JP3160898U - Indirect vaporization cooling system - Google Patents

Abstract

The present invention provides a lightweight and small indirect vaporizing cooling device with improved cooling efficiency. A substrate 1 made of an aluminum alloy thin plate 2 is disposed between a wet channel for causing a vaporization phenomenon and a dry channel through which air to be cooled passes, and the wet channel and the dry channel. Are arranged so as to be alternately arranged, and outside air is introduced into the aluminum alloy thin plates 2 arranged in large numbers, and dry air is allowed to pass through the adjacent wet channels, whereby the aluminum alloy thin plates are arranged. 2 is a configuration of an indirect vaporization cooling device that cools 2. [Selection] Figure 1

Description

  In the present invention, a humidified cooling zone (wet channel) and a cooled air zone (dry channel) formed by stacking substrates at predetermined intervals are alternately arranged adjacent to each other, and air flowing into the cooled air zone is The present invention relates to an indirect vaporization cooling device for cooling. In particular, it relates to the foundation that forms each channel.

  The method of cooling air using the heat of vaporization of water has been used for a long time. However, as an improvement in the heat exchange efficiency of heat exchange between a substrate disposed in a passage for vaporizing water and a fluid fed into a passage adjacent to the substrate, Japanese Patent Application Laid-Open No. 2004-5133 2009 October 21, etc. Several patents have been invented and put into practical use. For example, it is known from JP2009-150632A. When air is humidified, a vaporization phenomenon occurs and latent heat is taken away, whereby the temperature of the air is cooled to the wet bulb temperature of the air. However, at the same time, the air to be cooled is humidified. This principle is widely known as humidification cooling from the following patent documents and the like, and evaporative coolers using the same are widely made and sold. The humidified and cooled zone (wet channel) and the zone through which the air to be cooled pass (dry channel) are separated, and the temperature cooled in the humidified and cooled zone is transferred to the zone of the air to be cooled by heat exchange. A system that only cools the sensible heat of the air in the cooling zone. A so-called indirect vaporizer cooler has already been manufactured and sold.

  JP-T-2004-513320   JP 2009-150632 A

  The invention of Patent Document 1 passes a gas flow that passes through a wet side that vaporizes water sucked up by a capillary phenomenon from a water tank disposed in the lower part, and a dry side that adjoins the wet side (which allows a fluid to be cooled to pass). The fluid is cooled by heat exchange. A first channel and a second channel are provided on the dry side of these substrates, and a number of holes are formed in the substrate. The base of such a structure is difficult to manufacture and the thermal efficiency is not good.

  Moreover, although the flow path base of Patent Document 2 is formed of synthetic resin, the number of bases B that maintain the distance between the flow path bases is large per square and is formed in a circular shape. Under the influence of the turbulent flow of the air passing through, the smooth air flow could not be obtained and the cooling efficiency was lowered. In addition, since the base is made of synthetic resin, the heat exchange efficiency of the base is low, and the indirect vaporization cooling device cannot be manufactured in a small size.

The indirect evaporative cooling device of the present invention improves the cooling efficiency of the conventional indirect evaporative cooling device and provides a device that can be installed in general households that are compact and energy-saving with good heat transfer efficiency. To do.
The present invention is to provide an indirect evaporative cooling device that increases the heat exchange rate and transmits it to the cooled air passing through the dry channel with the maximum heat exchange efficiency.

  Another object of the present invention is to provide an indirect evaporative cooling device that can be easily manufactured using a thin aluminum alloy sheet having excellent thermal conductivity as a base.

The subject of this invention can be achieved by the following structures.
A base made of a thin plate of an aluminum alloy with a corrugated structure is placed between a wet channel for generating vaporization and a dry channel through which air to be cooled passes, and the wet channel and the dry channel are alternately arranged. An indirect arrangement in which a large number of layers are arranged so as to be arranged, outside air is introduced into the aluminum alloy thin plates arranged in large numbers, and dry air is passed through the adjacent wet channels to cool the aluminum alloy thin plates. It is a structure of a type vaporization type cooling device.

  The object of the present invention is to have a water retention layer whose surface in the hollow of the base that forms the wet channel is subjected to a hydrophilic treatment, and a hydrophilic synthetic resin film is applied or woven as the water retention layer, This can be achieved by an indirect vaporization type cooling device in which hydrophilic short fibers made of nonwoven fabric are electrostatically flocked, and if necessary, these water retention layers are impregnated with silica gel and sponge-like titanium oxide fine particle adsorbents.

  The object of the present invention is to have a water retention layer whose surface in the hollow of the base that forms the wet channel is subjected to a hydrophilic treatment, and a hydrophilic synthetic resin film is applied or woven as the water retention layer, Hydrophobic short fibers made of nonwoven fabric electrostatically flocked, and if necessary, impregnated silica gel and sponge-like titanium oxide fine particle adsorbent in the water retaining layer, and the wet adjacent to the base dry channel・ Achieved by an indirect evaporative cooling system that forms a shielding wall at the edge of the inlet side on the inlet side of the air to be cooled and has a notch on the upper side of the wet channel to form an exhaust port it can.

  The object of the present invention is to form an exhaust port by opening a part of the upper edge of the base for forming a wet channel having a water retaining layer on the surface of a hollow structure of a thin aluminum alloy plate, and forming the exhaust port on the upper side. In this way, a plurality of layers are combined to form a wet channel and a dry channel, and these are stacked in multiple stages, and the air to be cooled is sent from the inlet side to the hollow portion in the thin aluminum alloy sheet of the base. The air is introduced into the base of the wet channel, and dry air is introduced into the base of the wet channel, and air containing moisture is exhausted from the exhaust port provided on the upper side. This can be achieved by an indirect evaporative cooling device that cools the air to be cooled passing through the aluminum alloy thin plate.

  The subject of the present invention is the indirect evaporative cooling used as a humidifier for introducing indoor return air into the wet channel, supplying air from the exhaust outlet of the wet channel into the room, and increasing the indoor humidity. Can be achieved by equipment.

  The indirect evaporative cooling device of the present invention is a system for exchanging heat between air and air. As this system, the air zone to be cooled (dry channel as described in, for example, Patent Document 1 is roughly classified. ) And air flow in the humidification / cooling zone (wet channel) by the orthogonal flow, the parallel flow method in which the air flow in both channels inserts air into each channel from the same direction, and wet -There is a countercurrent system in which the air flow is opposite between the channel and the dry channel. It is recognized that the heat exchange efficiency is better when the air flow is orthogonal, when the air flow is parallel and countercurrent.

  The aluminum alloy thin plate used in the present invention can be easily manufactured by a mold or the like in a molten state of aluminum metal. The alloy contains aluminum as a main component and various metals mixed in order to improve the conductivity of aluminum. For example, an aluminum alloy thin plate mixed with iron, manganese, zinc, and silicon is known. This aluminum alloy thin plate is easily molded, lightweight, easy to mass-produce, and inexpensive. The inner surface of the substrate forming the wet channel can be hydrophilized. For example, it can be processed by the method described in JP-A-2002-275407. Alternatively, a hydrophilic layer may be formed on the surface of the aluminum alloy sheet to form a water retaining layer by electrostatic flocking. When the water retention layer is coated with a fine particle adsorbent such as silica gel or titanium oxide, the water retention capability is increased.

  As the base of the wet channel used in the indirect vaporization cooling device of the present invention, the hollow shape of the aluminum alloy thin plate forming the dry channel is made different. For example, by changing the size of the hollow shape, the air flow in the wet channel can be made efficient.

  A water retaining layer for wetting water is formed on the inner surface of the base of the aluminum alloy thin plate that forms the wet channel of the present invention. It is preferable to use a material obtained by adhering fine particles of moisture adsorbent to the fiber. The thickness of the water retaining layer (sheet) is suitably about 0.05 mm to 0.5 mm.

  In order to maximize the vaporization phenomenon in the wet channel of the indirect vaporization cooling device of the present invention, it is appropriate that the amount of water introduced into the wet channel is moderately moist and the water flows. On the other hand, the vaporization phenomenon is reduced. For this purpose, water is retained in the wet membrane. For example, adsorbent fine particles such as silica gel and sponge-like titanium oxide are attached.

  As a method of supplying water into the base wet channel in the indirect evaporative cooling device of the present invention, the base exhaust port is positioned on the upper side, and the wet channel and the dry channel base are alternately placed. The layers are vertically stacked, and the stacked substrates are immersed in a water tank to supply water by the capillary action of the water retaining layer. Since water may not reach the upper end of the base with this water absorption force, water is supplied from above the base.

  As a method of flowing air into the wet channel and the dry channel that form the base of the indirect vaporization type cooling device of the present invention, a method of flowing in from a certain direction is preferable. Various methods can be considered for flowing a part of the air passing through the dry channel into the wet channel, but at the air outlet side (air supply to the room) of the dry channel, the air is statically discharged outside the machine. By simply applying pressure, some air flows into the open wet channel substrate (split type).

  The amount of air introduced into the wet channel formed as described above is suitably 30 to 50% of the amount of air passing through the inside of the base. By changing the external static pressure on the outlet side of the base, a part of the air coming out of the dry channel flows into the wet channel. In this case, according to the experimental value, when a static pressure of about 90 to 100 Pascal is applied as the external static pressure, about 30% of the air flows into the base B. In addition, the air flowing into the wet channel is exhausted out of the machine from the exhaust port of the notch provided on the upper side of the base board after the vaporization phenomenon occurs in the channel.

  In order to generate the maximum vaporization phenomenon in the wet channel in the indirect vaporization type cooling apparatus of the present invention, it is necessary to appropriately select the flow rate of water and the diversion rate. As a result of the test analysis based on the experimental values, these elements are appropriate values having a flow path height of 1 to 5 mm and a flow rate of 1 to 5 m / sec.

  Since the aluminum alloy thin plate of the indirect vaporization type cooling device of the present invention is used, it is excellent in heat conduction efficiency and energy saving. In addition, even if a large number of substrates are stacked, the entire apparatus can be configured to be lightweight.

  By supplying the air exhausted from the exhaust port of the indirect vaporization cooling device of the present invention into the room, it can be used as a small humidifier.

  The aluminum alloy thin plate used in the present invention is preferably excellent in heat conduction efficiency, and for example, an aluminum member described in Japanese Patent Application Laid-Open No. 2008-307553 can be used. A base having a large number of flow holes between two aluminum plates can also be used. What formed the water retention layer which gave hydrophilic films, such as polyvinyl alcohol system resin and polyethylene glycol system resin which are hydrophilic synthetic resins, on the surface of these aluminum alloys is good.

It is the schematic of the 1st Example of the board | substrate used for this invention indirect vaporization type cooling device. It is a perspective view of 2nd Example of the base | substrate used for this invention. FIG. 3 is a schematic side view of FIG. 2. It is a partial expanded explanatory view which shows the internal state of the indirect vaporization type cooling device of this invention. It is explanatory drawing of the Example of the water supply structure arrange | positioned at the cooling unit upper part of this invention. It is a perspective view which shows one Example of the whole indirect type vaporization cooling device of this invention. It is the schematic explaining the structure of the shunt type | mold of the cooling part of the indirect vaporization type cooling device of this invention. It is the schematic explaining the orthogonal type | mold structure of the cooling part of this invention. It is the schematic which shows the parallel type | mold structure of the cooling part of this invention.

The indirect vaporization type cooling device of the present invention will be described based on an embodiment shown in the drawings.
As shown in FIG. 1, the substrate 1 is formed by a thin plate 2 of an aluminum alloy having a corrugation structure. Reference numeral 4 denotes a substrate B on the wet channel side provided with a water retention layer 3 whose inner surface is hydrophilized. This shows a state in which the base B4 is placed between the bases 1 and stacked, and the base 1 and the base B4 are formed by an aluminum alloy thin plate 2 having good air flow. It has a water retention layer 3 having excellent water moisture retention. As the water retaining layer 3, the surface is coated with a hydrophilic film resin, and short fibers such as woven fabric and non-woven fabric are implanted. In addition, a water-retaining film layer may be formed by forming a hydrophilic film formed by spraying or adhering fine particles of a water adsorbent such as spongy titanium oxide or silicon oxide on the water-retaining layer.

  A base B4 is disposed so as to be in contact with the water retention layer 3 on the outer surface of the base 1, and a wet channel is formed so as to dispose the base 1 at a predetermined interval. Air to be cooled, that is, air flowing into the substrate 1 does not enter the wet channel. The base B4 is formed of a thin plate 2 made of aluminum alloy, and an exhaust port 11 is formed by cutting out a part of the upper edge of the base plate B4. The dry air inflow side of the side wall of the base B4 is open, but the other side is shielded by a frame. The base B4 has a hollow space larger than that of the base 1.

  The substrate 1 and the substrate B4 are laminated and stacked, and are fixed by a round bar or the like to form the cooling unit 5. The lower end (bottom) of the cooling unit 5 is provided with a water tank 6 in which water is stored, and the lower end of the base 1 is immersed therein. Further, a water supply unit 7 as shown in FIG. 5 is placed on the upper side of the cooling unit 5. The water supply unit 7 includes a water supply pipe 8 and a watering nozzle 9 and is accommodated in a lid 10 of the cooling unit 5.

Description of the operation of the indirect vaporization cooling device of the present invention.
A water retaining layer 3 is provided on the inner surface of the base B 4, the base B 4 and the base 1 are arranged in a vertical shape, and the lower side is immersed in the water tank 6. On the other hand, the water supply part 7 which is a watering member is arrange | positioned on the upper side, and water is supplied to the water retention layer 3 of the base | substrate 1 from the upper part of the base | substrate B4 as needed. Cooled air is inserted into the dry channel from the inlet side of the base (aluminum alloy thin plate) 1 arranged vertically. At this time, it is blocked and does not flow into the base B4. The air that has passed through the hollow of the base 1 is cooled by heat exchange of the base 1 and is discharged from the air inlet side to the room and supplied to the room. A static pressure of 90 to 100 Pascal is applied near the outlet, and a part of the discharged air is blown into the base B4 and passes through the base B4, and this air is adsorbed in the water retention layer 2 of the base 1. The board | substrate 1 is cooled by the vaporization phenomenon of the water | moisture content. The moisture-containing air is exhausted from the exhaust port 11. In this way, the air in the dry channel is cooled by heat exchange.

  Water is supplied to the water retention layer 3 of the base 1 immersed in the water tank 6 disposed at the bottom of the apparatus by capillary reduction. Moreover, water is supplied from the watering nozzle 9 of the water supply part 7 arrange | positioned in the lid | cover 10 mounted in the upper end of the base | substrate 1 as needed, and the water retention layer 2 is moistened. Do not launch into the dry channel at this time.

The indirect evaporative cooling device of the present invention is described as a “split type” in which the counterflow direction of the air to be cooled in the cooling section and the air flow in the base B4 (wet channel) are counterflows as shown in FIG. Then, a part of the exhaust from the dry channel is supplied into the base B4 by static pressure in the wet channel. A flow rate rectifying plate may be disposed in this.
Further, as shown in FIG. 8, it is possible to make it “orthogonal”, and as shown in FIG. 9, it is made “parallel” so that all the air supplied into the dry channel and the wet channel can be obtained. It can also be made to exhaust from each channel. In this case, it is very efficient to use indoor return air as the air introduced into the wet channel.

  This machine cools air using only the vaporization phenomenon of water and does not use any refrigerant gas. The use of refrigerant gas is considered to be a cause of global warming and has a great effect on CO2 reduction. Further, since no compressor, no energy such as electricity and gas is used, the utility value is very wide.

1 Base 2 Aluminum alloy sheet 3 Water retention layer 4 Base B
5 Cooling unit 6 Water tank 7 Water supply unit 8 Water supply pipe 9 Sprinkling nozzle 10 Lid 11 Exhaust port

Claims (5)

  A base made of a thin plate of an aluminum alloy with a corrugated structure is placed between a wet channel for generating vaporization and a dry channel through which air to be cooled passes, and the wet channel and the dry channel are alternately arranged. A large number of layers are arranged so as to be arranged, outside air is introduced into the aluminum alloy thin plates arranged in large numbers, and dry air is allowed to pass through the adjacent wet channels to cool the aluminum alloy thin plates. An indirect evaporative cooling device characterized by   The surface of the base hollow forming the wet channel has a water retention layer in which a hydrophilic treatment is performed, and a hydrophilic synthetic resin film is applied as the water retention layer, or a hydrophilic short layer made of woven fabric or nonwoven fabric. 3. The indirect vaporization according to claim 1 or 2, wherein the fibers are electrostatically flocked, and if necessary, the water retention layer is impregnated with silica gel and sponge titanium oxide fine particle adsorbent. Cooling device.   The surface of the base hollow forming the wet channel has a water retention layer in which a hydrophilic treatment is performed, and a hydrophilic synthetic resin film is applied as the water retention layer, or a hydrophilic short layer made of woven fabric or nonwoven fabric. Electrostatic flocked fibers, and if necessary, impregnated silica gel and sponge titanium oxide fine particle adsorbent in these water retention layers, allowing cooling air to flow into the wet channel adjacent to the dry channel of the base 3. The side wall according to claim 1 or 2, wherein a shielding wall is formed projectingly on the side edge of the inlet, and an exhaust port is formed by having a notch on the upper side of the wet channel. Indirect evaporative cooling device.   A part of the upper edge of the base that forms a wet channel with a water retention layer is formed on the surface of a hollow structure of an aluminum alloy thin plate, and an exhaust port is formed by opening a part of the upper edge of the substrate. The wet channel and the dry channel are formed, and these are laminated in multiple stages, and the air to be cooled is fed from the inlet side into the hollow portion in the thin plate of the base aluminum alloy, and the air inlet side The air is supplied to the outside of the wet channel and the dry air is introduced into the base of the wet channel, the air containing moisture is exhausted from the exhaust port provided on the upper side, and passes through the aluminum alloy thin plate of the dry channel. An indirect evaporative cooling device characterized by cooling the air to be cooled.   5. A return air in a room is introduced into the wet channel, and air is supplied into the room through an exhaust port of the wet channel to be used as a humidifier for increasing the humidity in the room. The indirect vaporization type cooling device according to any one of the above items.

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