JP3381899B2 - Heat sink for heat-generating components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a heat sink for dissipating a component on a substrate by a heat sink in an electronic device component, and a heat sink for a heat-generating component for effectively utilizing a surface area of a substrate having a relatively small area. Regarding

[0002]

2. Description of the Related Art In recent years, with the demand for miniaturization of electronic devices, printed circuit boards have been miniaturized. For example, there is an increasing demand for a cache size in which electronic parts such as a CPU chip and a memory are mounted on a cash card size substrate to realize the functions of a personal computer in the card size. In addition, there is a demand for speeding up of electronic devices, and the amount of heat generated by the CPU tends to increase as speed increases. Therefore, cooling of the CPU is an essential condition.

FIG. 3 is a perspective view of a cash card size printed circuit board 1 on which a CPU 2, a memory 3 and an interface connector 4 are mounted. FIG. 4 is a side view showing such a printed board 1 and a heat sink for cooling the CPU 2 mounted on the board.
It is fixed to the portion where is located via an adhesive 5 having a good thermal conductivity.

By the way, a CPU having such a large amount of heat generation
If the is mounted, it is necessary to use a heavy heat sink or a large heat sink. In that case, a hole for fixing the heat sink is formed in the substrate so that the adhesive 5 does not peel off even if the heat sink is subjected to vibration or impact.
The heat sink corresponding to this hole is also provided with a screw hole and is fixed with a screw or the like. 5 (a) and 5 (b), holes 8 are made at four corners of the substrate 1 excluding the connector mounting portion (see FIG. 5b), and screw holes 9 are formed in the heat sink 6a at positions corresponding to the holes 8 and screw holes are formed. The state fixed by 11 is shown.

[0005]

However, when mounting a heat sink on a miniaturized board, it is difficult to make a hole in the board due to restrictions on component mounting. In reality, only a small and lightweight heat sink can be mounted. However, there was a limit to heat dissipation (the higher the CPU speed, the larger the amount of heat generation). An object of the present invention is to eliminate such drawbacks, and it is an object of the present invention to provide a heat sink capable of using a high-speed CPU while maximally utilizing the area of the substrate.

[0006]

In order to achieve such an object, according to the present invention, a heat generating component provided along a plane of a printed circuit board and attached to the substrate is contacted to radiate the heat generating component. a heat sink, a heat sink is
It is configured so as to support both ends of the PCB in a concave groove
And install one wall surface of the concave groove that constitutes one of the grooves
It is composed of a fixing member that is detachably fixed ,
At both ends of the heat sink long plate-like protrusions in the direction along the edge portion of the printed circuit board is provided, guide rails of these protrusions
It is configured to be inserted into the module .

[0007]

Since the heat sink supports the end portion of the printed circuit board, it is not necessary to perforate the board. Since the groove is formed on one side of the heat sink and the heat sink is fixed by the fixing member, the mounting is easy. Further, since the long plate-shaped convex portion is provided in the direction along the end portion of the printed circuit board, the mounting on the housing is easy.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to the drawings. 1A and 1B show an example of an embodiment of a heat sink for a heat-generating component of the present invention, wherein FIG. 1A is a perspective view and FIG. 1B is a side view. In the figure, 1 is a printed circuit board having a thickness t, 2 is a CPU having a height h, and 4 is a substrate 1.
Is an interface connector attached near the end of the. a is the vertical width, and b is the horizontal width from the end of the board to the vicinity of the interface connector. Reference numeral 16 is a heat sink, and the material of this heat sink is formed of a metal having a high thermal conductivity (for example, a copper alloy or an aluminum alloy).

Reference numeral 17 is a groove, and the width t'of this groove is the substrate 1
Is formed to be slightly larger than the thickness t, and the depth c is formed as shallow as possible so as not to shift when the substrate 1 is attached to the heat sink 16. Reference numeral 18 denotes a stepped portion formed at two upper and lower portions, and its height h'is formed to be the same as or slightly lower than the CPU height h in consideration of the CPU height h and the adhesive 5 height. .

The height c'of the lower step 18 is the groove 1
Corresponding to a depth c of 7. Reference numeral 19 is a bottom plate having two holes 20, 21 is a fixed plate having screw holes 20 'corresponding to the holes 20, and the plate thickness of the fixed plate 21 is the thickness corresponding to the height c of the stepped portion 18. Become. In the figure, a'corresponds to the vertical width a of the board 1, b'corresponds to the horizontal width b from the end of the board to the vicinity of the interface connector, and is formed slightly larger than the dimensions a and b. Reference numeral 25 denotes a convex portion formed in the upper and lower portions of the heat sink in the shape of a long plate along the lateral width direction, and the function of the convex portion will be described later.

FIG. 1B is a side view showing a state in which the printed board 1 is attached to the heat sink 16 (the interface connector is omitted). As shown in the figure, the printed circuit board 1 is tilted, the upper part thereof is inserted into the groove 17, and the fixing plate 21 is fixed to the bottom plate 19 with the screw 22 while the lower part of the substrate is pressed against the lower step portion 18. At this time, the head of the CPU 2 is in contact with the adhesive 5.

According to the above construction, when mounting the printed circuit board 1 on the heat sink 16, it is not necessary to form the holes 8 as shown in FIG. 5, and the depth of the groove 17 and the heights c, c'of the step portion 18 are formed. The substrate can be made effective by making the necessary minimum. Further, it is possible to attach a heat sink made of a heavy material such as copper or a thick aluminum having good heat conduction even on a small-sized substrate such as a cache size. As a result, it is possible to mount a CPU that increases the cooling effect and generates a large amount of heat.

FIG. 2 shows an example of an embodiment in which the heat sink of the present invention having a printed board is attached to the chassis 30. Inside the chassis 30, a pair of guide rails 31a are vertically arranged from the front to the back. 31b, 32
a and 32b are formed. The groove width D of these guide rails is formed slightly larger than the width d of the convex portion 25 of the heat sink, and the entire heat sink 16 can be housed in the chassis 30 along the upper and lower grooves.

Reference numeral 35 denotes a printed circuit board to which a connector 4a for connecting to a connector 4 fixed to the printed circuit board 1 is fixed.
It is designed to be inserted into. 36 is a cover of the chassis. With such a configuration, the guide rails in the chassis 30 support the heat sink 16, so that it is possible to improve the environmental resistance against vibrations and shocks.

The shape of the heat sink is not limited to the illustrated example. For example, the mounting and placement of electronic components on the printed circuit board is arbitrary, and the shape of the heat sink may be reversed, for example, the positions of the grooves and the bottom plate, and the point is to support the end of the printed circuit board without making holes. Any shape is possible.

According to the present invention as described in the foregoing, provided along the plane of the printed circuit board, a heat sink to conduct heat dissipation of the heat generation components in contact with the heat generating component mounted with its substrate, The heat sink is concave at both ends of the printed circuit board.
Concave that is configured to be supported by a groove
Fixing that attaches and detaches one wall surface of the groove
The heat sink is provided with long plate-shaped projections at both ends in the direction along the end of the printed circuit board, and the long plate-shaped projections are inserted into the guide rails. provided with, as a result, it was possible to realize a heat generating component of the heat sink which can be used a high-speed CPU while maximally utilizing the area of the substrate.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an example of a heat sink of a heat-generating component according to the present invention.

FIG. 2 is a perspective view showing a state in which a heat sink to which a printed board is attached is attached to a chassis.

FIG. 3 is a perspective view of a printed circuit board 1 on which a CPU, a memory, and an interface connector are mounted.

FIG. 4 Printed circuit board and CP mounted on this circuit board
It is a side view which shows the heat sink for cooling U.

5A and 5B are a side view and a perspective view of the substrate showing a state in which holes are formed at four corners of the substrate, screw holes 9 are formed in the heat sink at positions corresponding to the holes, and the screws are fixed by screws 11.

[Explanation of symbols]

1 printed circuit board 2 CPU chips 3 memory 4 interface connector 5 adhesive 16 heat sink 17 groove 18 steps 19 Bottom plate 20 holes 21 Fixed plate 22 screws 25 convex

Claims (2)

(57) [Claims] 1. A heat sink which is provided along a plane of a printed circuit board and contacts a heat generating component mounted on the circuit board to radiate the heat generating component, wherein the heat sink has a concave shape at both ends of the printed circuit board. Configured to support in a groove
And attach one wall surface of the concave groove that constitutes one of the grooves.
A heat sink for a heat-generating component, characterized by comprising a fixing member which is detachably fixed . 2. The print on both ends of the heat sink
A long plate-shaped convex portion is provided along the edge of the substrate.
The heat sink of the heat-generating component according to claim 1, wherein the convex portion is inserted into the guide rail .