JP3370354B2 - Reference data processing system and reference data processing method for mounting board production equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention operates each production facility and an inspection machine in each step of a mounting board production apparatus in which solder is printed on a printed circuit board to mount a component, and a land and a terminal of the component are solder-bonded. Standard data processing system and standard data to create mounting data and inspection data for
Data processing method .

[0002]

2. Description of the Related Art FIG. 6 is a block diagram showing the structure of a conventional mounting board production apparatus. In FIG. 6, a printed circuit board manufacturing unit 1, a screen manufacturing unit 2, a solder printing unit 3, a component mounting unit 4, and a soldering unit 5 are sequentially arranged from the upper side along the production line. In the printed board manufacturing unit 1, the printed board manufacturing machine 6 forms a circuit pattern having a land pattern on the board. The printed circuit board inspection machine 7 inspects the land position and shape of the printed circuit board, the state of the circuit pattern, and the like. Also, screen production department 2
At, the screen making machine 8 makes the screen for cream solder printing used in the solder printing section 3. The screen inspection machine 9 inspects the pattern position and shape of the screen, the state of the circuit pattern, and the like.

Further, in the solder printing section 3, the cream solder printing machine 10 prints cream solder on the land of the circuit board. The cream solder printing inspection machine 11 inspects the printing position, the printing state, and the state of the printing equipment of the cream solder printed by the cream solder printing machine 10. Further, in the component mounting unit 4, the mounting machine 12 transfers the suction nozzle head to the component supply unit to which electronic components and the like are supplied by the XY driving device, and suctions the component by the suction nozzle head to mount the circuit board. The parts are moved to the mounting position and the parts are mounted so that the leads and electrodes are positioned on the cream solder printed on the land. At this time, the component is mounted on the circuit board while the component recognition camera photographs the component suction state to manage the suction error. The after-component mounting inspection machine 13 inspects the state of components and equipment mounted by the mounting machine 12 at a predetermined position on the circuit board.

Further, in the soldering section 5, a reflow furnace is used.
14, the conveyor for conveying the circuit board is arranged in the furnace,
Heaters are arranged at the upper and lower positions of the conveyor, and fans are arranged at the upper and lower positions to blow hot air gas heated through the heater onto the circuit board. Further, the inside of the reflow furnace 14 is divided into a preheating chamber, a reflow heating chamber, and a slow cooling chamber, and each of the chambers is provided with the heater and the fan, and in the reflow heating chamber, the circuit board is uniformly heated. The components are soldered by reflowing the cream solder. The soldering inspection machine 15
Inspect the soldering condition of components on the circuit board and the condition of equipment. The mounting board production apparatus 16 is configured as described above.

Here, the inspection machines 7, 9, 11, 13,
The inspection data, which is the reference for target values, their permissible ranges, inspection conditions, etc. for operating 15, are all taught by teaching XY coordinates, mask data, land data, inspection conditions, etc., based on the actual printed circuit board. It was created on a physical basis.
In addition, although it has been attempted to use CAD data only for some mounting data, it is only extremely limited data such as XY coordinates, and the intended one is the operator's key. The efficiency of data creation was improved by reducing the input man-hours.

FIG. 7 is a conceptual diagram of a conventional inspection data creation procedure. As shown in FIG. 7A, the inspection data creation procedure is based on the basic data regarding the land such as the name, position, and orientation of each land to be printed, and the name, position, and orientation of parts corresponding to the land to be inspected. The basic data on the above and the allowable value at the time of inspection are selected based on the basic data, and the instruction code table for machine data corresponding to each data is referred to. I was typing in.

Further, as shown in FIG. 7B, a printed circuit board, which is known to have been printed or soldered with a printing object such as solder on a land accurately in advance, is printed using a printing inspection device or the like. The method has been adopted in which the necessary data is read, taken in by the inspection device, and the inspection conditions such as allowable values are additionally input.

[0008]

However, in the above-described conventional configuration, the target value, the permissible range, the inspection condition, and other criteria are not established until the inspection results are accumulated and the inspection results are accumulated and statistically processed. Since it is possible to estimate the true inspection data, it is unclear whether the inspection data created from the data having individual variations of the actual product shows a truly proper value. There is a problem in that it is not possible to accurately and quickly determine the presence or absence of a defect, such as whether the inspection printed circuit board is defective or whether the inspection data is defective.

That is, although there are ideal shapes, areas, and amounts of solder in designing the solder shape and the solder fret shape, they cannot always be easily realized on an actual printed circuit board. In addition, as shown in FIG. 8, what is to be checked on the actual product is a misalignment A between the land 17 and the printing cream solder 18 on the printed circuit board at the solder printing position, and a printing cream on the printed circuit board at the mounting position. It is a relative relationship such as the positional deviation B between the solder 18 and the component 19, and if these are misaligned, it is unclear whether the land 17 is displaced or the printing cream solder 18 is displaced, and the mounting position is also different. Even in the case, it is difficult to determine whether the component 19 is displaced or the printing cream solder 18 is displaced, and further, the alignment mark is displaced, and further, even in the soldering position, the displacement of the component 19 or the displacement of the solder fillet, It was difficult to determine if the alignment marks were misaligned. At this time, the operator empirically judges from the tendency of defectiveness to be, for example, "the deviation of the land 17" or "the deviation of the printing cream solder 18", but where is the guarantee that the answer is correct? Nonetheless, in the worst case, it led to erroneous feedback and delay due to unnecessary correction.

Further, as the density of the printed circuit board is increased, the precision required for the printed circuit board manufacturing, the screen manufacturing, the cream solder printing, the component mounting and the soldering, respectively, becomes stricter, and the gradual shift is not allowed. ing. Realizing and securing such high precision in the printed circuit board mounting process has been impossible with conventional efforts such as data creation based on actual products and precision assurance.

The present invention solves the above-mentioned problems of the prior art, and attempts to ensure accuracy from upstream processes including printed circuit board design, and checks each process based on a common line standard to determine the presence / absence of defects and the cause of defects. It was determined accurately and quickly, by stacking them, reference data processing system and the reference data of the mounting board production apparatus capable of ensuring a highly accurate quality in the printed circuit board mounting process
It is intended to provide a data processing method .

[0012]

In order to solve the above-mentioned problems, a reference data processing system of a mounting board production apparatus of a first invention of the present invention prints solder on a printed board to mount a component.
Mounting, and further there by the reference data processing system for creating <br/> the mounting data and inspection data for operating each of the production facilities and inspection machines in each step of the mounting board production apparatus for solder joining the lands and parts of the terminal Printed circuit board
As the circuit pattern design information, the land identification and position or
Is the identification and mounting position of the parts to be mounted corresponding to the land
And a CAD data holding unit for holding CAD data including the above data , and each land or each part in the CAD data .
Production that carries out the mounting production specified by the identification data
Data related to equipment and inspection machines that inspect the data
The same CAD data by using both
Mounting that operates the production equipment that performs mounting production based on
Inspection data for operating the inspection machine that performs the data and inspection
Those with a reference data generating unit to generate both
Is. In addition, in order to solve the above problems,
2 Reference data processing system for mounting board production apparatus of invention
Is the identification data of each land or each part in the CAD data.
Related to the production equipment that performs
Data and data related to the inspection machine that performs the inspection
Is provided with a CAM data holding unit.

In order to solve the above problems, the present invention
Reference data processing method for mounting board production apparatus of the third invention
Print the solder on the printed circuit board, mount the parts, and
Mounted board production equipment that solder-bonds land and component terminals to
Operate each production facility and inspection machine in each process of
Standard data for creating implementation data and inspection data for
A data processing method, the circuit pattern design of the printed circuit board
As information, the identification and position of the land or the land
C that includes the identification of the component to be mounted and the mounting position data
CAD data holding step of holding AD data, and the C
According to the identification data of each land or each part in the AD data
The equipment related to
Both the data and the data about the inspection machine that performs the inspection.
By using the same CAD data,
Mounting data and inspection to operate the production equipment that carries out production
Both of the inspection data that operate the inspection machine
And a reference data generating step.

[0014]

According to the first or third invention of the present invention,
Depending on the configuration, for example,
Regarding the data indicating the mounting position and the identification of the parts,
Equipment for mounting the parts from the identification data of the parts
Identify the data and from the identification data of the same part
Data about the inspection machine that inspects the mounting state of the part
By identifying and using both data,
From the CAD data of the
Inspect the mounting data to be operated and the mounting state of its parts
Both of the inspection data for operating the inspection machine are generated.
In this example, the mounting of components was taken as an example.
The same applies to printing and its inspection. These parts
Check the data on the equipment to be mounted and the mounting status of the parts.
Identical by using data on the inspection machine to be inspected
From CAD data of both mounting data and inspection data
By generating the
Identical criteria based on design information for inspection of wearing condition
The implementation data can be
Not only can the mounted results be highly accurate and low defects,
The inspection results are highly accurate and reliable.
It can be expensive. Also, according to the inspection result
The feedback to the production equipment is
High quality production can be realized. According to the second aspect of the present invention, according to the above configuration, the CAD data
Data indicating the mounting position of a specific component and identification of that component
About the component, mount the component from the identification data of the component.
Data about the equipment and the mounting status of the parts
Data related to the inspection machine to be inspected can be easily read out.
Therefore, it is possible to check the data for mounting production and the mounting status.
Make the criteria for inspection the same based on design information
Can easily create mounting data and inspection data
You can

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. It should be noted that components having the same effects as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.

FIG. 1 is a block diagram showing the configuration of a reference data processing system of a mounting board production apparatus according to an embodiment of the present invention. In FIG. 1, the printed circuit board CAD system 21 determines the layout of each element by simulating the layout of each element used in the target circuit with reference to the parts material list and the like, and determines the layout of each element from the layout of each element. The type and position of the land corresponding to the pin position and the shape of the pattern are obtained, the circuit pattern of the printed circuit board is designed, and similarly, the mask pattern is also designed. This printed circuit board CAD system 21 is provided with a CAD data holding unit 22, and this CAD data holding unit 22 is a land such as land pattern data related to the land such as land name or type, land position and orientation when the printed circuit board is designed. The basic data, the name or type of the part corresponding to the land, the name called the circuit number for distinguishing each part on the board, the part basic data about the part including the position and orientation to be mounted, and the mask pattern data Etc. are held for each printed circuit board,
Similarly, mask data, land data, etc. are held for each part number.

Further, the printed circuit board CAM system 23 is provided with a CAM data holding section 24, and the CAM data holding section 24 has a board inspection condition database, a screen inspection condition database, a print inspection condition database which are inputted in advance by an operator. CAM data such as a mounting inspection condition database, a soldering inspection condition database, equipment operating condition databases, a parts database, and a fillet shape database are held for each part number. Further, the printed circuit board CAM system 23 is provided with a reference data generation unit 25, and the reference data generation unit 25 receives the CAD data from the CAD data holding unit 22 and the CAM data from the CAM data holding unit 24. Then, the inspection data for operating the inspection machine of each process is generated, and the mounting data for operating the production equipment of each process is generated.

As described above, a printed circuit board and a screen are manufactured, solder is printed on the land of the printed circuit board using this screen, a component is mounted at a predetermined position of this printed solder, and the land and the terminal of the component are soldered. The standard data processing system 26 of the mounting board production apparatus 16 to be joined is configured, and the mounting data and the inspection data for operating each production facility and the inspection machine in each process of the mounting board production apparatus 16 are converted into CAD data as a line standard. Generate based on.

Here, the inspection data output from the reference data generating section 25 is an intended target value, for example, the area and shape of each land of cream solder, the position and angle of parts to be mounted, and the mounting position. It is a part to be processed, the shape and volume of the solder fillet, a numerical value that specifies an allowable range for this target value, an inspection algorithm and an inspection condition (optical, etc.) when inspecting.
Further, the mounting data output from the reference data generating unit 25 is a target value at which the component should be mounted, for example, an XY coordinate value, an angle, a component part number, and an operating condition when mounting the component. That is. This inspection data is input to the inspection machine of each process and becomes the reference value for operating the inspection machine, and this mounting data is input to the equipment of each process and becomes the reference value for operating the equipment. Become.

FIG. 2 is a diagram showing the deviation of the land, the printing cream solder and the parts with respect to the unified standard in the standard data processing system of FIG. In FIG. 2, C is the deviation of the CAD data d and the land 27 as a unified standard, and D is CA.
The D data d and the printing cream solder 28 are displaced from each other, and E is the CAD data d and the component 29 from each other.

FIG. 3 is a conceptual diagram of a procedure for creating inspection data and mounting data in the reference data processing system of FIG. In FIG. 3, the land name or type of the land to be inspected and mounted, the basic land data such as the position or orientation to be inspected, the corresponding land name or type, and the circuit number for distinguishing one by one from the board. Based on an appropriate database, you can enter the basic data of the part, including the name, position and orientation to be mounted, and the inspection condition data and production equipment operation data that specify the codes related to the allowable values at the time of inspection. Machine data to automatically operate the inspection device and each equipment. Note that components that are usually mounted on a board cannot be mounted physically on top of each other. Therefore, if it is possible to distinguish by the mounting coordinate values, the mounting coordinate values may be used instead of the circuit numbers on the board. .

FIG. 4 is a block diagram showing an example of the data flow in the reference data generator 25 of FIG. In FIG. 4, reference numeral 31 is basic component data regarding components, and 32 is basic land data regarding lands. Both of them are basic data given as CAD data, and the land basic data 32 regarding a land indicates which pin of which component the land corresponds to by a set of a circuit number and a pin number. Therefore, these data are handled as a set.

This land basic data 32 is a model list that lists the models of equipment for each applicable process.
Referring to 33, the model allocation 34 of the land to be inspected for each type of equipment in each process is performed, and the land to be inspected for each type of equipment in each process and the coordinate value of the position to be inspected for that land and the corresponding parts A model-specific land coordinate value table 35 recording the circuit number and the pin number in the case of performing is formed.

When this model-specific land coordinate value table 35 is formed, the equipment operation database 37 is accessed through the equipment master database 36 based on the data specifying the model, and the data regarding the operation characteristics of the specific model is read out. Be done. The equipment master database 36 records access addresses to the equipment operation database 37 for each model, and the equipment operation database 37 records operation characteristic data for each equipment of each process that affects inspection operation in each process. ing.

Further, the land shape database (land database) 38 is accessed based on the type or name of the land recorded in the model-specific land coordinate value table 35, and the data concerning the land shape is read out for each type of land.
The land shape database 38 records data relating to various land shapes. Furthermore, based on the type or name of the part corresponding to the land recorded in the model-based land coordinate value table 35, the part shape database 40 is accessed based on the part master database 39 that constitutes the part database, and for each part The data regarding the part shape is read. Similarly, the component property database 41 is accessed based on the component master database 39, and data relating to the color of the component is read for each component. Further, the component master database 39 records access addresses to the component shape database 40 and the component property database 41, respectively.
The data of various shapes of parts is recorded in, and the data of physical properties other than shape such as color and weight of parts are recorded in the part property database 41.

Further, for each land recorded in the land coordinate value table 35 for each model, the CAM data holding unit 24 to the C
Based on the information items of the inspection condition data 42 input as AM data, the inspection condition table 43 is created by inputting the conditions for inspecting the land. Here, even with the same land name, the allowable condition at the time of inspection may differ depending on the land position on the circuit board, so it cannot be defined for each land name or type like the land shape. Therefore, the inspection code for indicating the inspection condition for each land is set in the inspection condition table 43. The inspection code of the inspection condition table 43 corresponds to the access address to the inspection condition database 44, and the inspection condition database 44 records the data regarding the inspection condition such as the actual allowable value when inspecting the land.

As described above, the operation of reading out the predetermined data from the various databases based on the model-based land coordinate value table 35 is sequentially carried out by the read / write processing means 45, and by the read / write processing means 45. Based on the read data, the individual land array table 46 in which the data of the model of the inspection machine in each process, the type of land to be inspected, and the land inspection condition is written is formed for each part.

When the individual land array table 46 is formed in this manner, the name of each land and the coordinate value of the land inspection position are sequentially read from the model-specific land coordinate value table 35, and a set of the circuit number and the pin number and The data read from the individual land array table 46 based on the name of the part is machine data conversion means.
It is converted into machine data 48 by 47. The machine data 48 includes NC data corresponding to the coordinate values, part data corresponding to the type of parts, land data indicating the shape of lands, inspection condition data indicating allowable conditions at the time of inspection, and the like.

Although it is possible to perform data processing for each land as described above, it is also possible to perform data processing for each component in order to improve compatibility with the creation of mounting data. Normally, the inspection machine is often used in parallel with the production equipment of each process, and the inspection data is often processed in units of parts. Therefore, it is easier to handle the inspection data by processing the parts. Further, generally, it is possible to reduce the amount of processing by performing the processing collectively for each component rather than performing processing for each land that exists in plural for each component.

At this time, a storage database that stores the characteristics of various mounting systems that affect the mounting operation,
FIG. 5 shows an example of creating machine data for the mounting system from the common component database by adding an access means for accessing the equipment database for each mounting system and a machine data conversion means for the mounting system. ing.

FIG. 5 is a block diagram showing another example of the data flow in the reference data generator 25 of FIG. In FIG. 5, an address for mounted equipment is additionally set in the equipment master database 51, and reference data for each type of mounted equipment is registered in the equipment operation database 52. Also, considering that the model distribution 53 is performed for each part, model distribution
At the time of 53, the inspection machine and the mounting equipment are separately allocated for each part, and the information of both devices is included in the part-specific coordinate value table 54 for each model. The land shape database 38 extracts corresponding land data based on the information contained in the land basic data 32 with the part as a key. Further, read / write processing means 55
In addition to the individual land array table 46, an individual component array table 56 in which the model of the mounting equipment and the type of the component to be mounted are written for each component is formed. When the mounting data corresponding to the individual component arrangement table 56 is added to the machine data converting means 57 and the NC data for the mounting system is also created in the machine data 58, the inspection data for the inspection machine is obtained. Of course, it is possible to create mounting data for mounting equipment. At this time, the part master database 39, the part shape database 40, and the part property database 41, which are determined by the names and types of parts, can be commonly used.

As described above, the printed circuit board CAD system
A CAD data holding unit 22 of 21 holds CAD data such as land basic data and component basic data when designing a circuit pattern of a printed circuit board, and a reference data generation unit 25 automatically generates inspection data and mounting data based on the CAD data. By the generation, it is possible to eliminate the conventional physical standard of the mounting data and the inspection data, which is created by the operator visually and manually based on the actual printed circuit board. Then, the CAD data is adopted as a line uniform standard of the high-accuracy, high-density, non-defective product mounting system that comprehensively captures the mounting board production device 16, and based on this CAD data, screen data, land data, parts data, print Since board inspection data, print inspection data, component mounting data, mounting inspection data, soldering inspection data, etc. are created, it is possible to eliminate the conventional variations between actual solids and ambiguity of people, and Precise manufacturing can be realized based on design data. As a result, the CAD data is used as the unified standard for the line, the production standard and the inspection standard are unified, and the inspection standard is secured from the upstream process such as the printed circuit board manufacturing and the screen manufacturing, so that accurate printing, mounting, and soldering in the downstream process can be performed. The inspection can be performed and the solid quality of the product can be secured. In addition, with quality source management by ensuring quality in each process, high quality from upstream processes can be accumulated and high quality in the final process can be ensured. Further, it is possible to easily separate defects into factors for each process, and it is possible to easily clarify the cause of defects.

[0033]

As described above, according to the present invention, the mounting substrate
Mounting data for operating each production facility in the production equipment
And operating each inspection machine in each process of the mounting board production equipment
From the same CAD data as the inspection data for
Configured generate and aims to standardize fabrication reference inspection criteria, also by securing the inspection criteria from upstream processes, such as a printed circuit board fabrication, screen production, data not
Deficiencies in inspection due to equipment are eliminated, and true defects can be detected.
The inspection can be realized, and the accurate inspection of printing, mounting and soldering in the downstream process can be performed, and the solid quality of the product can be secured. In addition, with quality source management by ensuring quality in each process, high quality from the upstream process can be accumulated and high quality in the final process can be secured.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a reference data processing system of a mounting board production apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a deviation of land, printing cream solder, and parts with respect to a unified standard in the standard data processing system of FIG.

FIG. 3 is a conceptual diagram of a procedure for creating inspection data and mounting data in the reference data processing system of FIG.

4 is a block diagram showing an example of a data flow in a reference data generation unit 25 of FIG.

5 is a block diagram showing another example of the data flow in the reference data generation unit 25 of FIG.

FIG. 6 is a block diagram showing a configuration of a conventional mounting board production apparatus.

FIG. 7 is a conceptual diagram of a conventional inspection data creation procedure.

FIG. 8 is a diagram showing a relative relationship of misalignment of a land, a printing cream solder, and a component when checking the actual product.

[Explanation of symbols]

1 Printed Circuit Board Manufacturing Department 2 Screen production department 3 Solder printing department 4 parts mounting section 5 Soldering part 6 PCB manufacturing machine 7 Printed circuit board inspection machine 8 screen making machine 9 Screen inspection machine 10 cream solder printing machine 11 Cream solder printing inspection machine 12 mounting machine 13 Parts mounting inspection machine 14 Reflow furnace 15 Soldering inspection machine 16 Mounted board production equipment 21 Printed circuit board CAD system 22 CAD data storage 23 Printed circuit board CAM system 24 CAM data storage 25 Reference data generator 26 Standard data processing system

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshifumi Nakao               1006 Kadoma, Kadoma-shi, Osaka Matsushitaden               Instrument industry Co., Ltd. (72) Inventor Kiyoshi Masuda               1006 Kadoma, Kadoma-shi, Osaka Matsushitaden               Instrument industry Co., Ltd. (72) Inventor Tetsuo Horimoto               1006 Kadoma, Kadoma-shi, Osaka Matsushitaden               Instrument industry Co., Ltd.                (56) References JP-A-63-201876 (JP, A)                 Shinji Abe Outside 3 people "Printed circuit board               Development of Manufacturing Information Management System "Oki Electric Research               Development, Oki Electric Industry Co., Ltd., 1992 1               Mon, Vol. 59, No. 1, pp. 91-96

Claims (6)

(57) [Claims] 1. A component is mounted by printing solder on a printed circuit board.
And, a further reference data processing system for creating mounting data and inspection data for operating each of the production facilities and inspection machines in each step of the mounting board production apparatus for solder joining the lands and parts of the terminal, the printed circuit board As the circuit pattern design information,
Identification or position of the parts to be mounted corresponding to the land
A CAD data holding unit for holding CAD data including identification and mounting position data, and an identification data for each land or each component in the CAD data.
Related to the production equipment that performs
Data and data related to the inspection machine that performs the inspection
By using both of the
Mounting data to operate the production equipment
And the inspection data that operates the inspection machine that performs the inspection.
A reference data processing system for a mounting board production apparatus, comprising a reference data generation unit for generating the reference data. 2. Each land or each part in the CAD data
Production that carries out the mounting production specified by the identification data
Data related to equipment and inspection machines that inspect the data
A CAM data holding unit for holding data to be stored.
1. A standard data processing system for a mounting board production apparatus according to 1 . 3. The CAM data holding unit relates to production equipment.
Data and data related to inspection machines are used as a database
The standard device of the mounting board production apparatus according to claim 2,
Data processing system. 4. The CAM data holding unit relates to production equipment.
As data, the data regarding the equipment operation characteristics of the production equipment
Data on the shape of the components to be mounted, or solder
Holds data regarding the shape of the land to be printed, and inspects
As the data on the
Data on the shape of the part to be inspected, or half
Data regarding the shape of the land for inspecting the printing condition is stored.
The reference data generation unit holds the CAD data from the CAM data storage unit.
By the identification data of each land or each part in the data,
As data on production equipment, the equipment operation characteristics of production equipment
Data regarding the
Data about the shape of the land for solder printing or solder printing
To read the inspection conditions as data related to the inspection machine.
Related data, shape of parts to be inspected for mounting status
The shape of the land for inspecting the data or solder printing status
The mounting board raw material according to claim 2, which reads out data regarding
Standard data processing system for industrial equipment. 5. A total production in each process of a mounting board production apparatus.
Mounting data for operating equipment and inspection machines and
Request to generate inspection data based on the same CAD data
The mounting board production apparatus according to any one of claims 1 to 4.
Reference data processing system. 6. A component is mounted by printing solder on a printed circuit board.
Mounting board that solders the land and component terminals together
Producing each production equipment and inspection machine in each process of production equipment
Create implementation and inspection data to run
This is a standard data processing method, in which the land pattern is used as the circuit pattern design information of the printed circuit board.
Identification or position of the parts to be mounted corresponding to the land
Holds CAD data including identification and mounting position data
CAD data holding step and identification data of each land or each part in the CAD data
Related to the production equipment that performs
Data and data related to the inspection machine that performs the inspection
By using both of the
Mounting data to operate the production equipment
And the inspection data that operates the inspection machine that performs the inspection.
Mounting board production with reference data generation process to generate
Reference data processing method for equipment.