned by the upper and lower faceplate provided, a plurality of communication holes in the lower plate provided, provided a number of flow-guide cylinder extending through the upper and lower faceplate between respective communication holes, with allowed to communicate with rectifying chamber the processing liquid supply pipe, the processing
液供給管と処理液リターン管に夫々2方向バルブを設 Set respectively 2-way valve to the processing liquid return pipe a liquid supply pipe
け、両2方向バルブを夫々反対である処理液供給管と処 Only, processing both 2-way valve and each is opposite the treatment liquid supply pipe
理液リターン管に接続管で接続してウエハ処理装置を構 Structure the wafer processing system connected by connecting pipes sense liquid return pipe
成した。 Form was. 【0006】 【作用】本発明は前記のように構成したもので、処理液供給管から2方向バルブを通って整流室に処理液が送られ、連通孔からウエハ上に処理液流下し、整流筒を通り処理液リターン管から処理液を戻す。 [0006] DETAILED DESCRIPTION OF THE INVENTION The present invention is constructed as described above, the processing liquid to the rectification chamber from the treatment liquid supply pipe through the two-way valve is transmitted, the processing solution flows down from the communicating hole on a wafer, returning the treatment liquid flow-guide cylinder from the street treatment liquid return pipe. 【0007】 その後、前記両2方向バルブの方向を切換えることにより、逆に整流筒から処理液流下させ 、連通孔から整流管を通り、2方向バルブを介して処理液リターン管から処理液を戻すことになる。 [0007] Thereafter, by switching the direction of the two 2-way valve, conversely passed down the processing liquid from the rectifying column through the rectifier pipe from the communication hole, the processing liquid from the processing liquid return pipe through a 2-way valve It will return. 【0008】 【実施例】本発明の実施例を図1乃至図2に基いて詳細に説明すると、図1に示すように上部カップ1に処理液を送る処理液供給管4の途中に2方向バルブ19を設け、又、処理液リターン管5の途中にも2方向バルブ2 [0008] Examples of EXAMPLES The invention will be described in detail with reference to FIGS. 1 and 2, the middle in two directions of the treatment liquid supply pipe 4 for sending the process liquid to the upper cup 1 as shown in FIG. 1 the valve 19 is provided, also 2 to the middle of the process liquid return pipe 5-way valve 2
0を設ける。 0 is provided. そして、処理液供給管4の2方向バルブ1 The two-way valve 1 of the processing liquid supply pipe 4
9の反上部カップ1側と前記2方向バルブ20の一方とを接続管21で連結し、2方向バルブ19の一方と処理液リターン管5の反上部カップ1側とを接続管22で接続する。 9 anti upper cup 1 side one and the 2-way valve 20 are connected by connecting pipe 21 to connecting one anti upper cup 1 side of the processing liquid return pipe 5 of the 2-way valve 19 in the connecting pipe 22 . 【0009】一方、前記処理液供給管4の先端整流室23の上面と連通させ 、整流室23の下方に従来と同様にメッシュ電極6と被覆コンタクトピン7を設けてウエハ8に接続している。 Meanwhile, the distal end of the treatment liquid supply pipe 4 is top and communicating the rectification chamber 23, connected to a conventional manner to the mesh electrode 6 and covering the contact pins 7 below the rectifying chamber 23 provided on the wafer 8 there. 【0010】整流室23は図2に示すように上部カップ1の途中を上面板24と下面板25とで仕切ることによって形成し、下面板25に多数の連通孔26,26, [0010] rectification chamber 23 formed by partitioning by the top plate 24 and bottom plate 25 in the middle of the upper cup 1 as shown in FIG. 2, a number of communication holes 26, 26 on the lower surface plate 25,
…を設け、各連通孔26,26,…の間に上下面板2 ... The provided communication holes 26 and 26, the upper and lower faceplate 2 ... between
4,25を貫通するように整流筒27,27…を垂直方向に設けている。 It is provided flow-guide cylinder 27, 27 ... to the vertical direction so as to penetrate the 4, 25. 尚、下部カップ9は従来と同様底壁11に孔10を設け、バルブ13を有する処理液ドレン管12を設けている。 Incidentally, similarly to the lower cup 9 Conventionally, a hole 10 provided in the bottom wall 11 is provided with a processing liquid drain pipe 12 having a valve 13. 【0011】本実施例は前記のように構成したもので、 [0011] The present examples are constructed as described above,
図1において2方向バルブ19,20が夫々黒い位置が開放されていると、処理液供給管4から処理液であるメッキ液が実線の矢印で示すように整流室23に供給され、多数の連通孔26,26,…を通ってウエハ8上に均等に流下する。 When two-way valve 19, 20 is opened respectively black position in FIG. 1, the plating liquid is a processing liquid from a processing liquid supply pipe 4 is supplied to the rectification chamber 23 as shown by the solid line arrow, a number of communication holes 26, 26, through the ... evenly flows down on the wafer 8. 【0012】この状態で 、通電すると、上部メッシュ電極6と被覆コンタクトピン電極7を介してウエハ8に電流が流れ 、電解メッキが行われる。 [0012] In this state, when energized, current flows through the wafer 8 through the upper mesh electrode 6 covering the contact pins electrodes 7, electrolytic plating is performed. 尚、メッキ液は多数の整流筒27から実線の矢印で示すように、上面板24 Note that as the plating solution indicated by solid line arrow from a number of flow-guide cylinder 27, the upper plate 24
上から処理液リターン管5を通って戻るようになっている。 The processing liquid return pipe 5 from the top so that the return me through. 【0013】 その後 、2方向バルブ19,20の方向を切換える 、処理液であるメッキ液図3に示すように接続管21を通り、2方向バルブ20から処理液リターン管5を通って図2において破線の矢印で示すように、 [0013] Thereafter, when switching the direction of the two-way valves 19 and 20, a processing liquid plating solution passes through the connecting pipe 21 as shown in FIG. 3, through the processing liquid return pipe 5 from 2-way valve 20 Figure as shown by the dashed arrows in two,
逆に各整流筒27を通ってウエハ8上に流下し、逆に各連通孔26,26,…を通って整流室23内から処理液供給管4を通り、2方向バルブ19を介して接続管22 Flows down on the wafer 8 through respective flow-guide cylinder 27 in the reverse, the communication holes 26, 26, through the processing liquid supply pipe 4 from the rectification chamber 23 through the ... Conversely, connected via a two-way valve 19 tube 22
を通って戻るようになっている。 Through so that the return. 【0014】 【発明の効果】本発明は前記のような構成、作用を有するから、処理液は一旦整流室に入った後に連通孔からウエハ上に流下するので、処理液は均等にウエハ上に流下することになる。 [0014] According to the present invention the like configuration, because having an effect, so flows down from the treatment liquid once the communication hole after entering the rectifying chamber onto the wafer, the processing solution is uniformly on the wafer It will be flowing down. 更に 、2方向バルブを切換することにより戻りの整流筒から逆に処理液が流下することになり、より一層の均等化られる Further, by switching the two-way valve, reverse the process liquid from the rectifying column of the return is to flow down, more of the equalization is FIG. 【0015】 [0015]

【図面の簡単な説明】 【図1】本発明に係るウエハ処理装置の実施例の縦断面図。 Longitudinal sectional view of an embodiment of a wafer processing apparatus according to the BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] present invention. 【図2】その要部を拡大した断面図。 2 is a cross-sectional view enlarging a main portion thereof. 【図3】2方向バルブを切換えた際の作用を説明する縦断面図。 Figure 3 is a longitudinal sectional view illustrating the operation at the time of switching the two-way valve. 【図4】従来装置の断面図。 4 is a cross-sectional view of a conventional device. 【符号の説明】 1 上部カップ2 天板3 バルブ4 処理液供給管5 処理液リターン管6 上部メッシュ電極7 被覆コンタクトピン電極8 ウエハ9 下部カップ10 孔11 底壁12 処理液ドレン管13 バルブ14 ドレンカバー15 吸着保持部16 洗浄水ドレン17 純水ノズル19 2方向バルブ20 2方向バルブ21 接続管22 接続管23 整流室24 上面板25 下面板26 連通孔27 整流筒 [EXPLANATION OF SYMBOLS] 1 upper cup 2 the top plate 3 Valve 4 processing liquid supply pipe 5 treatment liquid return pipe 6 upper mesh electrode 7 covering the contact pins electrodes 8 wafer 9 lower cup 10 hole 11 bottom wall 12 processing liquid drain pipe 13 valve 14 drain cover 15 suction holding unit 16 the washing water drain 17 pure water nozzle 19 2-way valve 20 2-way valve 21 connecting pipe 22 connecting pipe 23 rectification chamber 24 the upper plate 25 lower plate 26 hole 27 flow-guide cylinder

Claims (1)

  1. (57)【特許請求の範囲】 【請求項1】 下面を開放し、天板に処理液供給管と処理液リターン管を設けた箱形の上部カップと、上面を開放し、底壁の中央部にウエハを載置する孔を設けた昇降自在の下部カップとからなり、上部カップに上下面板で仕切った整流室を設け、下面板に多数の連通孔を設け、 (57) opens the Patent Claims 1. A lower surface to open the upper cup of the box-shaped having a processing liquid return pipe and the treatment liquid supply pipe to the top plate, the top surface, the center of the bottom wall part wafer consists of a vertically movable lower cup provided with mounting holes to the rectified chamber to the upper cup partitioned by the upper and lower faceplate provided, it provided a large number of communication holes in the lower plate,
    各連通孔間に上下面板を貫通する整流筒を多数設け、前記処理液供給管を整流室と連通せしめると共に、前記処 Provided a number of flow-guide cylinder extending through the upper and lower faceplate between respective communication holes, with allowed to communicate with rectifying chamber the processing liquid supply pipe, the punished
    理液供給管と処理液リターン管に夫々2方向バルブを設 Set respectively 2-way valve to the processing liquid return pipe management solution supply pipe
    け、両2方向バルブを夫々反対である処理液供給管と処 Only, processing both 2-way valve and each is opposite the treatment liquid supply pipe
    理液リターン管に接続管で接続したことを特徴とするウエハ処理装置。 Wafer processing apparatus characterized by connecting a connection pipe sense liquid return pipe.
JP11262895A 1995-04-14 1995-04-14 Wafer processing apparatus Expired - Fee Related JP3394842B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11262895A JP3394842B2 (en) 1995-04-14 1995-04-14 Wafer processing apparatus

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Application Number Priority Date Filing Date Title
JP11262895A JP3394842B2 (en) 1995-04-14 1995-04-14 Wafer processing apparatus

Publications (2)

Publication Number Publication Date
JPH08283993A true JPH08283993A (en) 1996-10-29
JP3394842B2 true JP3394842B2 (en) 2003-04-07

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JP11262895A Expired - Fee Related JP3394842B2 (en) 1995-04-14 1995-04-14 Wafer processing apparatus

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100773165B1 (en) * 1999-12-24 2007-11-02 가부시끼가이샤 도시바 Semiconductor wafer processing apparatus and processing method
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus

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