JP3172614B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device, and more particularly, to an upper mold base, and an upper chase that can be slidably attached to and detached from the upper mold base in a horizontal direction. A lower mold base that can be relatively moved toward and away from the upper mold base, and a lower mold base that can be horizontally slidably attached to and detached from the lower mold base. The lower mold chase engageable with the chase, the upper mold base and the lower mold base are relatively moved toward and away from each other, and a mold clamping force is applied to the upper mold base or the lower mold base in the mold closed state. The present invention relates to a resin sealing device having a driving mechanism for causing the resin sealing device.

[0002]

2. Description of the Related Art Conventionally, an upper mold base, an upper chase that can be slid in and removed from the upper mold base in a horizontal direction, and relatively moved toward and away from the upper mold base. A lower mold base that is capable of being horizontally slidably attached to and detached from the lower mold base, and capable of engaging with the upper mold chase in a mold closed state; As a resin sealing device having a drive mechanism for applying a mold clamping force to the upper mold base or the lower mold base in the mold closed state while moving the mold base and the lower mold base relatively toward and away from each other. For example, JP
-269328, JP-A-62-269329, JP-A-62-269330, JP-A-63-8
There is a technique disclosed in Japanese Patent No. 2718 or the like.

In these resin sealing devices, the upper chase and the lower chase can be exchanged when changing the semiconductor device to be molded. At the time of this replacement, the upper chase and the lower chase are opened via the drive mechanism, and the upper chase before replacement is slid horizontally with respect to the upper mold base to be separated from the upper mold base. . The lower mold chase before replacement is also slid in the horizontal direction with respect to the lower mold base and detached from the lower mold base.
After this, slide the new upper chase horizontally to the upper mold base and attach / detach it to the upper mold base, and also slide the new lower chase horizontally to the lower mold base to lower the mold. Replacement is completed by mounting from the mold base.

[0004]

However, the above-mentioned conventional resin sealing device has the following problems. When exchanging the upper chase and the lower chase, the conventional device opens the upper chase and the lower chase, and separates the upper chase and the lower chase from the upper mold base and the lower mold base, respectively. Let it. Next, since a new upper chase and a new lower chase are separately mounted on the upper mold base and the lower mold base, respectively, at least five steps are required in the replacement work, which is an obstacle to improving the work efficiency. In addition, the upper chase and the lower chase must always be used in combination with a predetermined upper chase and lower chase. However, if the upper and lower chase are separately separated from the upper and lower mold bases when replacing the upper and lower chase, an error may occur in the combination of the two. There is. In addition, if the upper die chase and the lower die chase are handled separately, a large space is required as a work and storage space. Further, when the upper die chase and the lower die chase are handled separately, there is a possibility that the parting surfaces of both are dirty or damaged.

The inventor of the present invention has proposed that the upper chase and the lower chase be exchanged in a closed state when exchanging the upper chase and the lower chase. When the contact surfaces contact each other,
There was a problem that the parting surface was damaged by impact, vibration, and the like, and it was not realized. Therefore, the present invention provides a resin sealing device capable of performing the upper chase and the lower chase in a closed state when exchanging the upper chase and the lower chase and preventing damage to the parting surface. With the goal.

[0006]

To solve the above-mentioned problems, the present invention has the following arrangement. That is, an upper mold base, an upper chase that can be slid in the horizontal direction with respect to the upper mold base and detachable, and can be relatively moved toward and away from the upper mold base. A lower mold base, a lower mold chase that is slidable in a horizontal direction with respect to the lower mold base and is detachable, and is engageable with the upper mold chase in a mold closed state; A resin sealing device comprising: a drive mechanism for causing a mold base and the lower mold base to relatively move toward and away from each other and for applying a mold clamping force to the upper mold base or the lower mold base in the mold closed state. The upper mold base is detachable with the upper mold chase in a mold closed state, and the lower mold base is the lower mold chase in a mold closed state. A chair is detachable, and the upper and / or lower chase is resiliently attached to the upper and / or lower chase by an elastic force when the mold is closed and the driving mechanism does not apply a mold clamping force. That the parting surface of the upper chase and the lower chase can be brought into contact with each other by elastically deforming when the driving mechanism applies the mold clamping force. Features. In particular, the upper mold base may be fixed to the apparatus main body, the lower mold base may be slidable in a horizontal direction with respect to the apparatus main body to be detachable, and When the lower chase is closed, a chase exchange mechanism may be provided for horizontally sliding the lower chase to the lower mold base for detachment.

[0007]

[Operation] The operation will be described. Since the upper mold chase and the lower mold chase can be detached from the upper mold chase and the lower mold chase in the mold closed state, the upper mold chase and the lower mold chase can be exchanged in the mold closed state. In addition, in the upper die chase and / or the lower die chase, the parting surfaces of the upper die chase and the lower die chase are separated from each other by elastic force when the die is closed and the driving mechanism does not apply a die clamping force. When the drive mechanism applies the mold clamping force, there is provided an elastic body that elastically deforms and allows the upper part chase and the lower part chase to contact each other's parting surfaces. The state where the parting surface is separated can be maintained, and damage to the parting surface can be prevented.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a semiconductor sealing device for resin sealing a semiconductor chip of a semiconductor device as an example of a resin sealing device. In FIG. 1, reference numeral 10 denotes a base, on which four guide columns 12 are provided upright. 1
Reference numeral 4 denotes a movable plate constituting a main body of the apparatus.
And can be moved up and down along the guide column 12. Reference numeral 16 denotes an upper mold base, which is fixed to the lower surface of the movable plate 14. Reference numeral 18 denotes an upper die chase, which is attached to the upper die base 16. Although the detailed structure will be described later, the upper mold chase 18 is
It can be attached and detached by sliding in the horizontal direction.

Reference numeral 20 denotes a lower mold base, which is attached to the base 10. Lower mold base 20
Are fixed on the slide portion 22. Slide part 2
2 is slidable in the direction of arrow A along a rail 24a provided on the base 10. 26a is a ball screw, and two (one is not shown) are arranged along each rail 24a. Each ball screw 26a is screwed with a nut 28 (one not shown) fixed to the lower surface of the slide portion 22. The ball screw 26a is mounted on the base 1
It is driven by a motor 30a fixed to zero. Therefore, by driving the motor 30a, the ball screw 26a rotates, and the slide portion 22 and the lower mold base 20 can be moved along the rail 24a.
A lower mold chase 32 is housed in the lower mold base 20. Although the detailed structure will be described later, the lower die chase 3
Numeral 2 is detachably slid in the horizontal direction with respect to the lower mold base 20.

Reference numeral 34 denotes a drive mechanism, which is a mechanism for moving the movable plate 14 up and down. The drive mechanism 34 includes the motor 30b
And a pressing screw 36 rotated by the motor 30b, and a nut 37 screwed with the pressing screw 36 are fixed, and a crosshead 39 that moves up and down by the rotation of the pressing screw 36 is connected to the crosshead 39. It includes a pair of toggle links 38 for applying a pressing force. When the movable plate 14 is moved downward by the drive mechanism 34, the upper mold chase 18 and the lower mold base 20 attached to the upper mold base 16 are moved.
The lower chase 32 attached to the vehicle approaches. At this time, the engagement protrusions 40 protruding from the four sides of the upper die chase 18 and the engagement recesses 42 depressed from the four sides of the lower die chase 32 engage (see FIG. 2). In this state, the parting surface of the upper die chase 18 and the parting surface of the lower die chase 32 are not in close contact with each other. When performing resin sealing, the driving mechanism 34 further moves the movable plate 14 to oppose the filling pressure of the resin, and applies a pressing force (mold clamping) to the upper mold base 16 and the lower mold base 20 in the mold closed state. Force). In this state, the parting surface of the upper die chase 18 and the parting surface of the lower die chase 32 are in close contact with each other. A state in which the movable plate 14 moves upward, the upper die chase 18 and the lower die chase 32 are separated from each other and disengaged from each other is referred to as an upper die open state.

Reference numeral 44 denotes a chase exchanging mechanism. When the upper die chase 18 and the lower die chase 32 are closed, the lower die chase and the upper die chase 18 are horizontally slid in the direction of arrow A together with the lower die chase 18. Put on and take off.
The chase exchange mechanism 44 can be sequentially moved in the direction of arrow B by a carrier 46 that moves along the rail 24b. A rail 24c is fixed in the direction of arrow A on the upper surface of the transport vehicle 46, and a slide plate 48 is slidable in the direction of arrow A along the rail 24c. Slide plate 48
Is slid in the direction of arrow A by a ball screw 26b driven by a motor (not shown). A rail 24d on which the upper die chase 18 and the lower die chase 32 can slide on the upper surface in a closed state is disposed on a slide plate 48 in the direction of arrow A. The detachable arm 50 is movable in the direction of arrow A along the rail 24d, and a detachable rod 52 is provided at the tip of the detachable arm 50. The tip of the detachable rod 52
It is possible to enter the engaging hole 54 opened on the end face of the lower die chase 32, and it is impossible to pull out from the engaging hole 54 at the time of 1/4 rotation. The detachable arm 50 is moved in the direction of arrow A by an arm driving device 56 (for example, composed of a motor and a feed screw).

Next, the structure of the upper mold base 16 and the upper chase 18 will be described with further reference to FIG. The upper mold base 16 has a right end face on the opening / closing member 5.
It can be opened and closed at 8a. Closing the opening and closing member 58a,
By fixing, the upper mold chase 18 is positioned in the upper mold base 16. On the inner wall surface of the upper mold base 16, a horizontal guide groove 60a in the direction of arrow A is formed as clearly shown in FIG. Protrusions 62a are formed on both side surfaces of the upper die chase 18 so as to be slidably engageable with the guide grooves 60a. Therefore, when the opening / closing member 58a is in the open state (the state shown in FIG. 1), the upper chase 18 slides horizontally along the guide groove 60a, and is detachable from the upper mold base 16.

A spring 64, which is an example of an elastic body, is provided in the upper chase 18. A plunger 66 whose lower end can protrude from the parting surface of the upper die chase 18 is provided, and the spring 64 constantly urges the plunger 66 in the protruding direction. In a state where the mold is closed by providing the spring 64 and the driving mechanism 34 does not apply the mold clamping force, the lower end of the plunger 66 protruded by the elastic force of the spring 64 abuts against the parting surface of the lower mold chase 32, The parting surfaces of the upper die chase 18 and the lower die chase 32 are separated from each other (indicated by a gap G in FIG. 2). On the other hand, when the drive mechanism 34 applies the mold clamping force to the upper mold base 16, the spring 64
Is compressed, the plunger 66 retreats into the upper die chase 18 and the parting surfaces of the upper die chase 18 and the lower die chase 32 come into close contact with each other.

Next, the structures of the lower mold base 20 and the lower chase 32 will be described with reference to FIG. The lower mold base 20 has an opening / closing member 5 at the right end face.
It can be opened and closed at 8b. Closing the opening / closing member 58b,
By fixing, the lower chase 32 is positioned in the lower mold base 20. As shown in FIG. 7, a horizontal guide groove 60b in the direction of arrow A is formed on the inner wall surface of the lower mold base 20. On both sides of the lower die chase 32, ridges 62b are formed which can be slidably engaged with the guide grooves 60b. Therefore, when the opening / closing member 58b is in the open state (the state shown in FIGS. 1 and 7), the lower die chase 32 is slid horizontally along the guide groove 60b, and is detachable from the lower die base 20.
The lower die chase 32 is provided with a block 68 to which a plunger (not shown) for feeding the resin is attached, and the concave grooves 70 formed on both side surfaces of the block 68 are formed on the base 10. It is configured to slidably engage with the provided engaging portion 72. The engagement portion 72
When the lower mold base 20 is set on the base 10, the lower mold base 20 corresponds to the slit 74 formed on the bottom surface of the lower mold base 20 (see FIG. 7).

Next, replacement of the upper die chase 18 and the lower die chase 32 will be described with reference to FIGS. The state shown in FIG. 2 is a mold closed state in which the mold clamping force is released from the mold clamped state, and the parting surface of the upper mold chase 18 mounted in the upper mold base 16 and the lower mold base 20. Lower chase 32 mounted inside
The gap G is held by the elastic force of the spring 64. When exchanging the upper die chase 18 and the lower die chase 32, first, as shown in FIG. 3, the opening / closing member 58a is rotated in the direction of arrow C. By this rotation, the upper chase 18 is moved to the upper mold base 1.
6 can be removed.

In this state, the motor 30a is driven to advance the slide portion 22 and the lower mold base 20 (in the direction of arrow D). Since the opening / closing member 58b is in the closed state, the lower chase 32 cannot be removed from the lower mold base 20. Then, when the lower mold base 20 moves forward,
The lower die chase 32 advances integrally with the lower die base 20. At this time, since the mold closed state is maintained, the engaging convex portion 40 of the upper mold chase 18 and the engaging concave portion 42 of the lower mold chase 32 are engaged, and the upper mold chase 18 is Together with the upper mold base 16 (state of FIG. 4). Next, as shown in FIG. 5, the opening / closing member 58a is rotated in the direction of arrow E. With this rotation,
The lower die chase 32 can be removed from the lower die base 20.

During this time, the transport vehicle 4 of the chase exchange mechanism 44
6, the standby at the position shown in FIG. 1 is completed, the slide plate 48 moves toward the lower mold base 20, and the detachable arm 50 also moves in the same direction. By the movement of the detachable arm 50, the tip of the detachable rod 52 enters the engaging hole 54 of the lower chase 32. Thereafter, the attaching / detaching rod 52 is rotated by 1/4 and is engaged with the engaging hole 54. When the detachable arm 50 moves in the direction away from the lower mold base 20 in this state, the upper chase 18 and the lower chase 3 are closed.
2 are integrally pulled out from the lower mold base 20 and transferred onto the rail 24d (FIG. 6, arrow F). With the upper die chase 18 and the lower die chase 32 closed, the rail 2
4d, the slide plate 48 moves in a direction away from the lower mold base 20, and the transport vehicle 46
Move in the direction.

Subsequently, the transport vehicle 46 on which the new upper chase 18 and the lower chase 32 are transferred on the rail 24d while the mold is closed corresponds to the lower mold base 20 in the forward state (the state of FIG. 1). . From this state, the slide plate 48 and the detachable arm 50 move in the direction approaching the lower mold base 20, and the upper mold chase 18 and the lower mold chase 32 having the gap G are closed.
Install inside. Upper die chase 18 and lower die chase 32
Is mounted in the lower mold base 20, the attachment / detachment rod 52 is rotated by a quarter turn, and the engagement with the engagement hole 54 is released. When the detachable arm 50 moves in the direction away from the lower mold base 20 in this state, the upper chase 18 and the lower chase 32 become free with respect to the chase exchange mechanism 44. Subsequently, the opening / closing member 58b is closed, and the motor 3
The lower mold base 20 and the like retreat by the drive of Oa. By this retreat, the upper die chase 18 is mounted in the upper die base 16. When the upper chase 18 is mounted, the opening / closing member 58a is closed and the upper chase 18 is closed.
The exchange of the lower chase 32 is completed.

When the upper chase 18 and the lower chase 32 are exchanged, the mold can be kept in the closed state, so that the number of steps in the exchange operation can be reduced and the working efficiency can be improved. Also, the upper chase 18 and the lower chase 32, which can maintain the mold closed state, can always maintain a predetermined combination, so that the upper chase 18 and the lower chase 32 can be used later. No error occurs in the combination. . Further, since the upper die chase 18 and the lower die chase 32 can be handled in a mold closed state, the space for work and storage is smaller than in the case where they are handled separately. Furthermore, the upper chase 18 and the lower chase 3
Since the parts 2 are not treated separately, it is possible to suppress dirt and damage on both parting surfaces.

In particular, by disposing the spring 64, the parting surfaces of the upper die chase 18 and the lower die chase 32 by elastic force in a mold closed state and in a state in which the driving mechanism 34 does not apply a mold clamping force. So that
At the time of replacement, the upper part chase 18 and the lower part chase 32 can be kept apart from each other with their parting surfaces separated from each other, and damage to the parting surfaces can be prevented. Further, if the elastic force of the spring 64 is adjusted so that the lower surface of the ridge 62a and the bottom surface of the guide groove 60a cannot be brought into contact with each other in the closed state of the mold, frictional resistance between both surfaces can be eliminated.
And the lower die chase 32 can be exchanged more smoothly. As described above, various preferred embodiments of the present invention have been described. However, it is needless to say that the present invention is not limited to the above-described embodiments, and that many modifications can be made without departing from the spirit of the invention. .

[0021]

When the resin sealing device according to the present invention is used,
Since the upper mold chase and the lower mold chase can be kept in the mold closed state, the number of steps in the exchange operation can be reduced, and the work efficiency can be improved.
In addition, since the upper chase and the lower chase capable of maintaining the mold closed state can always maintain a predetermined combination, no error occurs in the combination of the upper chase and the lower chase. . Also, since the upper and lower chase can be handled in a closed mold, the work and storage space is smaller than when separately handled, and it is possible to suppress dirt and damage on both parting surfaces. Become.

In particular, by disposing the elastic body, the parting surfaces of the upper die chase and the lower die chase are separated from each other by the elastic force when the die is closed and the driving mechanism does not apply the die clamping force. Therefore, the upper part chase and the lower part chase can be kept separated from each other at the time of replacement, and damage to the parting surface can be prevented. Further, when the chase exchange mechanism is provided, it is possible to achieve a remarkable effect such that the chase exchange can be automated.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor sealing device which is an embodiment of a resin sealing device according to the present invention.

FIG. 2 is a partial cross-sectional view showing a mold-closed state in the semiconductor sealing device of the embodiment.

FIG. 3 is a partial side view showing a procedure of chase replacement in the semiconductor sealing device of the embodiment.

FIG. 4 is a partial side view showing a procedure of chase replacement in the semiconductor sealing device of the embodiment.

FIG. 5 is a partial side view showing a procedure of chase replacement in the semiconductor sealing device of the embodiment.

FIG. 6 is a partial side view showing a procedure of chase replacement in the semiconductor sealing device of the embodiment.

FIG. 7 is a partial perspective view showing a relationship between a lower mold base and a lower chase.

[Explanation of symbols]

 14 Movable plate 16 Upper mold base 18 Upper chase 20 Lower mold base 22 Slide part 32 Lower chase 34 Drive mechanism 40 Engagement convex part 42 Engagement concave part 44 Chase exchange mechanism 64 Spring

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-13723 (JP, A) JP-A-1-146712 (JP, A) JP-A-63-82717 (JP, A) JP-A-5-127 299458 (JP, A) JP-A-7-16879 (JP, A) JP-A-9-8073 (JP, A) JP-A-62-269328 (JP, A) JP-A-2-74312 (JP, A) Japanese Utility Model Application Hei 3-1226049 (JP, U) Japanese Utility Model Application Hei 4-73519 (JP, U) (58) Fields studied (Int. Cl. ⁷ , DB name) B29C 45/00-45/84 B29C 33/00 -33/76 H01L 21/56

Claims (3)

(57) [Claims] 1. An upper mold base, an upper chase that can be slid in the horizontal direction with respect to the upper mold base and detachable therefrom, and relatively moved toward and away from the upper mold base. A lower mold base that is capable of being horizontally slid with respect to the lower mold base to be detachable, and is capable of engaging with the upper mold chase in a mold closed state; A drive mechanism for relatively moving the upper mold base and the lower mold base toward and away from each other and for applying a mold clamping force to the upper mold base or the lower mold base in a mold closed state; In the stopper device, the upper mold base is detachable with the upper mold chase in a mold closed state, and the lower mold base is in the mold closed state. A lower mold chase is detachable, and the upper mold chase and / or the lower mold chase are resilient in the mold closed state and the driving mechanism does not apply a mold clamping force. An elastic body is provided that separates the parting surfaces of the upper and lower mold chases so that the parting surfaces of the upper and lower chase can be brought into contact with each other when the driving mechanism applies a mold clamping force. A resin sealing device characterized by the above-mentioned. 2. The apparatus according to claim 1, wherein the upper mold base is fixed to an apparatus main body, and the lower mold base is slidable in a horizontal direction with respect to the apparatus main body to be detachable. Item 2. The resin sealing device according to Item 1. 3. A chase exchanging mechanism for horizontally sliding the lower die chase to a lower die base when the upper die chase and the lower die chase are closed. Item 3. The resin sealing device according to Item 2.