JP3296737B2 - Method for removing solder paste adhering to squeegee of screen printing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing a solder paste attached to a squeegee of a screen printing machine and drooping from a tip of the squeegee.

[0002]

2. Description of the Related Art Conventionally, a printing screen having an opening for forming a printing pattern is mounted on a circuit board, a solder paste is supplied onto the printing screen, and the squeegee applies the solder paste to the opening. 2. Description of the Related Art There is known a screen printer in which a printed pattern is formed on a circuit board by sweeping upward.

[0003]

In the above-described screen printing machine, the squeegee rises in the vertical direction every time printing is completed, moves horizontally in the direction opposite to the printing direction, and returns to the original position. However, if the squeegee rises, the solder paste attached to the squeegee will hang down from the tip of the squeegee if the printing is repeated. The paste may fall within the printing area of the printing screen, causing uneven printing at the next printing. Therefore, it is sometimes necessary to remove the solder paste attached to the squeegee, but since this is performed manually, there is a problem that it takes time and effort.

Further, when the squeegee is moved to the maintenance position for maintenance such as removal of the solder paste attached to the squeegee and replacement of the squeegee, if only the squeegee is moved, the solder paste falls and the printing on the printing screen is performed. The print screen must be moved with the squeegee to adhere to areas and other parts,
When performing maintenance of the squeegee, there is a problem that the printing screen becomes an obstacle and the maintenance cannot be performed with good workability.

In addition, there is another problem that the printing operation is interrupted for a long time due to the operation of removing the solder paste attached to the squeegee, and the production efficiency is reduced.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to remove a solder paste attached to a squeegee of a screen printing machine and hanging from a tip of the squeegee. An object of the present invention is to automate, improve workability of squeegee maintenance, and reduce a decrease in production efficiency due to a work of removing solder paste attached to a squeegee.

[0007]

In order to achieve the above-mentioned object, the present invention provides a method of forming a solder paste pattern on a circuit board.
A method of removing solder paste attached to a squeegee of a screen printing machine for forming a squeegee and hanging from a tip of the squeegee, wherein the squeegee is lowered while the squeegee is separated upward from a printing screen. the Rukoto move the flat row with respect to the upper surface of the printing screen
Is characterized in that in conjunction with depositing the pendent solder paste on the upper surface of the front SL printing screen was as sawing from the squeegee. In this case, the squeegee
Parallel to the upper surface of the printing screen while lowering
Instead of moving the squeegee down
The printing screen may be moved.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a main part of the screen printing machine, FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 4 is an explanatory view of a method of removing a solder paste attached to a squeegee.

In these figures, reference numeral 1 denotes a printing means for performing screen printing on a circuit board P via a printing screen S, and a Y-axis direction (arrow in FIG. 2) extending horizontally to a housing H of the screen printing machine. C direction) and a frame 2 movably mounted in the
Is moved by driving means (not shown) such as a motor.

A squeegee head support member 3 is mounted inside the frame 2 by a guide member (not shown) so as to be vertically movable. A rotating shaft 4 extending in the vertical direction and formed of a ball screw is attached to the inside of the frame 2 so as to be rotatable around a center line. The rotating shaft 4 is fixed to one end of the squeegee head support member 3. Screwed to nut 5. The upper end of the rotating shaft 4 is connected to a rotating shaft of a pulse motor 6 fixed to the frame 2 via a timing belt 7. When the pulse motor 6 is driven, the squeegee head support member 3 moves in the vertical direction.

A pair of squeegee heads 9, 9 which are opposed to each other in the Y-axis direction and have a squeegee 8 attached to the lower end thereof, are supported by the squeegee head support member 3 so as to be slidable in the vertical direction. The squeegee head 9 is connected to a rod 10 a of an air cylinder 10 fixed to the upper surface of the squeegee head support member 3, and moves up and down with respect to the squeegee head support member 3 when the air cylinder 10 is driven. The air cylinder 10 and the pulse motor 6 are connected to a control device (not shown) for controlling the operation of the screen printing machine.

The printing screen S is horizontally supported by a screen support frame 11 provided below the printing means 1. The screen support frame 11 is attached to the housing H so as to be movable in the Y-axis direction, and is moved by driving means (not shown) such as a motor. The circuit board P is placed on a substrate support table 12 provided at a printing position by a transport conveyor (not shown), and is unloaded from the substrate support table after printing is completed. The substrate support table 12 is moved in the X-axis direction (the direction of arrow B in FIG. 1) and rotated in a horizontal plane by driving means (not shown) such as a motor. The circuit board P (not shown) drives the board support table 12 and the screen support frame 11 based on the image information of the circuit board P and the print screen S taken by the circuit board P.
And the print screen S are aligned.

Next, the operation of the screen printing machine will be described. In the printing process, first, the circuit board P transported onto the substrate support table 12 by the transport conveyor
After the alignment of the print screen S with the print screen S, the solder paste is supplied onto the print screen S by a solder paste supply unit (not shown). Then, as shown by the broken line in FIG. 2, the right squeegee head 9 descends to a position where the tip of the squeegee 8 contacts the upper surface of the printing screen S, and the entire printing means 1 moves to the left in FIG. The pattern is printed on the circuit board P. When the printing is completed, the circuit board P is transferred to the board supporting table 12 by the conveyor.
And a new circuit board P is placed on the board support table 12. Then, the right squeegee head 9 at the broken line position rises to the solid line position, and the left squeegee head 9 descends to the position where the tip of the squeegee 8 comes into contact with the upper surface of the printing screen S. To print on the circuit board P.

When the number of times of printing is increased, as described above, when the squeegee head 9 is lifted after printing, the solder paste attached to the squeegee 8 hangs from the tip of the squeegee 8 (see FIG. 3A). ). This screen printing machine performs an operation of removing the solder paste attached to the squeegee 8 every predetermined number of times of printing. Next, the operation will be described.

After the printing operation is completed, the air cylinder 10 of the printing means 1 is driven from the state in which the squeegee 8 is separated above the printing screen S, and the squeegee head 9 is moved to the position shown in FIG.
It descends to the position of (a). Next, the pulse motor 6 is driven to lower the squeegee head 9 little by little.
The entire moving means 1 moves in a direction opposite to the printing direction (rightward in FIG. 3). As shown in FIG. 3B, the solder paste SP
When the lower end of the solder paste SP contacts the upper surface of the print screen S, the solder paste SP remains on the print screen S even if the squeegee 8 moves due to the frictional force between the solder paste SP and the print screen S. The printing screen S is pulled in the moving direction of the squeegee 8 and extends in the moving direction of the squeegee 8 as shown in FIG.
It sticks on the top.

As the squeegee 8 moves, the solder paste SP attached to the squeegee 8 flows toward the printing screen S due to its fluidity, and almost all of the solder paste SP adheres to the printing screen S. When the squeegee 8 moves further, the solder paste SP attached to the print screen S is pulled off from the tip of the squeegee 8. This operation is performed in a portion of the print screen S other than the printing range (a portion where no opening is provided). When the above operation is completed, the printing operation is restarted.

As described above, it is not necessary to move the squeegee 8 to the maintenance position when removing the solder paste adhered to the squeegee 8, and the solder paste can be removed in a very short time. The interruption time is short. Therefore, it is possible to reduce a decrease in production efficiency due to the solder paste removing operation.

In the above embodiment, only the case where the solder paste hanging down from one squeegee 8 is removed has been described. However, the solder paste hanging down from the other squeegee 8 can also be removed by the same operation as described above. . In the above embodiment, the squeegee 8 is moved in the direction parallel to the print screen S while being lowered. Instead, the squeegee 8 performs only the lowering operation, and the print screen S is moved horizontally. It may move in the direction.

[0019]

As described above, according to the present invention,
The solder paste attached to the squeegee and dripping from the tip of the squeegee can be automatically removed. Also, since the solder paste adhered to the squeegee is adhered to the print screen and removed, during maintenance of the squeegee, the squeegee can be moved to the maintenance position after removing the solder paste adhered to the squeegee. Since the solder paste does not drop during the movement of the squeegee, only the squeegee can be moved to the maintenance position while the print screen is kept at the printing position. Therefore, since the printing screen does not interfere with the maintenance of the squeegee, the workability of the maintenance is improved. Further, when removing the solder paste attached to the squeegee, it is not necessary to move the squeegee to the maintenance position, and the work of removing the solder paste can be performed in a very short time, so that the interruption time of the printing work is short. Therefore, it is possible to reduce a decrease in production efficiency due to the solder paste removing operation.

[Brief description of the drawings]

FIG. 1 is a front view of a main part of a screen printing machine to which the present invention is applied.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is an explanatory view showing a method of removing a solder paste attached to a squeegee.

[Explanation of symbols]

 8 Squeegee S Printing screen SP Solder paste

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B41F 15/00-15/44 B41F 35/00 B41M 3/12

Claims (2)

(57) [Claims] 1. A pattern of a solder paste on a circuit board.
A method of removing solder paste attached to a squeegee of a screen printing machine to be formed and hanging from a tip of the squeegee, wherein the squeegee is moved downward from a state in which the squeegee is separated upward from the print screen. the drooping by Rukoto move the flat row with respect to the upper surface of the
Deposition of the solder paste on the upper surface of the front Stories printing screen
And removing the solder paste from the squeegee of the screen printing machine. 2. A solder paste pattern is formed on a circuit board.
Adheres to the squeegee of the formed screen printing machine, a method of removing suspended solder paste from the tip of the squeegee, the printing the squeegee while lowering the squeegee from the separated state upwardly relative to the printing screen scree
Move the solder paste to remove the dripping solder paste.
The scan <br/> method of removing the solder paste adhering to the squeegee in screen printing machine, characterized in that as sawing from Chigi with adhering to the upper surface of the front SL printing screen.