JP2887045B2 - Substrate exchange method and substrate exchange device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Field of the Invention The present invention is, for example, a plurality of substrate processing
The present invention relates to a substrate exchanging method and a substrate exchanging method for efficiently exchanging a substrate to be processed in each substrate processing apparatus , which is used in a substrate processing technique for performing a series of processes on a substrate to be processed by a processing apparatus .

[0002]

2. Description of the Related Art As is well known, in a manufacturing process of a precision electronic substrate such as a liquid crystal display substrate or a semiconductor substrate, for example, a rotary cleaning device (hereinafter "spin scrubber"), a rotary coating device (hereinafter "spin coater"). , Rotary developing device (hereinafter "spin developer"), oven (heater),
A series of processes are performed by arranging a substrate processing apparatus (substrate processing unit) such as an exposure machine and transferring a substrate to be processed into and out of the substrate processing apparatus while transporting the substrate along the arrangement. A transfer device that is used in a conventional manufacturing process and sequentially transfers a substrate to be processed is disclosed in, for example, JP-A-2-1328.
As disclosed in Japanese Patent Publication No. 40, a substrate that has been processed in the substrate processing apparatus is taken out from one substrate processing apparatus, and then a new substrate to be processed is introduced into the substrate processing apparatus.

[0003]

In the conventional substrate transfer apparatus, the introduction and removal of the substrate to and from the substrate processing apparatus are performed successively as described above. There was a problem that efficiency was poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and there is provided a substrate exchange method and a substrate exchange apparatus capable of improving the production efficiency of a substrate by efficiently introducing and removing the substrate. The purpose is to provide.

[0005]

Means for Achieving the Object Claim 1 according to the present invention
The substrate exchange method described in was processed by the substrate processing apparatus
Remove substrate from substrate processing equipment and transfer to substrate processing equipment
A method of replacing a substrate for introducing a substrate, the method comprising: (a) substrate processing
It holds the substrate from below by the upper of the pair of board holding member which is spaced apart vertically in the apparatus, double
Substrate transfer equipment for transferring substrates between a number of substrate processing equipment
A step of holding the substrate from below by the lower of the pair of substrates exchange member disposed at intervals in the up and down location, while holding the substrate by (b) the underlying substrate exchange member, a pair of groups
Move a pair of substrate exchange members to a position sandwiched by the plate holding members
A step of, by moving upwardly (c) upper substrate exchange member, is held by the upper substrate holding member
Together causing transfer on the upper side of the substrate exchange member substrate, transferring the lower substrate exchange member by moving downward, the substrate held by the lower side of the substrate exchange member on the lower side of the substrate holding member on pair a step of, (d) is the substrate while holding the substrate by the upper substrate exchange member, a pair of substrates exchange member
Characterized in that it comprises a step of retracting, against the substrate holding member.

[0006] substrate exchange method according to claim 2 according to the present invention, the substrate processed in the substrate processing apparatus substrate processing instrumentation
Removed from the location, and a substrate exchanging method for introducing a substrate into the substrate processing apparatus, based on the lower of the pair of board holding member disposed at intervals in the up and down (a) a substrate processing apparatus
It holds the plate from below, between a plurality of substrate processing apparatus
A step of holding the substrate from below by a pair of substrate exchange members arranged vertically above and below in a substrate transportation device for transporting the substrate , and (b) by the upper substrate exchange member while holding the substrate, position sandwiching the pair of board holding member
A step of moving the pair of substrates exchange member in location, (c) a lower substrate exchange member by causing movement upward, the substrate held by the lower side of the substrate holding member on the lower side of the substrate exchange member (C) transferring the substrate held by the upper substrate exchange member onto the upper substrate holding member by moving the upper substrate exchange member downward, and (d) exchanging the lower substrate exchange member. while holding the substrate by a member, characterized in that it comprises a step of <br/> retracting a pair of substrates exchange member with respect to the pair of board holding member.

[0007] A substrate exchange apparatus according to the present invention takes out a substrate processed by the substrate processing apparatus from the substrate processing apparatus.
And a substrate exchanging device for introducing a substrate into the substrate processing apparatus, wherein (a) a pair of substrate holding apparatuses which are arranged in each of the plurality of substrate processing apparatuses at an interval vertically and capable of holding the substrate from below. A mechanism, and (b) a pair of substrate exchange mechanisms that are vertically spaced apart in a substrate transport apparatus for transporting a substrate between a plurality of substrate processing apparatuses and that can hold a substrate from below, c) One of the pair of substrate exchange mechanisms is a pair
Receiving a substrate from one of the substrate holding mechanisms, and
The other of the plate exchange mechanisms is connected to the other of the pair of substrate holding mechanisms.
The pair of substrate exchange mechanisms are moved so that
Interval control means for changing the vertical distance between the pair of substrate exchange mechanisms in a state close to the holding mechanism ; and (d) advance / retreat control means for moving the pair of substrate exchange mechanisms toward and away from the pair of substrate holding mechanisms. (E) moving control means for moving the pair of substrate exchange mechanisms to the vicinity of each of the plurality of substrate processing apparatuses.

[0008]

[Action] In the substrate exchange process in the present invention, the processed substrate is held to the substrate holding member, to be processed new group
The board is held by the board exchange member. When the substrate exchange member approaches the substrate holding member and moves up and down,
These boards are replaced at the same time. In order to apply this method to a substrate processing system in which a plurality of substrate processing apparatuses are arranged, each substrate may be sequentially transferred to a series of substrate processing apparatuses while repeating the substrate exchange by this method.

Since the processed substrate and the substrate to be newly processed are simultaneously exchanged, the introduction and removal of the substrate into and from the substrate processing apparatus can be efficiently performed. In addition, when applied to a substrate processing system, the substrate exchange member can move between the substrate processing apparatuses while always holding the substrate to be processed. In other words, there is no need for a period of air transport in which the substrate to be processed moves without being placed. Therefore, the substrate to be processed can be efficiently transported.

[0010] Since the board exchange device of the present invention includes interval control means for changing the vertical interval between the pair of substrate exchange members, the substrate exchange method according to the present invention can be performed by a simple process of changing the interval. Exchange can be performed.

[0011]

【Example】

 <1. Overall Configuration of Substrate Processing System>

FIG. 2 is a plan layout view of a substrate processing system 1 as an example for effectively implementing the substrate exchange method of the present invention, and FIG. 3 is a view from the position III-III in FIG. FIG. This substrate processing system 1
The liquid crystal display substrate is used as a substrate to be processed, and is configured as an apparatus for applying a resist film for forming a pattern such as an electrode on the surface of the substrate to be processed. In FIG. 2 and each of the following drawings, a horizontal plane parallel to the floor is indicated by X-.
A three-dimensional rectangular coordinate system X with the Y plane and the vertical direction as the Z direction
-YZ is defined. When the (+ X) direction and the (−X) direction are not distinguished, they are simply referred to as “X direction” (the same applies to Y and Z). The substrate processing system 1 includes a processing unit A1 that performs a series of processing on a substrate to be processed, and a transport unit A2 that transports the substrate to be processed in the X direction along the processing unit A1.

The substrate processing system 1 has a multistage configuration in which a plurality of substrate processing apparatuses are arranged in multiple stages. In the processing section A1 of the first-stage portion AF1, a spin scrubber SS, a spin coater SC, an edge and a back rinse section ER are arranged in the X direction. Further, an interface section IF2 on which the substrate to be processed can be temporarily placed is provided in these arrangements.

On the other hand, a second-stage portion AF2 is provided on the first-stage portion AF1. The second-stage portion AF2 has a two-layer structure, and the first layer has an X-direction arrangement of hot plates (oven) HP1, HP4 to HP5, and cool plates (cooling plates) CP1 to CP3. The second layer is a hot plate HP2, HP3, HP6.
have. As shown in FIG. 3, the corresponding first layer and second layer (for example, the cool plate CP1 and the hot plate HP3) are vertically stacked. Also, an interface unit IF capable of temporarily mounting a substrate to be processed.
One is provided in these arrangements. First stage part A
Since F1 has a one-layer structure with respect to the substrate processing apparatus and the second-stage portion AF2 has a two-layer structure, the substrate processing system 1 has a two-stage three-layer structure with respect to the substrate processing apparatus.

A frame 200a extending in the X direction is provided on the front side of the processing section A1, that is, on the (-Y) side. The installation height is the height of the loading / unloading of the substrate to be processed in the spin coater SC, that is, the higher one of the pass line PS1 and the loading / unloading heights PL1 and PL2 of the upper substrate processing apparatuses CP3 and HP6 (that is, in the illustrated example). PL2). Two parallel guide rails (transport paths) 201 and 202 extending in the X direction are fixed to the frame 200a at intervals in the Z direction. The upper guide rail 201 has 1
A substrate transfer device 101 is attached, and the substrate transfer device 101 is free to translate in the X direction while being guided by the guide rail 201 (in FIG. 2, the connection relationship between the substrate transfer device 101 and the guide rail 201 is (Not shown). In addition, the lower guide rail 202 has
The board transfer devices 102 and 103 are attached, and the board transfer devices 102 and 103 can be translated in the X direction while being guided by the guide rails 202. These substrate transfer devices 101 to 103 are for transferring a substrate to be processed between the respective substrate processing devices, and the detailed configuration thereof will be described later.

<2. Configuration of substrate transfer device>

FIG. 4 is a perspective view of the substrate transfer apparatus 101 of FIG. FIG. 5 is a side view of the substrate transfer apparatus 101 viewed from the direction of arrow VII in FIG. 4, and FIG. 6 is an arrow VIII in FIG.
FIG. 2 is a plan view of the substrate transfer apparatus 101 viewed from a direction. Further, FIG. 7 shows the substrate transfer apparatus 1 viewed from the direction of arrow IX in FIG.
It is a front view of No. 01. In the system 1 of this embodiment, 3
Table transfer devices 101 to 103 are used,
Since their basic configurations are the same, the following description focuses on the substrate transfer device 101.

<2-1. Overall Configuration>

Referring first to FIG. Frame 200a
The first substrate transfer device 101 is attached to the upper guide rail 201 of the guide rails 201 and 202 fixed to the first. The substrate transfer device 101 has an X moving mechanism 110 for translating the entire substrate transfer device 101 in the horizontal X direction. A vertical arm mechanism 120a that bends and stretches in the vertical Z direction is connected to the X moving mechanism 110, and the housing 131 is supported by the vertical arm mechanism 120a. Referring to FIG. 4, this housing 131 is a hollow box having both ends opened in the Y direction, and houses therein a horizontal arm mechanism 140 that can bend and extend in the horizontal Y direction. A pair of hands 150a and 150b as a substrate exchange mechanism (substrate exchange member) are connected to the tip.

<2-2. X moving mechanism 110>

Returning to FIG. 5, the X moving mechanism 110 has wheels 111 and 112 arranged so as to sandwich the guide rail 201 from above and below. Also, the support member 115
A driving wheel 113 is connected to a motor 114 supported by the motor 114. By rotating the driving wheel 113 by the motor 114, the X moving mechanism 110 (and thus the entire substrate transfer device 101) is guided by the guide rail 201. Translate in the X direction.

<2-3. Vertical arm mechanism 120a>

A motor 116 is fixed below the support member 115. The vertical arm mechanism 120a includes two arms 121a and 122a having substantially the same length. The end of the first arm 121a is connected to the motor 116. Also, the end 12 of the second arm 122a
3a is connected to the housing 131. The vertical arm mechanism 120a is a so-called SCARA robot mechanism. Therefore, when the motor 116 rotates, the arms 121a and 122a rotate as indicated by arrows θ1 and θ2, respectively, and the housing 131 translates in the Z direction while maintaining its posture (arrow E1). By switching the rotation direction of the motor 116, the translation direction of the housing 131 in the Z direction is changed from the (+ Z) direction to the (−Z) direction.
Direction or from the (−Z) direction to the (+ Z) direction.

As shown in FIG. 6, another vertical arm mechanism 12 having the same structure as the vertical arm mechanism 120a is provided.
0b is provided on the opposite side of the housing 131. These vertical arm mechanisms 120a and 120b are mutually connected by a connecting member 124 extending in the horizontal X direction.
Therefore, the driving force of the motor 116 is also transmitted to the vertical arm mechanism 120b via the connecting member 124. That is,
When each arm of the first vertical arm mechanism 120a rotates, each arm of the second vertical arm mechanism 120b also rotates by a corresponding amount via the connecting member 124.
This allows the housing 131 to be supported at both ends,
Displaces in the Z direction without changing the posture. Note that, in the second vertical arm mechanism 120b, the first vertical arm mechanism 1
A torque spring 117 is provided to balance with the motor 116 in 20a.

FIG. 5 also shows the substrate transfer device 102, but the structure of the substrate transfer device 102 is almost the same. Although the X moving mechanism and the vertical arm mechanism are vertically symmetrical in the first and second substrate transfer devices 101 and 102, the housings 131 and 132 and the internal structure (described later) of the housings 131 and 132, including the directions, are mutually reciprocated. Are identical.

The range in which the housing 131 of the substrate transfer devices 101 to 103 belonging to the substrate processing system 1 can be displaced in the Z direction is from the pass line PS1 in FIG. 3 to the loading / unloading height PL of the substrate to be processed in the hot plate HP6.
The range is up to 2.

<2-4. Horizontal arm mechanism 140>

Referring to FIG. This FIG.
It is the top view which removed and showed the ceiling surface of 31. One end of a horizontal arm mechanism 140 is connected to the housing 131. The horizontal arm mechanism 140 is substantially equal length 2
Arm 141, 142. The first arm 141 has a motor 133 (FIG.
(See FIG. 5). Also, the second arm 14
2 are connected to the hands 150a and 150b.

The horizontal arm mechanism 140 is also configured as a SCARA robot mechanism. When the motor 133 is rotated, the arms 141 and 142 pivot in the directions of arrows α1 and α2, and the hands 150a and 150b maintain their postures. While moving in the Y direction (arrow E2). Therefore, by driving the motor 133, the hand 150
a, 150b translates in the (+ Y) direction.
Oa and 150b are exposed outside from the housing 131 and reach the inside of the substrate processing apparatus. When translated in the (−Y) direction, the hands 150 a and 150 b are accommodated in the housing 131.

<2-5. Opening / closing mechanism 160>

As shown in FIGS. 4 and 6, the upper and lower hands 150a and 150b are flat plates each having two fingers. Handle the substrate to be processed by hand 150a or 15
The substrate 131 is placed on the housing 131b and housed in the housing 131, and is transported to another substrate processing apparatus in that state.

The hands 150a and 150b are provided with an opening / closing mechanism 1.
It is connected to the tip of the arm 142 via 60. FIG. 8 is a plan sectional view of the opening / closing mechanism 160 as viewed from above. The opening / closing mechanism 160 has a main body 161, and the arm 14 is inserted through a hole 168 provided in the main body 161.
2 is connected to the tip. The main body 161 is provided with four rails 163 vertically.
, Two sliding blocks 162a and 162b are slidably mounted. Sliding blocks 162a, 162
Hands 150a and 150b are fixedly attached to b. The main body 161 is provided with an air cylinder 166 that rotates bidirectionally by the air pressure fed. The air cylinder 166 rotationally drives a drive shaft 164 to which two circular eccentric cams 165a and 165b are fixedly attached.

FIG. 9 is a front view of the opening / closing mechanism 160 as viewed in the + Y direction. This drawing is drawn with the main body 161 removed. The sliding blocks 162a and 162b are provided with guides 167a and 167b having a pair of horizontal upper and lower inner surfaces, respectively, on which the eccentric cams 165a and 165b can slide. The pair of eccentric cams 165a and 165b are eccentric in opposite directions with the drive shaft 164 interposed therebetween. As the drive shaft 164 rotates, the eccentric cam 165
a and 165b push up one of the sliding blocks 162a and 162b and push down the other. That is, the air cylinder 1
66 operates, the sliding blocks 162a, 1
The hands 150a and 150b fixed to 62b open and close in the vertical direction (Z direction).

FIG. 10 is a detailed view of a connecting portion between the arm 142 and the main body 161. Main body 161 and arm 142
A detachment mechanism 170 is interposed between the two. FIG. 10 shows a cross-sectional structure of the attaching / detaching mechanism 170. The hollow main body 171 houses a piston 172 capable of sliding with the inner surface while maintaining airtightness. Piston 1
A holding member 173 is attached to 72. Main unit 1
The spring 174 which is compressed and housed inside 71 is
The piston 172 and the presser 173 are constantly urged downward. The pressing force causes the holding member 173 to move the main body 161.
Of the main body 161 and the arm 142 are connected. When compressed air is supplied from an air pressure pipe to an air chamber 176 formed between the inner wall of the main body 171 and the piston 172, the piston 172 is lifted upward against the urging force of the spring 174, and 173
Emerge from the hole 168. As shown in FIG.
8 is provided with a notch, so that the main body 161 can be removed and inserted through the notch when the presser 173 is floating. That is, the detachment mechanism 1
Since the 70 is interposed, the connection and release between the main body 161 and the arm 142 can be freely performed.

<3. Operation of substrate transfer device>

FIG. 1 is a schematic diagram showing a procedure for exchanging a substrate 10 to be processed with a substrate processing apparatus 300 such as a hot plate HP using the substrate transfer apparatus 101. The substrate processing apparatus 300 is provided with shelves (substrate holding members) 310a and 310b having a two-tier structure for transferring the substrate 10 to and from the substrate transfer apparatus 101. As described later, the shelves 310a and 310b have a structure capable of transferring the substrate 10 to and from a predetermined position where the substrate 10 is to be installed when performing the processing. A pair of hands 150a and 15 of the substrate transfer device 101
By operating the air cylinder 166, the interval of 0b can be adjusted to be narrower or wider than the interval between the pair of shelves 310a, 310b.

The processed substrate 10a that has been processed in the substrate processing apparatus 300 is placed on, for example, an upper shelf 310a. The unprocessed substrate 10b to be newly processed is supplied to the lower hand 150b of the substrate transfer apparatus 101 by, for example, another substrate processing apparatus that performs processing one step before the substrate processing apparatus 300. The substrate transfer apparatus 101 in which the unprocessed substrate 10b is placed on the lower hand 150b,
In a state in which the housings 131a and 150b are housed, and the gap between the hands 150a and 150b is closed, the hands 150a and 150b are moved in the X and Z directions and stopped at the front of the substrate processing apparatus 300 (FIG. 1A). ). At this time, the height of the hands 150a and 150b is set to the shelf 310a and the shelf 31.
It is located in the middle of the height of 0b.

Next, the horizontal arm mechanism 140 is extended in the + Y direction, and the hands 150a and 150b are inserted into the substrate processing apparatus 300. Hands 150a and 150b are
When the arm 142 reaches a position sandwiched between the shelves 310a and 310b, the arm 142 stops extending. At this time, the upper hand 150a is below the processed substrate 10a,
10b is below the unprocessed substrate 10b (FIG. 1).
(B)).

Subsequently, by operating the opening / closing mechanism 160,
Until the hands 150a, 150b reach the position sandwiching the shelves 310a, 310b from above and below, the hands 150a, 150b
The interval between b is extended (FIG. 1C). During the expansion process, the processed substrate 10a is scooped from below by the upper hand 150a, and the unprocessed substrate 10b is scooped from below by the shelf 310b. That is, the processed substrate 10a
Moves from the shelf 310a to the upper hand 150a, and the unprocessed substrate 10b moves from the lower hand 150b to the shelf 310b.

Next, the horizontal arm mechanism 140 is contracted in the -Y direction, and the hands 150a and 150b are stored in the housing 131 (FIG. 1D). Thereafter, the substrate transport apparatus 101 moves appropriately in the X direction and the Z direction, and transports the processed substrate 10a to another substrate processing apparatus that performs, for example, processing after one process. The unprocessed substrate 10b supplied to the substrate processing apparatus 300 is moved to a predetermined position in the substrate processing apparatus 300 and subjected to a predetermined processing.

As shown in FIG. 11, in the process of replacing the substrate 10 to be processed, the vertical positional relationship between the processed substrate 10a and the unprocessed substrate 10b can be reversed. The processed substrate 10a to be received from the substrate processing apparatus 300 is placed on the shelf 310b, and the unprocessed substrate 10b to be delivered to the substrate processing apparatus 300 is placed on the upper hand 150a. The substrate transfer apparatus 101 stops at the front of the substrate processing apparatus 300 with the gap between the hands 150a and 150b widened (FIG. 11A). Extend the horizontal arm mechanism 140 in the + Y direction, and
After inserting the substrates 50a and 150b into the substrate processing apparatus 300 (FIG. 11B), the distance between the hands 150a and 150b is reduced (FIG. 1C). In this process, the processed substrate 10a is scooped from below by the lower hand 150b, and the unprocessed substrate 10b is scooped from below by the shelf 310a. That is, the processed substrate 10a moves from the shelf 310b to the lower hand 150b, and the unprocessed substrate 10b moves from the upper hand 150a to the shelf 310a. Thereafter, the horizontal arm mechanism 140 is contracted in the −Y direction,
a and 150b are housed in the housing 131 (FIG. 1).
(D)).

In the substrate processing system 1 in which a plurality of types of substrate processing apparatuses 300 are arranged, a series of processing is carried out by transporting the substrates 10 to be processed along the arrangement and sequentially taking in and out the substrate processing apparatuses 300. Will be applied. In the substrate processing system 1, in accordance with the order of processing performed on the substrate to be processed 10, between the substrate processing apparatus 300 in charge of even-numbered processing and the substrate processing apparatus 300 in charge of odd-numbered processing, Processed substrate 10a and unprocessed substrate 1
The vertical relationship of 0b may be reversed. That is, the processed substrate 10 in one substrate processing apparatus 300 shown in FIG.
a is the unprocessed substrate 10b shown in FIG. 11 in the substrate processing apparatus 300 that performs the next process, and the processed substrate 10a in FIG. 11 is the unprocessed substrate 10b shown in FIG. It is preferable to set the processing substrate 10b. As a result, the processed substrate 10a or the unprocessed substrate 10b is
Since the substrate can be directly transferred from one substrate processing apparatus 300 to the next substrate processing apparatus 300 without switching between a and 150b, highly efficient transfer is realized.

<4. Configuration and Operation of Shelf 310a, 310b>

An example of the structure and operation of shelves 310a and 310b provided in various substrate processing apparatuses 300 will be described.

<4-1. Example of spin coater SC>

FIG. 12 shows a shelf 3 in the spin coater SC.
It is a perspective view which shows the example of a structure of 10a, 310b. In this example, the shelves 310a and 310b are constituted by four pins 320 having a pair of upper and lower claws. The pin 320 is rotatably attached to the nozzle 321. The rotation of the pin 320 is driven by the belt 322. 4 pins 3
When the rotation position of the lever 20 is in the closed position, the pins 320 support the substrate 10 to be processed by one of the upper and lower claws.

The nozzle 321 is a nozzle for cleaning the end face of the substrate 10 to be processed. The nozzle 321 extends horizontally along one side of the substrate 10 supported by the pins 320.
3. The cleaning liquid is spouted from 3. Fixed base 324 and nozzle 321
The horizontal arm mechanism 325 for connecting the substrate 10
The distance between the pair of nozzles 321 is adjusted in accordance with the various dimensions of. The turntable 326 which supports the substrate 10 by vacuum suctioning the bottom surface of the substrate 10 and horizontally rotates the substrate 10 can be moved up and down. The substrate 1 to be processed is placed between the pin 320 and the upper edge of the cup 327 located thereunder.
Processing solution nozzle 32 for ejecting a resist solution to be applied to the substrate
8 are installed. The processing liquid nozzle 328 is
It is pivotable horizontally around 29.

As an example, the processed substrate 10a is placed on the upper nail of the pin 320, and the unprocessed substrate 10 is mounted on the lower nail.
The operation of this device will be described for the case where b is placed. First, the unprocessed substrate 10 b supplied by the substrate transfer device 101 is placed on the lower claws of the pins 320. While the unprocessed substrate 10b is supplied by the substrate transfer device 101, the turntable 326 that has been retracted to a position slightly lower than the pins 320 has a height enough to slightly lift the unprocessed substrate 10b from the lower claw ( Lower),
The unprocessed substrate 10b is supported while sucking the bottom surface. Subsequently, after the pin 320 rotates in the opening direction, the turntable 326 is lowered to a position where the unprocessed substrate 10b is stored inside the cup 327 while supporting the unprocessed substrate 10b.

Next, the processing liquid nozzle 328 retracted around the cup 327 so as not to hinder the lowering of the unprocessed substrate 10b,
6 to reach the center of rotation. The resist liquid is applied to the upper surface of the unprocessed substrate 10b by rotating the rotary table 326 horizontally and simultaneously ejecting the resist liquid from the tip of the processing liquid nozzle 328. At this time, the cup 327 functions to prevent scattering of the resist solution and to collect the resist solution. When the application is completed, the turntable 326 stops rotating,
The processing liquid nozzle 328 rotates again to the retracted position.

Thereafter, as the turntable 326 is raised, the original unprocessed substrate 10b which has become the processed substrate 10a is obtained.
Is lifted to a height (upper stage) slightly floating above the upper claw of the pin 320. Subsequently, the pin 320 rotates in the closing direction, and the turntable 326 descends to a position slightly lower than the pin 320. In this process, the turntable 326
The processed substrate 10a supported on the pin 320 is placed on the upper claws of the pins 320.

Subsequently, the hand 150 of the substrate transfer apparatus 101 is moved to a position where the processed substrate 10a is placed.
a and 150b enter, and the processed substrate 10a and the new unprocessed substrate 10b are exchanged. The new unprocessed substrate 10b placed on the lower claws of the pins 320 is transferred to the turntable 326 as the turntable 326 rises to the lower stage. Hereinafter, the same process is repeated.

The mechanism described above uses the spin coater SC
In addition, the present invention can be similarly applied to, for example, a spin scrubber SS and a spin developer SD.

<4-2. Example of hot plate HP>

FIG. 13 is a perspective view showing a configuration example of shelves 310a and 310b in the hot plate HP. In this example, the upper shelf 310a and the lower shelf 310b are
It is composed of four upper levers 330 each having a round bar-shaped claw, and four lower levers 331. The upper lever 330 and the lower lever 331 are
Is mounted so as to be rotatable. On the heater 332, the sub-plate 3 on which the substrate to be processed 10 is to be directly placed is placed.
33 is placed. Hot plate HP panel 33
The substrate transfer device 101 enters from the outside through a window 335 provided in the front part of the device 4. Above the upper lever 330 and the lower lever 331, a lid 336 supported so as to be able to move up and down by a lifting drive mechanism 338 is provided. With the operation of the air cylinder 337 provided in the lifting drive mechanism 338, the lid 336 moves up and down.

FIG. 14 is an internal side view of the hot plate HP. Each of the upper lever 330 and the lower lever 331, which are rotatably supported, is urged by a spring 339 in a rotation direction in which each claw stands up.
The rotation of these levers due to the urging force causes the stopper 340 to rotate.
At a predetermined rotation position. At this time,
The claw attached to the upper lever 330 is a lower lever 331.
It is at a position higher than the claw attached to. When the lid 336 is lowered, the pad 341 attached to the bottom surface of the lid 336 first comes into contact with the top of the upper lever 330, and the upper lever 3
The lower lever 331 is pressed down, and then abuts against the top of the lower lever 331 to push down the lower lever 331. A groove 342 is provided on a side surface of the sub plate 333 (FIG. 1).
3) When the lid 336 is lowered, the pawls attached to the upper lever 330 and the lower lever 331 engage with these grooves 34.
2 can be evacuated.

FIG. 15 is a plan view of a link mechanism 350 for connecting the four upper levers 330 to each other. The four upper levers 330 include a spline 351 and a connecting plate 3.
By 52, they are connected so that their turning positions are the same. Further, the width of the upper lever 330, that is, a pair of upper levers 3 connected by a spline 351.
The distance between the 30s can be expanded and contracted by the air cylinder 353.

FIG. 16 is an internal front view of a main part of the hot plate HP. The claw of the upper lever 330 and the claw of the lower lever 331 which are positioned above and below each other, for example, a processed substrate 10a and an unprocessed substrate 10b are respectively placed thereon. The mechanism described above can be applied not only to the hot plate HP but also to, for example, the cool plate CP.

<4-3. Operation example 1 of hot plate HP>

FIG. 17 shows the substrate transfer apparatus 101 when the processed substrate 10a is mounted on the claw of the upper lever 330 and the unprocessed substrate 10b is mounted on the claw of the lower lever 331.
6 is a timing chart showing the operation of each part of the hot plate HP. First, the processed substrate 10a is placed on the claw of the upper lever 330, and the lid 336 is positioned upward. The substrate transfer device 101 includes the lower hand 1
The unprocessed substrate 10b is placed on 50b, and the hot plate H
It is stationary in front of P. The horizontal arm mechanism 140 is in a contracted state, and the hands 150a and 150b are housed in the housing 131 in a state where the hands 150a and 150b are close to each other.

First, when the horizontal arm mechanism 140 is extended, the hands 150a and 150b enter the hot plate HP from the window 335, the upper hand 150a reaches below the processed substrate 10a, and the claw of the lower lever 331 is caught. Reaches below the unprocessed substrate 10b, the extension of the horizontal arm mechanism 140 stops (from time t1 to time t2).
).

Subsequently, by expanding the interval between the hands 150a and 150b, the processed substrate 10a moves from the claw of the upper lever 330 to the upper hand 150a, and the unprocessed substrate 10b moves from the lower hand 150b to the lower lever 331.
(Time t2 to time t3). That is, the processed substrate 10a and the unprocessed substrate 10b are exchanged. Next, while keeping the distance between the hands 150a and 150b wide, the horizontal arm mechanism 140 is contracted, and the processed substrate 10
a is housed in the housing 131. At this time, the air cylinder 353 operates at the same time, and the lateral width of the upper lever 330 increases (time t3 to time t4).

Subsequently, when the lid 336 is lowered, the lower lever 331 supporting the unprocessed substrate 10b is pushed down, and the unprocessed substrate 10b is placed on the upper surface of the sub-plate 333 (time t4 to time t5). ). In this process, the upper lever 330 is also pushed down at the same time, but since the width of the upper lever 330 is expanded, it does not interfere with the unprocessed substrate 10b. Substrate transfer device 101
Transports the processed substrate 10a to the substrate processing apparatus that executes the next step after time t4.

After time t5, the unprocessed substrate 10b is subjected to a heat treatment on the sub-plate 333 (time t5 to time t6). When the heating process is completed, the lateral width of the upper lever 330 is reduced (time t6 to time t7), and the lid 336 is further raised (time t7 to time t8). As the lid 336 is raised, the upper lever 3 pushed down by the lid 336
30 and the lower lever 331 stand up. Since the horizontal width of the upper lever 330 is narrow, the original unprocessed substrate 10b that has become the processed substrate 10a in this process is placed on the claw of the upper lever 330 and rises. After the lid 336 is sufficiently raised, the exchange of the processed substrate 10a and the unprocessed substrate 10b is performed again with the substrate transfer apparatus 101. That is, after time t8, the processing after time t1 is repeated.

<4-4. Operation example 2 of hot plate HP>

FIG. 18 is the opposite of the case shown in FIG.
A timing chart showing the operation of each part of the substrate transport apparatus 101 and the hot plate HP when the processed substrate 10a is placed on the claw of the lower lever 331 and the unprocessed substrate 10b is placed on the claw of the upper lever 330. It is. First, the processed substrate 10a is placed on the claw of the lower lever 331, and the lid 336 is located at the upper side. The substrate transfer device 101 moves the unprocessed substrate 1 to the upper hand 150a.
0b is placed and is stationary in front of the hot plate HP. The horizontal arm mechanism 140 is in a contracted state, and the hands 150a and 150b are housed in the housing 131 in a state where they are spaced apart from each other.

First, when the horizontal arm mechanism 140 is extended, the hands 150a and 150b enter the inside of the hot plate HP from the window 335, the lower hand 150b reaches below the processed substrate 10a, and the claw of the upper lever 330 is moved. Reaches below the unprocessed substrate 10b, the extension of the horizontal arm mechanism 140 stops (from time t1 to time t2).
). In this process, the upper lever 33 that was open
The width of 0 becomes narrower.

Subsequently, as the distance between the hands 150a and 150b shrinks, the unprocessed substrate 10b moves from the upper hand 150a to the claw of the upper lever 330, and the processed substrate 10a moves from the claw of the lower lever 331 to the lower hand. Fifteen
0b (time t2 to time t3). That is, the processed substrate 10a and the unprocessed substrate 10b are exchanged. Next, while keeping the interval between the hands 150a and 150b closed,
The horizontal arm mechanism 140 is contracted, and the processed substrate 10a is stored in the housing 131. (Time t3 to time t4
).

Subsequently, when the lid 336 is lowered, the upper lever 330 supporting the unprocessed substrate 10b is pushed down, and the unprocessed substrate 10b is placed on the upper surface of the sub-plate 333 (time t4 to time t5). . In this process, the lower lever 331 is also pushed down at the same time, so that the claw of the lower lever 331 does not interfere with the unprocessed substrate 10b. After time t4, the substrate transport apparatus 101 switches the processed substrate 10a to a substrate processing apparatus that executes the next process.
Is transported.

After time t5, the unprocessed substrate 10b is heated on the sub-plate 333 (time t5 to time t6). When the heating process is completed, the lateral width of the upper lever 330 is increased (time t6 to time t7), and the lid 336 is further raised (time t7 to time t8). As the lid 336 is raised, the upper lever 3 pushed down by the lid 336
30 and the lower lever 331 stand up. Since the width of the upper lever 330 is wide, the original unprocessed substrate 10b that has become the processed substrate 10a in this process is placed on the claw of the lower lever 331 and rises. After the lid 336 is sufficiently raised, the exchange of the processed substrate 10a and the unprocessed substrate 10b is performed again with the substrate transfer apparatus 101. That is, after time t8, the processing after time t1 is repeated.

<5. Processing efficiency>

The efficiency of processing in the substrate processing system 1 described above will be described. Table 1 shows a series of processing contents executed in the apparatus 1 of this embodiment.

[0072]

[Table 1]

As can be seen from Table 1, the cycle time T in these series of processes is 50 seconds. For this reason,
Each of the substrate transfer devices 101 to 105 takes out a substrate to be processed from one substrate processing apparatus, transports the substrate to another substrate processing apparatus, and takes the average time required for loading and unloading the substrate therefrom by ΔT, Assuming that the number of substrate processing apparatuses that can be handled by the substrate transport apparatus is N, the following Equation 1 needs to be satisfied.

[0074]

## EQU1 ## ΔT × (N + 1) ≦ T

Here, (N + 1) means that N
(N-1) transports while moving the substrate processing equipment
This is because it is necessary to carry out and take in each time, and it is necessary to carry out and take in once each of the N substrate processing apparatuses with the substrate processing apparatus immediately before / after.

For example, when the average time ΔT is 10 sec, the following equation 2 is obtained from the equation 1.

[0077]

## EQU2 ## 10 sec × (N + 1) ≦ 50 sec

For this reason, N ≦ 4 (the maximum value is N = 4). Therefore, the series of processes shown in Table 1 was repeated four times from the first one.
The substrate is divided into individual substrate processing apparatuses, and the substrate from the spin scrubber SS to the cool plate CP1 is divided into the first substrate transfer apparatuses 10.
Further, the second substrate transfer device 102 is in charge of the steps from the dehydration bake of the hot plate HP3 to the edge and the back rinse part ER. Furthermore, from the pre-bake of the hot plate HP4 to the cool plate CP3,
The third substrate transfer device 103 is in charge. The range of responsibility of such a substrate transfer device is “10” in the “Transfer device” column of Table 1.
It is expressed using a symbol such as "1". That is, the substrate transfer devices 101 to 103 in this embodiment
It is used as a "zone defense system" substrate transfer device with each assigned range.

Note that the second substrate transfer device 101
Passing of the substrate to the substrate transport apparatus 102 is b
This is performed via the interface unit IF1 (see FIG. 2). That is, the substrate to be processed, which has completed the processing in the cool plate CP1, is interposed by the first substrate transfer device 101.
The transfer is performed such that the substrate is transported to the face unit IF1, placed on the interface unit IF1, and the substrate to be processed is picked up by the second substrate transport unit 102.

As described above, the average time ΔT is such that the substrate transfer device exchanges the substrate to be processed with the two-stage shelf provided in each substrate processing device, and transports the substrate to the next substrate processing device. It is the time required for One substrate transfer apparatus can handle the number N of substrate processing apparatuses given by Equation 1 or Equation 2 with respect to the average time ΔT because the substrate processing apparatus 101 or the like transfers the processed substrate 10a, This is because receiving the unprocessed substrate 10b can be performed simultaneously.
This is because if only one of transfer and reception can be performed at a time with respect to one substrate processing apparatus as in the conventional apparatus, the substrate transfer apparatus moves between the substrate processing apparatuses without holding the substrate to be processed. This is because one substrate transfer device can handle only about half of the number N of the number N given by Equations 1 and 2 since the idle transport period is required. The substrate transfer device 101 and the like include a pair of hands 1
The provision of 50a and 150b enables the exchange of the processed substrate 10a and the unprocessed substrate 10b by cooperation with the two-stage shelf. This achieves efficient transfer of the substrate to be processed without any idle transport period.

Further, the substrate transfer device 101 and the like
Since the substrate to be processed can be replaced simply by changing the interval between the substrates 50a and 150b, the time required for replacing the substrate to be processed in the substrate processing system 1 is further reduced.
For this reason, conveyance with higher efficiency is realized. Further, the reduction in the time required for replacement leads to a reduction in the average time ΔT. As a result, as given by Expression 1, the number N of substrate processing apparatuses that can be handled by one substrate transfer apparatus 101 or the like increases. In other words, in the substrate processing system 1,
It is possible to reduce the number of substrate transfer devices 101 and the like to be installed.

Further, a two-stage shelf is installed in each substrate processing apparatus, and the position of the substrate to be processed in the substrate processing apparatus and the movement of the substrate to and from the shelf are determined. , Realized by a simple process. Therefore, the time required for the replacement in the tact time T is very short.

As described above, in the substrate processing system 1,
By using the substrate transfer device 101 and the like, efficient substrate processing is realized.

<6. Modification>

(1) FIG. 19 shows a modification of the lid 336 and the upper lever 330 of the hot plate HP. The pad 341 is made of a magnet, and the magnet 343 is also attached to the top of the upper lever 330. Pad 341 and magnet 343
Have the same magnetic pole on opposing surfaces. Therefore, when the lid 336 is lowered, the upper lever 330 is pushed down without contacting the pad 341 by the action of the magnetic repulsion. The lower lever 331 and the pad 341 opposed thereto are similarly configured. Since no contact occurs, there is an advantage that there is no dust generation due to friction of the contact portion.

(2) FIG. 20 shows a modification of the upper hand 150a. The two claws of the upper hand 150a are
Instead of being formed by one plate, as shown in FIG. 20, it may be a rod having a “U-shaped” cross-sectional shape.
A stopper 401 may be provided at the tip of the nail to prevent the substrate to be processed 10 from slipping or shifting. Although not shown, in this modification, the lower hand 150b
Is similarly configured. In addition, the cross-sectional shape may be, for example, “H-shape” or “I-shape” other than the “U-shape”. Moreover, you may comprise a nail | claw with a tube. With such a configuration, it is possible to support a heavy substrate with a nail that is lightweight and has little deformation.

(3) For example, a motor may be used instead of the air cylinder 166 that generates a rotational force by air pressure. However, as an actuator to be installed in a limited space between the upper hand 150a and the lower hand 150b, a small air cylinder capable of generating high torque is excellent.

(4) The processing in each substrate processing apparatus shown in Table 1 is an example, and can be arbitrarily changed. For example, in prebaking, hot plates HP4 to HP6
The heating time in may be different. Also,
The substrates to be processed may not be sequentially moved to the hot plates HP4 to HP6, but may be placed in any one of the hot plates that are empty at that time, and all necessary heating may be performed by the hot plates.

(5) The number of arms in the arm mechanism of the substrate transfer device is not limited. Also, unlike the embodiment,
A vertical arm mechanism may be provided on the horizontal arm mechanism.
However, in this case, since the connecting portion between the vertical arm mechanism and the hand must be lengthened, the embodiment is more advantageous.

(6) The present invention is applicable not only to a processing apparatus for a liquid crystal display substrate, but also to a processing apparatus for a semiconductor substrate or other substrates.

[0091]

According to the substrate exchange method of the present invention, a processed substrate and a substrate to be newly processed are exchanged at the same time, so that these substrates can be efficiently taken in and out of the substrate processing apparatus . is there. Further, since the substrate exchange member can be moved from one substrate processing apparatus to the next new substrate processing apparatus with the substrate to be processed always placed thereon without the period of idle transport, this method is used in a substrate processing system. In this case, there is an effect that the substrate can be efficiently transferred.

The board exchanging device according to the present invention comprises a pair of
One of the board exchange mechanisms is mounted on one of the pair of board holding mechanisms.
Receiving the board, and the other of the pair of substrate exchange mechanisms
The pair of bases is moved so that the substrate is transferred to the other side of the substrate holding mechanism.
In a state where the plate exchange mechanism is brought close to the pair of substrate holding mechanisms,
To and a distance control means for changing the vertical spacing of the pair of substrates exchange mechanism, by a simple process of changing the spacing, because it can perform the replacement of the substrate, the substrate processing apparatus In and out of the substrate to be processed can be performed more efficiently.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an operation of a substrate transfer device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a substrate processing system according to the embodiment of the present invention.

FIG. 3 is a side structural view of the substrate processing system according to the embodiment of the present invention.

FIG. 4 is a perspective view of the substrate transfer device according to the embodiment of the present invention.

FIG. 5 is a side view of the substrate transfer device according to the embodiment of the present invention.

FIG. 6 is a plan view of the substrate transfer device according to the embodiment of the present invention.

FIG. 7 is a front view of the substrate transfer device according to the embodiment of the present invention.

FIG. 8 is a plan view of the opening / closing mechanism according to the embodiment of the present invention.

FIG. 9 is a front view of the opening / closing mechanism according to the embodiment of the present invention.

FIG. 10 is a front sectional view of a detachable mechanism according to the embodiment of the present invention.

FIG. 11 is a schematic view illustrating an operation of the substrate transfer device according to the embodiment of the present invention.

FIG. 12 is a perspective structural view of a spin coater according to an embodiment of the present invention.

FIG. 13 is a perspective view of a hot plate according to an embodiment of the present invention.

FIG. 14 is a side structural view of a hot plate according to the embodiment of the present invention.

FIG. 15 is a plan structural view of a hot plate link mechanism according to the embodiment of the present invention.

FIG. 16 is a front structural view of a main part of the hot plate in the embodiment of the present invention.

FIG. 17 is a time chart showing an operation of each part at the time of board replacement in the embodiment of the present invention.

FIG. 18 is a time chart showing an operation of each part at the time of board replacement in the embodiment of the present invention.

FIG. 19 is a partial side view of a hot plate according to a modification of the present invention.

FIG. 20 is a perspective view of a hand according to a modified example of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing system 101-103 Substrate transfer apparatus 110 X moving mechanism 120 Vertical arm mechanism 140 Horizontal arm mechanism 150a, 150b Hand (substrate exchange member) 160 Opening / closing mechanism 300 Substrate processing apparatus (substrate processing unit) 310a, 310b Shelf (substrate holding) Element)

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-4-304372 (JP, A) JP-A-4-180246 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) B65G 1/00-1/20 B65G 49/07 H01L 21/68

Claims (3)

(57) [Claims] 1. A substrate the substrate processed by the substrate processing apparatus
Removed from the processing apparatus, and the substrate replacement method of introducing the substrate into the substrate processing apparatus holds the substrate from below by the upper of the pair of board holding member disposed at intervals in the up and down (a) a substrate processing apparatus For transferring substrates between multiple substrate processing equipment
A step of holding the substrate from below by the lower of the pair of the substrate transfer device is arranged vertically at a distance of the substrate replacement member, while holding the substrate by (b) the underlying substrate exchange member, one
A step of moving the pair of substrate exchange member at a position sandwiched between the substrate holding member of the pair, by moving upwardly (c) upper substrate exchange member, the substrate held by the upper substrate holding member upper A step of transferring the substrate held by the lower substrate exchange member onto the lower substrate holding member by transferring the substrate onto the substrate exchange member and moving the lower substrate exchange member downward, (d) while holding the substrate by the upper substrate exchange member, the substrate replacement method characterized by comprising the steps of retracting the pair of substrates exchange member with respect to the pair of board holding member. 2. A substrate a substrate processed in the substrate processing apparatus
Removed from the processing apparatus, and the substrate replacement method of introducing the substrate into the substrate processing apparatus, for holding a substrate from below by the lower of the pair of board holding member disposed at intervals in the up and down (a) a substrate processing apparatus To transfer substrates between multiple substrate processing equipment
A step of holding the substrate by the upper lower pair of substrate exchange member disposed at intervals in the upper and lower substrate transfer apparatus, while holding the substrate by (b) the upper substrate exchange member, one
Move the pair of board exchange members to a position sandwiching the pair of board holding members.
A step of moving, by causing move upwardly (c) lower substrate exchange member, together with make transfers the substrate held by the lower side of the substrate holding member on the lower side of the substrate exchange member on the upper substrate By moving the exchange member downward, a step of transferring the substrate held by the upper substrate exchange member onto the upper substrate holding member; (d) holding the substrate by the lower substrate exchange member, substrate replacement method characterized by comprising the steps of retracting the pair of substrates exchanging member with respect to the substrate holding member of a pair, the. 3. A substrate exchanging apparatus for taking out a substrate processed by a substrate processing apparatus from the substrate processing apparatus and introducing the substrate into the substrate processing apparatus. (B) a pair of substrate holding mechanisms capable of holding the substrate from below, and (b) a substrate transfer device for transferring the substrate between a plurality of substrate processing apparatuses, which are vertically spaced from each other. A pair of substrate exchange mechanisms capable of holding a substrate from below, and (c) one of the pair of substrate exchange mechanisms is a pair of substrate exchange mechanisms.
Receiving a substrate from one side, and the other of the pair of substrate exchange mechanisms
To pass the substrate to the other of the pair of substrate holding mechanisms,
Move the pair of substrate exchange mechanisms close to the pair of substrate holding mechanisms.
(D) interval control means for changing the vertical interval between the pair of substrate exchange mechanisms in a state in which the pair of substrate exchange mechanisms are moved forward and backward, and (e) And a movement control means for moving the pair of substrate exchange mechanisms to the vicinity of each of the plurality of substrate processing apparatuses.