JP3176134B2 - Semiconductor chip for inkjet recording head, inkjet recording head, and inkjet recording apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head provided with a recording element applicable to an ink jet recording apparatus used in a copying machine, a facsimile, a word processor, a printer as a terminal for output of a host computer, a video printer, and the like. The present invention relates to a semiconductor chip, an inkjet recording head, and an inkjet recording device.

[0002]

2. Description of the Related Art Conventionally, the construction of a recording head is shown in FIG.
As shown in FIG. 5B and the equivalent circuit of FIG. 5, the electrothermal transducer 2 and the functional element (diode) 11 are formed on the same substrate to reduce the size of the substrate 1 and reduce the number of electrical contacts with the outside. In addition, there is one shown in FIG. 2 (c) and an equivalent circuit in FIG. 4 in which the electric contact 12 is directly taken out of each heater. As shown in FIG. 2 (d), the ink is supplied to the surface of the substrate 1 by a top plate 14 having a wall forming a flow path as shown in FIG. Further, FIG. 3 in which an ink supply hole 16 is provided as a different configuration of the substrate 1.
There are forms such as (a), (b), and (c). In this case, the ink is supplied from the back surface of the substrate through the ink supply hole 16 and the ink is ejected in a direction perpendicular to the surface of the substrate 1.

FIG. 2 shows the structure of the recording head substrate described above.
As shown in the equivalent circuit of FIG. 5, electric energy (drive signal) is applied to the electrothermal conversion element disposed in the electrothermal conversion element section 2 from the electric contact disposed in the electric contact section 12 by the matrix wiring section 10. It is selectively supplied via the matrix wiring and the diode of the diode array arrangement unit 11. The ink 15 is supplied to the upper surface of the electrothermal conversion element, and is heated and foamed by the electrothermal conversion element, and the ink is ejected by the foaming pressure. 2 (c) and 3 (a),
(B) and (c) show the electrical contacts 12 as shown in FIG.
More electric energy is supplied to the electrothermal conversion element section 2 by the wiring section 13.
Is supplied via

Referring to FIG. 1, a substrate 1 made of a material such as glass other than metal such as silicon is used.
A large number of elements are arranged in an array in the electrothermal conversion element section, and each element is individually connected to a wiring of a wiring section 13 so that each element can be selectively heated. Provides more electrical energy.

[0005]

However, each of the conventional configurations has the following problems to be solved.

I) <FIG. 2 (c) and FIG. 3 (a),
In the case of the configurations shown in (b) and (c)> The number of nozzles (the number of electrothermal conversion elements) n
Is required, and the area for arranging them and the area of the wiring portion 13 connecting the electrothermal conversion element and the electric contact are required to be large, so that the size of the substrate 1 is inevitably increased, and It was not suitable for miniaturization and the manufacturing cost was high. In addition, the number of wires connecting the electrical contact to the drive system of the recording apparatus main body is large, and the cost is high.

Ii) (in the case of the configuration shown in FIGS. 2A and 2B) The number of electrical contacts is

[0008]

[Outside 1] If n is not an integer, then n = m × 1 where m + 1 is the smallest integer) and is smaller than i) since it is the smallest. However, since the circuit shown in FIG. 5 is driven, the driving element on the common electrode (common) side is required. Since a large number of nozzles may simultaneously flow current, a large capacity is required.

Further, as will be described later, the pressure wave at the time of foaming is transmitted as a back wave to the upstream of the nozzle (toward the common flow chamber), and adjacent nozzles are simultaneously driven due to fluid crosstalk of ink between the nozzles. Impairs ejection stability. For this reason, it is necessary to simultaneously drive each nozzle at a distance as far as possible in order to achieve stable ejection, that is, to achieve high image quality. However, in the case of the circuit shown in FIG. ) At the same time, the segment (SE
G) A large amount of current flows in the horizontal wiring and a potential difference is generated between the horizontal wirings, so that appropriate electric energy cannot be supplied to each electrothermal conversion element. For this reason, there is a limitation that a plurality of driving cannot be performed over each COM.

Iii) In the case of the configuration shown in FIGS. 3 (a), 3 (b) and 3 (c) For a high-speed response of the ink flow, the sectional area of the ink supply path must be large. Therefore, there is a method of providing an ink supply hole 16 in the substrate 1 and shortening the distance from the ink supply hole to the electrothermal conversion element. However, the area of the perforated portion is wasted, thereby increasing the cost.

[0011]

According to the present invention, a logic circuit unit such as an electrothermal conversion element, a shift resist unit for converting a serial image signal into a parallel signal, a latch unit for temporarily holding a parallel signal, and a common wiring are provided on the same substrate. In the case where the semiconductor chip (substrate) is formed above, unnecessary elements are eliminated by defining each element and wiring arrangement, and the size of the semiconductor chip (substrate) for the ink jet recording head is further promoted. Such a semiconductor chip for an inkjet head according to the present invention includes a plurality of electrothermal conversion elements arranged in a line for discharging ink, and a common electrical connection to the plurality of electrothermal conversion elements. A first common wiring for supplying a drive voltage to the conversion element, an electrical contact for receiving an image signal used to drive the electrothermal conversion element, and a corresponding one provided for the electrothermal conversion element; A plurality of selective driving elements for selectively driving the electrothermal converting element, a second common wiring electrically connected to the plurality of selective driving elements in common, and grounding; A circuit that is electrically connected and converts a serial image signal received through the electrical contact into a parallel image signal, and a circuit that temporarily holds the converted parallel signal and supplies the parallel signal to the selected drive element. A logic circuit to be provided in the same semiconductor chip for an ink jet recording head, wherein the electrothermal conversion element, the selective drive element, and the logic circuit are arranged from one side of the semiconductor chip to the other side. The selective drive elements are arranged in order, and are arranged at substantially the same cycle as the electrothermal conversion elements in the arrangement direction of the electrothermal conversion elements. Alternatively, a plurality of electrothermal transducers arranged in a line for discharging ink, and a first electrical power supply commonly connected to the plurality of electrothermal transducers to supply a drive voltage to the electrothermal transducers Common wiring, electrical contacts for receiving an image signal used to drive the electrothermal transducer,
A plurality of selection drive elements for selectively driving the electrothermal conversion elements are provided corresponding to the electrothermal conversion elements, and are electrically connected in common to the plurality of selection drive elements,
A second common wiring for grounding, a circuit electrically connected to the electrical contact, for converting a serial image signal received through the electrical contact into a parallel image signal, and temporarily converting the converted parallel signal. A logic circuit having a circuit for holding and supplying the selective drive element to the semiconductor chip for an ink jet print head provided in the same semiconductor chip, wherein: Are arranged adjacent to each other in a set, and the selective drive element and the second common wiring are arranged adjacent to each other in a set. A semiconductor chip for an ink jet recording head, which is arranged adjacently. Further, when multiple chips are arranged close to each other and arranged in the longitudinal direction of the nozzle array or the electrothermal conversion element array and electrically connected by cascade connection, the mounting density can be greatly increased and the electrical contacts The chip can be arranged close to the side where the electrothermal conversion element is located or on the opposite side because it is not in the way. Further, when the electric contacts are provided on both sides of the electrothermal transducer, a layout in which the wiring resistance is extremely reduced can be obtained. Also,
The ink jet recording head of the present invention is an ink jet recording head having a liquid path provided corresponding to the above-described semiconductor chip for an ink jet recording head and an electrothermal transducer and having a discharge port for discharging a liquid. Or
A plurality of electrothermal transducers arranged in a line for ejecting ink, and a first electrical supply common to the plurality of electrothermal transducers for supplying a drive voltage to the electrothermal transducers
And an electrical contact for receiving an image signal used to drive the electrothermal transducer, and provided corresponding to the electrothermal transducer to selectively drive the electrothermal transducer. A plurality of selective drive elements for performing the operation, a second common wiring electrically connected to the plurality of selective drive elements in common, and grounding, and an electrical contact electrically connected to the electrical contact. An ink-jet device comprising: a circuit for converting a serial image signal received through the device into a parallel image signal; and a logic circuit having a circuit for temporarily holding the converted parallel signal and supplying the signal to the selected driving element, provided in the same semiconductor chip. A semiconductor chip for a recording head;
An ejection port provided to correspond to the electrothermal transducer and ejecting ink from an end of the recording head semiconductor chip, wherein the semiconductor on the side where the ejection port is provided is provided. The electrothermal conversion element is disposed at one end of the chip, the electrothermal conversion element, the selection drive element, and the logic circuit are sequentially disposed from the one end of the semiconductor chip, and the other end of the semiconductor chip An ink jet recording head, wherein the electrical contacts are arranged in a portion.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings.

Embodiment 1 FIG. 1 shows an arrangement of elements on a substrate 1 of an ink jet recording apparatus according to an embodiment of the present invention. The electrothermal conversion element unit 2 composed of an array of a plurality of elements is arranged at one end of one side of the substrate 1. This is because the ink is supplied from one end of the substrate on which the elements are arranged. Since the flow resistance can be reduced when the ink supply chamber is closer to the ink supply chamber, high-speed response of ink discharge can be achieved. The effect is high if it is arranged within 1000 μm from the end face of the electrothermal conversion element, and the effect becomes higher as the end face is approached. The electric contact portions 7, 8, 9 are arranged on both sides of the substrate, which is the end of the electrothermal conversion element portion 2, and serve as first common wiring for supplying electric energy (pulse) to be applied to each electrothermal conversion element. A _VH contact portion 7 serving as a contact of the _VH wiring portion 3 and a GND serving as a contact of a ground (GND) wiring portion 5 serving as a second common wiring for grounding supplied electric energy.
It comprises a contact portion 8 and a logic contact portion 9 which is a signal contact of the logic circuit portion 6 constituting the logic circuit. Also, V _H
An array 4 of transistors as a selective driving element is provided between the wiring section 3 and the GND wiring section 5, and is individually connected to each element of the electrothermal conversion element so as to be selectively driven. The individual transistors of the transistor array unit 4 are connected so as to be controlled by the logic unit 6.

FIG. 6 shows an example of the configuration of an ink jet head using the substrate 1 of this embodiment.

Reference numeral 1001 denotes a top plate having n discharge ports 1002 and a groove (not shown) forming a flow path for supplying ink to each discharge port. Nozzles and ink chambers are formed in a one-to-one correspondence with 1005. Electrode 10
Reference numeral 04 denotes the top plate 1001 and the 2
Although not shown in the drawing, they are connected to each other by a method such as wire bonding, gang bonding, bumping, pressure welding, or pressure bonding, and receive supply of external electric energy.

The paired top plate 1001 and substrate 10
03 is mounted on the ink tank cover 1006.
The ink cover 1006 is an ink tank case 10007
And an ink tank is formed to store ink therein. Although not shown in the drawing, the ink may include an ink holding member such as an ink absorber. Further, the ink passes through the ink supply path of the ink tank cover 1006 and the electrothermal conversion element array 1005 of the substrate 1003.
To the nozzle leading to the lower part of the nozzle. This head configuration will be described in detail with reference to a sectional view (FIG. 7). As described above, the ink is supplied from the supply path of the ink tank cover 1006 to the back side of the substrate 1003 near the area where the electrothermal conversion element array 1005 is arranged, and passes through the grooves constituting the flow path of the top plate 1001 to generate individual electric heat. It reaches the surface of the conversion element. Here, the ink is heated by the electrothermal conversion element and foams, and is ejected to the outside from the ejection port 1002 by the foaming pressure to form dots on printing paper (not shown). Further, as shown in the cross-sectional view of FIG. 8, the ink 1010 is supplied to the surface of the electrothermal conversion element 1005 as shown in FIG. Is discharged as follows.

In this way, by adopting a structure in which the ink is wrapped around and supplied from the back surface of the substrate (where the recording elements are arranged), the uneven distribution of heat on the substrate is alleviated and stable. Recording can be performed.

Further, since the distance between the position where the recording element is arranged and the ink supply chamber 43 can be made very short, the refill speed can be increased, and high-speed response of ink ejection can be achieved. Can be.

Further, the distance from the foaming position (recording element) to the common liquid chamber 43 is short, and
Since the back wave generated at the time of foaming can be dispersed by increasing the spread at the portion leading to the above, the influence of cross talk of the back wave between the nozzles can be reduced. In order to produce such an effect, the arrangement of the recording elements is preferably within 1000 μm from the end of the substrate, and more preferably within 300 μm (however, the arrangement position (distance) of the recording elements here is the common liquid chamber of the flow path). The distance from the side end to the center in the direction along the flow path of the recording element.)

As described above, FIGS. 6 to 8 show an example of an ink jet recording head using the substrate of the present invention, in which the ink is ejected in a direction perpendicular to the surface on which the recording elements are arranged. FIG. 9 shows an example of a recording head that ejects ink in a direction along a surface on which recording elements are arranged as a head form.

FIG. 9 is a partial sectional view thereof.

In the figure, a top plate 4 provided with a groove for forming a liquid flow path 47 is joined to a substrate 1. The ink is supplied from the common liquid chamber 43 into the liquid flow path 47, and the ink is filled up to the orifice 5 by the capillary force. When an electric signal is applied to the recording element corresponding to the liquid flow path 47 to generate heat, the ink is heated and foamed 41, and the ink is ejected from the ejection port 5 by energy generated by the foaming.

An electric signal used for recording is supplied from a printed circuit board to the element substrate of the present invention on which the shift register is provided, via a bonding wire.

FIG. 10 shows the structure of the ink jet print head substrate 1003 of this embodiment, and FIG. 11 shows an equivalent circuit diagram thereof. A silicon substrate is mainly used for the substrate 1003, but any other material that can form a semiconductor may be used. A semiconductor layer 1029 is provided on the substrate 1003, and a semiconductor is formed by a method such as ion implantation. Here 10
15, 1016, 1023, 1024, 1025, 10
26 corresponds to a semiconductor. A first electric insulating layer 1028 is provided on the semiconductor layer 1029, and a conductor is further patterned on the first electric insulating layer 1028. Although not shown in the figure, a through hole is formed as necessary to form a circuit diagram shown in FIG. Contacts the lower semiconductor layer 1029.
A first conductor in an upper layer of 1028 is a _VH wiring 101 as a first common wiring for supplying electric energy necessary for foaming.
4, a GND wiring 1017 as a second common wiring, which is a ground for it, an enable wiring 1019 for heating the electrothermal transducer 1005 at an arbitrary timing,
A latch line 1020 that forms a latch unit for latching print data, a serial data line 1021 that supplies serial data, and a clock line 1022 that shifts serial data at a predetermined timing. Further, a second electric insulating layer 1027 is provided on the first conductor,
It is separated from the conductor layer and is contacted with a through hole determined to constitute the circuit diagram of FIG. First, the electrothermal conversion element 1005 is contacted with a _VH wiring 1014 through a _VH to heater wiring 1011 through a through hole to supply electric energy. Further, the other end of the electrothermal conversion element 1005 is connected to the collector of the transistor 1015 or 1016 through the through hole of the first insulating layer 1028 via the heater to the transistor wiring 1012. First transistor 1015 and second transistor 10
16 has two rows, but one row to
The area efficiency is improved by taking multiple rows. For example, when the pitch of each heater is small, a plurality of transistors are arranged because a transistor closer to a square has a better area effect. Further, the other ends (bases) of the transistors 1015 and 1016 are connected to a logic gate logic 1023 forming a logic gate portion via a transistor base wiring 1018. This transistor base wiring 1018 is made of polysilicon or the like. The first and second conductive layers are made of a material having low resistivity such as aluminum. The other ends (emitters) of the transistors 1015 and 1016 are connected to a GND wiring 1017 through through holes by transistors to the GND wiring. The logic gate logic 1023 selectively sends an ON signal to the transistor through the enable wiring 1019.
Takes a larger number of wirings by driving, and
005 can be freely heated. The wiring 1019 is a wiring through which weak electricity flows. Even if the wiring is complicated, the power loss is small and 1005 can be freely selected and heated. As shown in FIG. 10, in the present embodiment, the electrothermal conversion elements 1005 and V
_H wiring 1014, transistors 1015, 1016, G
The ND wiring 1017 and the logic circuit are arranged in this order. That is, the _VH wiring is arranged adjacent to the electrothermal conversion element,
GND wirings are arranged adjacent to the arrangement of the transistors, and these sets are arranged adjacent to each other. Therefore, the wiring configuration can be simplified even when a logic circuit such as a shift register is formed over the same substrate. Although FIGS. 10 and 11 illustrate a case where two basic circuit configurations are arranged, FIG.
It is shown in FIG. This is an arrangement in which n basic configurations are similarly arranged. In this case, the number of necessary electrical contacts is V _H contact 103
4, a large number of electrothermal transducers 1 if there are basically eight GND contacts 1035, enable contacts 1036, time division contacts 1037, latch contacts 1038, serial data contacts 1039, clock contacts 1040, and reset contacts 1041
015 can be driven. Here, 1042, 1043, 10
Reference numerals 44 and 1045 denote output contacts for cascade connection for outputting a signal or the like to another substrate.
39, 1038, and 1037 input contacts.

Next, an embodiment of a manufacturing process of the substrate 1 in which the respective elements shown in FIG. 10 are formed will be described with reference to the drawings.

FIGS. 13A and 13B show steps after the latch 12, the shift register 11, the transistor 10 and the like are formed by a method such as ion folding or diffusion. FIG.
(B) is a partial sectional view thereof.

In the substrate structure of the present invention, the signal line 3 for applying a logic signal from the shift register 11 to the transistor 10 and turning on / off the transistor is formed using a semiconductor layer. This can be performed because the current between the shift register 11 and the transistor 10 is weak, and there is no need to newly form a wiring.

Further, in the substrate structure of the present invention, as shown in FIGS. 13A and 15, the transistors 10 are arranged in the direction of arrangement of the electrothermal transducers substantially equal to the arrangement cycle of the electrothermal transducers. Then, by alternately arranging them at different distances from the left register, the integration efficiency is increased.
In particular, in a substrate used for ink-jet, a large current flows through the recording element through the transistor, so that the area of the transistor must be increased for efficiency.In addition, in order to achieve high-definition recording of ink-jet recording, the arrangement interval of the recording elements is required. Must be narrowed, but such an arrangement can achieve these objects. Here, the distance from the shift register to the transistor is changed in two stages, but this may be a larger number of stages.

FIGS. 14 (a), (b), FIGS. 15, 16,
FIGS. 14C and 14D are diagrams showing the manufacturing process of the substrate of the present invention, and show the manufacturing process in this order.

FIG. 14A shows a state in which an interlayer insulating film 29 of SiO ₂ , SiN or the like is formed on the substrate formed in FIG. 13 and through holes for contact with the upper layer are opened. Next, in FIG. 14B, the first wiring such as the _VH common electrode 21, the ground wiring 24, the logic wiring 31, and the contact 30 is formed by Al or the like. After that, FIG.
As shown in the top view and (b) sectional view, a second interlayer insulating film such as SiO ₂ or SiN (Si ₃ N ₄ ) is formed on the first wiring, and a through hole is provided.

Next, a second Al film is formed thereon and patterned to form an electrical connection between the electrothermal transducer 2 and the _VH electrode and the transistor, and to form a pad and the like (FIG. 16). ).

Subsequently, in order to prevent a short circuit between the electrodes due to the ink, a protective film 36 is formed in FIG. Further, as shown in FIG. 14D, a cavitation-resistant layer 37 may be formed on the protective film by using Ta or the like. The anti-cavitation layer is for protecting the electrodes and other layers from foaming and defoaming phenomena for ejecting ink. FIG. 17 shows a timing chart of these signals. Here, CLK
Is a clock signal. In response to this pulse, the initials of SI are input to the shift register, data is held in the latch by LAT, and output by enable EI. Further, it is possible to perform the driving in which the influence of the fluid crosstalk is reduced by the time division circuit. Finally, an example of a recording apparatus in which the recording head is mounted will be described below.

FIG. 18 is a schematic view of an ink jet recording apparatus IJRA to which the ink cartridge of the present invention is applied. Here, the carriage HC rotates the spiral groove 50 of the lead screw 5004 rotating via the driving force transmission gears 5011 and 5009 in conjunction with the forward and reverse rotation of the drive motor 5013.
05 is a pin (not shown)
And is reciprocated in the directions of arrows a and b. The carriage HC includes a recording head unit 5030 and an ink tank unit 503.
1 is attached. Reference numeral 5002 denotes a paper pressing plate, which presses the paper against the platen in the moving direction of the carriage. Reference numerals 5007 and 5008 denote home position detecting means for confirming the presence of the lever 5006 of the carriage in this area and switching the rotation direction of the motor 5013. Reference numeral 5016 denotes a member that supports a cap member 5022 that caps the front surface of the recording head. Reference numeral 5015 denotes suction means that suctions the inside of the cap, and performs suction recovery of the recording head via an opening 5023 in the cap. Reference numeral 5017 denotes a cleaning blade, and reference numeral 5019 denotes a member that allows the blade to move in the front-rear direction. It goes without saying that the blade is not limited to this form, and a well-known cleaning blade can be applied to this embodiment.
Reference numeral 5012 denotes a lever for starting suction for suction recovery. The lever 5012 moves with the movement of the cam 5020 that engages with the carriage, and the driving force from the drive motor moves by a known transmission means such as clutch switching. Controlled.

The capping, cleaning, and suction recovery are configured so that when the carriage HC is positioned at the home position side area, desired operations can be performed at the corresponding positions by the action of the lead screw 5005. If a desired operation is performed at a known timing, any of the embodiments can be applied.

In the present invention, the carriage HC
The recording head cartridge is mounted on the upper side. Here, a recording head cartridge of a type in which the recording head portion 5030 and the ink tank portion 5031 can be separated is mounted. Since the recording head of the present invention can be made compact for the above-mentioned reason, the mounting of the carriage and the like can be performed more easily. In addition, since the function of converting the recording signal from a serial signal to a parallel signal, which has been provided in the conventional apparatus, is provided on the substrate of the recording head, the recording apparatus can have a simple configuration. Since the number of connection terminals for supplying signals to the device is small, wiring arrangement and the like can be simplified, the manufacturing process can be simplified, and a compact and low-cost recording device can be obtained.

In the head mounted on such an ink jet recording apparatus, there are a head which can be replaced by a user and a head which cannot be replaced. However, in the configuration of this embodiment, the number of electrical contacts is small, so that the user can replace the head. This is particularly effective because the space for contact points in a compact head is small, so that the head is compact and the reliability at the time of attachment and detachment is improved.

FIG. 19 shows an arrangement relationship between each element and each wiring on the substrate 1.

(A) shows another example of the arrangement on the substrate according to the present invention. Unlike the arrangement of FIG. 1, the _VH wiring 20 and the GND wiring 21 adjacent to the electrothermal transducer array 2 are electrically connected. Disposed between the heat conversion element array 2 and the selection drive element 4;
Since the electric wiring between them is connected at the shortest distance, the circuit configuration has less electric loss.

(B) is described as a reference arrangement example. In an element substrate used for an ink jet recording head, a top plate having a groove for forming a flow path is bonded on the substrate as described above. However, in order to increase this adhesion,
The smoothness of the element substrate surface is required. In FIG. 19B, the first and second wirings intersect at a position distant from the position of the printing element requiring particularly smoothness. Therefore, the top plate can be brought into close contact with the substrate 1 without using an adhesive such as a drum film or a dense material.

(C) shows another example of the arrangement on the substrate of the present invention. In this example, the _VH wiring 3 is arranged adjacent to the recording element array 2 and at the end of the substrate. Circuit wiring can be performed without the necessity of multilayering the electric wiring, and it can be manufactured at low cost.

Further, since the folded wiring is not performed, the arrangement in the vicinity of the printing element can be made large, and the width of the heater can be increased.

(D) shows another example of the arrangement on the substrate of the present invention. In this example, the GND wiring 5 is also arranged near the electrothermal conversion element array 2 to reduce the electric loss. It is less.

The present invention includes a means (for example, an electrothermal conversion element or a laser beam) for generating thermal energy as energy used for discharging ink, particularly in an ink jet recording system. A recording head of a type that causes a change in the state of ink,
In a recording apparatus, an excellent effect is provided.

The typical structure and principle are described in, for example, US Pat. Nos. 4,723,129 and 4,740.
It is preferable to use the basic principle disclosed in the specification of Japanese Patent No. 796. This method is a so-called on-demand type,
Although it can be applied to any of the continuous type, especially in the case of the on-demand type, it can be applied to the sheet holding the liquid (ink) or the electrothermal conversion element arranged corresponding to the liquid path. By applying at least one drive signal that gives a rapid temperature rise exceeding the nucleate boiling corresponding to the recorded information, heat energy is generated in the electrothermal transducer and the film is heated on the heat acting surface of the recording head. As a result, bubbles in the liquid (ink) can be formed in one-to-one correspondence with the drive signal, which is effective. By discharging the liquid (ink) through the discharge opening by the growth and contraction of the bubble, at least one droplet is formed. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are performed immediately and appropriately, so that the ejection of a liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable. The driving signal in the form of a pulse is described in US Pat. No. 4,463,359 and US Pat.
No. 262 are suitable. If the conditions described in U.S. Pat. No. 4,313,124 relating to the temperature rise rate of the heat acting surface are adopted, more excellent recording can be performed.

As the configuration of the recording head, in addition to the combination of a discharge port, a liquid path, and an electrothermal conversion element (a linear liquid flow path or a right-angled liquid flow path) as disclosed in the above-mentioned respective specifications, A configuration using U.S. Pat. No. 4,558,333 or U.S. Pat. No. 4,459,600, which discloses a configuration in which a heat acting portion is arranged in a bending region, is also included in the present invention. In addition, Japanese Unexamined Patent Application Publication No. 123670/1984 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal conversion element for a plurality of electrothermal conversion elements, The present invention is also effective as a configuration based on Japanese Patent Application Laid-Open No. 59-138461, which discloses a configuration corresponding to a discharge unit.

Further, as a full-line type recording head having a length corresponding to the width of the maximum recording medium that can be recorded by the recording apparatus, a combination of a plurality of recording heads as disclosed in the above specification is used. Either a configuration that satisfies the length or a configuration as one integrally formed recording head may be used, but the present invention can more effectively exert the above-described effects.

In addition, the print head is exchangeable with a print head of the chip type, which can be electrically connected to the main body of the apparatus and can supply ink from the main body of the apparatus, or is integrated with the print head itself. The present invention is also effective when a cartridge-type recording head provided in a fixed manner is used.

In the present invention, it is preferable to add recovery means for the recording head, preliminary auxiliary means, and the like, which are provided as components of the recording apparatus, since the effects of the present invention can be further stabilized. If you list these specifically,
Caving means, cleaning means, pressure or suction means, electro-thermal conversion element or another heating element or pre-heating means by a combination of these, and ejection other than recording Is also effective for performing stable printing.

Further, the recording mode of the recording apparatus is not limited to the recording mode of only the mainstream color such as black, but may be a single recording head or a combination of plural recording heads. The present invention is also effective for an apparatus provided with at least one of full colors by color mixing.

[0050]

As described above, even when the electrothermal conversion element and the logic circuit such as the shift register and the latch are formed on the same substrate, each element and the wiring pattern are arranged as in the present invention. By doing so, the number of contacts can be reduced, thereby suppressing electrical loss and reducing costs due to wiring patterns. Furthermore, the effective use of the area of the semiconductor chip, the reduction of the fluid loss in the liquid flow path on the substrate, and the effectiveness of the electrical contacts in the head configuration using a plurality of chips have been enhanced.

[Brief description of the drawings]

FIG. 1 is a view showing a layout of each element on a substrate.

FIG. 2A is a diagram showing a substrate layout for diode matrix driving. (B) The small type figure of (a) in the substrate layout of the diode matrix drive. (C) The figure which shows the board layout of a direct drive. (D) is a diagram showing a schematic cross section of the head.

FIGS. 3A, 3B, and 3C are diagrams showing a direct drive type substrate layout having ink supply holes.

FIG. 4 is a diagram showing an equivalent circuit diagram of direct drive.

FIG. 5 is an equivalent circuit diagram of 4 × 4 diode matrix driving.

FIG. 6 is an exploded view of a head configuration using the substrate of FIG. 1;

FIG. 7 is a sectional view of the vicinity of a nozzle having a head configuration.

FIG. 8 is a sectional view of the vicinity of a nozzle having a head configuration.

FIG. 9 is a schematic cross-sectional view of a recording head using the element substrate of the present invention.

FIG. 10 is a detailed view of the substrate of FIG. 1;

FIG. 11 is an equivalent circuit of the diagram of FIG. 9;

FIG. 12 is a development of FIG.

FIG. 13 is a view showing a manufacturing process of the element substrate of the present invention.

FIG. 14 is a view showing a manufacturing process of the element substrate of the present invention.

FIG. 15 is a view showing a manufacturing process of the element substrate of the present invention.

FIG. 16 is a view showing a manufacturing process of the element substrate of the present invention.

FIG. 17 is a timing chart of driving by the circuit of FIG. 11;

FIG. 18 is a diagram showing an example of a main body on which a head using the substrate of the present invention is mounted.

FIG. 19 is a diagram showing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electrothermal conversion element array 3 VH wiring 4 Transistor array 5 GND wiring 6 Logic part 7 VH contact 8 GND contact 9 Logic contact 10 Matrix wiring 11 Diode array 12 Contact 13 Wiring 14 Top plate 15 Ink 16 Ink supply hole 17 Dry film 18 Orifice plate 19 VH common electrode 1001 Top plate 1002 Orifice 1003 Substrate 1004 Contact 1005 Electrothermal conversion element array 1006 Ink tank cover 1007 Ink tank case 1008 Drop red 1009 Foaming 1010 Ink 1011 Heater to VH wiring 1012 Heater to transistor wiring 10 Transistor to GND wiring 1014 VH wiring 1015 First transistor 1016 Second transistor 1017 GND wiring 101 Transistor gate wiring 1019 Enable wiring 1020 Latch wiring 1021 Serial data wiring 1022 Clock wiring 1023 Logic gate wiring 1024 Latch logic 1025, 1026 Shift register 1027 Second insulating layer 1028 First insulating layer 1029 Semiconductor layer 1031 Time division circuit 1032 Latch logic 1033 Shift Register 1034 VH contact 1035 GND contact 1036 Enable contact 1037 Time division contact 1038 Latch contact 1039 Serial data contact 1040 Clock contact 1041 Clear contact 1042 Clock out contact 1043 Serial data out contact 1044 Latch out contact 1045 Time division out contact 5002 Paper press plate 5003 Carriage shaft 5004 Carriage screw -Shaft 5005 Screw groove 5006 Photo spacer 5007 Stop plate 5008 Photo interrupter 5009 Carriage shift gear 5010 Gear 1 5011 Gear 2 5012 Motor holder 5013 Carriage motor 5014 Recovery unit 5015 Recovery header 5016 Recovery cap 5017 Rubber blade 5018 Platen frame 5019 Printer unit Printer unit Presser 5021 Recovery cam 5022 Cap sponge 5023 Cap receiver

Continuing on the front page (72) Inventor Teruo Ozaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Akihiro Yamanaka 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Hiroto Matsuda 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (56) References JP-A-2-178064 (JP, A) JP-A-62-263071 (JP, A) JP-A-59-135174 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B41J 2/05

Claims (9)

(57) [Claims] 1. A plurality of electrothermal transducers arranged in a line for discharging ink, and a common electrical connection to the plurality of electrothermal transducers, for supplying a drive voltage to the electrothermal transducers. A first common wiring, an electrical contact for receiving an image signal used to drive the electrothermal transducer, and a plurality of electrical contacts provided corresponding to the electrothermal transducer; A plurality of selection driving elements for driving the plurality of selection driving elements, a second common wiring commonly connected to the plurality of selection driving elements for grounding, and an electric connection electrically connected to the electric contact. A logic circuit having a circuit for converting a serial image signal received through a contact into a parallel image signal and a circuit for temporarily holding the converted parallel image signal and supplying the selected drive element to the selected driving element is provided in the same semiconductor chip. A semiconductor chip for an ink jet recording head, wherein the electrothermal conversion element, the selection drive element, and the logic circuit are arranged in this order from one inside the semiconductor chip to the other, and the selection drive element The semiconductor chip for an ink jet recording head is arranged in the arrangement direction of the electrothermal conversion elements at substantially the same cycle as the electrothermal conversion elements. 2. A plurality of electrothermal conversion elements arranged in a line for discharging ink, and are electrically connected to the plurality of electrothermal conversion elements in common, and supply a driving voltage to the electrothermal conversion elements. A first common wiring, an electrical contact for receiving an image signal used to drive the electrothermal transducer, and a plurality of electrical contacts provided corresponding to the electrothermal transducer; A plurality of selection driving elements for driving the plurality of selection driving elements, a second common wiring commonly connected to the plurality of selection driving elements for grounding, and an electric connection electrically connected to the electric contact. A logic circuit having a circuit for converting a serial image signal received through a contact into a parallel image signal and a circuit for temporarily holding the converted parallel image signal and supplying the selected drive element to the selected driving element is provided in the same semiconductor chip. A semiconductor chip for an ink jet recording head, wherein the first common wiring and the row of the electrothermal conversion elements are arranged adjacent to each other in a set, and the selective driving element and the A semiconductor chip for an ink jet recording head, wherein a second common wiring is formed adjacent to each other in a set, and further, these two sets are disposed adjacent to each other. 3. The selection drive element according to claim 1, wherein the selection drive elements are arranged in a plurality of columns having different distances from a circuit for converting the serial image signal into a parallel image signal.
4. The semiconductor chip for an ink jet recording head according to claim 1. 4. The semiconductor chip for an ink jet recording head according to claim 1, wherein the electrothermal transducer is arranged at a position within 1000 μm from an end of the semiconductor chip. 5. The semiconductor chip for an ink jet recording head according to claim 1, wherein the electric contact is disposed on a side of the semiconductor chip opposite to the side on which the heating element is disposed. 6. The semiconductor chip for an ink jet recording head according to claim 1, wherein said logic circuit has a configuration for outputting a signal received from outside to another semiconductor chip. 7. A liquid passage provided with the semiconductor chip for an ink jet recording head according to claim 1 and a discharge port for discharging a liquid provided corresponding to the electrothermal conversion element. An inkjet recording head comprising: 8. A plurality of electrothermal conversion elements arranged in a line for discharging ink, and are electrically connected in common to the plurality of electrothermal conversion elements and supply a driving voltage to the electrothermal conversion elements. A first common wiring, an electrical contact for receiving an image signal used to drive the electrothermal transducer, and a plurality of electrical contacts provided corresponding to the electrothermal transducer; A plurality of selection driving elements for driving the plurality of selection driving elements, a second common wiring commonly connected to the plurality of selection driving elements for grounding, and an electric connection electrically connected to the electric contact. A logic circuit including a circuit for converting a serial image signal received via a contact into a parallel image signal and a circuit for temporarily holding the converted parallel signal and supplying the selected drive element to the selected drive element is provided in the same semiconductor chip. A semiconductor chip for an ink jet recording head, and an ejection port that is provided corresponding to the electrothermal transducer and that ejects ink from an end portion of the semiconductor chip for a recording head. The electrothermal transducer is arranged at one end of the semiconductor chip on the side where the discharge port is provided, and the electrothermal transducer, the selective drive element, and the logic circuit are arranged in this order from the one end of the semiconductor chip. Wherein the electrical contact is provided at the other end of the semiconductor chip. 9. An ink jet recording apparatus comprising: the ink jet recording head according to claim 7; and means for scanning the recording head.