JP3356989B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a processing apparatus for removing a processing agent from an edge of a substrate such as an LCD substrate or a semiconductor wafer.

[0002]

2. Description of the Related Art In the manufacture of liquid crystal displays (LCDs) and semiconductors, a resist film pattern is formed on the upper surface of an LCD substrate or semiconductor wafer as a substrate.
A so-called lithography process is performed. This lithography processing includes various processing steps such as cleaning of the substrate, drying of the substrate, application of a resist on the surface of the substrate, exposure of a photosensitive film, and development. For example, after the substrate is washed, it is subjected to a hydrophobic treatment and further cooled, and then a resist as a photoresist is applied to form a photosensitive film on the surface of the substrate. After heating and baking, the photosensitive film is exposed to a predetermined pattern by an exposure device, and a developing solution is applied to the surface of the exposed substrate and developed, and then the developing solution is rinsed with a rinsing solution, The development processing is completed.

In the lithography process described above,
As a process of applying the resist, a spin coating method, a spray method, or the like is employed. When the resist is applied by these methods, the film thickness is uniform immediately after the application, but after the rotation stops and the centrifugal force stops working or as time passes, the resist is applied at the peripheral edge of the substrate due to the influence of surface tension. It will be thick as it rises. Further, the resist shaken off by the rotation may be scattered on the back surface of the substrate, and the resist may adhere to unnecessary portions. In this way, the non-uniform thick film formed on the peripheral portion of the substrate and the resist attached to the back surface are used in the subsequent process of transporting the substrate.
This causes particles to be generated. In addition, this may cause a device that conveys the substrate to become dirty.

Conventionally, after a resist is applied to a substrate by a coating device, the substrate is transferred to a removing device to remove unnecessary resist attached to the periphery of the substrate. The removing device is provided with a nozzle head having a concave portion for injecting the solvent from the inside, and the peripheral edge of the substrate is inserted into the concave portion through a gap,
While moving the concave portion along the peripheral edge of the substrate, a solvent is injected from the inside of the concave portion to the upper and lower surfaces of the peripheral edge of the substrate to dissolve unnecessary resist and remove by suction.

[0005]

However, the above-mentioned substrate is designed to be vacuum-adsorbed and held on the mounting table at the center thereof, but since the peripheral edge of the substrate is a free end, heat treatment or the like is not possible. After that, the peripheral edge may be warped, and as a result, the peripheral edge of the warped substrate may not be able to be inserted at the entrance of the concave portion of the nozzle body of the above-described removal device.

In such a case, it is conceivable to increase the gap between the concave portions to facilitate insertion of the peripheral edge of the substrate. However, if the gap between the concave portions is widened, it becomes difficult for the solvent ejected from inside the concave portion to be applied to the resist. In addition, since the efficiency of resist removal may decrease, it is not preferable to increase the gap between the concave portions.

It is also conceivable to correct the warpage of the substrate by performing vacuum suction of the substrate on the mounting table to the peripheral edge of the substrate. However, if the substrate is vacuum-adsorbed to the peripheral edge of the substrate, various processes are performed. On the main arm to transfer the board to the device,
When transferring the substrate on the mounting table, the main arm and the mounting table may interfere with each other, and therefore, it is not preferable to perform vacuum suction to the peripheral edge of the substrate.

On the other hand, depending on the type of the resist, it may not be possible to completely remove the resist at the peripheral portion of the substrate simply by supplying the solvent to the resist, and measures for such a case are required.

The present invention has been made in view of such circumstances, and even if warpage occurs in the peripheral edge of the substrate, it is possible to easily insert the substrate into the concave portion of the nozzle body for injecting the solvent. It is an object of the present invention to provide a processing device that can perform the processing. It is another object of the present invention to provide a processing apparatus capable of sufficiently removing a resist on a peripheral portion of a substrate.

[00010]

According to a first aspect of the present invention, there is provided a processing apparatus for removing a processing agent attached to a peripheral portion of a substrate to which a processing agent has been applied, wherein the peripheral portion of the substrate is inserted. A nozzle for supplying a solvent to a peripheral portion of the substrate inserted into the concave portion, a moving mechanism for moving the nozzle along the peripheral portion of the substrate, and a peripheral portion of the substrate at an inlet of the concave portion of the nozzle. And a guide unit for guiding the substrate, wherein the processing agent on the peripheral edge of the substrate is removed by the solvent supplied to the peripheral edge of the substrate.

As described above, since the guide means for guiding the peripheral portion of the substrate to the entrance of the concave portion of the nozzle is provided, the solvent is supplied to the peripheral portion of the substrate even if the peripheral portion of the substrate may be warped. The substrate can be easily inserted into the recess of the nozzle means.

In this case, the guide means may have a rotating body disposed at the entrance of the recess. Although it is generally not preferable that the substrate after applying the treatment agent is in contact with unnecessary objects, unnecessary contact with the substrate is avoided by using a rotating body, for example, a roller as the guide means. be able to.

[0013] Further, a cleaning outlet for injecting a solvent into the rotating body may be arranged near the rotating body. This can prevent the dissolved processing agent from adhering to the roller, and does not adversely affect the substrate.

[0014] The apparatus may further include a removing member provided in the recess of the nozzle and abutting against the end face of the substrate to scrape the processing agent adhered to the end face of the substrate and the vicinity thereof .
Can be.

As described above, the removal member is provided in the recess of the nozzle in contact with the end face of the substrate to scrape the processing agent attached to the end face of the substrate and the vicinity thereof. It is also possible to sufficiently remove the processing agent adhering to the substrate.

In this case, as the removing member, a member having a leaf spring that exerts an urging force when the end face of the substrate comes into contact can be used, so that the removing member always presses the end face of the substrate. can do. Therefore, the processing agent adhered to the peripheral portion of the substrate can be reliably removed by the removing member. Also, due to the spring effect, unnecessary force does not act on the substrate, and the removing member is
The end of the substrate can be uniformly contacted without shifting the position of the substrate. Also, by forming a large number of holes on the surface of the leaf spring, the processing agent can be efficiently removed at the hole forming portion, and the solvent and the processing agent can be sucked through the holes to process the leaf spring or the like. The deposition of the agent can be prevented. Further, by using an aggregate of metal wires as the removing member, it is possible to efficiently scrape the processing agent attached to the peripheral portion of the substrate by the projections of the wire.

Further, in any of the above processing apparatuses, the solvent supply means may have a solvent injection hole provided in the nozzle and for injecting the solvent to the upper and lower surfaces of the substrate. Further, a suction means for sucking the processing agent in the vicinity of the peripheral portion of the substrate dissolved by the solvent may be provided. The rotating body is located at the entrance of the concave portion of the nozzle.
It can be configured to partially protrude. Also before
The nozzle is a solvent injection hole that injects the solvent onto the upper and lower surfaces of the substrate
Wherein the rotating body is disposed on both sides of the solvent injection hole.
It can also be configured so that In addition, some solvents
Hand that sucks the processing agent near the periphery of the melted substrate
A step, wherein the nozzle injects the solvent onto the upper and lower surfaces of the substrate.
Wherein the rotating body has the solvent injection hole.
It may be configured to be arranged between the suction means
You.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing an LCD substrate coating / developing processing system to which the present invention is applied.

This coating / developing processing system includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and developing on the substrates G. A processing unit 2 and an interface unit 3 for transferring a substrate G between the exposure unit (not shown) and a cassette station 2 and an interface 3 at both ends of the processing unit 2, respectively. Have been.

The cassette station 1 has a transport mechanism 10 for transporting the LCD substrate between the cassette C and the processing section 2. And cassette station 1
, A cassette C is loaded and unloaded. The transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the direction in which the cassettes are arranged. The transport arm 11 allows the substrate G to be moved between the cassette C and the processing unit 2.
Is carried out.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
2, 13 and 14, and each processing unit is disposed on both sides of these transport paths. Then, relay portions 15 and 16 are provided between them.

The front section 2a includes a main transfer device 17 movable along the transfer path 12. On one side of the transfer path 12, two cleaning units (SCRs) 21a and 21b are arranged. UV irradiation on the other side of the transport path 12
A cooling unit (UV / COL) 25, a heat treatment unit (HP) 26 and a cooling unit (COL) 27, each of which is stacked in two layers, are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13. On one side of the transfer path 13, a resist coating unit (CT) 22 and a peripheral edge of the substrate G are provided. A peripheral resist removal unit (ER) 23 for removing a portion of the resist is provided.
On the other side of the heat treatment unit 3, a heat treatment unit (HP) 28 having two stacked layers, and a heat treatment / cooling unit (HP /
COL) 29, and an adhesion processing / cooling unit (AD / COL) 30 in which an adhesion processing unit and a cooling unit are vertically stacked.

Further, the rear section 2c is provided with a main transport device 19 movable along the transport path 14,
On one side, three development processing units 24a, 24
b and 24c are arranged, and on the other side of the transport path 14, a heat treatment unit 31 that is stacked in two layers vertically and two heat treatment units that are stacked vertically in a heat treatment unit and a cooling unit. Cooling unit (HP / CO
L) 32, 33 are arranged.

The processing section 2 includes a cleaning processing unit 21a and a resist processing unit 2 on one side of the transport path.
2. Only a spinner unit such as the development processing unit 24a is arranged, and only a heat processing unit such as a heating processing unit or a cooling processing unit is arranged on the other side.

A chemical solution supply unit 34 is arranged at a portion of the relay units 15 and 16 on the side where the spinner system unit is arranged, and further, a space 35 is provided in which the main transport device can be taken in and out.

The main transporting devices 17, 18, and 19 respectively include an X-axis driving mechanism, a Y-axis driving mechanism in two directions in a horizontal plane,
And a vertical Z-axis drive mechanism.
A rotation drive mechanism that rotates about an axis is provided.

The main transfer device 17 transfers the substrate G to and from the arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from the respective processing units in the front section 2 a. It has a function of transferring the substrate G between the two. Further, the main transfer device 18 is connected to the relay unit 1.
5 and transfer the substrate G to the middle section 2
b has a function of loading / unloading the substrate G to / from each processing unit and transferring the substrate G to / from the relay unit 16. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, and loads and unloads the substrate G to and from each processing unit in the subsequent unit 2 c, and transfers the substrate G to and from the interface unit 3. Has the function of performing Note that the relay sections 15 and 16 also function as cooling plates.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a substrate G between these and an exposure apparatus (not shown)
And a transport mechanism 38 for carrying in and out the wafer. The transport mechanism 38 includes the extension 36 and the buffer stage 3
The transfer arm 39 is provided on the transfer path 38a provided along the arrangement direction of the transfer unit 7 and the transfer arm 39 transfers the substrate G between the processing unit 2 and the exposure apparatus.

By thus integrating and integrating the processing units, it is possible to save space and increase the efficiency of processing.

In the coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing section 2, where the ultraviolet irradiation / cooling unit (UV) of the former section 2a is firstly used. / COL) 25, after the surface modification / cleaning treatment and subsequent cooling, the cleaning unit (S
After the scrubber cleaning is performed in CR) 21a and 21b, and is heated and dried in one of the heat treatment units (HP) 26,
It is cooled by one of the cooling units (COL) 27.

Thereafter, the substrate G is transported to the middle section 2b,
In order to enhance the fixability of the resist, the upper part of the unit 30 is subjected to a hydrophobic treatment (HMDS treatment) in the adhesion processing unit (AD), and is cooled in the cooling unit (COL). The resist is applied, and an extra resist on the periphery of the substrate G is removed by the periphery resist removal unit (ER) 23. Thereafter, the substrate G is pre-baked in one of the heat processing units (HP) in the middle section 2b, and is cooled in the lower cooling unit (COL) of the unit 29 or 30.

Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. And
The substrate G is carried in again via the interface unit 3,
Development processing is performed in any of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is subjected to post-baking in any one of the heat treatment units (HP) in the subsequent section 2c, and then cooled in the cooling unit (COL). Then, the sheet is stored in a predetermined cassette on the cassette station 1 by the transport mechanism 10.

Next, a peripheral resist removing unit (ER)
23 will be described in detail. As shown in FIGS.
At the center of the peripheral resist removal unit (ER) 23, a mounting table 41 supported at the upper end of the column 40 is disposed. A plurality of suction members 42 are mounted on the upper surface of the mounting table 41, and the substrate G is held on the upper surface of the mounting table 41 by sucking the lower surface of the substrate S with the suction members 42.

The lower end of the column 40 penetrates a bearing 44 fixed to the apparatus frame 43, and the column 40 slides in the bearing 44, whereby the mounting table 41 is supported so as to be able to move up and down. However, since the piston rod 47 of the cylinder 46 fixed to the apparatus frame 43 is connected to the cover body 45 attached in the middle of the column 40, the mounting table 41 is moved in accordance with the advance and retreat of the piston 47.
Are configured to perform a lifting operation.

When the substrate G is carried into the peripheral resist removing unit (ER) 23, the substrate G is carried into the peripheral resist removing unit (ER) 23 by the arm 18a of the main transfer device 18, as shown in FIG. You. Then, the mounting table 41 is moved by moving the piston rod 47 forward.
Is lifted, and the substrate G is received.
Adsorb the lower surface of. Thereafter, the mounting table 41 is lowered by retracting the piston rod 47, and the substrate G is carried into the peripheral resist removal unit (ER) 23.

Conversely, the peripheral resist removing unit (E
R) When the substrate G is carried out from 23, the piston rod 47 is advanced, and the reference numeral 4 indicated by a one-dot chain line in FIG.
The mounting table 41 and the substrate G are raised to the positions 1 'and G'. After the substrate G is raised in this way, when the empty arm 18a enters the inside of the peripheral edge resist removal unit (ER) 23, the mounting table 21 is lowered by the retreat of the piston rod 47, whereby the substrate G is 18a. After that, the arm 18a retreats from the inside of the peripheral resist removal unit (ER) 23,
The substrate G is carried out.

Below the substrate G placed on the mounting table 41, a drain pan 50 for receiving a solvent or a resist used for removing the resist on the peripheral edge of the substrate G, which has fallen downward, is arranged. Have been. A drain pipe 51 for draining the solvent accumulated in the drain pan 50 and an exhaust pipe 52 for exhausting the atmosphere in the peripheral resist removal unit (ER) 23 are connected to the bottom surface 49 of the drain pan 50. I have. In addition, two suction plates 60 and 61 are vertically arranged between the substrate G mounted on the mounting table 41 and the exhaust pipe 52. Each of these suction plates 60 and 61 is made of punched metal, and has a large number of ventilation holes 6.
2, 63 are respectively formed.

As shown in FIG. 3, nozzles 65, 66, 67, and 68 that move along four sides of the rectangular substrate G are disposed around the substrate G mounted on the mounting table 41. (Only the nozzles 65 and 67 are shown in FIG. 2). In this embodiment, the nozzles 65 and 67 are connected to the substrate G
Are arranged so as to move along the short sides L1 and L3, respectively, and the nozzles 66 and 68 are arranged so as to oppose so as to move along the long sides L2 and L4 of the substrate G, respectively.
These nozzles 65, 66, 67, 68 are respectively attached to the tips of L-shaped moving members 70, 71, 72, 73.

As shown in the figure, guide rails 75, 76, 77, 78 are arranged so as to surround the periphery of the substrate G, and these guide rails 75, 76, 77, 78
Support members 80, 81, 8 fixed to the device frame 43
2, 83, 84, 85, 86, 87 respectively. Then, the moving members 70, 71, 72, 7
3 to the guide rails 75, 76, 77, 7
8 so that the nozzles 65, 66, 67, and 68 are slidably mounted on each of the four sides L1, L2,
It is configured to be able to move along each of L3 and L4.

Next, based on FIGS. 2, 3 and 5, the nozzles 45, 47 moving along the short sides L1, L3 of the substrate G will be described.
Will be described. A motor 90 is attached to the outside of the support member 81, and a drive shaft 91 of the motor 90 extends to a support member 84 arranged to face the support member 81. A drive pulley 92 is attached to the drive shaft 91 near the inside of the support member 81.
A drive pulley 93 is mounted near the inside of the drive pulley 4.
On the other hand, a driven pulley 94 is attached near the inside of the support member 80, and a driven pulley 95 is also attached near the inside of the support member 85. An endless belt 96 is wound around the driving pulley 92 and the driven pulley 94, and an endless belt 97 is wound around the driving pulley 93 and the driven pulley 95. Therefore, these two endless belts 96 and 97 are circulated in the same direction by the operation of the motor 90.

A moving member 70 supporting the nozzle 65 is connected to the upper side of the endless belt 96 via a bracket 98, and the moving member 7 supporting the nozzle 67 is provided.
2 is connected to the lower side of the endless belt 97 via a bracket 99. In this manner, by interlocking the upper end of the endless belt 96 of one moving member 70 and the lower side of the endless belt 97 of the other moving member 72, the operation of the motor 90 causes the nozzles 65 and 66 to be opposite to each other. It is configured to move in parallel in the direction. That is, in FIG. 5, when the drive shaft 91 is rotationally driven in the clockwise direction a by the operation of the motor 90, the nozzle 65 moves to the back side along the left short side L1 of the substrate G, and the nozzle 67 moves.
Moves toward the near side along the right short side L3 of the substrate G.
In FIG. 5, when the drive shaft 91 is driven to rotate in, for example, a counterclockwise rotation direction b by the operation of the motor 90,
The nozzle 65 moves to the near side along the left short side L1 of the substrate G, and the nozzle 67 moves to the back side along the right short side L3 of the substrate G.

The nozzles 65 and 67 moving along the short sides L1 and L3 of the substrate S have been described above.
The nozzles 6 and 68 also move along the long sides L2 and L4 of the substrate G in exactly the same configuration as the nozzles 65 and 67. That is, as shown in FIG. 3, the motor 100 is mounted outside the support member 87, and the drive shaft 10
1 is a support member 8 arranged opposite to the support member 87
It has been extended to two. A drive pulley 102 is attached to the drive shaft 101 near the inside of the support member 87, and the drive pulley 10 is mounted near the inside of the support member 82.
3 are attached. On the other hand, a driven pulley 104 is attached near the inside of the support member 86, and a driven pulley 105 is also attached near the inside of the support member 83. An endless belt 106 is wound around the driving pulley 102 and the driven pulley 104, and the driving pulley 103
The endless belt 107 is wound around the driven pulley 105. Then, in exactly the same manner as the nozzles 65 and 67 described above, these nozzles 66 and 68 are moved in parallel in opposite directions along the long sides L2 and L4 of the substrate G by the operation of the motor 100. It is configured.

As described above, when carrying the substrate G into the peripheral resist removing unit 23 by lifting and lowering the mounting table 41 and when carrying out the substrate G from the peripheral resist removing unit 23, as shown in FIG. And nozzles 65 and 6
Since 6, 67 and 68 are retracted to positions away from the periphery of the substrate G, loading and unloading of the substrate G is performed by the nozzles 65, 66,
There is no worry that it will be hindered by the presence of 67,68.

Next, referring to FIG. 6 to FIG.
The structure of 5, 66, 67, 68 will be described. However, since all of them have the same configuration, the nozzle 65 that moves along the short side L1 of the substrate G will be described as a representative.

As shown in FIG. 6, the nozzle 65 is
0, and a concave portion 111 is formed on a side surface thereof. The peripheral portion of the substrate G sucked and held by the mounting table 41 is inserted into the recess 111 in a non-contact state. That is, the upper and lower surfaces of the peripheral portion of the substrate G are covered with the nozzle body 110. Further, an upper outlet 1 for spraying a resist solvent toward the upper surface of the peripheral edge of the substrate G inserted into the recess 111 is formed in the nozzle body 110.
12 and lower blow holes 113 and 114 for spraying a resist solvent toward the lower surface of the peripheral edge of the substrate G, respectively. Furthermore, in the approximate center of the nozzle body 110,
A suction hole 118 is provided for sucking and discharging the gas component and the resist dissolved in the solvent in the vicinity of the peripheral edge of the substrate G in the recess 111 to the outside.

As shown in FIG. 7, the upper surface of the concave portion 111 is provided with a total of four upper outlet holes 112,
These upper outlet holes 112 are parallel to the short side L1 along the vicinity of the periphery of the substrate G. A solvent is supplied to these upper outlets 112 via liquid passages 115 passing above the inside of the nozzle main body 110, and the solvent is ejected downward from the upper outlets 112 to be sprayed onto the upper peripheral edge of the substrate G. It has become.

As shown in FIG. 8, two lower blow holes 113 and four lower blow holes 1
14 are provided. The lower blowout hole 113 is arranged in parallel with the short side L1 along the vicinity of the periphery of the substrate G, while the lower blowout hole 114 is arranged such that the short side L1 extends from the vicinity of the periphery of the substrate G toward the inside of the substrate G. And orthogonal. A solvent is supplied to these lower outlets 113 and 114 via liquid passages 116 and 117 that pass under the inside of the nozzle body 110, and the solvent is ejected upward from the lower outlets 113 and 114 to cause the substrate G Is sprayed onto the lower surface of the peripheral edge of the camera.

In this embodiment, as shown in FIGS. 6 to 9, four concave portions 120 are formed at the upper and lower corners of the entrance of the concave portion 111, and these concave portions 1 are formed.
Four rollers 121 are provided rotatably on each of the 20 rollers. These rollers 121 guide the peripheral edge of the substrate G to the concave portion 111 when the peripheral edge of the substrate G approaches the entrance of the concave portion 111, even when the peripheral edge of the substrate G is warped. It has a function of facilitating insertion of the G into the recess 111. It is preferable that the tip of the peripheral edge of the roller 121 is formed sharp so as to minimize the contact area with the substrate G. This is because, in general, it is not preferable that the substrate G after the application of the resist comes into contact with unnecessary parts, and unnecessary contact with the substrate G is avoided as much as possible.

The roller 1 is located near the roller 121.
Roller cleaning outlets 122 and 123 for jetting a solvent to the roller 21 to clean the roller 121 are provided. By cleaning the roller 121 in this way, it is possible to prevent the dissolved resist from adhering to the roller 121, so that the substrate G is not affected. On the upper side of the nozzle body 110, the blowout holes 122 for roller cleaning are
As shown in FIG. 7, a liquid passage 115 for supplying a solvent is provided.
In the lower side of the nozzle main body 110, the roller cleaning blow-off holes 123 are, as shown in FIG.
16 and 117, respectively. It is preferable that the roller cleaning outlets 122 and 123 are arranged closer to the short side L1 of the substrate G than the upper and lower outlets 112, 113 and 114 for dissolving the resist. This can prevent the solvent that has washed the roller 121 from affecting the substrate G.

Next, the processing steps in the peripheral resist removing unit (ER) 23 will be described. The substrate G on which the resist is applied by the resist coating unit (CT) 22 as described above is carried into the peripheral resist removing unit (ER) 23. At the time of loading, as shown in FIG. 3, the nozzles 65, 66, 67, 6
8 is in a state of being retracted to a position away from the periphery of the substrate S. As shown in FIG. 4, the peripheral resist removal unit (ER) is controlled by the arm 18a of the main transfer device 18.
The substrate G carried into the storage 23 is first received on the mounting table 41 in the above-described procedure. After receiving this, empty arm 1
8a exits the peripheral resist removal unit 23,
The mounting table 41 is lowered, and the peripheral resist removing unit 23 is removed.
The substrate G is carried in.

Next, the operation of the motors 90 and 100 causes the nozzles 65, 66, 67 and 68 to move the four sides L of the substrate G.
Movement is started along each of 1, L2, L3, and L4. At this time, in the present embodiment, as shown in FIGS.
Since four rollers 121 are rotatably provided at each of the upper and lower corners at the entrance of the concave portion 111 of the nozzle body 110, even if the peripheral edge of the substrate G is warped, When the periphery of the substrate G approaches the entrance of the recess 111, the rollers 121 guide the periphery of the substrate G to the recess 111, so that the periphery of the substrate G can be easily inserted into the recess 111. For example, 550
In the case of a × 650 mm substrate, warpage having a width of about 5 mm may occur, but the width of the recess 111 is 3.5 to 4.5 mm.
If the roller 121 is not provided, the peripheral portion of the substrate G may not be inserted into the concave portion 111 if the roller 121 is not provided. However, by providing the roller 121, the concave portion is formed by the roller 121 even if the peripheral portion of the substrate G is removed from the frontage. Guided to 111.

The peripheral edge of the substrate G has the nozzles 65, 66, 6
When it is inserted in a non-contact state into the concave portions 111 of the seventh and 68, the solvent is blown out from the upper and lower blowout holes 112, 113 and 114 and the roller cleaning blowout holes 122 and 123, and is sucked and exhausted from the suction hole 118. Thus, unnecessary resist adhering to the periphery of the substrate G can be dissolved and removed using the solvent.

After the unnecessary resist adhering to the substrate G is removed in this way, the mounting table 41 is raised, and the arm 18a of the main carrier 18 receives the substrate G, so that the peripheral resist removing unit 23 Unloads the substrate G. At the time of carrying out, all of the nozzles 65, 66, 67, and 68 are retracted to positions away from the periphery of the substrate G as shown in FIG.

As described above, the peripheral resist removing unit 2
3, the resist film on the substrate G is exposed by the exposure device (not shown), and then the developing units (DEV) 24a, 24b, 24
c) is developed.

Next, another embodiment of the present invention will be described. Here, the present embodiment is different from the previous embodiment only in that the nozzles 65, 66, 67, 68 are provided with a removing member for scraping the resist adhered to the peripheral edge of the substrate G. That is, as shown in FIG. 10 which is a cross-sectional view showing the upper surface of the concave portion 91, a removing member 130 made of a leaf spring abutting on the end surface of the substrate G is fixed to the nozzle main body 90, thereby supplying the solvent. Still, the resist adhering to the peripheral portion of the substrate G can be scraped off. The removing member 130 has an arc shape protruding toward the substrate G and exerts an urging force on the end surface of the substrate G, so that the removing member 130 always presses the end of the substrate G. And therefore the removal member 1
The resist 30 can reliably remove the resist adhering to the peripheral edge of the substrate G. In addition, due to the spring effect, unnecessary force does not act on the substrate, and the removing member 130,
The end of the substrate G can be uniformly contacted without shifting the position of the substrate G which is positioned and held.

The removing member 130 made of a leaf spring may be a simple plate material, but preferably has a large number of holes formed on its surface. For example, one having a large number of circular holes 131 as shown in FIG. 11A, one having a large number of elongated holes 131 ′ as shown in FIG. The removing member 130 'having a mesh structure as shown in FIG. With such a structure, the resist can be efficiently removed at the hole forming portion, and the solvent and the resist are sucked through the hole to prevent the resist from being deposited on a leaf spring or the like. it can.

Further, as shown in FIG. 12, a removing member 132 using an aggregate of metal wires can be provided.
In this case, the aggregate of the metal wires becomes a gold scourer,
The resist liquid adhering to the peripheral portion of the substrate G can be efficiently scraped off by the convex portion of the wire.

Further, as shown in FIG. 13, a removing member 133 made of a leaf spring is fixed by a supporting member 134 so that its longitudinal direction is perpendicular to the end surface of the substrate G.
The resist adhering to the peripheral portion of the substrate G at the end of the removing member 133 may be removed. In this case,
When the substrate G moves along the arrow direction, the removing member 13
3 is deformed by the spring effect as shown in the figure.
3 can uniformly contact the end of the substrate G without shifting the position of the substrate G which is positioned and held.

The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the scope of the present invention. For example, as shown in FIG. 14, a resist coating unit (CT) 22 'and a peripheral resist removing unit (ER) 23' are arranged adjacent to each other in the same unit 200, and the resist coating unit 22 'and the peripheral resist removing unit are removed. The substrate G may be transferred to and from the unit 23 '. The resist coating unit 22 ′ shown here supplies the resist by moving the resist nozzle 144 to the upper part of the center of the substrate G sucked and held by the spin chuck 143 in the cup 142, and supplies the resist. A resist is applied to the entire surface of the substrate G by force. The substrate G on which the coating has been completed is held by the arm 141, and the arm 141 is
5, the substrate G is transported to the peripheral edge resist removing unit 23 '. Then, the resist on the peripheral portion of the substrate G is removed by the peripheral resist removing unit 23 ′ in the same manner as the peripheral resist removing unit 23.

As described above, the resist coating unit 22 'and the peripheral resist removing unit 23' are arranged adjacent to each other in the same unit 200, and the substrate G is transported between them by the transport arm 141 therein. Thereby, the transfer operation of the main transfer mechanism 18 can be simplified, and the throughput can be improved.

Although an example using rollers as the guide means has been described, the present invention is not limited to this, and other rotating bodies such as balls can be suitably used, and are limited to rotating bodies. Not even a thing. Further, the removing member may be any member as long as it can contact the end surface of the substrate and scrape off a processing agent such as a resist, and its structure and arrangement are not limited. Furthermore, in the above embodiment, the case where the resist attached to the peripheral portion of the substrate is removed has been described.
The present invention can be applied not only to the resist but also to the case where other processing agents are removed.

[0063]

As described above, according to the present invention,
Since the guide means for guiding the peripheral portion of the substrate to the entrance of the concave portion of the nozzle is provided, even if the peripheral portion of the substrate may be warped, the substrate is provided in the concave portion of the nozzle means for supplying the solvent to the peripheral portion of the substrate. Can be easily inserted.

Further, since a removing member is provided in the concave portion of the nozzle in contact with the end face of the substrate to scrape the processing agent adhered to the end face of the substrate and the vicinity thereof. The used treating agent can be sufficiently removed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a resist coating and processing method to which the processing apparatus of the present invention is applied.
FIG. 2 is a plan view of the development processing system.

FIG. 2 is a front view showing a peripheral resist removing unit according to an embodiment of the processing apparatus of the present invention.

FIG. 3 is a plan view of a peripheral resist removing unit of FIG. 2;

FIG. 4 is a perspective view illustrating loading / unloading of a substrate in a peripheral edge resist removing unit.

FIG. 5 is a perspective view of a nozzle moving mechanism in the peripheral edge resist removing unit.

FIG. 6 is a longitudinal sectional view of a nozzle in a peripheral edge resist removing unit.

FIG. 7 is a cross-sectional view of the nozzle showing an upper surface of a concave portion formed in the nozzle in the peripheral edge resist removing unit.

FIG. 8 is a cross-sectional view of the nozzle showing a lower surface of a concave portion formed in the nozzle in the peripheral edge resist removing unit.

FIG. 9 is a vertical cross-sectional view of a nozzle in the peripheral edge resist removing unit as viewed from the substrate side.

FIG. 10 is a cross-sectional view of a nozzle showing an upper surface of a concave portion formed in the nozzle in a peripheral resist removing unit according to another embodiment of the processing apparatus of the present invention.

FIG. 11 is a schematic diagram showing a removing member used in the nozzle of FIG. 10;

FIG. 12 is a cross-sectional view of a nozzle showing an upper surface of a concave portion formed in the nozzle in a peripheral resist removing unit using another removing member.

FIG. 13 is a cross-sectional view of a nozzle showing an upper surface of a concave portion formed in the nozzle in a peripheral edge resist removing unit using still another removing member.

FIG. 14 is a plan view showing a unit in which a resist coating unit and a peripheral resist removing unit are integrated.

[Explanation of symbols]

 23 Peripheral resist removal unit 41 Mounting table 65, 66, 67, 68 Nozzle 90, 100 Motor (moving mechanism) 110 Nozzle main body 111 Depression 121 Roller (guide means) 122, 123 Roller cleaning blowout holes 130, 130 ', 132, 133 Removal Material

Continuation of the front page (56) References JP-A-7-263394 (JP, A) JP-A-9-223664 (JP, A) JP-A-6-69126 (JP, A) JP-A-4-65115 (JP) JP-A-6-45302 (JP, A) JP-A-2-1577763 (JP, A) JP-A-5-114555 (JP, A) JP-A-8-102434 (JP, A) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/027 B05C 11/20 G03F 7/42

Claims (13)

(57) [Claims] 1. A processing apparatus for removing a processing agent adhered to a peripheral portion of a substrate to which a processing agent has been applied, comprising a concave portion into which the peripheral portion of the substrate is inserted, wherein the peripheral portion of the substrate inserted into the concave portion. A nozzle for supplying a solvent to the substrate, a moving mechanism for moving the nozzle along the peripheral edge of the substrate, and a guide means for guiding the peripheral edge of the substrate to the entrance of the concave portion of the nozzle, and the liquid is supplied to the peripheral edge of the substrate. A processing agent for removing a processing agent at a peripheral portion of the substrate by the solvent. 2. The processing apparatus according to claim 1, wherein said guide means has a rotating body disposed at an entrance of the recess. 3. The processing apparatus according to claim 2, further comprising a cleaning unit provided near the rotating body and supplying a solvent to the rotating body for cleaning. 4. The processing apparatus according to claim 2, wherein the rotating body is a roller. 5. disposed in a recess of the nozzle, in contact with the end face of the substrate, claims 1 and further comprising a removal member scrape processing agent adhered substrate end face and in the vicinity thereof The processing device according to claim 4 . 6. The processing apparatus according to claim 5, wherein the removing member has a leaf spring that exerts an urging force when the end face of the substrate comes into contact. 7. The processing apparatus according to claim 6, wherein the leaf spring has a large number of holes formed on a surface thereof. 8. The processing apparatus according to claim 5, wherein the removing member is an aggregate of a metal wire. Wherein said nozzle includes a processing unit according to any one of claims 1 to claim 8, characterized in that it has a solvent injection holes for injecting the solvent on the upper and lower surfaces of the substrate. 10. Further, the processing apparatus according to any one of claims 1 to claim 9, characterized in that it comprises a suction means for sucking the treatment agent of the vicinity of the periphery of the substrate dissolved by a solvent. Wherein said rotating body, claims 2, wherein the protruding part the inlet of the recess of the nozzle
The processing apparatus according to claim 4 . 12. The nozzle according to claim 1, wherein the solvent is supplied to the upper and lower surfaces of the substrate.
Has a solvent injection hole for injecting said rotating body claims, characterized in that arranged on both sides of the solvent injection holes
12. The processing apparatus according to any one of 2, 3 , 4, and 11 . 13. The method of claim 1, further comprising the step of:
A suction means for sucking the processing agent near the peripheral portion;
The whirl has a solvent injection hole for injecting the solvent into the upper and lower surfaces of the substrate.
And the rotating body, according to claim, characterized in that disposed between the suction means and the solvent injection holes 2,3,4,1
The processing device according to any one of the preceding claims.