JP3065559U - Glass coating card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lightweight card material having rigidity, water repellency, water resistance, antifouling property, abrasion resistance and flexibility, having a room temperature glass coating layer formed on a surface thereof. The present invention provides a glass-coated card such as an IC card and a credit card manufactured by the company. SOLUTION: A room temperature glass is prepared by using a liquid composition of a single composition or a composite composition of a hydrolyzable organometallic compound which contains a boron ion and a halogen ion as a catalyst required for oxidization (vitrification) on the surface and is melted in alcohol. A glass-coated card comprising a stack of at least two paper card materials having a coating layer formed thereon and an IC chip mounted between the stacked paper card materials. .

Description

[Detailed description of the invention]

[0001]

[Industrial technical field]

 The present invention relates to a lightweight, glass-coated card having rigidity, water repellency, water resistance, stain resistance, abrasion resistance and flexibility.

[0002]

[Prior art]

 Cards such as IC cards are made by attaching a magnetic tape storing predetermined information to the surface of a thin plate made of plastic or the like, or by embedding various IC chips inside. In particular, recently, in addition to contact cards, non-contact IC cards used in so-called electronic money systems have been put into practical use.

In the case of an IC card as an example, these cards include an antenna (winding coil, embedded coil, etching coil, printed wiring coil, printed coil, on-chip coil, etc.) and an IC module (IC, capacitor). , A substrate, etc.), and a card material that constitutes the card body, a reinforcing material that is built into the card if necessary, and an adhesive, etc. The card material is polyvinyl alcohol. (PVC), ABS resin, polyethylene terephthalate (PET) and the like were used.

[0004]

[Problems to be solved by the invention]

 These cards mainly have the same thickness (0.76 mm) as current credit cards and the like, but have improved portability and will have a thickness of about 0.2 to 0.3 mm in the future. It is expected that.

[0005] As the miniaturization and thinning of cards have been promoted in this way, the IC chips to be included have a rigidity, water repellency, water resistance, stain resistance, abrasion resistance, and so on. Flexibility and lightness are required. In addition, since these card materials are provided at low cost, it is required that they be inexpensive and that they can be incinerated safely so that used IC cards can be easily disposed of.

Conventionally, resins such as PCV, ABS, and PET are excellent in rigidity, water repellency, water resistance, and stain resistance, have a certain degree of flexibility, and are easy to process in carding. It has been frequently used as card material. IC cards are often carried in a wallet or card case, but at this time, the force to bend the IC card is repeatedly applied. It is not perfect in terms of sex.

Although the resin is soft and excellent in workability such as carding, the surface is liable to wear due to contact with clothing pockets or purses after carding, and printing on the surface is difficult. Another problem is that marks, characters, patterns, and the like that have been embossed or the like are difficult to identify.

[0008] When disposing of a card whose expiration date has expired or is no longer used for any reason, depending on the material, etc., it is safe that environmental hormones (endocrine disrupting substances) and toxic dioxins may be generated. There are also sexual issues.

The present invention has been made in view of the above-mentioned conventional problems, and a core material made of paper or the like made of resin such as PCV, ABS, PET or the like having a room temperature glass coating layer formed on a surface thereof is used as a card material. It is an object of the present invention to provide a lightweight glass-coated card that can be manufactured at low cost, is excellent in rigidity, water repellency, water resistance, stain resistance, abrasion resistance and flexibility, and is lightweight.

[0010]

[Means for Solving the Problems]

 In order to achieve the above object, the invention according to claim 1 of the present application is applied to a glass coating card, the surface of which contains a boron ion and a halogen ion as a catalyst necessary for oxidization (vitrification), and is a hydrolyzable organic compound melted in alcohol. Laminate at least two or more paper card materials on which a room temperature glass coating layer is formed by using a liquid compound having a single composition or a composite composition of a metal compound, and mount an IC chip between the laminated paper card materials. Do it, The invention according to claim 2 of the present application is the glass coated card according to claim 1, wherein the paper card material is laminated in three layers, and the paper card material laminated in the middle has a hollow portion. The IC chip is mounted in the hollow portion of the paper card material laminated in the middle. Further, according to the invention of claim 3 of the present application, in the glass-coated card of claim 1, the paper card material is laminated in two layers, and a concave portion is formed in one of the paper card materials. The IC chip is mounted in a recess provided in the one paper card material. The invention according to claim 4 of the present application relates to a glass-coated card, which is used as a catalyst necessary for oxidizing (vitrifying) the surface of a card material such as polyvinyl alcohol (PVC), ABS resin, and polyethylene terephthalate (PET). A room-temperature glass coating layer is formed by using a solution of a single composition or a composite composition of a hydrolyzable organic metal compound containing boron ions and halogen ions and melted in alcohol.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

 FIG. 1 illustrates a glass-coated card according to an embodiment of the present invention, in particular, an embodiment in which the card is applied to an IC card using a paper material. The card material of the glass-coated card applied to the IC card according to the embodiment of the present invention, that is, the state of the paper core material constituting the card material and the room-temperature glass coating layer formed on the surface thereof are schematically illustrated. It is shown in a typical manner. In the figure, 1 and 3 are room temperature glass coating layers that provide rigidity, water repellency, water resistance, stain resistance and abrasion resistance to the card surface, and 2 is paper made to ensure flexibility and light weight of the card itself. The respective core materials are shown. The core 2 is made of a raw material such as pulp or the like obtained by filtering bark fiber, and is made of a paper material obtained by drying the raw material. The glass-coated card of the present invention is manufactured by forming raw materials such as pulp into a predetermined shape of an IC card under pressure, mounting an IC chip, and bonding with an appropriate adhesive.

In manufacturing the core material 2, Western paper, Japanese paper (handmade high-quality Japanese paper, plain Japanese paper made by machine-making), fibers made of non-woven fabric with enhanced strength, which are often used recently, and the like are used. be able to. Nonwoven fabrics are made by entanglement of all fibers, such as paper fibers and cloth fibers, using an adhesive or the like, and differ from paper in that no adhesive is used. is there. That is, paper is the same as a nonwoven fabric in that it is made by entanglement of plant fibers, but paper uses water instead of an adhesive, focusing on the fact that the plant fibers are hydrophilic. It is manufactured.

[0013] In other words, instead of the adhesive, water is used as a medium, and after making the water, the water is dried with water, and the resulting paper fibers (vegetable fibers) are entangled. The material is paper, and the non-woven fabric is made of fibers entangled using an adhesive instead of water. By using such a non-woven fabric, it is possible to finish as a core material for a card material having excellent water repellency, without consuming a large amount of water, at lower cost than using a normal paper material.

The room-temperature glass coating layer 1 or 3 is formed by spraying a core material into a liquid agent comprising the following components, by brushing, or by dipping or printing such as gravure coating or offsetting. is there. If the core material is immersed in the liquid agent, a room temperature glass coating layer can be formed on both the front and back surfaces of the core material as shown in FIG. On the other hand, when the liquid agent is sprayed or brushed, the room-temperature glass coating layer can be formed only on the desired surface, either the front or back of the core material, as shown in FIG.

The room-temperature glass coating layer is formed such that the room-temperature glass coating layer is formed on all surfaces exposed to the outside in the IC card as a finished product. Therefore, a room-temperature glass coating layer is formed on the surface of the IC card as a finished product, which is not particularly exposed to the outside, in particular, the adhesive surface between paper card materials, so that the rigidity, water repellency, and water resistance of the IC card are obtained. Sufficiency, antifouling property and abrasion resistance. In order to further improve the rigidity, water repellency, water resistance, stain resistance and abrasion resistance of the finished IC card, in addition to the above-mentioned exposed surface, the IC card is mounted on the IC chip mounting surface and its internal surface such as the side and top surfaces. Also forms a room temperature glass coating layer. Since the room temperature glass coating layer has excellent insulation properties, if the room temperature glass coating layer is formed on the IC chip mounting surface as described above, the IC chip may be short-circuited and malfunction may occur. Can also be prevented.

The liquid agent includes a main agent obtained by melting a silicon-containing organosiloxane and an organopolysiloxane with a lower alcohol, an ammonium salt (eg, ammonium chloride (NH ₄ Cl)), a boron ion-forming substance (eg, triethoxyborane). (B (Et) ₃ )) and a catalyst obtained by melting an organometallic compound (for example, metal alkoxide) containing Ti (titanium) and Sn (tin) in a lower alcohol were melted at a predetermined ratio with a diluting solvent. Use a coating agent.

The catalyst may be a fluorine compound (for example, sodium fluoride) instead of the ammonium salt. Further, the organometallic compound containing Ti (titanium) and Sn (tin) may be An organic metal compound containing Zn (zinc), Al (aluminum), or the like may be used instead of Ti, titanium, and Sn (tin).

The formation of the room-temperature glass coating layer 1 or 3 is based on the fact that the functional group R (methyl group, phenyl group, etc.) of the organopolysiloxane is hydrolyzed by moisture in the air as shown in the following formula 1. Then, as shown in the following formula 2, the hydroxyl group of the organopolysiloxane produced by this reaction is attacked by the functional group of the cross-linking agent (organosiloxane having a functional side chain). It also undergoes a dealcoholization reaction under the action of a catalyst, and is formed of a cured polysiloxane, which is a polymer compound having a three-dimensional structure.

[0019]

(Equation 1)

[0020]

(Equation 2)

When this is represented by a chemical reaction formula, it is represented by the following formulas 3, 4, 5, and 6.

[0022]

(Equation 3)

[0023]

(Equation 4)

[0024]

(Equation 5)

[0025]

(Equation 6)

[0026] Further, by the catalyst, B³⁺And X^-(Halogen ion) to complex ion BX_Four ^- And metal-containing organic compound (metal alkoxide) M (OR)_nM (metal) and BX_Four ^-B very easily causes a substitution reaction, and the complex ion MX_{n + 1} ^-Then, this complex ion MX_{n + 1} ^-Is hydrolyzed and hydrolyzed to form M (OH) _n Causes a dehydration condensation reaction, and a metal oxide (glass) is obtained at room temperature.

In the manufacture of the glass-coated card of the present invention, first, a raw material in which pulp material and resin are mixed is prepared. Next, this raw material is paper-formed using a paper-making machine, and has a predetermined size (for example, a rectangular shape of 60 cm × 90 cm and a thickness of 1.0 mm to 3.5 mm after drying because it contains moisture). ) Core material 2 is prepared.

Next, the core material 2 is cut into a size (for example, 5.5 cm × 8.5 cm) necessary for manufacturing an IC card by a cutting machine, and is pressed by a press machine. It is formed into an IC card shape. Next, the core material 2 is immersed in a coating tank containing a separately prepared glass coating agent and taken out.

When the core material 2 is dried at, for example, 80 ° C. for 1 hour, so-called coating films of about 10 μm to 13 μm are formed as the room-temperature glass coating layers 1 and 3 to form the room-temperature glass coating layer. It becomes paper card material. As described above, in forming a coating layer on the core material 2, a coating agent is put into a spray container, and a glass coating agent is sprayed from the spray container onto the core material 2 to form the coating layer 1 or 3. Alternatively, the paper card material may be formed by coating with a brush or formed by printing such as gravure coating or offset to form a room temperature glass coating layer. In the above description, the size of the core material 2 is described as a rectangular shape of 60 cm × 90 cm and a thickness of about 1 mm to 3.5 mm. From now on, ten pieces of 5.5 cm × 8.5 cm card materials will be described. Manufacturable. The size of the core material 2 is appropriately determined according to the size and thickness of the completed IC card, and is not limited to this size.

Further, the card material may be colored to draw a picture, or an appropriate pattern may be printed by a normal printing technique to form the normal glass coating layer. Further, since the core material is paper, it can be embossed (textures and symbols can be represented by making the surface uneven).

When the core material 2 is not cut after the room temperature glass coating layer is formed, the room temperature glass coating layer remains at the cut end of the core material 2 as shown in FIG. As described, when two or more card materials are manufactured simultaneously by a press machine and then cut into individual card materials, the press is performed after forming a room temperature glass coating layer. In such a case, as shown in FIG. 1 (d), the paper as the core material may be exposed at the cut end of the core material 2 (in both cases, both the front and back sides of the core material 2). When a room temperature glass coating layer is formed on the surface). In this way, the stage and method of forming the room-temperature glass coating layer should be determined by examining where the coating layer should be formed in the finally manufactured card material. Decide appropriately. In some cases, the room temperature glass coating layer is first formed on the core material 2 and then formed into a predetermined shape by a press machine. If necessary, the room temperature glass coating layer may be additionally formed by spraying or the like after forming the predetermined shape.

FIG. 2 shows a glass-coated card according to claim 2 of the present application. In FIG. 2, (a) is a diagram showing a rectangular IC card in a cross section in a long side direction, and (b) is a diagram. FIG. 3 is a diagram showing a rectangular IC card in a cross section in a short side direction. In the figure, 4 is a first card material of paper card material laminated in three layers, 5 is a second card material of paper card material laminated in three layers, and 7 is 3 card material. A third card material of the paper card material laminated on the layers, and 6 denotes an IC chip mounted in a hollow portion of the second card material. In this embodiment, the second paper card material 5 has substantially the same thickness as the IC chip to be mounted, is punched into the same shape as the IC chip, is shaped like a frame, and is mounted. It has a function as a spacer for supporting the IC chip from four sides. On the other hand, the first paper card material 4 and the third paper card material 7 are flat. The first paper card material 4 supports the upper part of the IC chip to be mounted, and the third paper card material 7 provides a mounting surface for the IC chip.

The mounting of the IC chip on the paper card material and the bonding of the paper card materials are performed as follows, for example. First, a flat paper card material 7 and a paper card material 5 as a frame are bonded using an adhesive ordinarily used for bonding glass so that the four sides coincide. Next, the IC chip 6 is mounted in the hollow portion of the paper card material 5. If the dimensions of the hollow portion are substantially the same as those of the IC chip, the IC chip is simply mounted, and there is no need to fix it using an adhesive or the like. Then, the paper-made card material 4 is adhered so as to cover the upper portion of the paper-made card material 5 so that the four sides thereof are aligned with each other using an adhesive or the like usually used for bonding glass.

In the present embodiment, the card material 5 is made hollow while the other card materials 4 and 7 are made flat. However, the thickness of the card material 5 is made smaller than the thickness of the IC chip to be mounted, and A recess may be formed in the members 4 and / or 7, so that when both are bonded, an internal space having the same depth as the mounted IC chip can be created.

FIG. 3 shows a glass-coated card according to the third aspect of the present invention. In FIG. 3, (a) is a diagram showing a rectangular IC card in a cross section in a long side direction, and (b) is a diagram. FIG. 3 is a diagram showing a rectangular IC card in a cross section in a short side direction. In the drawing, 8 is a first card material of paper card materials laminated in two layers, 10 is a second card material of paper card materials laminated in two layers, 9 is The IC chips mounted in the recesses of the second card material are shown. In the present embodiment, the second paper card material 5 has a thickness greater than the IC chip to be mounted, provides a mounting surface for the IC chip, and the recess has substantially the same shape as the IC chip, and And has a function of supporting the mounted IC chip from the bottom and four sides. On the other hand, the first paper card material 8 has a flat plate shape and supports the upper part of the IC chip to be mounted.

The mounting of the IC chip on the paper card material and the bonding of the paper card materials are performed, for example, as follows. First, the IC chip 9 is mounted in the concave portion of the paper card material 10. In mounting, as long as the dimensions and shape of the hollow portion are substantially the same as the dimensions and shape of the IC chip, the IC chip is simply mounted and there is no need to fix it using an adhesive or the like. Then, the paper card material 8 is adhered so as to cover the upper portion of the paper card material 10 with the four sides thereof aligned with each other using an adhesive or the like generally used for bonding glass.

In the present embodiment, the concave portion is provided only in the paper card material 10, but when the paper card materials 8 and 10 are bonded, an internal space having the same depth as the IC chip to be mounted is created. As described above, both the paper card materials 8 and 10 may be provided with concave portions.

In the embodiment shown in FIGS. 2 and 3, a flat paper card material can be further added and laminated. As a result, the thickness of the IC card as a finished product can be freely controlled, and the room temperature glass coating layer and paper core material, such as rigidity, water repellency, water resistance, stain resistance, abrasion resistance, and flexibility, can be used. The degree of excellent properties provided can be freely controlled. In addition, as described above, by controlling the thickness of the card material part freely, in the non-contact type IC card, control is performed such that the antenna coil inside the IC card is not reached unless the electromagnetic field has a constant strength. It is also easy. This makes it easy to control the IC chip mounted on the IC card so that it does not operate at a certain distance from the reader / writer device that communicates with the IC card.

In the above embodiment, a non-contact type IC card using a paper material as a core material has been described as an example. However, this is not limited to a non-contact type IC card. IC cards, or so-called plastic credit cards, bank cash cards, telephone cards, orange cards, etc. that use conventionally used polyvinyl alcohol (PVC), ABS resin, polyethylene terephthalate (PET), etc. The surface of prepayment cards, member's cards, etc. may be coated with glass, and when applied to these cards, rigidity, water repellency, water resistance, stain resistance and abrasion resistance are further improved. In addition to conventional polyvinyl alcohol (PVC), ABS resin, polyethylene Compared to a so-called plastic card such as terephthalate (PET), the coated surface has an excellent advantage in that the frictional property is reduced, so-called slipperiness is reduced, and slippage from a wallet or a card case is reduced. This is because the glass coating according to the present invention is applied.

[Effect of the invention]

As described above, in the glass-coated card of the present invention, a core material is manufactured from raw materials such as pulp, and a base material obtained by melting organosiloxane and organopolysiloxane containing silicon with a lower alcohol and an ammonium salt ( For example, ammonium chloride (NH ₄ Cl)), a boron ion generating substance (for example, triethoxyborane (B (Et) ₃ )), and an organic metal compound containing Ti (titanium) and Sn (tin) (for example, metal alkoxide) ) Is melted in a lower alcohol with a catalyst in a predetermined ratio with a diluting solvent. A coating agent is applied to the core material and then dried to form a room-temperature glass coating layer to produce a card material. It has rigidity, water repellency, water resistance, stain resistance, abrasion resistance and flexibility, and is lightweight.

Thus, in the glass coated card of the present invention, when a paper material is used as the card material, the rigidity is lower and the rigidity is lower than those using a resin such as PVC, ABS resin, or PET. It can achieve properties comparable to those in water repellency, water resistance and stain resistance. The glass coated card of the present invention has a room-temperature glass coating layer formed on its surface, so it achieves superior effects in terms of abrasion resistance and flexibility compared to the conventional card material described above. This eliminates the situation where the characters, embossments and patterns on the surface wear out and become indistinguishable with multiple cards, and even if the IC card is twisted or bent while being carried, damage may occur. Can be hardwired. For this reason, the glass-coated card of the present invention has a high utility value as a contact-type IC card as well as a contact-type IC card.

When the glass coated card of the present invention is made of a paper material, it does not generate environmental hormones (endocrine disrupting substances) or toxic dioxins even if it is incinerated and disposed of. It is effective in terms of.

Further, the glass coated card of the present invention can be easily applied to conventional cards using resins such as PVC, ABS resin and PET in terms of surface treatment. This has the effect of increasing the difficulty of slipping on the surface and reducing the risk of slipping off the wallet or card case.

[Brief description of the drawings]

FIG. 1 is a view for explaining a room temperature glass coating layer formed on the surface of a paper card material constituting the glass coating card of the present invention.

FIG. 2 is a diagram showing a cross section of a glass-coated card according to an embodiment of the present invention, wherein (a) is
A diagram showing a rectangular IC card in a cross section in a long side direction,
(B) is a diagram showing a rectangular IC card in a cross section in the short side direction.

FIG. 3 is a diagram showing a cross section of a glass-coated card according to an embodiment of the present invention, wherein (a) is
A diagram showing a rectangular IC card in a cross section in a long side direction,
(B) is a diagram showing a rectangular IC card in a cross section in the short side direction.

[Explanation of symbols]

 1,3 ·· Room temperature glass coating layer 2 ·· Core material 4,5,7,8,10 ·· Paper card material 6,9 ··· IC chip

Claims (4)

[Utility model registration claims] 1. A solution containing a single or composite composition of a hydrolyzable organometallic compound which contains boron ions and halogen ions as a catalyst necessary for oxidization (vitrification) on the surface thereof and is melted in alcohol at room temperature A glass-coated card comprising at least two or more paper card materials having a glass coating layer formed thereon, and an IC chip mounted between the stacked paper card materials. 2. The paper card material is laminated in three layers, and the paper card material laminated in the middle has a hollow portion.
The glass coated card according to claim 1, wherein a C chip is mounted in the hollow portion of the paper card material laminated in the middle. 3. The paper card material is laminated in two layers, and
A recess is provided in one of the paper card materials, and an IC is provided.
The glass-coated card according to claim 1, wherein the chip is mounted in a concave portion provided in the one paper card material. 4. Polyvinyl alcohol (PVC), AB
A single composition of a hydrolyzable organometallic compound containing boron ions and halogen ions as a catalyst necessary for oxidization (vitrification) on the surface of a card material such as S resin and polyethylene terephthalate (PET), A glass-coated card, wherein a room-temperature glass coating layer is formed using a liquid composition having a composite composition.