JP3359844B2 - Matrix type image display device - Google Patents

Matrix type image display device

Info

Publication number
JP3359844B2
JP3359844B2 JP18154697A JP18154697A JP3359844B2 JP 3359844 B2 JP3359844 B2 JP 3359844B2 JP 18154697 A JP18154697 A JP 18154697A JP 18154697 A JP18154697 A JP 18154697A JP 3359844 B2 JP3359844 B2 JP 3359844B2
Authority
JP
Japan
Prior art keywords
signal line
circuit
line driving
driving circuit
data signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP18154697A
Other languages
Japanese (ja)
Other versions
JPH1090650A (en
Inventor
靖 久保田
一郎 白木
保 酒井
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Priority to JP8-192566 priority Critical
Priority to JP19256696 priority
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP18154697A priority patent/JP3359844B2/en
Publication of JPH1090650A publication Critical patent/JPH1090650A/en
Application granted granted Critical
Publication of JP3359844B2 publication Critical patent/JP3359844B2/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26500687&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3359844(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers
    • G09G3/3674Details of drivers for scan electrodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers
    • G09G3/3685Details of drivers for data electrodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0404Matrix technologies
    • G09G2300/0408Integration of the drivers onto the display substrate
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00Command of the display device
    • G09G2310/02Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264Details of driving circuits
    • G09G2310/0289Details of voltage level shifters arranged for use in a driving circuit
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00Command of the display device
    • G09G2310/06Details of flat display driving waveforms
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers
    • G09G3/3648Control of matrices with row and column drivers using an active matrix
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix type image display device in which pixels are arranged in a matrix on a substrate, and more particularly to an improvement in a driving circuit for driving each pixel for display.

[0002]

2. Description of the Related Art Conventionally, liquid crystal elements, EL (electroluminescence) elements and LEDs (light emitting diodes)
An image display device in which elements and the like are arranged in a matrix is used. A liquid crystal display device will be described below as an example of such a matrix type image display device. FIG. 11 is a front view showing a schematic configuration of a general liquid crystal display device 1. This liquid crystal display device 1 generally includes
A pixel array ARY in which a large number of pixels PIX are formed, a scanning signal line driving circuit gd and a data signal line driving circuit sd for displaying and driving the pixels PIX, and drive control of these signal line driving circuits gd and sd. Control circuit 2 for
It is comprised including.

On the pixel array ARY, a large number of scanning signal lines GL j (j = 1, 2,..., N) and data signal lines SL i (i = 1, 2,. Are formed, and two adjacent scanning signal lines GL j , GL
The pixels PIX are to be formed in an area surrounded by j + 1 and the data signal lines SL i and SL i + 1, and the pixels PIX are arranged in a matrix.

The data signal line driving circuit sd samples the input image signal DAT in synchronization with a timing signal such as a clock signal CKS from the control circuit 2, and amplifies the image signal DAT as necessary. Data signal line SL
Output to i . The scanning signal line drive circuit gd a clock signal CKG from the control circuit 2, in synchronization with the timing signals such as GPS, sequentially selects the scanning signal lines GL j, to be described later are provided in the pixel PIX Controls opening and closing of switching elements. Thus, the data signal line SL
i , the image signal (data) DAT output to each pixel PI
X, the image data DAT is held until the next scanning timing, and display output is performed.

[0005] The data signal line driving circuit sd is the image data DAT when slide into output to the data signal line SL i, the sequentially image data DAT to the pixel of the selected line by a scanning signal line GL j The point-sequential driving method of outputting and the image data D
A line-sequential driving method for outputting an AT is known. As an example, a data signal line driving circuit of a point-sequential driving method with a simple circuit configuration will be described with reference to FIG.

FIG. 12 is a block diagram showing an electrical configuration of a typical conventional data signal line drive circuit sd.
Above the respective data signal lines SL i, analog switches as
w i is interposed, and this analog switch asw i
There When turned on, the image data DAT is output is sampled to the data signal line SL i. To control these analog switches asw i, scanning circuit srs i corresponding individually to the respective analog switches asw i
(I = the 1, 2, ..., m) and is provided with a buffer bufs i.

The scanning circuits srs i are cascaded with each other, and a clock signal CKS is commonly input to each scanning circuit srs i . Also, the scanning circuit sr at the start end
The s 1, is given a start pulse SPS created based on such a horizontal synchronizing signal. Therefore, from each scanning circuit srs i , a sampling pulse is sequentially output from the scanning circuit srs 1 on the starting end side, and this sampling pulse is held and amplified in the buffer bufs i and , if necessary, It is inverted, given the respective analog switches asw i.

As shown in FIG. 13, for example, the scanning signal line driving circuit gd includes a scanning circuit srg k (k = 1, 2,..., N + 1) similar to the scanning circuit srs i and each scanning signal line. and a GL 2 types that correspond to j aND circuit and1 j, and2 j and buffer BUFG j is constructed. Each scanning circuit srg k is cascaded with each other similarly to the scanning circuit srs i .
A start pulse SPG generated based on a vertical synchronizing signal or the like is input to the scanning circuit srg 1 at the start end, and the start pulse SPG is sequentially transmitted to a subsequent stage in response to a clock signal CKG generated based on a horizontal synchronizing signal or the like. Are outputted to the scanning circuits srg 2 , srg 3 ,.

Each scanning circuit srg j , sr adjacent to each other
The output from the g j + 1, after being calculated in the AND circuit and1 j, is further input to the AND circuit and2 are computed and the clock signal GPS in j buffer BUFG j. Each of the scanning circuits srg k outputs the start pulse SPG with a delay of a half cycle in response to the clock signal CKG. That is, the pulse output from the scanning circuit srg j rises at the rising timing of the clock signal CKG, and is held for one cycle until the next rising timing.
j + 1 outputs a pulse for one period from the falling timing of the clock signal CKG. That is, the adjacent scanning circuit srg j, will be pulse shifted by a half period between srg j + 1 are input to the AND circuit and1 j, the clock signal from the logical product circuit and1 j CKG
The length of the pulse of the half cycle is output to the AND circuit and2 j.

[0010] the clock signal GPS, for example are as fast as twice of the clock signal CKG, therefore pulse output from the AND circuit and2 j is shorter than half the period of the clock signal CKG Become
There is no period in which these pulses overlap each other between adjacent AND circuits and2 j and and2j + 1 . The output from the AND circuit and2 j is a buffer bufg j
In, while being amplified and inverted as required, are output to the respective scanning signal lines GL j.

Here, the drive voltage of each signal line drive circuit gd, sd will be considered. In the data signal line drive circuit sd, a VGA (Video Graphi) is used when the scanning circuit srs i is not subjected to a desired frequency, for example, when the scanning signal line drive circuit gd is not parallelized or simultaneously sampled.
cal Array) display, about 25.2 MH
z can be driven, and the analog switch as
w i data signal lines image data DAT of positive and negative polarities in S
It is determined from the request, such that it is capable of outputting the L i, generally is determined by the request from the analog switch asw i than requests from the scanning circuit srs i. For example, when the liquid crystal driving voltage is ± 5 V and the voltage of the counter electrode is 0 V,
Level of the image signal in the data signal line SL i is -5 to +5
V, and the driving voltage of the data signal line driving circuit sd is also −
It becomes about 5 to + 5V.

On the other hand, in the scanning signal line driving circuit gd, the switching element in the pixel PIX determines the driving voltage on the positive side so that the positive image data can be written to the pixel capacitance. The driving voltage on the negative polarity side is determined so that the negative polarity image data can be held for one frame period. For example, in order to satisfy these conditions, when the threshold voltage of the switching element is +3 V, the driving signal level of the scanning signal line driving circuit gd is set to +3 V on the positive polarity side, and the level of the image signal +5 V on the positive polarity side. And the margin + 2V are added, and on the negative polarity side, the voltage is about -8V obtained by adding -5V which is the level of the image data DAT to the above + 3V and the margin -6V. Here, the drive signal level is a level of an output signal in each signal line drive circuit gd · sd, and can be the same as a drive voltage of these signal line drive circuits gd · sd.

The above-described drive voltages and drive signal levels are merely examples, and their optimum values vary depending on the drive method, drive circuit configuration, transistor characteristics, type of liquid crystal, and the like.

[0014]

As described above, in the liquid crystal display device, in order to display and drive the liquid crystal as described above,
It is necessary to apply a positive and negative 5V the voltage across, and whereas the analog switch asw i of the data signal line driving circuit sd is a CMOS configuration for handling the image data DAT of positive and negative polarities, the scanning signal lines The switching element in the pixel PIX controlled by the drive circuit gd is N
Due to the single-channel configuration such as MOS, the driving voltage of the data signal line driving circuit sd and the scanning signal line driving circuit gd is generally a voltage used in a general integrated circuit, for example, 3.3 V. Or greater than 5V,
In addition, the voltage levels are often different from each other.

For this reason, the clock signals CKS; CKG, GP to be input to the respective signal line driving circuits sd, gd.
It is necessary to increase the amplitude of S and the start pulses SPS, SPG, etc., and to a desired level. Therefore, the control circuit 2 for controlling the signal line drive circuits sd and gd and an interface circuit for converting the output of an external circuit such as an image signal processing circuit to a desired voltage level are required. There is a problem that power consumption is increased.

Another conventional technique for solving such a problem is disclosed in Japanese Patent Application Laid-Open No. Hei 6-95073. In this prior art, the input amplitude to the data signal line driving circuit and the scanning signal line driving circuit is adjusted to 5V (0V-5V), and a desired output amplitude level is set by a level shift circuit provided inside each driving circuit. 15V
(0V-15V). Thereby, the amplitude of the input signal is reduced, and the load on the external interface circuit is reduced.

However, in this prior art, one voltage level of an input signal, in this example, only the high potential side is shifted, and the input signal levels of both the data signal line driving circuit and the scanning signal line driving circuit are made the same. Is raised to the level of the drive signal. Therefore, there is a problem that the method cannot be applied when the optimum values of the driving signal levels of the data signal line driving circuit and the scanning signal line driving circuit are different from each other as described above.

An object of the present invention is to provide a data signal line driving circuit and a scanning signal line driving circuit, each of which has an optimized driving signal level. It is an object of the present invention to provide a matrix-type image display device which can simplify the configuration and reduce power consumption by making the same and lower.

[0019]

According to a first aspect of the present invention, there is provided a matrix type image display device, comprising: a substrate on which pixels for displaying an image are arranged in a matrix; In a matrix-type image display device including a scanning signal line driving circuit and a data signal line driving circuit for supplying, at least one of the scanning signal line driving circuit and the data signal line driving circuit includes a scanning signal An output stage to the line or the data signal line, a two-stage level shift circuit connected in series with each other, and the two-stage level shift circuit is provided for the scanning signal line driving circuit or the data signal line driving circuit. A level shift circuit that shifts the voltage levels on both the high potential side and the low potential side;
A level shift circuit for shifting the voltage level on both the high potential side and the low potential side of the scanning signal line driving circuit, wherein the data signal line driving circuit includes It is characterized by having a level shift circuit for shifting one of the voltage levels on the low potential side.

According to the above configuration, even if an input signal having a low voltage, for example, an amplitude of 5 V, from an external circuit such as a control circuit or an image signal processing circuit is directly input to each signal line driving circuit, The line drive circuit is provided in the output stage.
The level shift circuit of the stage can shift the voltage level of the output signal to the optimum level on both the low potential side and the high potential side.

Therefore, the load on the external circuit can be reduced, the structure can be simplified and the power consumption can be reduced, and an optimum drive signal level suitable for the drive circuit configuration and the display medium can be obtained. Display quality can be improved.

Further, while the data signal line drive circuit for outputting image data to the data signal line is usually of a CMOS configuration, the switching element provided for each pixel and for writing image data is of an NMOS configuration. The driving signal level of the scanning signal line driving circuit requires a voltage amplitude larger than the driving signal level of the data signal line driving circuit. That is, the voltage level on the high potential side of the scanning signal line driving circuit is higher than the voltage level on the high potential side of the data signal line driving circuit, and the voltage level on the low potential side of the scanning signal line driving circuit is set to the data signal line driving circuit. It is required to be lower than the voltage level on the low potential side of the circuit.

In this case, using the other voltage level not shifted in the data signal line drive circuit as a reference, the maximum shift in the level shift circuit is more effective than using one of the voltage levels in the scan signal line drive circuit as a reference. The amount can be reduced, and the load on the circuit can be reduced.

According to a second aspect of the present invention, in the matrix type image display device, the driving signal levels of the scanning signal line driving circuit and the data signal line driving circuit are different from each other, and the scanning signal line driving circuit and the data signal line driving circuit are different from each other. The input signal levels to the signal line driving circuit are equal to each other.

According to the above configuration, the driving signal levels of the scanning signal line driving circuit for opening and closing the switching elements formed in each pixel and the data signal line driving circuit for inputting image data to the switching elements are as follows: In contrast, the levels of the input signals to the data signal line driving circuit and the scanning signal line driving circuit, for example, the clock signal and the start pulse are aligned with each other. ing.

Therefore, even if the output voltage of the external circuit and the driving signal levels of the scanning signal line and the data signal line are optimized, the output voltage of the external circuit, the data signal line driving circuit and the scanning signal There is no need to add a level conversion circuit or the like for matching the input voltage of the line drive circuit, and the burden on the external circuit can be reduced.

According to a third aspect of the present invention, there is provided a matrix type image display device, wherein a substrate on which pixels for displaying an image are arranged in a matrix is provided, and a scanning signal for selectively supplying image data to each of the pixels. In a matrix-type image display device including a line driving circuit and a data signal line driving circuit, at least one of the scanning signal line driving circuit and the data signal line driving circuit is connected to a scanning signal line or a data signal line. Of the scanning signal line driving circuit or the data signal line driving circuit of the scanning signal line driving circuit or the data signal line driving circuit. A level shift circuit for shifting both of the voltage levels, and in a signal line drive circuit including the level shift circuit, The transistor constituting the bell shift circuit has a different element structure from that of the transistor constituting the preceding circuit and has a high withstand voltage. The transistor constituting the level shift circuit has a structure in which a channel region and a source region and a drain region are connected to each other. A transistor having a low impurity concentration between the channel region and the transistor constituting the level shift circuit, wherein an impurity doping amount per area between the channel region and the source and drain regions is 1 × 10 12 to The scanning signal line driving circuit has a structure having an area of 1 × 10 14 / cm 2 ,
The scanning signal line driving circuit is provided with a two-stage level shift circuit.
Shift the voltage levels on both the high and low potential sides of the
And the data signal line drive circuit includes the data signal line
Either the high potential side or the low potential side of the drive circuit
It has a level shift circuit for shifting the pressure level .

According to the above arrangement, even if an input signal having a low voltage, for example, an amplitude of 5 V, from an external circuit such as a control circuit or an image signal processing circuit is directly input to each signal line drive circuit, The line drive circuit is provided in the output stage.
The level shift circuit of the stage can shift the voltage level of the output signal to the optimum level on both the low potential side and the high potential side.

Therefore, the load on the external circuit can be reduced, the structure can be simplified and the power consumption can be reduced, and an optimum drive signal level suitable for the drive circuit configuration and the display medium can be obtained. Display quality can be improved.

Then, the element structure of the transistor constituting the level shift circuit and the transistor constituting the preceding circuit are changed in accordance with the withstand voltage required for the element. For example, an offset structure is adopted.

Further, when the breakdown voltage of the level shift circuit is increased as described above, high reliability can be obtained for both the level shift circuit and the circuit on the subsequent stage.

Normally, image data is transferred to a data signal line.
The output data signal line drive circuit has a CMOS configuration
Is provided for each pixel while writing image data
The switching element that performs only scanning is an NMOS
The drive signal level of the signal line drive circuit is
A voltage amplitude greater than the circuit drive signal level is required.
You. That is, the voltage level on the high potential side of the scanning signal line driving circuit is
Level is the voltage level on the high potential side of the data signal line drive circuit.
And the voltage on the low potential side of the scanning signal line drive circuit
Set the voltage level to the low potential side of the data signal line drive circuit
Lower than required.

In this case, the data signal line driving circuit
It is better to refer to the other voltage level that is not shifted
The voltage level of either one of the
Rather than the maximum shift amount in the level shift circuit.
It can be made smaller, reducing the load on the circuit
Can be.

In the matrix type image display device according to the fourth aspect of the present invention, pixels for displaying an image are arranged in a matrix.
And the image data selectively to each of the above pixels
Signal line driving circuit and data signal for supplying data
Matrix image display including a line driving circuit
In the apparatus, the scanning signal line driving circuit or the data signal
At least one of the line driver circuits is a scanning signal line.
Or connected in series with each other at the output stage to the data signal line.
The two-stage level shift circuit.
The shift circuit includes the scan signal line drive circuit or the data signal.
Voltage drive circuits on both the high and low potential sides
A level shift circuit that shifts the bell;
In the signal line driving circuit including the shift circuit, the output
Transistors constituting the level shift circuit provided in stages
The star is a transistor and the element that constitute the circuit on the previous stage.
The substructures are different from each other and have high withstand voltage.
The transistors that make up the circuit consist of a channel region and a source.
Between the region and the drain region.
The level shift circuit.
Transistors have channel and source regions and drains.
Impurity doping amount per area between rain region
Has an area of 1 × 10 12 to 1 × 10 14 / cm 2
As well as a structure, the drive signal level of the scanning signal line driving circuit and the data signal line drive circuit are different from each other, and the input signal level of the scanning signal line driving circuit and the data signal line drive circuit is equal to each other The scanning signal line driving circuit
The path includes the two-stage level shift circuit and the scanning signal.
Voltage drive circuits on both the high and low potential sides
And the data signal line driving circuit shifts the bell.
Either the high potential side or the low potential side of the
Level shift circuit to shift either voltage level
Characterized in that it.

According to the above arrangement, each signal line drive circuit
And external circuits such as control circuits and image signal processing circuits.
An input signal having a low voltage, for example, an amplitude of 5 V
Even if the signal is inputted, the signal line driving circuit is provided in the output stage.
The voltage level of the output signal is determined by the stage level shift circuit.
To the optimal level for both the low and high potential sides
can do.

Therefore, the load on the external circuit is reduced.
Configuration can be simplified and power consumption can be reduced.
And the most suitable for the drive circuit configuration, display medium, etc.
Appropriate drive signal level can be obtained to improve display quality
can do.

Then, a transistor constituting the level shift circuit
Transistor and the transistor that constitutes the previous circuit
Changes the element structure according to the withstand voltage required for the element
I do. For example, an offset structure is adopted.

Further, as described above, the level shift circuit
If the breakdown voltage is increased, the level shift circuit and the subsequent stage
High reliability can be obtained for both the circuit and the circuit.

Further, the scanning signal line drive circuit for opening and closing the switching element formed in each pixel, the driving signal level of the data signal line driving circuit for inputting image data to the switching element, is optimized, respectively On the other hand, the levels of input signals to the data signal line driving circuit and the scanning signal line driving circuit, for example, a clock signal and a start pulse are aligned with each other.

Therefore, even if the output voltage of the external circuit and the driving signal levels of the scanning signal line and the data signal line are optimized, the output voltage of the external circuit, the data signal line driving circuit and the scanning signal There is no need to add a level conversion circuit or the like for matching the input voltage of the line drive circuit, and the burden on the external circuit can be reduced.

Normally, image data is transferred to a data signal line.
The output data signal line drive circuit has a CMOS configuration
Is provided for each pixel while writing image data
The switching element that performs only scanning is an NMOS
The drive signal level of the signal line drive circuit is
A voltage amplitude greater than the circuit drive signal level is required.
You. That is, the voltage level on the high potential side of the scanning signal line driving circuit is
Level is the voltage level on the high potential side of the data signal line drive circuit.
And the voltage on the low potential side of the scanning signal line drive circuit
Set the voltage level to the low potential side of the data signal line drive circuit
Lower than required.

In this case, in the data signal line driving circuit
It is better to refer to the other voltage level that is not shifted
The voltage level of either one of the
Rather than the maximum shift amount in the level shift circuit.
It can be made smaller, reducing the load on the circuit
Can be.

In the matrix type image display device according to the fifth aspect of the present invention, the pixels for displaying an image are arranged in a matrix.
And the image data selectively to each of the above pixels
Signal line driving circuit and data signal for supplying data
Matrix image display including a line driving circuit
In the apparatus, the scanning signal line driving circuit or the data signal
At least one of the line driver circuits is a scanning signal line.
Or connected in series with each other at the output stage to the data signal line.
The two-stage level shift circuit.
The shift circuit includes the scan signal line drive circuit or the data signal.
Voltage drive circuits on both the high and low potential sides
A level shift circuit for shifting the bell,
Line drive circuit or data signal line drive circuit
Transistors constituting either one constitute the above pixel.
Along with the transistors to be formed,
The scanning signal line driving circuit is formed in a noristic manner, and includes the two-stage level shift circuit for shifting both the high potential side and the low potential side voltage levels of the scanning signal line driving circuit. The signal line driver circuit includes a level shift circuit that shifts a voltage level on either the high potential side or the low potential side of the data signal line drive circuit.

According to the above configuration, each signal line drive circuit
And external circuits such as control circuits and image signal processing circuits.
An input signal having a low voltage, for example, an amplitude of 5 V
Even if the signal is inputted, the signal line driving circuit is provided in the output stage.
The voltage level of the output signal is determined by the stage level shift circuit.
To the optimal level for both the low and high potential sides
can do.

Therefore, the load on the external circuit is reduced.
Configuration can be simplified and power consumption can be reduced.
And the most suitable for the drive circuit configuration, display medium, etc.
Appropriate drive signal level can be obtained to improve display quality
can do.

Further, a scanning signal line driving circuit or data
At least one of the signal line driver circuits has a pixel shape.
It is formed integrally on an insulating substrate to be formed.

Therefore, the pixel and the drive circuit are the same
Process to reduce manufacturing costs.
Can be.

Normally, image data is transferred to a data signal line.
The output data signal line drive circuit has a CMOS configuration
Is provided for each pixel while writing image data
The switching element that performs only scanning is an NMOS
The drive signal level of the signal line drive circuit is
A voltage amplitude greater than the circuit drive signal level is required.
You. That is, the voltage level on the high potential side of the scanning signal line driving circuit is
Level is the voltage level on the high potential side of the data signal line drive circuit.
And the voltage on the low potential side of the scanning signal line drive circuit
Set the voltage level to the low potential side of the data signal line drive circuit
Lower than required.

In this case, in the data signal line driving circuit,
It is better to refer to the other voltage level that is not shifted
The voltage level of either one of the
Rather than the maximum shift amount in the level shift circuit.
It can be made smaller, reducing the load on the circuit
Can be.

Further, in the matrix type image display device according to the invention of claim 6, pixels for displaying an image are a matrix type.
Substrates arranged in a matrix, and selectively
A scanning signal line driving circuit for supplying data;
Matrix type image including the
In the image display device, the scanning signal line driving circuit or the
Data signal line drive circuit
In series with each other at the output stage to signal lines or data signal lines
A connected two-stage level shift circuit is provided.
The level shift circuit includes the scanning signal line driving circuit or the data
Data signal drive circuit on both the high potential side and the low potential side.
Having a level shift circuit for shifting the voltage level,
The scan signal line drive circuit or data signal line drive circuit
At least one of the transistors
Along with the transistors that make up the silicon
It is formed monolithically with a film and the scanning signal
Drive signal level of line drive circuit and data signal line drive circuit
Are different from each other, and the scanning signal line driving circuit and the data
The input signal levels to the signal line drive circuit are
The scanning signal line driving circuit is a two-stage level shift circuit.
A high potential side and a low voltage side of the scanning signal line driving circuit.
Shifts both voltage levels on the
The drive circuit is provided on the high potential side or the data signal line drive circuit.
Is the level that shifts one of the voltage levels on the low potential side.
Characterized in that it have a Berushifuto circuit.

According to the above configuration, each signal line drive circuit
And external circuits such as control circuits and image signal processing circuits.
An input signal having a low voltage, for example, an amplitude of 5 V
Even if the signal is inputted, the signal line driving circuit is provided in the output stage.
The voltage level of the output signal is determined by the stage level shift circuit.
To the optimal level for both the low and high potential sides
can do.

Therefore, the load on the external circuit is reduced.
Configuration can be simplified and power consumption can be reduced.
And the most suitable for the drive circuit configuration, display medium, etc.
Appropriate drive signal level can be obtained to improve display quality
can do.

Further, the scanning signal line driving circuit or the data
At least one of the signal line driver circuits has a pixel shape.
It is formed integrally on an insulating substrate to be formed.

Therefore, the pixel and the drive circuit are the same
Process to reduce manufacturing costs.
Can be.

The switching elements formed in each pixel are
Scanning signal line drive circuit for opening and closing the element, and the switch
Signal line drive circuit for inputting image data to the switching element
Drive signal levels are optimized and differ from each other.
In contrast, these data signal line drive
Input signal to the circuit and the scanning signal line driving circuit, for example,
Clock signals, start pulses, etc.
Are aligned.

Therefore, if the output voltage of the above external circuit is
And the drive signal levels of the scanning signal lines and data signal lines.
Even if the optimization is performed, the output
Voltage and data signal line driving circuit and scanning signal line driving circuit
Level conversion circuit to match the input voltage of
This eliminates the need to add
Can be

Further, usually, image data is transferred to a data signal line.
The data signal line drive circuit that outputs to
Is provided for each pixel,
The switching element that performs the integration is of NMOS configuration,
The drive signal level of the test signal line drive circuit is
Voltage amplitude greater than the drive signal level of the
It is. That is, the voltage on the high potential side of the scanning signal line drive circuit
The level is the voltage level on the high potential side of the data signal line drive circuit.
Higher than that of the scanning signal line drive circuit, and
Voltage level on the low potential side of the data signal line drive circuit.
Be required to be lower than the

In this case, the data signal line driving circuit
It is better to refer to the other voltage level that is not shifted
The voltage level of either one of the
Rather than the maximum shift amount in the level shift circuit.
It can be made smaller, reducing the load on the circuit
Can be.

[0059]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described.
The following is a description based on FIGS. 1 to 7.

FIG. 1 is a block diagram showing an electrical configuration of a scanning signal line driving circuit GD according to an embodiment of the present invention, and FIG. 2 is a waveform diagram for explaining the operation of the scanning signal line driving circuit GD. FIG. 3 is a block diagram showing an electrical configuration of the data signal line drive circuit SD according to one embodiment of the present invention. These signal line drive circuits GD and SD can be used in place of the conventional signal line drive circuits gd and sd in the general liquid crystal display device 1 described above.

[0061] scanning signal line drive circuit GD is scanning circuit SRG j (above j corresponding individually to each of the scanning signal lines GL j
= 1, 2,..., N), a logic circuit LOG j , a level shifter LS1 j , a level shifter LS2 j and a buffer BUF j
It is provided with.

The scanning circuits SRG j are realized by a shift register or the like, and are cascaded with each other. These scan circuits SRG j, in common, from the control circuit 2, is created based on such a horizontal synchronizing signal, a clock signal CKG as shown in FIG. 2 (a) is input. In addition, the start of the scanning circuit SRG 1, from the control circuit 2, are created on the basis of such a vertical synchronizing signal, a start pulse SPG as shown in FIG. 2 (b) is input, the residual of the scanning circuit SRG Outputs from the preceding scanning circuits SRG 1 to SRG n−1 are given to 2 to SRG n , respectively. Therefore, the start pulse SPG is equal to the clock signal C
In response to KG, the data is sequentially transmitted to the subsequent scanning circuit.

[0063] The output from each of the scanning circuits SRG j, is input to the corresponding logic circuit LOG j. These logic circuits LOG j Further, as shown in FIG. 2 (c), the example is a clock signal GPS twice the frequency of the clock signal CKG, is input from the control circuit 2. Logic circuit LOG j, as shown in FIG. 2 (d), the only output and the period clock signal GPS is at a high level both from the scanning circuit SRG j, derives a high-level output. Therefore, this logic circuit LOG j
Is at a high level almost for a period of 1/4 of the clock signal CKG, and the logic circuit LOG
The high-level periods of j-1 and LOG j + 1 do not overlap each other.

[0064] The scanning circuit SRG j and a logic circuit LO
G j is and the control circuit 2, similar to the image signal processing circuit (not shown), the driving voltage has a 5V, thus the output voltage level from the logic circuit LOG j becomes 0V / 5V. The output from the logic circuit LOG j, in the first level shifter LS1 j, as shown in FIG. 2 (e), the
The voltage level is converted to 0V / 10V,
In the level shifter LS2 j, as shown in FIG. 2 (f), the is converted into -8 V / 10V. Level shifter LS
The output from the 2 j, along with being amplified by the buffer BUF j, is inverted as necessary, is output to the respective scanning signal lines GL j. The voltage level of the scanning signal line GL j is
The result is as shown in FIG.

[0065] Further, the data signal line drive circuit SD, the scanning circuit SR provided individually for each of the data signal line SL i
S i (the above i = 1, 2,..., M), a logic circuit LOS i , a level shifter LS3 i and a sampling circuit SMP i . Scanning circuit SRS i is cascaded to each other as in the scanning circuit SRG j, in these scanning circuits SRS i, common to the clock signal CKS from the control circuit 2 is input, and the start of the scan Circuit S
A start pulse SPS generated based on a horizontal synchronizing signal or the like is input to RS 1 and the remaining scanning circuit SRS
2 to SRS m include scanning circuits SRS 1 to SRS m−1 at the preceding stage.
Are input.

[0066] The output from the scanning circuit SRS i via a logic circuit LOS i which is realized by a latch circuit, is input to the level shifter LS3 i. Level shifter LS3
i is to level-shift the low potential side of 0V / 5V signals from said logic circuit LOS i, is converted to -5V / 5V,
And outputs it to the sampling circuit SMP i. by this,
Image data DAT from the control circuit 2 is sampled and output to the data signal lines SL i.

FIG. 4 shows the level shifters LS1 j and LS
It is an electric circuit diagram showing a specific configuration of the 2 j. Logic circuit L
The output stage of the OG j is constituted by a CMOS inverter consisting of transistors Q01, Q02, from the output stage, each of the two lines L01, L02, mutually signals antiphase 0V / 5V output Is done.

The input signals of 0V / 5V input from the lines L01 and L02 are input to the gates of the transistors Q11 and Q12 of the level shifter LS1 j , respectively. The transistors Q11 and Q12 are formed of NMOSs, and their sources are commonly connected to a low-potential 0V power supply line PL1. The drain of the transistor Q11 is connected to the drain of the transistor Q13 and the gate of the transistor Q14. The drain of the transistor Q12 is connected to the drain of the transistor Q14 and the gate of the transistor Q13. The transistors Q13 and Q14 are formed of PMOS, and their sources are commonly connected to a high-potential 10V power line PL2. Outputs are led out from the drains of the transistors Q11 and Q12 to lines L11 and L12, respectively.

Therefore, when the line L01 is at 5 V and the line L02 is at 0 V, the transistors Q11 and Q14 conduct, and the transistors Q12 and Q13
Is cut off, the line L11 becomes 0V, and the line L12
Becomes 10V. On the other hand, when the line L01 is at 0V and the line L02 is at 5V, the transistors Q11 and Q14 are turned off and the transistors Q12 and Q1 are turned off.
3 conducts, the line L11 becomes 10V, and the line L11
12 becomes 0V. Thus, the high potential side of the voltage level of the input signal level 0V / 5V from the logic circuit LOG j,
It is shifted to the 10V by the level shifter LS1 j.

[0070] the line L11, L12 are respectively connected to the gates of the transistors Q21, Q22 of the level shifter LS2 j. Transistors Q21, Q22
Is composed of a PMOS, and the source is commonly connected to the power supply line PL2 of 10V. Transistor Q21
Is connected to the drain of the transistor Q23 and the gate of the transistor Q24, and the drain of the transistor Q22 is connected to the drain of the transistor Q24 and the gate of the transistor Q23. The transistors Q23 and Q24 are composed of NMOSs, and have a common low potential -8V power supply line P.
L3. The drains of the transistors Q21, Q23, the output line L2 of the buffer BUF j are connected.

Therefore, when the line L11 is at 10 V and the line L12 is at 0 V, the transistors Q22 and Q23 conduct, and the transistors Q21 and Q24
Is cut off, and the output line L2 becomes -8V. On the other hand, the line L11 is at 0V and the line L12 is at 10V.
When the voltage is V, the transistors Q21 and Q24 conduct, the transistors Q22 and Q23 shut off, and the output line L2 becomes 10V.

[0072] Thus, by the level shifter LS2 j, the voltage level of the low potential side is outputted is shifted from 0V to -8 V.

The level shifter LS3 i in the data signal line driving circuit SD shifts the voltage level on the low potential side of the input signal level 0V / 5V from the logic circuit LOS i to -5V. Circuit G
It is configured similarly to the level shifter LS2 j in D.

The signal line driving circuit G configured as described above
The element structure of the transistors constituting D and SD is shown, for example, in FIG. FIG. 5 shows the signal line driving circuit GD,
FIG. 3 is a cross-sectional view schematically showing an element structure of a transistor constituting SD. In FIG. 5, reference numerals TG, TS,
TD is a gate electrode, a source region, and a drain region, respectively, reference numeral CNL is a channel region, and reference numeral RAY is a gate insulating film.

FIG. 5A shows the scanning circuits SRG j and SRS i.
And the logic circuits LOG j , LOS i, etc., and have the simplest structure called a single drain structure. In this transistor, the source region TS and the drain region T are self-aligned by ion doping using the gate electrode TG as a mask.
D is formed.

On the other hand, the level shifters LS1 j , L
S2 j ; LS3 i , the transistors used in the buffer BUF j and the sampling circuit SMP i are high breakdown voltage transistors. This transistor is shown in FIG.
The structure is as shown in FIGS.

The transistor shown in FIG. 5B has a longer channel length than the transistor shown in FIG. 5A, as indicated by reference numeral CNLa.

In general, when the channel length is increased, the electric field between the source and the drain is reduced, and the breakdown voltage of the element (source / drain) is reduced.
It is known that the drain-to-drain withstand voltage and the applied voltage at which the transistor does not deteriorate during long-term operation) are improved.
Further, as the channel length increases, the performance (driving ability) of the transistor decreases. If a transistor having an excessively long channel length is used, as a result, the signal line driving circuit GD · S
This impairs the characteristics of D or the characteristics of the entire display device. Therefore, the upper limit of the channel length of the transistor shown in FIG. 5B is determined so that the characteristics of the signal line driving circuits GD and SD or the characteristics of the entire display device can be sufficiently obtained.

The active layer of the transistor shown in FIG. 5B can be manufactured by polycrystallizing an amorphous silicon thin film. There are a plurality of methods for polycrystallizing the amorphous silicon thin film. The methods are roughly classified into a method of polycrystallizing by heat treatment, a method of polycrystallizing by laser irradiation, and a method of combining these two methods. Further, there is also a method of combining these methods with a method of promoting crystallization using a metal catalyst. In the formation of the active layer by the above method, the correlation between the channel length of the transistor to be formed and the element withstand voltage differs depending on conditions such as the temperature and time of the heat treatment and the output of the laser.

For example, in a polycrystalline silicon thin film transistor manufactured by polycrystallization of an amorphous silicon thin film under a certain method and condition and capable of obtaining an element withstand voltage of 5 to 7 V with a channel length of 3 μm, an element of 10 V or more In order to ensure a withstand voltage, the channel length is required to be 4.5 μm or more, and in order to ensure an element withstand voltage of 15 V or more, the channel length is required to be 6 μm or more. In addition, the length of the channel length of this transistor that does not impair the characteristics of the signal line driver circuits GD / SD or the characteristics of the entire display device is preferably 10 μm or less, more preferably 8 μm or less.

A channel length of 2 μm manufactured by changing the method and conditions for polycrystallization of the amorphous silicon thin film.
In a transistor capable of obtaining an element withstand voltage of 5 to 7 V, a channel length of 3 μm or more is required to secure an element withstand voltage of 10 V or more, and a channel length is required to secure an element withstand voltage of 15 V or more. 4.5 μm or more is required. The upper limit of the channel length in this transistor is preferably 8 μm, and more preferably 6 μm.
m.

Further, in a transistor manufactured by further changing the method and conditions for polycrystallizing the amorphous silicon thin film and obtaining an element withstand voltage of 5 to 7 V with a channel length of 4 μm, 1
The channel length is required to be 6 μm or more in order to secure the element withstand voltage of 0 V or more, and the channel length is required to be 8 μm or more in order to secure the element withstand voltage of 15 V or more. The upper limit of the channel length in this transistor is preferably 12 μm, and more preferably 10 μm.

[0083] For example, in the configuration of the scanning signal line drive circuit GD in FIG. 1, the scanning circuit SRG j and a logic circuit L
The transistor used for OG j has a channel length of 3 μm.
5A is driven at a driving voltage of 5 V and the level shifter LS1 j · L is used.
As transistor used in S2 j, and a buffer BUF j, channel length with transistor shown in FIG. 5 (b) of 7 [mu] m, to no voltage 10V is driven at 18V.
With such a configuration, a high-speed and highly reliable scanning signal line driving circuit GD can be realized.

As described above, the correlation between the channel length and the improvement in the withstand voltage of the element differs depending on the method of manufacturing the transistor (particularly the active layer) and the structure (size, etc.) of the transistor. When used for GD / SD, if the channel length of the transistor shown in FIG. 5B is 1.5 to 3 times the channel length of the transistor shown in FIG. Regardless of the method and conditions of polycrystallization of the amorphous silicon thin film for forming the layer, and the structure (size, etc.) of the transistor,
A favorable element withstand voltage can be obtained. If the ratio of the channel length of the transistors used for the level shifters LS1 j , LS2 j and LS3 i in the signal line drive circuit GD / SD to the transistor used in the circuit at the preceding stage is within this range, the signal line drive circuit GD · SD Works most efficiently.

The transistor shown in FIG. 5C has a larger gate insulating film than the transistor shown in FIG. 5A, as indicated by reference numeral RAYa.

In general, as the thickness of the gate insulating film increases, the element breakdown voltage increases in proportion to the thickness. However,
It is also known that, depending on the film formation method, the breakdown voltage rapidly decreases below a certain film thickness due to defects or the like. Also,
As the thickness of the gate insulating film increases, the performance (driving ability) of the transistor decreases. When a transistor having an excessively thick gate insulating film is used, as a result, the signal line driving circuit GD · S
This impairs the characteristics of D or the characteristics of the entire display device. Therefore, the upper limit of the thickness of the gate insulating film of the transistor shown in FIG. 5C is determined so that the characteristics of the signal line driving circuits GD and SD or the characteristics of the entire display device can be sufficiently obtained.

The gate insulating film of the transistor as shown in FIG. 5C is formed by a CVD (Chemical Va) method.
por deposition method). As the CVD method, there are methods such as a thermal CVD method and a plasma CVD method, and the film quality of a gate insulating film to be formed differs depending on conditions such as a kind of gas used and a reaction temperature. Therefore, the correlation between the film thickness of the gate insulating film of the transistor to be formed and the element withstand voltage differs depending on each condition.

For example, CVD under certain methods and conditions
In a polycrystalline silicon thin-film transistor in which a gate insulating film is formed by a method and has a gate insulating film thickness of 80 nm and an element withstand voltage of about 10 V, in order to obtain an element withstand voltage of 15 V or more, the thickness of the gate insulating film is required. Is 100n
m or more, and a gate insulating film thickness of 120 nm or more is required in order to secure an element breakdown voltage of 20 V or more. In this transistor, the thickness of the gate insulating film that does not impair the characteristics of the signal line driving circuits GD / SD or the characteristics of the entire display device is preferably 20.
0 nm or less, more preferably 150 nm or less.

In order to obtain an element withstand voltage of 15 V or more in a polycrystalline silicon thin film transistor having a gate insulating film thickness of 90 nm and an element withstand voltage of about 10 V by changing the method and conditions of the CVD method described above, The thickness of the gate insulating film must be 110 nm or more, and the gate insulating film must have a thickness of 130 nm or more in order to ensure an element breakdown voltage of 20 V or more. The upper limit of the thickness of the gate insulating film in this transistor is preferably 220 n
m, more preferably 180 nm.

Further, by further changing the method and conditions of the CVD method, a polycrystalline silicon thin film transistor having a gate insulating film thickness of 100 nm and an element breakdown voltage of about 10 V can be obtained in order to obtain an element breakdown voltage of 15 V or more. Means that the thickness of the gate insulating film needs to be 125 nm or more,
In order to secure the above element breakdown voltage, the gate insulating film needs to have a thickness of 150 nm or more. The upper limit of the thickness of the gate insulating film in this transistor is preferably 250 nm, and more preferably 220 nm.

[0091] For example, in the configuration of the scanning signal line drive circuit GD in FIG. 1, the scanning circuit SRG j and a logic circuit L
As transistor used in OG j, the film thickness of the gate insulating film using the transistor shown is a diagram of 80nm 5 (a), together with the driving by the driving voltage 5V, level shifter L
As transistor used in S1 j · LS2 j and buffer BUF j, FIG thickness of 120nm gate insulating film 5
Driving is performed at a voltage of 10 V to 18 V using the transistor shown in FIG. With such a configuration, a high-speed and highly reliable scanning signal line driving circuit GD can be realized.

As described above, the correlation between the degree of the film thickness and the improvement of the element withstand voltage varies depending on the method of forming the gate insulating film, the heat treatment conditions, the structure (size, etc.) of the transistor, and the like. When used for the circuit GD / SD,
If the thickness of the gate insulating film of the transistor shown in FIG. 5C is 1.25 to 2.5 times the thickness of the gate insulating film of the transistor shown in FIG. 5A, the gate insulating film is formed. A preferable element withstand voltage can be obtained irrespective of the conditions of the CVD method or the structure (size, etc.) of the transistor. If the ratio of the thickness of the gate insulating film between the transistor used for the level shifters LS1 j , LS2 j and LS3 i in the signal line drive circuit GD / SD and the transistor used for the circuit on the preceding stage is within this range, the signal line drive is performed. The circuit GD / SD operates most efficiently.

On the other hand, the transistor shown in FIG.
This is a transistor called an LDD structure. The transistor includes a channel region CNL and a source region TS
A region having a low impurity concentration indicated by the reference numeral LDD, that is, a region having a relatively low impurity doping amount per area, and a region (LDD region, Lig).
htly Doped Drain region).

What affects the characteristics of the transistor is
Actually, it is an impurity concentration per volume, but here, as a condition of the manufacturing process, an impurity doping amount per area is a characteristic of the LDD region. In a normal transistor manufacturing process, since most of the implanted impurities are set to enter the active layer, the value obtained by dividing the impurity doping amount per area by the film thickness of the active layer is the impurity concentration per volume. Become. The impurity doping amount per area in the source region TS and the drain region TD is 1 × 10 15 to 5 × 10 15 / cm 2 , whereas the impurity doping amount per area in the region LDD is preferably 1 × 10 15 / cm 2. 10 12 -1 × 10 14 / cm 2
And more preferably 5 × 10 12 to 5 × 10 13 / c.
m 2 .

As described above, it is known that the device withstand voltage can be improved by relaxing the electric field between the source and the drain. As one method of realizing this electric field relaxation, an LDD structure (Lightly Doped Dra
in structure). This is a structure in which a junction region of a transistor (a pn junction region between a source and a drain) is an LDD region having a low impurity doping amount per area, and a depletion layer width in this region is widened, thereby relaxing the electric field. is there.

The junction region of the transistor shown in FIG. 5D can be formed by self-alignment injection. The correlation between the impurity doping amount per area of the junction region and the relaxation of the electric field between the source and the drain in this transistor differs depending on the method of manufacturing the transistor (particularly, the junction region). In the case of a transistor having a region,
In a transistor having a channel length of 5 μm and not having the LDD structure, the element withstand voltage is about 5 to 7 V. On the other hand, 2 ×
L of about 10 13 / cm 2 , that is, an impurity doping amount per area of 5 × 10 12 to 5 × 10 13 / cm 2
In a transistor having a DD region, the channel length is 5 μm
Thus, a device withstand voltage of 15 V or more can be secured.

The amount of impurity doping per area of the LDD region in this transistor is determined so that the resistance of this region is substantially equal to the on-resistance of the channel. The impurity doping amount per area of this region is 1 × 10 14
If it exceeds / cm 2 , the resistance of this region becomes too small, and most of the applied voltage is applied to the channel region of the transistor. Therefore, the electric field between the source and the drain cannot be reduced. When the impurity doping amount per area of this region is 1 × 10 12 / cm 2 or less, the reliability of the transistor is improved, but the resistance of this region becomes too large, and the driving capability of the transistor is increased. Will be reduced. Therefore, the impurity doping amount per area of the region LDD in the transistor shown in FIG. 5D is preferably 1 × 10 12 to 1 × 10 14 / cm 2 when used for the signal line driving circuit GD / SD. And more preferably 5 × 10 12 to 5 × 10 13 / cm 2
It is.

In the formation of the LDD region of the transistor by the self-aligned implantation, the film quality of the active layer, the interface state between the gate insulating film and the active layer, the width of the LDD region, the type of the implanted impurity, the implantation energy and the The correlation between the impurity doping amount per area of the LDD region and the device withstand voltage differs depending on the activation conditions and the like. However, if the impurity doping amount per area is within the above range, a preferable device withstand voltage can be obtained.

[0099] For example, in the configuration of the scanning signal line drive circuit GD in FIG. 1, the scanning circuit SRG j and a logic circuit L
As the transistor used for OGj , the transistor shown in FIG. 5A having a single drain structure (a structure having no LDD region) is used and driven at a driving voltage of 5 V, and at the same time, the level shifters LS1 j and LS2 j and the buffer BU
As transistor used in F j, impurity doping amount per area using the transistor shown in FIG. 5 (d) having a LDD region of 2 × 10 13 / cm 2, voltage 10
Drive at V to 18V. With such a configuration,
A high-speed and highly reliable scanning signal line driving circuit GD can be realized.

The transistor shown in FIG.
This transistor is called an offset structure, and has a region (offset region) between the channel region CNL and the source region TS and the drain region TD, which is not doped with an impurity indicated by reference numeral OFF. Further, the transistor shown in FIG. 5F is a transistor called a multi-gate structure, and is denoted by CNL.
1, a plurality of channels are connected in series as shown by CNL2.

The transistors having the structures shown in FIGS. 5D to 5F have the same channel length and the same gate film thickness, and have the structure shown in FIG. 5A. The breakdown voltage between the source and the drain can be made larger than that. Therefore, with such a structure, the withstand voltage of the transistor can be increased. The structure shown in FIG. 5 (b) and FIGS. 5 (d) to 5 (f) particularly
This is very effective because it can be formed in the same step as the structure shown in FIG. Further, by applying at least one of the structures shown in FIGS. 5B and 5C to the transistors having the structures shown in FIGS. 5D to 5F, the withstand voltage is further increased. be able to. Thus, a desired breakdown voltage can be obtained for each transistor in the signal line drive circuits GD and SD, and reliability can be improved.

The scanning circuits SRG j and SRS i are:
For example, it is realized by a configuration as shown in FIG. Each of the scanning circuits SRG j and SRS i includes two clocked inverters INV1 and INV2 having a CMOS structure and an inverter I
NV3. Inverter INV1
Are input with the start pulses SPG and SPS or the output of the preceding scanning circuit. In FIG. 6, the clock signals CKG and CKS are input to a clock input terminal indicated by reference numeral CK, and the clock signals CKG and CKS are input to a clock input terminal indicated by reference numeral / CK.
A clock signal obtained by inverting KS is input.

The output of the inverter INV1 is inverted by the inverter INV3 and output to the logic circuits LOG j and LOS i and to the next-stage scanning circuit. This output is fed back to the input side of the inverter INV3 by the inverter INV2. Thus,
Each scanning circuit SRG j , SRS i is provided with a clock signal CKG,
In response to CKS, the start pulse SP is sequentially turned on.
G and SPS can be held for one period of the clock signals CKG and CKS.

The pixels PIX driven by the signal line driving circuits GD and SD configured as described above are configured, for example, as shown in FIG. FIG. 7 is an electric circuit diagram schematically showing an electric configuration of each pixel PIX. Each pixel PIX includes a generally-are the switching element, a field effect transistor SW which is selected taking the signal level of the data signal line SL i when the scanning signal line GL j becomes high level, the The signal level taken in by the field effect transistor SW is provided with a pixel capacitance applied to one electrode. The pixel capacitance is composed of a liquid crystal capacitance CL and an auxiliary capacitance CS added as necessary.

[0105] When the scanning signal line GL j becomes high level, the drain of the field effect transistor SW - conducting between the source and the one electrode of the data signal line SL i and the liquid crystal capacitance CL and the auxiliary capacitor CS is connected You. Liquid crystal capacity CL
Is connected to a common electrode VP common to all pixels. In the case of the so-called CS-on-common structure shown in FIG. 7, the other electrode of the auxiliary capacitance CS is connected to the counter electrode VP, similarly to the liquid crystal capacitance CL.
Thus, captured from the data signal line SL i, the voltage applied to the liquid crystal capacitor CL, the liquid crystal of the transmittance or reflectance is modulated, it is possible to perform image display.

[0106] CS Onkomon structure shown in FIG. 7, the capacitance of the scanning signal line GL j can be reduced, the burden of the scanning signal line drive circuit GD is lighter, is suitably carried out in the pixel array of a relatively large area.

As described above, the scanning signal line driving circuit GD and the data signal line driving circuit SD according to the present invention are provided with the input from the external circuits such as the control circuit 2 for generating the clock signals CKG and CKS and the like and the image signal processing circuit. As long as the signal level is within a range in which the signal line drive circuits GD and SD operate normally, each pixel PIX has an element structure of the field-effect transistor SW and an image signal level regardless of the voltage level. The signals are converted and provided by the level shifters LS1 j , LS2 j ; LS3 i so that the corresponding optimum drive signal level is obtained. Therefore, it is not necessary to add an interface circuit or the like to the external circuit, so that the configuration can be simplified and the power consumption can be reduced, and the pixel PIX can be driven at an optimal driving signal level to achieve high display quality. Can be obtained.

The level shifters LS1 j , LS2 j ; L
S3 i, the subsequent buffer BUF j and the sampling circuit SMP i and the level shifters LS1 j and LS2
j ; Since the element structures of the scanning circuits SRG j and SRS i and the logic circuits LOG j and LOS i which are prior to LS3 i are different from each other, a withstand voltage corresponding to the voltage to be used can be obtained. High reliability can be obtained.

Furthermore, generally, the output stage of the data signal line drive circuit SD (in the example of FIG. 3, the sampling circuit SMP
i ) has a CMOS configuration, whereas the field effect transistor SW of the pixel PIX has one channel (N in the example of FIG. 7).
Channel) configuration. Therefore, the high-potential-side voltage required when outputting a high-potential level is higher in the scanning signal line driving circuit GD than in the data signal line driving circuit SD.
Further, the period during which the field effect transistor SW should hold the image data DAT is longer than that of the output stage (the field effect transistor SW is one field, and the output stage of the data signal line driving circuit SD is one horizontal scanning cycle). On the other hand, the low-potential-side voltage required for holding the low voltage level is lower in the scanning signal line driving circuit GD than in the data signal line driving circuit SD.

Therefore, as in the present invention, one drive voltage (5 V in the example of FIG. 3) of the data signal line drive circuit SD is fixed, and the other drive voltage (0 V) of the data signal line drive circuit SD and Shifting the driving voltage of the scanning signal line driving circuit GD is more effective than shifting one of the three driving voltages while fixing one driving voltage of the scanning signal line driving circuit GD, and the level shifters LS1 j , LS2 j ; LS3. The maximum shift amount at i can be reduced.

For example, in the case of the scanning signal line driving circuit GD shown in FIGS. 1 and 4, while the shift amount in the level shifter LS2 j is −8 V, one driving of the scanning signal line driving circuit GD is performed. Voltage, for example 5 on the high potential side
When V is fixed, the shift amount of the level shifter LS2 j needs to be −13V. As described above, when the shift amount in the level shifters LS1 j , LS2 j ; LS3 i increases, the operation may become unstable or the signal delay may increase, whereas the scanning signal line driving circuit GD of the present invention may be used. , SD, such a problem can be solved by fixing one potential of the data signal line drive circuit SD.

Another embodiment of the present invention will be described with reference to FIGS.
The following is a description based on FIG.

FIG. 8 is a front view showing a schematic configuration of a liquid crystal display device 11 according to another embodiment of the present invention. In the liquid crystal display device 11, the signal line drive circuits GD and SD are:
It is formed integrally on the common substrate 12 together with the pixel array ARY. In the liquid crystal display device 1 shown in FIG.
The field effect transistor SW of the pixel PIX is made of amorphous silicon, and the signal line driving circuits GD and SD are formed of an integrated circuit external to the pixel array ARY.

On the other hand, due to demands for improving the driving force of the field effect transistor SW accompanying the recent increase in screen size, reducing the mounting cost of the signal line driving circuits GD and SD, and further increasing the reliability of mounting. The pixel array ARY is monolithically formed using a polycrystalline silicon thin film on a quartz substrate.
And a signal line driving circuit GD, SD. Furthermore, with the aim of achieving a larger screen and lower cost, an attempt was made to form a field-effect transistor SW from a polycrystalline silicon thin film at a process temperature of about 600 ° C. or less, which is the strain point of the glass, using a glass substrate. Have been. Therefore, in the liquid crystal display device 11, the pixel array ARY and the signal line driving circuits GD and SD are integrally formed on the substrate 12 made of glass as described above.
To the control circuit 2 and the power supply voltage generating circuit 13.

The power supply voltage generation circuit 13 outputs a high-level voltage 5 V from the terminal VSH to the data signal line drive circuit SD, and outputs a low-level voltage − from the terminal VSL.
Outputs 5V. 0V from the terminal COM is applied to the substrate 12.
And a voltage of 0 V / 5 V of the counter electrode VP is applied from the terminal VP.

On the other hand, a high-level voltage of 10 V is output from the terminal VGH to the scanning signal line driving circuit GD,
The terminal VGL outputs a low-level voltage, -8V or -3V. This voltage level of the counter electrode VP is for corresponding to performing the AC driving by changing the above 0V / 5V, although the voltage level of the high potential side of the scanning signal line GL j remains 10V, This is because the voltage level on the low potential side is -8 V when the voltage level of the counter electrode VP is 0 V, and is -3 V when the voltage level of the counter electrode VP is 5 V. Of course, in addition to this, the scanning circuits SRG j and SRS i and the logic circuit LO
Power supply (0V / 5V) for driving G j , LOS i, etc.
Is supplied to the signal line drive circuits GD and SD.

The pixel PIX in the liquid crystal display device 11
Is shown, for example, in FIG. Each pixel PIX
Generally comprises a field effect transistor SW and a pixel capacitance including a liquid crystal capacitance CL and an auxiliary capacitance CS. Gate of the field effect transistor SW is connected to the scanning signal line GL j, the drain is the data signal line S
Is connected to L i, the source is connected to one electrode of the liquid crystal capacitance CL and the auxiliary capacitor CS. Liquid crystal capacity CL
A drive voltage of 5 V / 0 V is applied from the power supply voltage generation circuit 13 to the opposite electrode VP, which is the other electrode of the above. The other electrode of the auxiliary capacitance CS is connected to the adjacent scanning signal line GLj -1 .

[0118] Thus configured, in the pixel PIX so-called CS on-gate structure, in accordance with the AC driving of the counter electrode VP, the other electrode is a scanning signal line GL j of the auxiliary capacitor CS is also the same cycle and the same It is necessary to drive AC with amplitude. For this reason, the voltage corresponding to the off level of the scanning signal line driving circuit GD, that is, the driving voltage on the low potential side needs to be changed in the above-described cycle because the field-effect transistor SW has the NMOS configuration in the example of FIG. .

For example, when the AC cycle is a two-field period, the drive signal level on the lower potential side of the odd field is lower than that of the even field, and when the AC cycle is two horizontal scanning periods, the odd line is an even number field. The drive signal level on the lower potential side than the line is lowered. Thus, in order to change the drive signal level on the low potential side,
As described above, the power supply voltage generation circuit 13 supplies the level shifter L
By varying the power supply voltage input to the S2 j, may be changed to shift amount in the level shifter LS2 j.

[0120] By thus AC-driving the counter electrodes VP, the amplitude of the image data DAT to be output to the data signal line SL i is reduced, the data signal line drive circuit SD
Power consumption can be reduced.

FIG. 10 shows a liquid crystal display device 11 as described above.
FIG. 6 is a waveform diagram for explaining the operation of FIG. The power supply voltage generation circuit 13 of the liquid crystal display device 11 switches the output voltage from the terminal VGL to the power supply line PL3 between -8V and -3V as described above, for example, in an odd field and an even field. Therefore, in an odd field set to -8 V, the operation is the same as that in FIG. 2 described above, whereas in an even field set to -3 V, the operation is as shown in FIG. FIGS. 10A to 10G respectively correspond to FIGS. 2A to 2G described above. In the even field, in response to the voltage VP of the counter electrode becomes 5V, the low potential side is -3V next output voltage from the level shifter LS2 j, whereby the driving voltage of the scanning signal line GL j is, -3V / It becomes 10V.

In this way, by connecting the other terminal of the auxiliary capacitance CS to the adjacent scanning signal line GLj -1 as shown in FIG. 9, the routing of the common electrode is reduced, and the aperture ratio is increased. Pixel P with CS on-gate structure
In AC driving of the IX, the level when the field effect transistor SW is turned off can be adapted, and high-quality display can be performed.

[0123] The present invention is not limited to the liquid crystal display device 1, 11, the pixel PIX is formed in a matrix array regions are partitioned by the scanning signal line GL j and the data signal line SL i, and the pixel The present invention can be suitably applied to a matrix type display device including a switching element in PIX. The above-described drive voltage and drive signal level are merely examples, and needless to say, appropriate values are selected according to the element structure and the amplitude level of the image data DAT.

[0124] In the first and second embodiments, the scanning signal line drive circuit GD is first and second level shifter, comprising a level shifter LS1 j · LS2 j, the data signal line drive circuit SD is a third LS3 which is a level shifter
Although i is provided, the configuration is not limited to this. In the present invention, the data signal line driving circuit SD includes the level shifters LS1 and LS2, and the scanning signal line driving circuit G
D may include a level shifter LS3. That is, the data signal line driving circuit SD may include the level shifters LS1 i and LS2 i instead of LS3 i , and the scanning signal line driving circuit GD may include LS3 j instead of LS1 j and LS2 j . Also, the data signal line drive circuit SD
However, the configuration may be such that level shifters LS1 i and LS2 i are provided instead of LS3 i , and each of these signal line drive circuits GD and SD is provided with level shifters LS1 and LS2.
However, when the data signal line drive circuit SD is configured to include the level shifters LS1 i and LS2 i as described above, the difference in drive signal level between the data signal line drive circuit SD and the scan signal line drive circuit GD is determined. Must be taken into account. That is, the level shifters LS1 i are set so that an optimum drive signal level for driving the data signal line is obtained.
· LS2 i it is necessary to adjust the amount of signal level shift due. Similarly, the scanning signal line drive circuit GD is also in the case of a configuration including a level shifter LS3 j, for optimum levels of the drive signal for driving the scanning signal lines is obtained, the signal level of the shift by the level shifter LS3 j It is necessary to adjust the amount.

Further, in the matrix type image display device of the present invention, the scanning signal line driving circuit GD includes the two-stage level shifters LS1 j and LS2 j and includes both the high potential side and the low potential side of the input signal level. The data signal line drive circuit SD that shifts the voltage level may have a configuration including a level shifter LS3 i that shifts the voltage level of either the high potential side or the low potential side of the input signal level. This configuration can also be suitably applied to the liquid crystal display devices 1 and 11 described above.

Further, in the matrix type image display device of the present invention, when the pixel PIX is selected by the scanning signal, the switching element SW takes in the image data and gives it to one electrode of the pixel capacitance, thereby forming the pixel capacitance. the other electrode of the storage capacitor CS that is connected to the adjacent scanning signal lines GL j, image display by driving the display media by applying a voltage between the one electrode and the other opposing electrode of the pixel capacitor The above-mentioned counter electrode is AC-driven at a cycle whose voltage level is predetermined, and the scanning signal line driving circuit GD
A configuration may be adopted in which two level shifters LS1 j and LS2 j are provided, and the voltage shift amount of one of the level shifters changes in each cycle.

[0127]

As described above, in the matrix type image display device according to the first aspect of the present invention, at least one of the scanning signal line driving circuit and the data signal line driving circuit is connected in series to the output stage thereof. And the two-stage level shift circuit shifts both the high-potential side and the low-potential side voltage levels of the scanning signal line driving circuit or the data signal line driving circuit. The scanning signal line driving circuit includes the two-stage level shift circuit and shifts both the high potential side and the low potential side voltage levels of the scanning signal line driving circuit, thereby providing the data signal line driving circuit. The circuit includes a level shift circuit that shifts either the high potential side or the low potential side voltage level of the data signal line drive circuit.

Therefore, the load on the external circuit can be reduced, the structure can be simplified and the power consumption can be reduced, and an optimal drive voltage suitable for the drive circuit configuration and the display medium can be obtained. Display quality can be improved.

Further, the maximum shift amount in the level shift circuit can be reduced, and the load on the circuit can be reduced.

In the matrix type image display device according to the second aspect of the present invention, as described above, the drive signal levels of the scanning signal line drive circuit and the data signal line drive circuit are optimized and different from each other. On the other hand, the levels of input signals to the data signal line driving circuit and the scanning signal line driving circuit such as a clock signal and a start pulse are aligned with each other.

Therefore, even if the output voltage of the external circuit and the driving signal levels of the scanning signal line driving circuit and the data signal line driving circuit are optimized, the output voltage and the data signal line are output on the output side of the external circuit. It is not necessary to add a level conversion circuit or the like for matching the input voltage of the driving circuit and the scanning signal line driving circuit, so that the load on the external circuit can be reduced.

Further, in the matrix type image display device according to the third aspect of the present invention, as described above, at least one of the scanning signal line driving circuit and the data signal line driving circuit is connected to the scanning signal line or the data signal line. The output stage of the scan signal line includes a two-stage level shift circuit connected in series with each other, and the two-stage level shift circuit includes a high potential side and a low potential side of the scanning signal line driving circuit or the data signal line driving circuit. In the signal line drive circuit including the level shift circuit, the transistor included in the output stage and constituting the level shift circuit includes a level shift circuit for shifting both voltage levels on the output side, and a circuit on a preceding stage thereof is provided. The transistor constituting the element and the element structure are different from each other and have a high withstand voltage. A transistor having a low impurity concentration between the source region and the drain region, and the transistor constituting the level shift circuit includes an impurity doping per area between the channel region and the source and drain regions. The quantity is 1 × 10 12 to 1 × 10 14 /
and has a region which is cm 2, and drive the scanning signal lines
The driving circuit includes the two-stage level shift circuit and the driving circuit.
Of both the high potential side and the low potential side of the
The data signal line drive circuit shifts the
High or low potential side of the data signal line drive circuit
Level shift circuit that shifts one of the voltage levels
It is a structure which has .

Therefore, the voltage level of the output signal can be shifted to the optimum level on both the low potential side and the high potential side, so that the load on the external circuit is reduced, and the configuration is simplified and the power consumption is reduced. In addition to this, it is possible to obtain an optimum drive signal level suitable for a drive circuit configuration, a display medium, and the like, thereby improving display quality. Further, when the breakdown voltage of the level shift circuit is increased in this manner, high reliability can be obtained for both the level shift circuit and the circuit on the subsequent stage.

Further, the system in the data signal line driving circuit
Scanning is better with reference to the other voltage level
The voltage level of one of the signal line drive circuits
Than the maximum shift amount in the level shift circuit.
Can reduce the burden on the circuit.
it can.

In the matrix type image display device according to the fourth aspect of the present invention, as described above, the scanning signal line driving is performed.
Circuit and / or data signal line drive circuit
One is at an output stage to a scanning signal line or a data signal line,
A two-stage level shift circuit connected in series
The two-stage level shift circuit includes the scanning signal line drive.
High or low potential of the drive circuit or data signal line drive circuit.
Level shift circuit that shifts both voltage levels on the potential side
Signal line driving circuit having a path and including the level shift circuit.
The level shift circuit provided in the output stage.
The transistors that make up the circuit constitute the circuit on the previous stage.
Transistor and element structure are different from each other.
And the transistors constituting the level shift circuit are:
Between the channel region and the source and drain regions
And a structure having a region with a low impurity concentration.
The transistors that make up the bell shift circuit are
Area between the region and the source and drain regions.
Impurity doping amount of 1 × 10 12 to 1 × 10 14 / c
m 2 , the driving signal levels of the scanning signal line driving circuit and the data signal line driving circuit are different from each other, and the input signals of the scanning signal line driving circuit and the data signal line driving circuit are different from each other. The signal levels are equal to each other
In addition, the scanning signal line driving circuit includes the two-stage level shifter.
The scanning signal line driving circuit and the high potential side of the scanning signal line driving circuit.
Shifts the voltage levels of both
The signal line driver circuit has a high potential of the data signal line driver circuit.
Shifts the voltage level of either side
Level shift circuit .

Therefore, the voltage level of the output signal is set to a low potential.
Shift to the optimum level on both the high-side and the high-potential side
To reduce the load on the external circuit and simplify the configuration.
And low power consumption and drive
Optimal drive signal level suitable for circuit configuration, display medium, etc.
Can improve the display quality.
You. Further, as described above, the breakdown voltage of the level shift circuit is increased.
In other words, the level shift circuit and the subsequent circuit
In addition, high reliability can be obtained.

[0137] Also, optimized driving signal level of the output voltage and the scanning signal lines and data signal lines of the external circuit, the output side of the external circuit, their output voltage and the data signal line drive circuit and the scanning signal There is no need to add a level conversion circuit or the like for matching the input voltage of the line drive circuit, and the burden on the external circuit can be reduced.

Further, the system in the data signal line driving circuit
Scanning is better with reference to the other voltage level
The voltage level of one of the signal line drive circuits
Than the maximum shift amount in the level shift circuit.
Can reduce the burden on the circuit.
it can.

In the matrix type image display device according to the fifth aspect of the present invention, as described above,
Circuit and / or data signal line drive circuit
One is at an output stage to a scanning signal line or a data signal line,
A two-stage level shift circuit connected in series
The two-stage level shift circuit includes the scanning signal line drive.
High or low potential of the drive circuit or data signal line drive circuit.
Level shift circuit that shifts both voltage levels on the potential side
A scanning signal line driving circuit or a data signal line
Transistors that constitute at least one of the drive circuits
The star, together with the transistors that make up the pixel ,
Monolithically formed of crystalline silicon thin film
To, the scanning signal line driving circuit includes a level shift circuit of the two-stage shift both the voltage level of the high potential side and the low potential side of the scanning signal line driving circuit, the data signal line drive circuit And a level shift circuit for shifting either the high potential side or the low potential side voltage level of the data signal line drive circuit.

Therefore, the voltage level of the output signal is set to a low potential.
Shift to the optimum level on both the high-side and the high-potential side
To reduce the load on the external circuit and simplify the configuration.
And low power consumption and drive
Optimal drive signal level suitable for circuit configuration, display medium, etc.
Can improve the display quality.
You. In addition, pixels and drive circuits are formed in the same process
And the manufacturing cost can be reduced.

The maximum shift in the level shift circuit is
The load on the circuit can be reduced.
Can be

In the matrix type image display device according to the sixth aspect of the present invention, as described above, the scanning signal line driving is performed.
Circuit and / or data signal line drive circuit
One is at an output stage to a scanning signal line or a data signal line,
A two-stage level shift circuit connected in series
The two-stage level shift circuit includes the scanning signal line drive.
High or low potential of the drive circuit or data signal line drive circuit.
Level shift circuit that shifts both voltage levels on the potential side
A scanning signal line driving circuit or a data signal line
Transistors that constitute at least one of the drive circuits
The star, together with the transistors that make up the pixel,
Monolithically formed of crystalline silicon thin film
The scanning signal line driving circuit and the data signal line driving circuit
Drive signal levels are different from each other, and the scanning signal line
The input signal level of the drive circuit and the data signal line drive circuit is
The scanning signal line driving circuit is equal to each other,
The scanning signal line driving circuit is provided with a level shift circuit.
Shift both the potential and low potential voltage levels,
The data signal line drive circuit includes a data signal line drive circuit.
Voltage level on either the high or low potential side of the
That having a level shift circuit for shifting the Le.

Therefore, the voltage level of the output signal is set to a low potential.
Shift to the optimum level on both the high-side and the high-potential side
To reduce the load on the external circuit and simplify the configuration.
And low power consumption and drive
Optimal drive signal level suitable for circuit configuration, display medium, etc.
Can improve the display quality.
You. In addition, pixels and drive circuits are formed in the same process
And the manufacturing cost can be reduced.

The switching elements formed in each pixel are
Scanning signal line drive circuit for opening and closing the element, and the switch
Signal line drive circuit for inputting image data to the switching element
Drive signal levels are optimized and differ from each other.
In contrast, these data signal line drive
Input signal to the circuit and the scanning signal line driving circuit, for example,
Clock signals, start pulses, etc.
Are aligned.

Therefore, if the output voltage of the external circuit is
And the drive signal levels of the scanning signal lines and data signal lines.
Even if the optimization is performed, the output
Voltage and data signal line driving circuit and scanning signal line driving circuit
Level conversion circuit to match the input voltage of
This eliminates the need to add
Can be

Further, the maximum shift in the level shift circuit is
The amount of shift can be reduced, reducing the load on the circuit.
can do.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating an electrical configuration of a scanning signal line driving circuit according to an embodiment of the present invention.

FIG. 2 is a waveform chart for explaining an operation of the scanning signal line driving circuit shown in FIG.

FIG. 3 is a block diagram showing an electrical configuration of a data signal line driving circuit according to one embodiment of the present invention.

4 is an electric circuit diagram showing a specific configuration of a level shifter in the scanning signal line driving circuit shown in FIG.

FIG. 5 is a cross-sectional view schematically showing an element structure for realizing the level shifter as shown in FIG.

6 is an electric circuit diagram showing one configuration example of a scanning circuit in the scanning signal line driving circuit shown in FIG. 1 and the data signal line driving circuit shown in FIG.

FIG. 7 is an electric circuit diagram schematically showing an electric configuration of a pixel in the liquid crystal display device according to the embodiment of the present invention.

FIG. 8 is a front view showing a schematic configuration of a liquid crystal display device according to another embodiment of the present invention.

9 is an electric circuit diagram schematically showing an electric configuration of a pixel in the liquid crystal display device shown in FIG.

10 is a waveform chart for explaining an operation of the scanning signal line driving circuit in the liquid crystal display device shown in FIG.

FIG. 11 is a front view showing a schematic configuration of a general liquid crystal display device.

FIG. 12 is a block diagram showing an electrical configuration of a data signal line driving circuit in a typical conventional liquid crystal display device.

FIG. 13 is a block diagram showing an electrical configuration of a scanning signal line driving circuit in a typical conventional liquid crystal display device.

[Explanation of symbols]

Reference Signs List 1 liquid crystal display device (matrix type image display device) 2 control circuit 11 liquid crystal display device (matrix type image display device) 12 substrate 13 power supply voltage generating circuit ARY pixel array BUF j buffer CL liquid crystal capacitance CS auxiliary capacitance GD scanning signal line driving circuit GL j scanning signal line LS1 j level shifters (level shift circuit) LS2 j level shifters (level shift circuit) LS3 i shifter (level shift circuit) SD data signal line drive circuit SL i data signal lines SMP i sampling circuit SRG j scanning circuit SRS i Scan circuit SW Field effect transistor

Continuation of the front page (56) References JP-A-57-11396 (JP, A) JP-A-6-12035 (JP, A) JP-A-5-165431 (JP, A) JP-A-5-259891 (JP) , A) JP-A-7-169969 (JP, A) JP-A-8-37313 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) G02F 1/133 550 G09G 3/20 G09G 3/36

Claims (6)

(57) [Claims]
1. A semiconductor device comprising: a substrate on which pixels for displaying an image are arranged in a matrix; and a scanning signal line driving circuit and a data signal line driving circuit for selectively supplying image data to each of the pixels. Wherein at least one of the scanning signal line driving circuit and the data signal line driving circuit is connected in series with each other at an output stage to the scanning signal line or the data signal line. A two-stage level shift circuit, wherein the two-stage level shift circuit includes a level shift circuit that shifts both high-potential and low-potential voltage levels of the scanning signal line driving circuit or the data signal line driving circuit. And the scanning signal line driving circuit includes the two-stage level shift circuit and includes both the high potential side and the low potential side of the scanning signal line driving circuit. Wherein the data signal line drive circuit has a level shift circuit for shifting one of a high potential side and a low potential side voltage level of the data signal line drive circuit. Image display device.
2. The driving signal levels of the scanning signal line driving circuit and the data signal line driving circuit are different from each other, and the input signal levels of the scanning signal line driving circuit and the data signal line driving circuit are equal to each other. The matrix type image display device according to claim 1, wherein:
3. A substrate on which pixels for displaying an image are arranged in a matrix, and a scanning signal line driving circuit and a data signal line driving circuit for selectively supplying image data to each of the pixels. Wherein at least one of the scanning signal line driving circuit and the data signal line driving circuit is connected in series with each other at an output stage to the scanning signal line or the data signal line. A two-stage level shift circuit, wherein the two-stage level shift circuit includes a level shift circuit that shifts both high-potential and low-potential voltage levels of the scanning signal line driving circuit or the data signal line driving circuit. In the signal line driver circuit including the level shift circuit, a transistor included in the output stage and constituting the level shift circuit is provided The transistor forming the level shift circuit has a low impurity concentration between the channel region, the source region, and the drain region. The transistor constituting the level shift circuit has an impurity doping amount per area of 1 × 10 12 to 1 × 10 14 between the channel region and the source and drain regions.
/ With cm a structure having a 2 whose area, the scanning signal line driving circuit, the 2-stage level shift times of
A high potential side and a low potential side of the scanning signal line driving circuit.
The both voltage levels on the potential side are shifted, and the data signal line driving circuit shifts the data signal line driving circuit.
Voltage level on either the high or low potential side of the
A matrix type image display device comprising a level shift circuit for shifting a pixel.
4. Pixels for displaying an image are arranged in a matrix.
And the image data selectively to each of the above pixels
Signal line driving circuit and data signal for supplying data
Matrix image display including a line driving circuit
In the apparatus, the scanning signal line driving circuit or the data signal line driving circuit
At least one of them is a scanning signal line or data signal.
Two stages of levels connected in series
And the two-stage level shift circuit includes the scanning signal line driving circuit.
Potential and low potential of the circuit or data signal line drive circuit
Level shift circuit to shift both voltage levels
A signal line driving circuit having the level shift circuit.
To form the level shift circuit provided in the output stage.
Transistors that are that make up the circuit of the preceding stage tiger
Njisuta and element structure are different from each other, a high breakdown voltage, the transistor constituting the level shift circuit, channel
Between the source region and the drain region.
A transistor having a low-concentration region, wherein a transistor forming the level shift circuit is a channel.
Area between the source region and the source and drain regions.
Impurity doping amount per 1 × 10 12 to 1 × 10 14
/ Cm 2 , the driving signal levels of the scanning signal line driving circuit and the data signal line driving circuit are different from each other, and the scanning signal line driving circuit and the data signal line driving circuit have different driving signal levels. input signal level rather equal to each other, the scanning signal line driving circuit, the 2-stage level shift times of
A high potential side and a low potential side of the scanning signal line driving circuit.
The both voltage levels on the potential side are shifted, and the data signal line driving circuit shifts the data signal line driving circuit.
Voltage level on either the high or low potential side of the
A matrix type image display device comprising a level shift circuit for shifting a pixel.
5. Pixels for displaying an image are arranged in a matrix.
And the image data selectively to each of the above pixels
Signal line driving circuit and data signal for supplying data
Matrix image display including a line driving circuit
In the apparatus, the scanning signal line driving circuit or the data signal line driving circuit
At least one of them is a scanning signal line or data signal.
Two stages of levels connected in series
And the two-stage level shift circuit includes the scanning signal line driving circuit.
Potential and low potential of the circuit or data signal line drive circuit
Level shift circuit to shift both voltage levels
Having the scanning signal line driving circuit or the data signal line driving circuit.
The transistor that constitutes at least one of them is
Along with the transistors that make up the pixel,
The scanning signal line driving circuit is formed monolithically with a thin film, and the scanning signal line driving circuit includes the two-stage level shift circuit to shift both the high potential side and the low potential side voltage levels of the scanning signal line driving circuit. the data signal line driving circuit, luma Torikusu be <br/> further comprising a level shift circuit for shifting the one of the voltage level of the high potential side or the low potential side of the data signal line drive circuit Type image display device.
6. Pixels for displaying an image are arranged in a matrix.
And the image data selectively to each of the above pixels
Signal line driving circuit and data signal for supplying data
Matrix image display including a line driving circuit
In the apparatus, the scanning signal line driving circuit or the data signal line driving circuit
At least one of them is a scanning signal line or data signal.
Two stages of levels connected in series
And the two-stage level shift circuit includes the scanning signal line driving circuit.
Potential and low potential of the circuit or data signal line drive circuit
Level shift circuit to shift both voltage levels
Having the scanning signal line driving circuit or the data signal line driving circuit.
The transistor that constitutes at least one of them is
Along with the transistors that make up the pixel,
It is formed monolithically with a thin film and drives the scanning signal line driving circuit and the data signal line driving circuit.
The driving signal levels are different from each other and the scanning signal line drive
The input signal levels of the circuit and the data signal line drive circuit are
And the scanning signal line driving circuit performs the two-stage level shift circuit.
A high potential side and a low potential side of the scanning signal line driving circuit.
The both voltage levels on the potential side are shifted, and the data signal line driving circuit shifts the data signal line driving circuit.
Voltage level on either the high or low potential side of the
And a level shift circuit for shifting the
Matrix-type image display device that.
JP18154697A 1996-07-22 1997-07-07 Matrix type image display device Expired - Lifetime JP3359844B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8-192566 1996-07-22
JP19256696 1996-07-22
JP18154697A JP3359844B2 (en) 1996-07-22 1997-07-07 Matrix type image display device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18154697A JP3359844B2 (en) 1996-07-22 1997-07-07 Matrix type image display device
US08/892,157 US6157361A (en) 1996-07-22 1997-07-14 Matrix-type image display device
US09/684,912 US6373460B1 (en) 1996-07-22 2000-10-10 Matrix-type image display device having level shifters

Publications (2)

Publication Number Publication Date
JPH1090650A JPH1090650A (en) 1998-04-10
JP3359844B2 true JP3359844B2 (en) 2002-12-24

Family

ID=26500687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18154697A Expired - Lifetime JP3359844B2 (en) 1996-07-22 1997-07-07 Matrix type image display device

Country Status (2)

Country Link
US (2) US6157361A (en)
JP (1) JP3359844B2 (en)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3359844B2 (en) * 1996-07-22 2002-12-24 シャープ株式会社 Matrix type image display device
JP4013293B2 (en) * 1997-09-01 2007-11-28 セイコーエプソン株式会社 Display device combined type image sensor device and active matrix display device
US7196699B1 (en) 1998-04-28 2007-03-27 Sharp Kabushiki Kaisha Latch circuit, shift register circuit, logical circuit and image display device operated with a low consumption of power
JP4386479B2 (en) * 1998-05-11 2009-12-16 Okiセミコンダクタ株式会社 Display device driving circuit, display unit, and portable display device
JP2000267136A (en) * 1999-03-18 2000-09-29 Toshiba Corp Liquid crystal display device
JP3437489B2 (en) 1999-05-14 2003-08-18 シャープ株式会社 Signal line drive circuit and image display device
JP2001051661A (en) 1999-08-16 2001-02-23 Semiconductor Energy Lab Co Ltd D-a conversion circuit and semiconductor device
US6476790B1 (en) * 1999-08-18 2002-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device and a driver circuit thereof
JP2001143491A (en) * 1999-08-31 2001-05-25 Semiconductor Energy Lab Co Ltd Shift register circuit, drive circuit for display device, and display device using the drive circuit
US6515648B1 (en) 1999-08-31 2003-02-04 Semiconductor Energy Laboratory Co., Ltd. Shift register circuit, driving circuit of display device, and display device using the driving circuit
JP2001228457A (en) * 1999-12-08 2001-08-24 Sharp Corp Liquid crystal display device
JP2002123208A (en) 2000-10-13 2002-04-26 Nec Corp Picture display device and its driving method
US6927753B2 (en) * 2000-11-07 2005-08-09 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2002175036A (en) * 2000-12-07 2002-06-21 Sanyo Electric Co Ltd Active matrix display
TW591268B (en) * 2001-03-27 2004-06-11 Sanyo Electric Co Active matrix type display device
JP2002300010A (en) * 2001-03-29 2002-10-11 Toshiba Corp Semiconductor storage device
JP3916986B2 (en) * 2001-05-18 2007-05-23 シャープ株式会社 Signal processing circuit, low-voltage signal generator, and image display device including the same
TWI222085B (en) * 2001-06-14 2004-10-11 Via Tech Inc Signal display apparatus and related method
US6967639B2 (en) * 2001-09-26 2005-11-22 International Business Machines Corporation Image display device, scan line drive circuit and driver circuit for display device
KR100753365B1 (en) * 2001-10-16 2007-08-30 삼성전자주식회사 Shift register and liquid crystal display having the same
KR100896404B1 (en) 2001-12-12 2009-05-08 엘지디스플레이 주식회사 Shift register with level shifter
JP4159779B2 (en) * 2001-12-28 2008-10-01 株式会社半導体エネルギー研究所 Semiconductor devices, electronic equipment
US6639574B2 (en) 2002-01-09 2003-10-28 Landmark Screens Llc Light-emitting diode display
EP1331628A3 (en) * 2002-01-22 2005-01-19 Seiko Epson Corporation Method of and circuit for driving a pixel
JP2003347926A (en) * 2002-05-30 2003-12-05 Sony Corp Level shift circuit, display apparatus, and mobile terminal
KR100506005B1 (en) * 2002-12-31 2005-08-04 엘지.필립스 엘시디 주식회사 flat panel display device
US6838924B1 (en) * 2003-04-25 2005-01-04 Xilinx, Inc. Dual stage level shifter for low voltage operation
JP2005049637A (en) * 2003-07-29 2005-02-24 Seiko Epson Corp Driving circuit and protection method therefor, electro-optical device, and electronic equipment
KR100539979B1 (en) * 2003-09-16 2006-01-11 삼성전자주식회사 Common level shifter, precharge circuit, scan line driver having the same, level shifting method and scan line driving method
JP4149430B2 (en) * 2003-12-04 2008-09-10 Hoya株式会社 Pulse output circuit, display device drive circuit using same, display device, and pulse output method
JP2005321457A (en) * 2004-05-06 2005-11-17 Seiko Epson Corp Scanning line driving circuit, display device and electronic equipment
JP4207858B2 (en) * 2004-07-05 2009-01-14 セイコーエプソン株式会社 Semiconductor device, display device and electronic apparatus
US20060290404A1 (en) * 2005-06-23 2006-12-28 Ati Technologies Inc. Apparatus and methods for voltage level conversion
US7437582B1 (en) * 2005-08-10 2008-10-14 Xilinx, Inc. Power control in a data flow processing architecture
JP5215534B2 (en) * 2006-05-19 2013-06-19 株式会社ジャパンディスプレイイースト Image display device
KR100768240B1 (en) * 2006-09-19 2007-10-17 삼성에스디아이 주식회사 Voltage level converting circuit
TW200823825A (en) * 2006-11-17 2008-06-01 Fitipower Integrated Tech Inc Level shifter and multilevel shifter
CN101303837B (en) * 2007-05-11 2010-09-15 瑞鼎科技股份有限公司 Scanning driver
JP2007293353A (en) * 2007-05-25 2007-11-08 Semiconductor Energy Lab Co Ltd Liquid crystal display, d/a conversion circuit, and semiconductor device
TWI396163B (en) * 2008-01-14 2013-05-11 Innolux Corp Level shifter and system for displaying image
CN101494454B (en) * 2008-01-23 2012-08-29 统宝光电股份有限公司 Image display system
JP2010199640A (en) * 2009-02-20 2010-09-09 Toshiba Corp Signal level conversion circuit
TWI563488B (en) * 2016-02-01 2016-12-21 Sitronix Technology Corp Gate driving circuit
CN109427282A (en) * 2017-09-01 2019-03-05 群创光电股份有限公司 Display equipment

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5711396A (en) 1980-06-25 1982-01-21 Casio Computer Co Ltd Level converting circuit
JPH0683415B2 (en) 1985-10-03 1994-10-19 カシオ計算機株式会社 LCD drive circuit
JP2997356B2 (en) 1991-12-13 2000-01-11 京セラ株式会社 Driving method of liquid crystal display device
US5959603A (en) * 1992-05-08 1999-09-28 Seiko Epson Corporation Liquid crystal element drive method, drive circuit, and display apparatus
JPH0612035A (en) 1992-03-05 1994-01-21 Toshiba Corp Display device
JP2903838B2 (en) 1992-03-13 1999-06-14 日本電気株式会社 Clocked inverter circuit
JPH0695073A (en) * 1992-09-11 1994-04-08 Toshiba Corp Liquid crystal display device
US5731796A (en) * 1992-10-15 1998-03-24 Hitachi, Ltd. Liquid crystal display driving method/driving circuit capable of being driven with equal voltages
JP2586785B2 (en) * 1993-02-01 1997-03-05 日本電気株式会社 Signal level conversion circuit
US5703617A (en) * 1993-10-18 1997-12-30 Crystal Semiconductor Signal driver circuit for liquid crystal displays
JP3407371B2 (en) * 1993-12-16 2003-05-19 セイコーエプソン株式会社 Drive circuit and display device
JPH07169969A (en) 1993-12-16 1995-07-04 Toshiba Corp Manufacture of thin film transistor
US5510748A (en) * 1994-01-18 1996-04-23 Vivid Semiconductor, Inc. Integrated circuit having different power supplies for increased output voltage range while retaining small device geometries
JP3096836B2 (en) * 1994-03-03 2000-10-10 セイコーインスツルメンツ株式会社 Display device
JP3599827B2 (en) 1994-05-20 2004-12-08 三菱電機株式会社 Active matrix liquid crystal display manufacturing method
KR0145615B1 (en) * 1995-03-13 1998-12-01 김광호 The driving device of the tft liquid crystal display
JPH08330939A (en) * 1995-06-05 1996-12-13 Toshiba Corp Level shifter circuit
US5949398A (en) * 1996-04-12 1999-09-07 Thomson Multimedia S.A. Select line driver for a display matrix with toggling backplane
JP3359844B2 (en) * 1996-07-22 2002-12-24 シャープ株式会社 Matrix type image display device

Also Published As

Publication number Publication date
JPH1090650A (en) 1998-04-10
US6373460B1 (en) 2002-04-16
US6157361A (en) 2000-12-05

Similar Documents

Publication Publication Date Title
EP3229226B1 (en) Shift register unit, driving method therefor, gate drive circuit, and display device
US9779682B2 (en) GOA circuit with forward-backward scan function
US8816728B2 (en) Gate driving circuit and display apparatus having the same
US8194817B2 (en) Shift register circuit
US10127875B2 (en) Shift register unit, related gate driver and display apparatus, and method for driving the same
US6928135B2 (en) Shift register for pulse-cut clock signal
US10043477B2 (en) GOA circuit
US7289594B2 (en) Shift registrer and driving method thereof
US10043473B2 (en) GOA circuit
US7508479B2 (en) Liquid crystal display
US9653179B2 (en) Shift register, driving method and gate driving circuit
EP0574920B1 (en) Active matrix display device
US7209132B2 (en) Liquid crystal display device, method of controlling the same, and mobile terminal
DE4446330B4 (en) Image display device
US7656378B2 (en) Drive circuit for display apparatus and display apparatus
KR100864918B1 (en) Apparatus for driving data of liquid crystal display
US7477226B2 (en) Shift register
US7492853B2 (en) Shift register and image display apparatus containing the same
JP3442449B2 (en) Display device and its driving circuit
US10204582B2 (en) Shift register and driving method thereof, gate electrode driving circuit, and display device
US8274504B2 (en) Output amplifier circuit and data driver of display device using the same
US7916114B2 (en) Shift register units, display panels utilizing the same, and methods for improving current leakage thereof
US9824656B2 (en) Gate driver unit, gate driver circuit and driving method thereof, and display device
US9916805B2 (en) GOA circuit for LTPS-TFT
US6437768B1 (en) Data signal line driving circuit and image display apparatus

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071011

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081011

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081011

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091011

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091011

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101011

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111011

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121011

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131011

Year of fee payment: 11

EXPY Cancellation because of completion of term