JP2665179B2 - IC cleaning equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC cleaning apparatus for cleaning ICs, and more particularly to an IC cleaning apparatus for cleaning IC surfaces.

[0002]

2. Description of the Related Art When an electronic device such as a chip capacitor is soldered to an IC surface, flux adheres to the IC surface. If the attached flux is not removed, rust is generated at the joint with the electronic device, and the reliability is significantly reduced. Therefore, after the electronic device is soldered to the IC, the electronic device is washed with water or the like to remove the flux.

Conventionally, ICs for removing flux
Washing device The washing device is composed of a plurality of washing tanks arranged in a line below a trolley conveyor for moving a basket containing a plurality of ICs, and a drying chamber arranged next to the last washing tank. I was Then, the baskets containing the ICs are sequentially immersed in a cleaning tank to perform bubble cleaning, and then placed in a drying chamber at the last stage to dry the cleaning liquid to remove the flux.

[0004]

In the above-described conventional IC cleaning apparatus, although bubbles are generated in the cleaning tank to increase the cleaning power and the water is washed, since the surface of the IC is hydrophilic, the plaques are hardly detached and the cleaning time is reduced. There was a problem that it took. Also, after immersion in the cleaning liquid, it is immediately put into the drying chamber.
There is a disadvantage that the amount of water droplets remaining on the surface C is large and it takes time to dry.

[0005] An automatic soldering apparatus employing a cleaning apparatus of this type using a hot water shower is disclosed in Japanese Patent Application Laid-Open No. 59-97761. In this cleaning apparatus, a plurality of units each including a pipe capable of showering a soldering object with a hot water shower and a hot water tank for performing bubble cleaning from below are arranged along a conveyor.

[0006] However, in this cleaning apparatus, the I
Even when the present invention is applied to cleaning of C, since the hot water shower nozzle is fixed, a portion where a plurality of ICs are not arranged and hot water does not take place, and there is a problem of whether or not the flux can be completely removed. In addition, even if the removal of flux can be completely achieved, a number of hot water tanks must be arranged, which makes the equipment large and expensive, as well as requiring a large floor space and effectively using the floor space. There is a drawback that you can not.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a small and inexpensive IC cleaning apparatus capable of shortening the cleaning and drying time and reducing the floor area.

[0008]

SUMMARY OF THE INVENTION A feature of the present invention is that a frame portion through which a plurality of external leads projecting from a lower surface of an IC is fitted into a package body of the IC, and a wall extending below the frame portion and surrounding the external leads. And a plurality of washing nozzles that jet water downward while moving on the tray member, and a plurality of cleaning nozzles are arranged in the longitudinal direction. A shower pipe member to be arranged;
An IC cleaning apparatus comprising: an air blow pipe member in which a drying nozzle that blows air downward while moving on the tray member is disposed in a longitudinal direction.

It is preferable that the shower tube member is located below the air blow tube member or is located in the same plane.

[0010]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a plan view and a partially cutaway side view showing an embodiment of an IC cleaning apparatus according to the present invention. As shown in FIG. 1, the IC cleaning apparatus includes a frame 5 into which a package body of the IC 13 is fitted through a plurality of external leads 13 projecting from a lower surface of the IC 13 to which a plurality of electronic devices 14 are soldered. An IC mounting portion having a wall portion extending below the portion and surrounding the external lead;
And a shower pipe in which a plurality of washing nozzles 2a for ejecting water downward while moving on the tray 1 are arranged in a longitudinal direction. 2, and an air blow pipe 3 in which a drying nozzle 3a for blowing air downward while moving on the tray 1 is arranged in a longitudinal direction.

The air blow pipe 3 is disposed on the shower pipe 2 and guide rollers 10a and 10b attached to the ends of the air blow pipe 3 and the shower pipe 2 so that they can move on the tray 1 independently. The rails 9a and 9b on which the vehicle travels are arranged in two stages, upper and lower. The reason why the air blow pipe 3 is disposed on the upper side is that when the shower pipe 2 is on the upper side, there is a possibility that water drops may be applied to the air blow pipe 2.

Flexible pipes 11 and 12 for supplying water or compressed air to shower pipe 2 or air blow pipe 3
Although not shown in the drawing, is wound around a reel, so that the flexible pipes 11 and 12 can be freely expanded and contracted. Also, the shower pipe 2 and the air blow pipe 3
Although not shown in the drawing, the moving mechanism is performed by a variable speed motor that winds a traction rope attached to the tube via a pulley so as to take up little space.

Frame 5 in IC mounting section 7 of tray 1
Has a spigot so that the package body of the IC 13 can enter. The wall 6 is provided so that water does not enter and the external lead 15 does not get wet. Further, it is desirable to provide a packing on the side wall of the spigot portion so that water does not enter the inside.

Next, the operation of the IC cleaning apparatus will be described. First, the IC 13 is placed on the frame 5 of the IC mounting portion 7 of the tray 1.
Insert Then, the tray 1 is placed on a drainage tank (not shown). Next, the shower tube 2 ejects water from the washing nozzle 2a while moving in the direction of arrow A. At this time, the water pressure is, for example, 4 kg / cm ² , and the moving speed is 10
0 to 200 mm / sec. Then, when it crosses the surface of the tray 1, it moves in the direction of arrow B and returns to the original position while spraying water. The cleaning operation by reciprocating movement of ejecting water while moving as described above is repeated about three times.

Next, while moving the air blow pipe 3 in the direction of arrow C, the drying air is supplied from the drying nozzle 3a to the tray 1.
Spray on the surface. The air pressure at this time is, for example, 5 k
g / cm ² and the moving speed is 300 to 500 mm / sec.
Set to c. Then, it moves while blowing dry air in the direction of arrow D from the point where it crosses the surface of the tray 1 and returns to the original position. The drying operation by the reciprocating movement is repeated about 5 to 10 times while blowing the dry air while moving as described above.

Since the shower pipe 2 and the air blow pipe 3 travel on rails 9a and 9b having different heights, the shower pipe 2 and the air blow pipe 3 can move without interference. As described above, instead of performing the reciprocating movement of only drying after the reciprocating movement of only cleaning is completed, a method of performing washing and drying alternately or performing a washing operation and a drying operation with a time lag can be selected.

When the flux of the IC was removed by trial with this IC cleaning apparatus, what was conventionally required for 20 minutes could be processed in an extremely short time of 2 minutes. The apparatus itself requires only one drain tank without arranging a large number of washing tanks as in the related art, and the floor area is reduced to 1/10. Further, the conventional large-sized conveyor and washing tank can be omitted, and the cost can be reduced to a fraction.

FIG. 2 is a view for explaining another embodiment of the IC cleaning apparatus of the present invention. This IC cleaning device is shown in FIG.
As shown in (1), the moving surfaces of the shower pipe 2 and the air blow pipe 3 are the same. Other than that, it is the same as the above-mentioned embodiment.

This IC cleaning device is designed to lower the height of the device. The shower tube 2 and the air blower are operated so that the washing and drying operations by the reciprocating motion of the shower tube 2 and the air blow tube 3 can be performed. The movement of the tube 3 is limited. That is, the shower pipe 2
The air blow pipe 3 can move without interfering with each other by setting the movement range from the original position to A shown by the arrow from the original position. Further, in this embodiment, since the rail can be shared, there is an advantage that the cost can be further reduced.

[0021]

As described above, according to the present invention, a plurality of I
By providing two pipe members arranged and arranged with a number of nozzles for ejecting water and dry air while moving on the tray on which C is mounted, the flux on the surface of the IC is scraped off by the impact force of the water, Even if the water droplets remain on the surface of the IC, the water droplets are scattered by the strong blowing force of the dry air, so that there is an effect that the water droplets can be washed faster and dried earlier.

The size of the apparatus is substantially the same as the size of the tray for arranging a plurality of ICs, and is installed in comparison with the conventional arrangement of a large number of washing tanks and drying chambers arranged in a line. There is an effect that the floor area can be significantly reduced. Also, there is an effect that the cost can be significantly reduced as the device is made smaller.

[Brief description of the drawings]

FIG. 1 is a plan view and a partially cutaway side view showing an embodiment of an IC cleaning apparatus of the present invention.

FIG. 2 is a view for explaining another embodiment of the IC cleaning apparatus of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tray 2 Shower pipe 2a Cleaning nozzle 3 Air blow pipe 3a Drying nozzle 5 Frame part 6 Wall part 7 IC mounting part 8 Space 9a, 9b Rail 10a, 10b Guide rail 11, 12, Flexible piping 13 IC 14 Electronic device 15 External Lead

Claims (3)

(57) [Claims] 1. An IC having a frame portion through which a plurality of external leads projecting from a lower surface of an IC and into which a package body of the IC is fitted, and a wall extending below the frame portion and surrounding the external leads.
A shower in which a plurality of C mounting portions are arranged in a space and are arranged vertically and horizontally and connected, and a plurality of washing nozzles for ejecting water downward while moving on the tray member are arranged in a longitudinal direction. An IC comprising: a pipe member; and an air blow pipe member in which a drying nozzle for blowing air downward while moving on the tray member is disposed in a longitudinal direction.
Cleaning equipment. 2. The IC cleaning apparatus according to claim 1, wherein said shower pipe member is located below said air blow pipe member. 3. The IC cleaning apparatus according to claim 1, wherein the shower pipe member and the air blow pipe member are located in the same plane.