JP3289162B2 - Method punching cast of casting parts - Google Patents

Method punching cast of casting parts

Info

Publication number
JP3289162B2
JP3289162B2 JP28317493A JP28317493A JP3289162B2 JP 3289162 B2 JP3289162 B2 JP 3289162B2 JP 28317493 A JP28317493 A JP 28317493A JP 28317493 A JP28317493 A JP 28317493A JP 3289162 B2 JP3289162 B2 JP 3289162B2
Authority
JP
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP28317493A
Other languages
Japanese (ja)
Other versions
JPH07132359A (en )
Inventor
恒 河野
Original Assignee
本田技研工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は中空部を有する鋳物部品にドリルにて前記中空部に連通する連通孔を切削して形成する場合における鋳物部品の鋳抜き方法に関する。 The present invention relates to a method punching cast a cast in a case of forming by cutting the communication hole communicating with the hollow portion at the drill in castings having a hollow portion.

【0002】 [0002]

【従来の技術】奥行きの狭い中空部を有する鋳物部品に当該中空部に連通する連通孔をドリルにて切削する加工を行う場合において、前記中空部の奥行きが狭いことから、ドリル先端部に発生する特に傘状の切り屑が前記中空部に嵌まり込んで洗浄等によっても除去されずに残ることがある。 In the case where the Related Art communication hole communicating to the hollow portion in castings having a narrow hollow portion of depth for machining of cutting in the drill, arise from the depth of the hollow portion is narrow, the drill point especially umbrella chips to is sometimes also remain without being removed by washing or the like is fitted into the hollow portion.

【0003】これを図2および図3に基づいて説明する。 [0003] This will be described with reference to FIGS. 図2は射出成形によって鋳造されたアルミ製のシリンダーブロックの縦断面図である。 Figure 2 is a longitudinal sectional view of a cast aluminum cylinder block by injection molding. 下端部のクランクケース部分の図示は省略してある。 Illustration of the crankcase portion of the lower portion is omitted. このシリンダーブロック10は、最内周部分に鋳鉄製のシリンダースリーブ1 The cylinder block 10, cast iron cylinder sleeve on the innermost circumferential portion 1
2が位置し、次いで内壁13,冷却水の循環する中空部分としてのウオータージャケット14,外壁15が位置している。 2 is located, then the inner wall 13, water jacket 14 of the hollow portion of the coolant circulation, the outer wall 15 is positioned. このようなシリンダーブロック10が一体として鋳造された後に、前記冷却水の出入口としてのウオータジャケット14に連通する連通孔8がドリル7によって穿孔される。 After such cylinder block 10 is cast integrally, a communication hole 8 which communicates with the water jacket 14 as inlet and outlet of the cooling water is perforated by a drill 7.

【0004】この連通孔8の穿孔にあたり、穿孔の最終端においては図2,図3に示すような傘状の切り屑9が発生することがある。 [0004] Upon perforation of the communication hole 8, in the final end of the perforation may be 2, the umbrella-shaped chip 9 as shown in FIG. 3 is generated. この発生した傘状の切り屑9は、 Umbrella chips 9 this that generated the
前記中空部としてのウオータージャケット14の奥行きが狭いために、この部分に嵌まり込んで、穿孔の後に行われる洗浄作業によっても排出されずにそのまま残ることがある。 For the depth of water jacket 14 is narrow as the hollow portion, fits into this part, it may also remain intact without being discharged by the cleaning operation performed after the perforation. このような、洗浄作業によっても排出されない切り屑を取り除くために余分な作業行程を必要としていた。 Such, it has required extra working stroke to be rid of chips that are not discharged by the cleaning operation.

【0005】 [0005]

【発明が解決しようとする課題】本発明は前記のような問題点に鑑みて創案されたものであり、中空部を有する鋳物部品に当該中空部に連通する連通孔をドリルにて切削する際に、前記中空部に滞留するような大きさの切り屑の発生を抑え、洗浄によっても排出されない切り屑をその都度排出するという余分な作業行程を必要としない鋳物部品の鋳抜き方法の提供を目的としている。 SUMMARY OF THE INVENTION It is an object of the present invention has been made in view of the above problems, when cutting a through hole connecting to the hollow portion in castings having a hollow portion at the drill to suppress the generation of the chip size, as accumulated in the hollow portion, to provide a method punching cast a cast that does not require extra working stroke that also discharged each time the chip is not discharged by washing it is an object.

【0006】 [0006]

【課題を解決するための手段】本発明は前記の目的を達成するために、中空部を有する鋳物部品の前記中空部に連通する連通孔をドリルにて切削して形成する場合における鋳物部品の鋳抜き方法であって、形成しようとする前記連通孔の位置に予め鋳造段階にて前記連通孔となる鋳孔を、当該鋳孔の先端部の一部に突出して形成された突出部が前記中空部の先端部隔壁を遮るように臨ませて形成し、ドリルにて前記隔壁を切削することにより前記連通孔を形成するようにするものである。 The present invention SUMMARY OF THE INVENTION To achieve the above object, a communication hole communicating with the hollow portion of the casting part having a hollow part of the castings in the case of forming by cutting at the drill a cast punching method, a Iana made in advance the communication hole at the casting stage to the position of the communication hole to be formed, the protruding portion formed to protrude a portion of the distal end portion of the Iana said to face to block the tip partition wall of the hollow portion is formed by, and is to form the communication hole by cutting the partitions in a drill.

【0007】 [0007]

【作 用】シリンダーブロックに、鋳造の段階にて、予め、連通孔となる鋳孔を、その鋳孔の一部に形成される突出部がシリンダーブロックの中空部先端の隔壁を略直交して遮るように臨ませて形成しておく。 To the work for Cylinder block at the casting stage, previously, the Iana as a communication hole, the projecting portion formed on a part of its Iana is substantially perpendicular to the hollow tip of the partition wall of the cylinder block previously formed so as to face to intercept. 次いで、ドリルにて前記隔壁を切削するが、この切削における隔壁とドリルとの接触は、前記鋳孔の突出部を除いた部分に限られることから、洗浄によっても排出されない大きさの例えば傘状の切り屑等の発生が抑えられる。 Then, while cutting the partitions in the drill, the contact between the partition wall and the drill in the cutting, from said limited to the portion excluding the projection portion of Iana, size of e.g. umbrella not discharged by washing generation of chips of is suppressed.

【0008】 [0008]

【実施例】本発明の一実施例を図面に基づいて説明する。 It will be described based on an embodiment of the embodiment of the present invention with reference to the drawings. 図1(A)は、鋳造されたアルミ製シリンダーブロックの、形成される連通孔部分の要部縦断面図であり、 1 (A) is of cast aluminum cylinder block is an essential part longitudinal cross sectional view of the communication hole portions formed,
図1(B)は加工によって連通孔が形成されたシリンダーブロックの要部縦断面図である。 1 (B) is an essential part longitudinal cross sectional view of a cylinder block in which the communication holes are formed by machining.

【0009】図1(A)において、このシリンダーブロック1は前記従来の技術において説明したように、射出成形によって最内周部分より鋳鉄製のシンリダースリーブ2,内壁3,中空部としてのウオータージャケット4,外壁5が形成される。 [0009] In FIG. 1 (A), the cylinder block 1 as described in the prior art, cast iron thin Rida sleeve 2 from the innermost peripheral portion by injection molding, the inner wall 3, water jacket serving as a hollow portion 4, the outer wall 5 is formed. 本発明においては、この鋳込み行程において連通孔となる鋳孔6が、形成される連通孔の径(ドリル径)よりやや小径に外壁5部分に形成される。 In the present invention, Iana 6 as a communication hole in the casting process is formed on the outer wall 5 portion slightly smaller diameter than the diameter of the communication holes are formed (drill diameter). この鋳孔6は、その先端部の一部に突出部6aが形成されており、この突出部6aを、前記中空部としてのウオータージャケット4の先端部隔壁4aに略直交してこの先端部隔壁4aを遮るように臨ませてある。 The Iana 6 is protruded portion 6a is formed in a part of the tip portion, the projecting portion 6a, the tip partition wall substantially orthogonal to the distal end partition wall 4a of the water jacket 4 as the hollow portion They are to face to block the 4a.

【0010】このように形成されたシリンダーブロック1の鋳孔6に対してドリル7を当該鋳孔6の内壁を広げるように切削して侵入させ、さらにこのドリル7が前記隔壁4aを切削することによって前記中空部としてのウオータージャケット4に連通する連通孔8が加工される。 [0010] in this way the drill 7 against Iana 6 of the formed cylinder block 1 infested by cutting to widen the inner wall of the Iana 6, further the drill 7 is cut the partitions 4a communication hole 8 communicating with the water jacket 4 as the hollow portion is machined by. この場合、ドリル7と切削される隔壁4aとの接触は前記鋳孔6の突出部6aを除いた部分に限られることから、加工後の洗浄等によっても排出されないような大きさの例えば前記傘状の切り屑9(図3参照)等は発生しないようになる。 In this case, the contact between the partition 4a being cut and drill 7 is the Iana from being limited to the portion excluding the projection portion 6a of 6, the size of for example the umbrella as not discharged by washing or the like after the processing Jo swarf 9 (see FIG. 3) or the like will not occur.

【0011】 [0011]

【発明の効果】以上説明のように本発明によれば中空部を有する鋳物部品に当該中空部に連通する連通孔をドリルにて形成する加工を行うにあたり、加工後の洗浄によっても排出されないような大きさの切り屑の発生を防ぐことができ、これによって、残された切り屑をその都度取り除くという余分な作業行程を必要としない鋳物部品の鋳抜き方法を実現できる。 According to the present invention as described in the foregoing communicating holes communicating with the hollow portion castings having a hollow portion in performing processing for forming at drill, so as not to be discharged by washing after processing sized generation of chips can be prevented, and thereby, the remaining chips can realize how punching cast a cast that does not require extra working stroke of removing each time.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】(A)図は鋳造されたアルミ製シリンダーブロックの、形成しようとする連通孔部分の要部縦断面図であり、(B)図は加工によって連通孔が形成されたシリンダーブロックの要部縦断面図である。 [1] of the (A) drawing cast aluminum cylinder block is an essential part longitudinal cross sectional view of the communication hole portion to be formed, (B) the figure of the cylinder block where the communication hole is formed by machining is an essential part longitudinal cross sectional view.

【図2】鋳造されたアルミ製のシリンダーブロックの縦断面図である。 2 is a longitudinal sectional view of a cast aluminum cylinder block.

【図3】ドリルの切削によって発生する傘状の切り屑の外観図である。 3 is an external view of an umbrella-like chips generated by the cutting of the drill.

【符号の説明】 DESCRIPTION OF SYMBOLS

1・・シリンダーブロック 4・・ウオータージャケット(中空部) 4a・隔壁 6・・鋳孔 6a・突出部 7・・ドリル 8・・連通孔 9・・傘状の切り屑 1 ... cylinder block 4 swarf ... water jacket (hollow portion) 4a · bulkhead 6 ... Iana 6a · protrusions 7 .. drill 8 · communication holes 9 · umbrella

Claims (1)

    (57)【特許請求の範囲】 (57) [the claims]
  1. 【請求項1】 中空部を有する鋳物部品の前記中空部に連通する連通孔をドリルにて切削して形成する場合における鋳物部品の鋳抜き方法であって、形成しようとする前記連通孔の位置に予め鋳造段階にて前記連通孔となる鋳孔を、当該鋳孔の先端部の一部に突出して形成された突出部が前記中空部の先端部隔壁を遮るように臨ませて形成し、ドリルにて前記隔壁を切削することにより前記連通孔を形成するようにしたことを特徴とする鋳物部品の鋳抜き方法。 Position of the communication hole which a cast punching method a cast, to be formed in the case of forming by cutting a 1. A communication hole communicating with the hollow portion of the casting part having a hollow portion at the drill wherein the communicating hole become Iana, formed protruded portion formed to protrude a portion of the distal end portion of the Iana is to face to block the distal end bulkhead of the hollow portion in advance casting stage, the communication hole method punching cast a cast, characterized in that so as to form a by cutting the partitions in a drill.
JP28317493A 1993-11-12 1993-11-12 Method punching cast of casting parts Expired - Fee Related JP3289162B2 (en)

Priority Applications (1)

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US7732899B1 (en) 2005-12-02 2010-06-08 Amkor Technology, Inc. Etch singulated semiconductor package
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7928542B2 (en) 2001-03-27 2011-04-19 Amkor Technology, Inc. Lead frame for semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US7968998B1 (en) * 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US8318287B1 (en) 1998-06-24 2012-11-27 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8729710B1 (en) 2008-01-16 2014-05-20 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation

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US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8102037B2 (en) 2001-03-27 2012-01-24 Amkor Technology, Inc. Leadframe for semiconductor package
US7928542B2 (en) 2001-03-27 2011-04-19 Amkor Technology, Inc. Lead frame for semiconductor package
US7732899B1 (en) 2005-12-02 2010-06-08 Amkor Technology, Inc. Etch singulated semiconductor package
US7968998B1 (en) * 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US8441110B1 (en) 2006-06-21 2013-05-14 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US8304866B1 (en) 2007-07-10 2012-11-06 Amkor Technology, Inc. Fusion quad flat semiconductor package
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US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
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US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
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US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
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US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
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US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8729682B1 (en) 2009-03-04 2014-05-20 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
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US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
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US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

Also Published As

Publication number Publication date Type
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