JP3034740B2 - Connector integrated sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a resin housing for housing a sensing element, in which a connector having a terminal is formed, and a capacitor for preventing line noise is fixed to the terminal. Related to a connector-integrated sensor.

[0002]

2. Description of the Related Art FIG.
No. 541 and the like, a cross-sectional view of a conventional pressure sensor in which measures against electromagnetic noise are taken, and FIG. 10 is a diagram showing an assembly of a shield cover and a capacitor of the pressure sensor. In the figure, reference numeral 1 denotes a pressure-sensitive element 1 as a sensing element which is one of electronic circuit elements. This pressure-sensitive element 1
Has a semiconductor diaphragm using a semiconductor piezoresistive effect inside. 2 is a hybrid IC for amplifying a signal from the pressure-sensitive element 1 and compensating for temperature, 3 is a board on which the pressure-sensitive element 1 and the hybrid IC 2 are mounted,
Reference numeral 4 denotes a terminal which is electrically connected to the substrate 3 and serves as an input / output terminal for an external device. This terminal 4 is 3
It is composed of two electric wires (power supply line, signal output line, ground line), one of which is a ground line connected to the ground.

[0005] Reference numeral 5 denotes a shield cover as a shield member that covers the pressure-sensitive element 1 and the hybrid IC 2 and blocks radio wave noise that enters the pressure-sensitive element 1 from the outside. This shield cover 5 is electrically and mechanically attached to the substrate 3. Reference numeral 6 denotes a capacitor for preventing line noise from the terminal 4. The capacitor 6 is formed of a concentric double cylinder, and a projection 5a of the shield cover 5 is connected to the outer cylinder side by soldering.
A terminal 4 penetrating the inner cylinder is connected to the inner cylinder by soldering. The space between the inner cylinder and the outer cylinder is filled with a dielectric. Reference numeral 7 denotes a resin housing that accommodates and protects the pressure-sensitive element 1, the hybrid IC 2, the substrate 3, a part of the terminal 4, the shield cover 5, and the capacitor 6 in the recess 7a.

[0004] Reference numeral 8 denotes a terminal 4
Is a connector portion formed in an inserted state. The connector portion 8 is electrically connected to an external device via the terminal 4 by being mechanically connected to an external connector (not shown). 9 is the housing 7
And a resin housing cap 1 in which a gas introduction hole 9a for pressure detection is formed.
Reference numeral 0 denotes a pressure sensor as a connector-integrated sensor including the pressure-sensitive element 1, the hybrid IC 2, the substrate 3, the terminal 4, the shield cover 5, the capacitor 6, the housing 7, the connector 8, and the housing cap 9.

Next, the operation of the pressure sensor 10 will be described. The detection gas G guided into the gas inlet 9a of the housing cap 9 reaches the position of the semiconductor diaphragm of the pressure-sensitive element 1, and deforms the semiconductor diaphragm. For this reason, the pressure-sensitive element 1 has a shape corresponding to the degree of distortion caused by the deformation amount of the semiconductor diaphragm at this time.
A pressure signal is output by the semiconductor piezoresistive effect. This pressure signal is amplified by the hybrid IC 2, temperature-compensated, and output from the signal output line of the terminal 4 of the connector section 8 to the outside.

On the other hand, since the pressure signal from the pressure sensing element 1 of the pressure sensor 10 is a small signal, it is sensitive to external electromagnetic noise and is greatly affected by the electromagnetic noise. Therefore, in such a pressure sensor 10, it is necessary to take measures to prevent electromagnetic noise. In general, electromagnetic noise includes radio wave noise that propagates in the air and line noise that comes on a wire.
To prevent radio noise, and the capacitor 6 to prevent line noise.

That is, radio noise propagating in the air to the pressure-sensitive element 1 is blocked by the shield cover 5, and escapes from the shield cover 5 through the substrate 3 to the ground wire of the terminal 4. Therefore, radio wave noise does not reach the pressure-sensitive element 1 side. Further, line noise propagating from the power supply line and the signal output line of the terminal 4 to the pressure sensing element 1 side is cut off by the capacitor 6.
After reaching the shield cover 5 through the substrate 3, it escapes to the ground wire of the terminal 4. Therefore, the line noise does not reach the pressure-sensitive element 1 side.

Next, a procedure for manufacturing the pressure sensor 10 will be described. First, with the terminal 4 inserted into the mold, a housing material including the connector portion 8 is poured into the mold including the connector portion 8 to form the housing 7 including the connector portion 8 by a so-called insert molding method.
Next, as shown in FIG. 10, the shield cover 5 and the capacitor 6 joined by solder are incorporated in the housing 7. In this case, the recess 7a of the housing 7
The shield cover 5 is inserted into the inside of the housing 7, and the inner cylinder of the capacitor 6 is inserted into the end of the terminal 4 projecting toward the recess 7a of the housing 7, and the terminal 4 and the capacitor 6 are soldered. Next, the substrate 3 on which the pressure-sensitive element 1, the hybrid IC 2, and the like are mounted is incorporated into the housing 7, and the shield cover 5 and the terminal 4 are mounted.
Is soldered to a predetermined position on the substrate 3. Finally, if the recess 7a of the housing 7 is covered with the housing cap 9, the pressure sensor 10 is completed.

[0009]

SUMMARY OF THE INVENTION A conventional pressure sensor 10
Is configured as described above, the pressure sensor 1
In order to manufacture the 0, the terminal 4 and the capacitor 6 must be soldered in the housing 7, and there is a problem that the manufacturing is not easy. Note that for this,
It has also become difficult to automate the production line of the pressure sensor.
In addition, it is necessary to secure a space for accommodating the capacitor 6 in the concave portion 7a of the housing 7, and there is a problem that the pressure sensor 10 becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. Even if a capacitor for preventing line noise is provided, it is easy to manufacture and the size can be reduced. An object of the present invention is to provide a connector-integrated sensor.

[0011]

According to a first aspect of the present invention, the capacitor is fixed to the shield cover.
In both cases, the tip of the terminal is inside the shield cover.
And the capacitor and the seal
The capacitor side of the cover is
It is buried in a housing .

[0012]

In the connector-integrated sensor according to the first aspect of the present invention, a capacitor and a capacitor for preventing line noise are provided.
The shield cover on the sensor side by insert molding.
To reduce the size of the sensor and reduce the number of assembly steps.
I tried to ease of manufacture me. In addition, radio noise propagating in the air and traveling toward the sensing element is blocked by the shield cover, and is released to the outside via the shield cover. In addition, since the distal end of the terminal is disposed inside the shield cover, the size of the sensor is further reduced.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. Reference example 1 . Figure 1 is a sectional view of a pressure sensor according to one reference example of the present invention,
FIG. 2 is a side view of the terminal assembly. In addition,
The same or corresponding portions as those of the pressure sensor shown in FIG. 9 are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 1, reference numeral 20 denotes a shield cover as a shield member which covers the pressure-sensitive element 1 and the hybrid IC 2 and protects them from external radio noise. This shield cover 20 is electrically and mechanically attached to the substrate 3. Reference numeral 21 denotes a second shield cover divided from the shield cover 20. The second shield cover 21 is soldered to the outer cylinder of the capacitor 6 and is connected to a ground wire of the terminal 4 via a bypass wire (not shown). 22 is Terminal 4
, The capacitor 6, and the second shield cover 21 in advance.

Reference numeral 23 denotes a resin housing for accommodating and protecting the pressure-sensitive element 1, the hybrid IC 2, the substrate 3, a part of the terminal 4, and the shield cover 20 in the recess 23a.
Reference numeral 4 denotes a terminal assembly 2
Reference numeral 2 denotes a connector portion formed in an inserted state. The function of the connector section 24 is the same as that of the connector section 8. Reference numeral 25 denotes a pressure-sensitive element 1, a hybrid IC 2, a substrate 3, a terminal 4, a capacitor 6, a housing cap 9, a shield cover 20, a second shield cover 21,
And a pressure sensor as a connector-integrated sensor composed of a housing 23 including a connector portion 24.

Next, the operation of the pressure sensor 25 for preventing electromagnetic noise will be described. Radio noise propagating in the air to the pressure-sensitive element 1 is blocked by the shield cover 20, passes through the board 3 from the shield cover 20, and escapes to the ground wire of the terminal 4. Therefore, radio wave noise does not reach the pressure-sensitive element 1 side. Further, line noise propagating from the terminal 4 side to the pressure-sensitive element 1 side is cut off by the capacitor 6, reaches the second shield cover 21 from the capacitor 6, and then passes through the bypass line to the ground line of the terminal 4. Missed by Therefore, the line noise does not reach the pressure-sensitive element 1 side. The second shield cover 21 also has a function of blocking a part of radio wave noise directed toward the pressure-sensitive element 1.

Next, a method of manufacturing the pressure sensor 25 will be described. First, materials for forming the housing 23 including the connector portion 24 (in the following description of the manufacturing method, the housing 23 is assumed to include the connector portion 2) will be described. Housing 23
Is formed by pouring a resin into a predetermined mold. Therefore, the following three conditions are required for the resin material forming the housing 23.

A. It is necessary that the molding resin temperature is lower than the melting point of the solder forming the terminal assembly 22. B) It is necessary that the injection pressure is small (has good fluidity) to the extent that the inserted capacitor 6 is not deformed by pressurization during injection. C. It is necessary that the electrical insulation is large and the coefficient of linear expansion is small enough not to deform the capacitor 6 due to thermal expansion.

A liquid crystal polymer is used as a material of the housing 23 satisfying the above three conditions. This liquid crystal polymer has good fluidity and sufficiently satisfies the condition (b), whereas the conventionally used material does not particularly satisfy the condition (b).

Next, a specific method of manufacturing the pressure sensor 25 will be described. Terminal assembly 22
Is inserted into a predetermined mold, a liquid crystal polymer is poured into the mold, and an insert molding method (when the resin is molded, the terminal assembly 22 is set in the resin before molding (before curing)). The housing 23 is formed by an outsert method in which the terminal assembly 22 and the like are attached to the molded resin. In this case, since the liquid crystal polymer has particularly good fluidity, the injection pressure of the liquid crystal polymer can be kept small, and the capacitor 6 of the terminal assembly 22 is not deformed. Next, the pressure-sensitive element 1 and the hybrid IC 2 are mounted, and the shield cover 2 is mounted.
0 is attached to the recess 23 of the housing 23.
a, and the terminal 4 is soldered to a predetermined position of the substrate 3. And finally, the concave portion 2 of the housing 23
If the cover 3a is covered with the housing cap 9, the pressure sensor 25 is completed.

As described above, in this pressure sensor 25,
Since the housing 23 including the connector portion 24 is formed integrally with the terminal assembly 22 by insert molding, the terminal 4 and the capacitor 6 are soldered in the narrow housing 7 like the conventional pressure sensor 10. There is no need to perform this, making the production easy. Further, in the pressure sensor 25, since it is not necessary to provide a housing portion for the capacitor 6 in the concave portion 23a of the housing 23, the size can be reduced accordingly. In the above reference example , since the capacitor 6 which is a feed-through capacitor is used, it is necessary to fix the second shield cover to the capacitor from the viewpoint of the capacitance. However, it may be omitted depending on the type of application of the capacitor.

Embodiment 1 FIG. 3 is a sectional view of a pressure sensor according to an embodiment of the present invention,
FIG. 4 is a side view of the terminal assembly.

In the drawing, reference numeral 26 denotes a shield cover as a shield member which covers the pressure-sensitive element 1, the hybrid IC 2 and the like and protects them from external radio noise. This shield cover 26 is soldered to the outer cylinder of the capacitor 6 and connected to the ground wire of the terminal 4 via a bypass wire (not shown). Reference numeral 27 denotes a terminal assembly in which the terminal 4, the capacitor 6, and the shield cover 26 are assembled in advance. The other configuration of the pressure sensor 25 is the same as that of the pressure sensor 25 of the first embodiment .

Next, a method of manufacturing the pressure sensor 25 will be described. With the terminal assembly 27 inserted into a predetermined mold, a liquid crystal polymer is poured into the mold, and the capacitor 6 is inserted by insert molding.
And the capacitor 6 side of the shield cover 26 is buried,
The housing 23 including the connector part 24 is formed. Subsequently, the substrate 3 on which the pressure-sensitive element 1 and the hybrid IC 2 are mounted is inserted into the recess 23a of the housing 23, and the terminal 4 is soldered to a predetermined position on the substrate 3. Finally, the recess 23 a of the housing 23 is covered with the housing cap 9.

[0025] As described above, in the pressure sensor 25, a housing 23, including the connector portion 24, since the integrally formed with the terminal assembly 27 by insert molding, the pressure sensor 25 of Reference Example 1 Similar effects can be obtained. In Reference Example 1, the tip of the terminal 4 is located outside the shield cover 20, and the tip of the terminal 4 and the shield cover 20.
Although a predetermined distance had to be maintained between the terminals 4 and 5 to prevent a short circuit, in this embodiment, the distal end of the terminal 4 was disposed inside the shield cover 26,
It is not necessary to consider such a thing, and the size can be further reduced. The radio noise interrupted by the shield cover 26 and the line nozzle interrupted by the capacitor 6 and escaped to the shield cover 26 escape to the outside via the ground wire of the terminal 4.

Reference Example 2 FIG. 5 is a sectional view of an acceleration sensor according to another embodiment of the present invention, and FIG. 6 is a side view of a terminal assembly.

In the drawing, reference numeral 30 denotes an acceleration detecting element as a sensing element which is one of electronic circuit elements, 31 denotes a hybrid IC for amplifying a small output from the acceleration detecting element 30 and compensating for temperature, and 32 denotes an acceleration detecting element. A substrate 33 on which the element 30 and the hybrid IC 31 are mounted is a terminal electrically connected to the substrate 32 and serving as an input / output terminal for an external device. This terminal 33 has three electric wires (power supply line, signal output line, ground line)
, One of which is a ground line connected to the ground. 34 is an acceleration detecting element 30
And a hybrid cover which covers the hybrid IC 31 and the like, and blocks radio wave noise that propagates in the air and enters the acceleration detection element 30 side. This shield cover 34 is electrically and mechanically attached to the substrate 32. Reference numeral 35 denotes a second shield cover divided from the shield cover 34. This second shield cover 3
5 is connected to a terminal 33 via a bypass line (not shown).
Ground wire is connected.

Reference numeral 36 denotes a capacitor for preventing line noise from the terminal 33. The capacitor 36 has the same structure as the capacitor 6, and the terminal 3 is connected to the inner cylinder.
3 is soldered, and a second shield cover 35 is soldered to the outer cylinder. 37 is a terminal 33, a second shield cover 35, a capacitor 36
And a terminal assembly that was previously assembled,
Numeral 38 denotes a resin housing for accommodating and protecting the acceleration detecting element 30, the hybrid IC 31, the substrate 32, a part of the terminal 33, and the shield cover 34 in the recess 38a.

Reference numeral 39 denotes a connector portion formed by inserting the terminal assembly 37 into a part of the housing 38. The function of the connector section 39 is the same as that of the connector section 8. 40 is a concave portion 38a of the housing 38
41 is a housing cap for covering the acceleration detecting element 3.
0, hybrid IC 31, substrate 32, terminal 3
3, an acceleration sensor as a connector-integrated sensor including a shield cover 34, a second shield cover 35, a capacitor 36, a housing 38, a connector 39, and a housing cap 40.

Next, the operation of the acceleration sensor will be described. For example, in this acceleration sensor mounted on a car, the acceleration detecting element 30 is set in accordance with the acceleration of the car.
Output a very small acceleration signal. The acceleration signal is amplified by the hybrid IC 31, temperature-compensated, and output from the terminal 33 to an external device. In this case, radio wave noise propagating in the air to the acceleration detecting element 30 side is blocked by the shield cover 34,
Terminal 3 from shield cover 34 through substrate 32
3 escaped to the ground wire. Further, line noise from the terminal 33 side to the acceleration detection element 30 side is cut off by the capacitor 36 and escaped to the ground wire of the terminal 33 via the second shield cover 35.

Next, a method of manufacturing the acceleration sensor will be described. With the terminal assembly 37 inserted into a predetermined mold, a liquid crystal polymer is poured into the mold, and the connector 39 is inserted by insert molding.
Is formed to include the housing 38. Subsequently, the substrate 32 on which the acceleration detecting element 30 and the hybrid IC 31 are mounted and the shield cover 34 is attached is inserted into the recess 38 a of the housing 38, and the terminal 33 is soldered to a predetermined position on the substrate 32. Finally, if the concave portion 38a of the housing 38 is covered with the housing cap 40, the acceleration sensor 41 is completed.

[0032] As described above, in the acceleration sensor 41, a housing 38, including the connector portion 39, since the formed integrally with the terminal assembly 37 by insert molding, similarly to the pressure sensor of Example 1 Effects can be obtained. Also in this reference example, since the capacitor 36 which is a feed-through capacitor was used, it was necessary to fix the second shield cover to the capacitor from the viewpoint of capacitance, but this can be omitted depending on the type of application of the capacitor.

Embodiment 2 FIG. FIG. 7 is a sectional view of an acceleration sensor according to another embodiment of the present invention, and FIG. 8 is a side view of a terminal assembly.

In the figure, reference numeral 42 denotes a shield cover as a shield member which covers the acceleration detecting element 30 and the hybrid IC 31 and protects them from radio noise. The shield cover 42 is soldered to the outer cylinder of the capacitor 36 and is connected to the ground wire of the terminal 33 via a bypass wire (not shown). 43
Is a terminal assembly in which the terminal 33, the capacitor 36, and the shield cover 42 are assembled in advance. Other configurations of the acceleration sensor 41 are for reference.
This is the same as the acceleration sensor 41 of Example 2 .

Also in this acceleration sensor 41, with the terminal assembly 43 inserted in a predetermined mold, a liquid crystal polymer is poured into this mold, and the capacitor 36 and the shield cover 4 are formed by insert molding.
2 including the connector portion 39 in which the capacitor 36 side is embedded.
A housing 38 is formed. Then, the substrate 3 on which the acceleration detecting element 30 and the hybrid IC 31 are mounted
2 is inserted into the concave portion 38a of the housing 38, the terminal 33 is soldered to a predetermined position on the substrate 32, and the concave portion 38a of the housing 38 is covered with the housing cap 40, whereby the acceleration sensor 41 is manufactured.

Therefore, the acceleration sensor 41 can obtain the same effect as the pressure sensor 25 of the first embodiment.

In the pressure sensors 25 and the acceleration sensors 41 of the first and second embodiments and the first and second reference examples , a plurality of line noise preventing capacitors are mounted, and the capacitors are pre-assembled with terminals and the like. The housing may be formed in a state where the assembly is inserted into the mold.

[0038]

As described in the foregoing, according to the connector-integrated sensor according to claim 1 of the present invention, a capacitor and shea
Insert the capacitor side of the mold cover by insert molding
Built-in housing reduces assembly man-hours
Thus, the sensor can be easily manufactured, and the size of the sensor can be reduced. Further, since the capacitor is embedded in the housing by insert molding and fixed to the shield cover, and the tip of the terminal is located inside the shield cover, the size of the sensor can be further reduced.

Further, according to the connector-integrated sensor according to claim 2 of the present invention, since consisted material having good fluidity during forming shape, it is possible to reduce the injection pressure during molding,
The capacitor does not deform during insert molding.

[Brief description of the drawings]

1 is a cross-sectional view of a pressure sensor according to Embodiment 1 of the present invention.

FIG. 2 is a side view of a terminal assembly of the pressure sensor of FIG. 1;

FIG. 3 is a sectional view of the pressure sensor according to the first embodiment of the present invention.

FIG. 4 is a side view of a terminal assembly of the pressure sensor of FIG. 3;

FIG. 5 is a sectional view of an acceleration sensor according to Embodiment 2 of the present invention.

FIG. 6 is a side view of a terminal assembly of the acceleration sensor of FIG. 5;

FIG. 7 is a sectional view of an acceleration sensor according to a second embodiment of the present invention.

FIG. 8 is a side view of a terminal assembly of the acceleration sensor of FIG. 7;

FIG. 9 is a sectional view of a conventional pressure sensor.

10 is a diagram showing an assembly of a shield cover and a capacitor of the pressure sensor of FIG. 9;

[Explanation of symbols]

1 pressure-sensitive element (sensing element), 4 terminals, 6
Capacitor, 21 second shield cover, 23 housing, 24 connector part, 26 shield cover, 30
Acceleration detection element (sensing element), 33 terminal, 35 second shield cover, 36 capacitor, 3
8 Housing, 39 connector part, 42 Shield cover.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-223669 (JP, A) JP-A-60-149938 (JP, A) Japanese Utility Model Showa 57-64644 (JP, U) Japanese Utility Model Showa 58- 34029 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) G01L 9/04 101

Claims (2)

(57) [Claims] An electric input line of the sensing element is provided on a part of a resin housing for housing the sensing element.
A connector portion having a terminal composed of an electric output line and an earth line is formed, and a shield cover for blocking electromagnetic noise propagating in the air is provided so as to cover the sensing element, and further the terminal is provided on the terminal. in the connector-integrated sensor capacitor for preventing line noise are fixed, the capacitors the Sea
The terminal cover
Is located inside the shield cover,
In addition, the capacitor of the capacitor and the shield cover
Buried in the housing by insert molding
Connector-integrated sensor, characterized in that it is. 2. The connector-integrated sensor according to claim 1, wherein the housing is made of a material having good fluidity during molding.