JP3394820B2 - Piezo components - Google Patents

Piezo components

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Publication number
JP3394820B2
JP3394820B2 JP14442494A JP14442494A JP3394820B2 JP 3394820 B2 JP3394820 B2 JP 3394820B2 JP 14442494 A JP14442494 A JP 14442494A JP 14442494 A JP14442494 A JP 14442494A JP 3394820 B2 JP3394820 B2 JP 3394820B2
Authority
JP
Japan
Prior art keywords
external connection
piezoelectric substrate
vibration damping
damping layer
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14442494A
Other languages
Japanese (ja)
Other versions
JPH0818386A (en
Inventor
康宏 川島
吉宏 池田
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP14442494A priority Critical patent/JP3394820B2/en
Publication of JPH0818386A publication Critical patent/JPH0818386A/en
Application granted granted Critical
Publication of JP3394820B2 publication Critical patent/JP3394820B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component having external connection terminals projecting from a piezoelectric substrate and having a vibration damping layer formed on the surface of the piezoelectric substrate. 2. Description of the Related Art Conventionally, as a piezoelectric component such as a TS (thickness shear vibration) mode ceramic filter, FIG.
There are the following. The piezoelectric component 50 includes a vibration electrode 51
The external connection terminals 53 are connected and fixed to the piezoelectric substrate 52 having soldering by soldering or the like, and a vibration damping layer 54 made of silicon rubber is formed on the surface of the piezoelectric substrate 52. The vibration damping layer 54 includes the vibration electrode 51
Is provided to moderately vibrate and suppress unnecessary vibration. In the drawing, reference numeral 55 denotes a flange provided at an intermediate portion of the external connection terminal 53 for the purpose of positioning the piezoelectric component 50 in the height direction. In the piezoelectric component 50 having such a configuration, a so-called dipping method in which the piezoelectric substrate 52 having the external connection terminals 53 attached thereto is immersed in a liquid silicon bath,
The vibration damping layer 54 has been formed by a technique such as instilling liquid silicon using a trowel. [0004] However, in the conventional piezoelectric component 50, when the material of the vibration damping layer is applied or drip is performed with the external connection terminal 53 being on the upper side, the material of the vibration damping layer becomes piezoelectric. The substrate 52 is solidified in a state of protruding outside from the upper end surface in the drawing, and the external dimensions are deviated. Therefore, in order to avoid such inconvenience, the vibration damping layer 54 is formed with the external connection terminal 53 facing down. However, even in this case, a part of the vibration damping layer material applied on the surface of the piezoelectric substrate 52 flows out from the piezoelectric substrate 52 toward the external connection terminal 53, and hangs down on the external connection terminal 53. Due to such a droop of the vibration damping layer 54,
There is a problem that poor appearance occurs. [0005] Therefore, an object of the present invention is to prevent the sagging of the vibration dipping layer which causes the appearance defect. In order to achieve the above object, according to the present invention, an external connection terminal is projected from a piezoelectric substrate, and a vibration damping layer is formed on the surface of the piezoelectric substrate. Wherein the external connection terminal has a wide portion wider than the terminal tip side, including a boundary portion with the piezoelectric substrate in an extending direction thereof, and a terminal tip end of the wide portion. It is characterized in that the portion protrudes from the piezoelectric substrate. According to the above construction, when the material of the vibration damping layer applied on the piezoelectric substrate hangs down toward the external connection terminals in order to form the vibration damping layer, first, the boundary between the piezoelectric substrate and the piezoelectric substrate is formed. It will flow into the wide part provided in the part. Due to the surface tension of the vibration damping layer material that has flowed into the wide portion, it is difficult for the vibration damping layer material to flow into the distal end side of the external connection terminal that is narrower than the wide portion, and is received by the wide portion. That is, the wide portion functions as a dam for damping the vibration damping layer material flowing into the external connection terminal. An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a front view of a piezoelectric component according to one embodiment of the present invention. The piezoelectric component 1 is a TS mode filter and includes a piezoelectric substrate 3 having a vibrating electrode 2.
External connection terminals 4 are connected and fixed to both ends and the center in the width direction of the piezoelectric substrate 3 by soldering or the like. A vibration damping layer 5 made of silicon rubber is formed on the surface of the piezoelectric substrate 3 so as to cover the vibration electrode 2. The vibration damping layer 5 is provided for appropriately vibrating the vibration electrode 2 and for suppressing unnecessary vibration. External connection terminal 4
A flange 6 for positioning the piezoelectric component 1 in the height direction is provided in the middle part. The flange 6 is formed wider than the tip 4 a of the external connection terminal 4. This piezoelectric component 1 is characterized by the configuration of an external connection terminal 4 described below. That is, the external connection terminal 4
Is provided with a wide portion 7 wider than the terminal tip portion 4a (excluding the flange portion 6), including a boundary portion with the piezoelectric substrate 3 in the extending direction. The distal end 7a of the wide portion 7 slightly protrudes from the piezoelectric substrate 3 and is cut in a direction orthogonal to the extending direction of the external connection terminal 4. Note that the external connection terminal 4 of the present embodiment has a wide portion 7 by forming the entire base 4b in contact with the piezoelectric substrate 3 wide.
Is composed. When manufacturing the piezoelectric component 1 configured as described above, the dipping method and the drip method (both conventional methods) are applied to the surface of the piezoelectric substrate 3 with the external connection terminals 4 attached, as in the conventional example. According to the example, the material (liquid silicon) to be the vibration damping layer 5 is applied, and a part of the vibration damping layer material applied on the surface of the piezoelectric substrate 3 is transferred from the piezoelectric substrate 3 to the external connection terminal 4 ( In particular, it flows toward the central external connection terminal 4). However, the vibration damping layer material that has flowed out to the external connection terminals 4 first enters the wide portion 7 provided at the boundary with the piezoelectric substrate 3. The vibration damping layer material that has entered the wide portion 7 further tries to flow toward the distal end side of the external connection terminal 4. However, since the surface tension of the vibration damping layer material acts, the vibration damping layer material has a smaller width than the wide portion 7. It is difficult to flow into the tip of the external connection terminal.
Therefore, as long as the vibration damping layer material does not enter the wide part 7 beyond the allowable limit (which is determined by the area of the wide part 7 and the length of the front end 7a of the wide part 7), the vibration damping layer The material is blocked by the wide portion 7 and does not flow into the terminal tip side from the wide portion 7. Therefore, the sagging of the vibration damping layer 5 can be limited only to the wide portion 7, that is, the vicinity of the piezoelectric substrate 3, and the appearance defect due to the sagging of the vibration damping layer 5 does not occur. In the above-described embodiment, the distal end 7a of the wide portion 7 is cut off in a direction perpendicular to the extending direction of the external connection terminal 4. However, as shown in FIG.
May be cut out in a step-like manner. According to this structure, the length of the wide end portion side end portion 7a is increased, and the force for damping the vibration damping layer material is increased. Further, although not shown, the wide portion distal end 7a may be curved in an arc shape, or the wide portion distal end 7a may be tapered and inclined. Also, as shown in FIG. 1, the present invention can be implemented in the external connection terminal 4 without the flange 6 as shown by the phantom line. Further, in the above-described embodiment, the wide portion 7 is formed by widening the entire base portion 4b of the external connection terminal 4. However, the present invention is not limited to such a structure, and the wide portion 7 is not limited to such a structure. 7 may be provided at least at the boundary between the external connection terminal 4 and the piezoelectric substrate 3, so that the effects of the present invention can be obtained. As described above, according to the present invention, the wide portion provided in the external connection terminal receives the droop of the vibration damping layer material, so that the vibration damping layer material hangs down on the external connection terminal. Was prevented. Therefore, the appearance defect due to the sagging of the vibration damping layer material was eliminated, and the decrease in the yield due to the appearance defect was eliminated.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing a structure of a piezoelectric component according to one embodiment of the present invention. FIG. 2 is a front view showing a modification of the present invention. FIG. 3 is a front view showing the structure of a conventional piezoelectric component. [Description of Signs] 3 Piezoelectric substrate 4 External connection terminal 5 Vibration damping layer 7 Wide part 7a End part on the tip side of wide part

   ────────────────────────────────────────────────── ─── Continuation of front page       (56) References JP-A-6-85603 (JP, A)                 Actual opening Hei 4-76721 (JP, U)

Claims (1)

  1. (57) [Claim 1] A piezoelectric component having an external connection terminal protruding from a piezoelectric substrate and a vibration damping layer formed on a surface of the piezoelectric substrate, wherein the external connection terminal has an extension. A piezoelectric element having a wide portion that is wider than a terminal tip side, including a boundary portion with the piezoelectric substrate in an outgoing direction, and a terminal tip end portion of the wide portion protrudes from the piezoelectric substrate. parts.
JP14442494A 1994-06-27 1994-06-27 Piezo components Expired - Lifetime JP3394820B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14442494A JP3394820B2 (en) 1994-06-27 1994-06-27 Piezo components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14442494A JP3394820B2 (en) 1994-06-27 1994-06-27 Piezo components

Publications (2)

Publication Number Publication Date
JPH0818386A JPH0818386A (en) 1996-01-19
JP3394820B2 true JP3394820B2 (en) 2003-04-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP14442494A Expired - Lifetime JP3394820B2 (en) 1994-06-27 1994-06-27 Piezo components

Country Status (1)

Country Link
JP (1) JP3394820B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916414A (en) * 1996-08-22 1999-06-29 Mitsubishi Heavy Industries, Ltd. Glue applicator for corrugated board

Also Published As

Publication number Publication date
JPH0818386A (en) 1996-01-19

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