JP3385197B2 - Shape maintaining wire harness, method for manufacturing the same, and vacuum forming mold - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shape-retaining wire harness, a method for manufacturing the shape-retaining wire harness, and a vacuum forming die used for manufacturing the shape-retaining wire harness.

[0002]

9 to 12 show a conventional method in which a wire harness is flattened and held in a predetermined wiring shape. In this method, the vacuum mold 1 shown in FIG. 9 is used. In this vacuum forming die 1, a plurality of ribs 3 are projected on a flat forming surface 2, and a space between the opposing ribs 3 is a recess 4 for wiring. A plurality of suction holes (not shown) are formed in the molding surface 2.

In manufacturing a wire harness, a lower die film (not shown) is placed on the forming surface 2 of the vacuum forming die 1, and then a plurality of electric wires 5 are provided along the wiring recess 4 as shown in FIG. Deploy. After this wiring, as shown in FIG. 11, after heating the upper mold film 6, the upper mold film 6 is covered and the electric wire 5 is sandwiched by the lower mold film and the upper mold film 6.

In this state, the lower mold film and the upper mold film 6 are brought into close contact by vacuum suction from the suction hole,
Glue the upper and lower films. As a result, the installation recess 4
A shape conforming to is given to the electric wire 5, and the shape giving wire harness 7 shown in FIG. 12 is manufactured. 10 and 11
In the figure, 8 is a connector, which is connected in advance to a necessary terminal portion of the electric wire 5.

[0005]

However, the electric wire 5
When thin films are used as the upper and lower films sandwiching the film, the adhesive strength of the adhesive surfaces of the upper and lower films is lowered. This is because the upper and lower films do not come into close contact with each other, and a bonded portion and a non-bonded portion are formed between the upper and lower films, resulting in a problem that rigidity and waterproofness are deteriorated. For this reason, conventionally, a film having a certain thickness or more must be used, which causes inconvenience that the degree of freedom in selecting a film is reduced.

Therefore, it is an object of the present invention to provide a shape-retaining wire harness having sufficient rigidity and waterproofness even if a thin film is used. Another object of the present invention is to provide a manufacturing method capable of manufacturing the shape-retaining wire harness, and a vacuum forming mold used in the manufacturing method.

[0007]

In order to achieve the above object, the shape-retaining wire harness according to the invention of claim 1 is a wire harness in which a wiring shape is maintained by joining upper and lower films sandwiching a plurality of electric wires. In addition, the upper and lower films are joined together in a state in which minute irregularities are formed on the entire surfaces.

[0008] In this wire harness, since the upper and lower films are formed with minute irregularities, the films are closely adhered to each other even if the films are thin. For this reason,
A shape-retaining wire harness having high rigidity and reliable waterproofness can be provided.

The manufacturing method according to the second aspect of the present invention comprises the steps of placing the lower film on the forming surface of a vacuum forming die on which minute irregularities are formed, and vacuum suction to transfer the minute irregularities to the lower film. A step of placing the lower film and the plurality of electric wires on the molding surface, and then covering the upper film, and a step of vacuum suction from a vacuum molding die to bond the upper and lower films. To do.

In the present invention, by vacuum suctioning the lower film placed on the molding surface of the vacuum molding die, minute irregularities on the molding surface are transferred to the lower film. This makes it possible to obtain a lower film having minute irregularities.

After that, the lower film and a plurality of electric wires are placed on a vacuum forming die, and the upper film is covered and vacuum sucked, so that the upper film becomes a lower film while fine irregularities are imparted by the forming surface of the vacuum forming die. The upper and lower films are bonded to each other in close contact with each other. Therefore, a shape-retaining wire harness having rigidity and waterproofness can be manufactured. Therefore, even if a thin film is used, a shape-retaining wire harness of good quality can be manufactured.

According to the manufacturing method of the invention of claim 3, after placing the lower film and the plurality of electric wires on which the minute unevenness is provided on the forming surface of the vacuum forming die on which the minute unevenness is formed, It is characterized in that the upper film is covered on the upper part, and the upper and lower films are joined by vacuum suction from a vacuum forming die.

In the present invention, the lower film is provided with fine irregularities in advance. This lower film is placed on the forming surface of the vacuum forming mold, and vacuum suction is performed with a plurality of electric wires sandwiched between the upper film and the upper film, so that the upper film adheres to the lower film while providing minute irregularities. Then the upper and lower films are joined. Therefore, it is possible to manufacture a shape-retaining wire harness having good rigidity and waterproofness even if a thin film is used.

A vacuum forming die according to a fourth aspect of the present invention is a vacuum forming die in which upper and lower films sandwiching a plurality of electric wires are placed on a forming surface, and the upper and lower films are joined by vacuum suction. It is characterized in that minute irregularities are formed on the molding surface.

Since this vacuum molding die has minute irregularities formed on the molding surface, the minute irregularities can be transferred to the film by vacuum suction of a flat film. Further, since the upper and lower films are brought into close contact with each other by vacuum suction of the upper and lower films, the upper and lower films can be reliably joined.

[0016]

1 to 6 show the manufacturing process of an embodiment of the shape-retaining wire harness of the present invention in the order of steps, in which 11 is a vacuum forming mold.

The upper surface of the vacuum molding die 11 is a molding surface 12, and a plurality of ribs 13 are provided on the molding surface 12 so as to face each other. The ribs 13 are fixed to the molding surface 12 in a protruding manner by gluing, screwing or the like, and the space between the ribs 13 is a recess 14 for wiring. The rib 1
At both ends of 3, there are provided connector insertion holes 18 into which the connectors 17 at both ends of the electric wire 16 are inserted.

The wiring recess 14 is for imparting a shape to the wire harness 15. In this embodiment, the plurality of ribs 13 are bent in an L shape, and the cabling recesses 14 formed between the ribs 13 are L-shaped as shown in FIG.
The wire harness 15 provided with the letter shape is formed.

The entire forming surface 12 of the vacuum forming die 11 is
Minute irregularities 19 are formed. The fine irregularities 19 may be embossed, and fine mesh grooves in the vertical and horizontal directions,
Others may be used. By these minute irregularities 19,
The upper and lower films 20, 21 can be brought into close contact with each other, and minute irregularities can be transferred to the lower mold film 20.

Incidentally, the molding surface 12 of the vacuum molding die 11 is
A plurality of suction holes (not shown) are opened, and vacuum suction can be performed from the molding surface 12 by connecting the suction holes to a pump via a hose or the like.

Next, the manufacture of the wire harness 15 according to this embodiment will be described. As shown in FIG. 1, the film 23 is placed on the molding surface 12 of the vacuum molding die 11 with the connector insertion hole 18 closed by the lid 22. The film 23 is a flat film and is placed so as to cover the entire molding surface 12.

After this placement, vacuum suction is performed from the molding surface 12. The film 23 is brought into close contact with the molding surface 12 by vacuum suction, and the minute unevenness 19 of the molding surface 12 is transferred to the film 23 by this close contact. And stop vacuum suction,
When the film 23 is peeled off from the molding surface 12, as shown in FIG. 2, a transfer film 25 having minute irregularities 24 is formed. The transfer film 25 serves as a prototype of the lower mold film 20. By the vacuum suction, the transfer film 25 is simultaneously formed with the rib portion 26 to which the rib 13 of the molding surface 12 is transferred.

Ribs 26 are formed on the transfer film 25.
Punch along the line. The punching is performed so that the rib portion 26, the inside of the rib portion 26, and further, the outer portion of the rib portion 26 to some extent are left. By this punching, FIG.
The lower mold film 20 shown in is formed.

The lower die film 20 is placed on the forming surface 12 of the vacuum forming die 11 again. This placement is performed by the rib portion 26.
So as to fit the ribs 13 on the molding surface 12, whereby the lower die film 20 can be fixed to the molding surface 12 in a positioned state.

After that, as shown in FIG.
6 is placed on the molding surface 12. The plurality of electric wires 16 are ribs 1.
It is set so as to be fitted into the wiring recess 14 between the wires 3, and the electric wire 16 is positioned on the lower mold film 20 by this setting. In this case, the connectors 1 at both ends of the electric wire 16
7 is fixed by being fitted into the connector insertion hole 18 of the molding surface 12.

FIG. 5 shows the subsequent step. After the connector insertion hole 18 is closed with the lid 22, the molding surface 12 is covered with the upper mold film 21. The upper die film 21 is made of a flat film, and after heating the film, the electric wire 16 is sandwiched between the lower die film 20 and the molding surface 12 by covering the entire molding surface 12. A hot melt adhesive (not shown) is previously applied to the lower surface of the upper mold film 21.

With the upper mold film 21 covered, vacuum suction is performed from the molding surface 12. Although the upper mold film 21 is brought into close contact with the lower mold film 20 from above the electric wire 16 by vacuum suction, since the minute irregularities 19 are formed on the molding surface 12, the upper mold film 21 can be reliably brought into close contact with the lower mold film 20.
As a result, the lower mold film 20 and the upper mold film 21 are adhered and bonded to each other, and the shape-retaining wire harness 15 having a shape can be obtained.

FIG. 6 shows that after the above-mentioned forming, the vacuum forming die 11 is formed.
1 shows a wire harness 15 formed by removing from the wire harness, punching out an excessive portion around the wire, and removing the wire harness by cutting or the like.

In the above-mentioned joining, since the lower mold film 20 and the upper mold film 21 are joined by the minute unevenness 13 of the molding surface 12, the tightly joined joint can be surely made, and the wire harness 15 having rigidity and waterproofness is provided. Can be Therefore, even if a thin film is used as the lower mold film 20 and the upper mold film 21, the wire harness 15 having rigidity and waterproofness can be manufactured.

FIG. 7 and FIG. 8 show a process of installing the wire harness 15 manufactured as described above on a base material 27 such as an automobile door. The base material 27 includes a plurality of steps 28, 29,
The wire harness 15 is provided along the steps 28, 29, 30 so that the wire harness 15 can be installed in a three-dimensional direction.

In the present invention, the microscopic asperity 24 is not transferred to the lower mold film 20 by vacuum suction of the molding surface 12 of the vacuum molding die 11, and the microscopic asperity is previously formed on the lower mold film 20 by another device. May be given. And
By performing the same process as described above using the lower mold film 20 provided with minute irregularities, it is possible to manufacture the wire harness 15 having rigidity and waterproofness even if a thin film is used.

Further, the molding surface 12 is kept in a flat state without imparting fine irregularities to the lower mold film 20.
, And may be vacuum-sucked together with the flat upper mold film 21. Also in this case, since the lower mold film 20 and the upper mold film 21 can be satisfactorily adhered to each other due to the minute irregularities 19 of the molding surface 12, a wire harness having rigidity and waterproofness even if a thin film is used. can do.

[0033]

As described above, according to the invention of claim 1, since minute irregularities are formed in the upper and lower films, even if the films are thin, the films can be closely adhered to each other, and a large size can be obtained. Rigidity and reliable waterproofness can be provided.

According to the second aspect of the present invention, the minute irregularities on the molding surface are transferred to the lower film, and a plurality of electric wires are sandwiched by the lower film and the upper film, and vacuum suction is performed to join the upper and lower films. A shape-retaining wire harness having rigidity and waterproofness can be manufactured.

According to the third aspect of the present invention, since the lower film to which the minute irregularities have been previously applied is used, the labor for imparting the minute irregularities to the lower film can be omitted, and the shape-retaining wire harness can be manufactured quickly. can do.

According to the invention of claim 4, since minute irregularities are formed on the molding surface, the minute irregularities can be transferred to a flat film, and furthermore, by vacuum suction of the upper and lower films, The upper and lower films can be reliably joined.

[Brief description of drawings]

FIG. 1 is a perspective view showing a relationship between a vacuum forming die and a film according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which minute irregularities are transferred to a film by vacuum suction.

FIG. 3 is a perspective view of a process of manufacturing a lower mold film.

FIG. 4 is a perspective view of a step of setting an electric wire on a forming surface of a vacuum forming die.

FIG. 5 is a perspective view of a step of setting an upper die film on a forming surface of a vacuum forming die.

FIG. 6 is a perspective view of a process of taking out the manufactured shape-retaining wire harness from a vacuum forming mold.

FIG. 7 is a perspective view when the manufactured shape-retaining wire harness is installed on a base material.

FIG. 8 is a perspective view showing a state in which the manufactured shape-retaining wire harness is installed on a base material.

FIG. 9 is a perspective view of a vacuum forming mold used for manufacturing a conventional wire harness.

FIG. 10 is a perspective view showing an electric wire wiring step in a conventional manufacturing method.

FIG. 11 is a perspective view showing a set of upper mold films in a conventional manufacturing method.

FIG. 12 is a perspective view of a wire harness manufactured by a conventional manufacturing method.

[Explanation of symbols]

11 Vacuum mold 12 Molding surface 15 wire harness 16 electric wires 19 Micro unevenness 20 Lower film 21 Upper mold film

Front page continuation (51) Int.Cl. ⁷ identification code FI // B29L 31:34 B29L 31:34 (58) Fields investigated (Int.Cl. ⁷ , DB name) H01B 7/00 301 B29C 51/12 B29C 51/36 H01B 13/00 525 H02G 3/04

Claims (4)

(57) [Claims] 1. A wire harness in which a wiring shape is maintained by joining upper and lower films sandwiching a plurality of electric wires, wherein the upper and lower films are joined in a state in which minute irregularities are formed on the entire surface. A shape-retaining wire harness that is characterized in that 2. A step of placing a lower film on a forming surface of a vacuum forming die on which minute irregularities are formed, vacuum suction to transfer the minute irregularities to the lower film, and the lower film and a plurality of electric wires. The method for manufacturing a shape-retaining wire harness, comprising: placing an upper film on the molding surface; and covering the upper film with a top film, and joining the upper and lower films by vacuum suction from a vacuum molding die. . 3. A lower film and a plurality of electric wires to which minute irregularities are applied are placed on the molding surface of a vacuum forming die on which minute irregularities are formed, and then an upper film is covered thereon.
A method for manufacturing a shape-retaining wire harness, which comprises vacuum suction from a vacuum forming die to bond upper and lower films. 4. A vacuum molding die in which upper and lower films sandwiching a plurality of electric wires are placed on a molding surface, and the upper and lower films are joined by vacuum suction, and minute irregularities are formed on the molding surface. A vacuum forming mold that is characterized by