JP2591834Y2 - Furnace sealed shutter device in semiconductor manufacturing equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to a semiconductor manufacturing apparatus (hereinafter referred to as CVD) for forming a semiconductor single crystal on a material wafer.
(Hereinafter abbreviated as "device").

[0002]

2. Description of the Related Art FIG. 4 is a longitudinal sectional front view showing the structure of a conventional CVD apparatus provided with an in-furnace seal shutter device.
The inside of the process chamber 2 surrounded by the frame 1 is divided into a heater unit 3 in the upper right part and a clean unit part 4 in the upper left part, as shown in FIG.
Reference numeral 7 denotes a quartz boat on which wafers are mounted, and 8 denotes a handler for operating the quartz boat 7. Open bottom 1 of manifold 10 at bottom
An in-furnace seal type shutter device 13 including a seal shutter 12 for opening and closing 1 is provided. Further, a robot 19 and a carrier stage 19A are disposed on the left side in the drawing of the handler 8, and the portions other than the heater section 3 and the clean unit section 4 are filled with N ₂ gas.

A conventional in-furnace seal type shutter device 13 comprises:
As shown in FIG. 5, an air swing motor 16 is fixed to a plate 15 fixed to a rod 14a of an air cylinder 14 fixed to a frame 1a, and an arm 17 is fixed to a rod 16a of the air swing motor 16, Further, a seal shutter 12 having an O-ring 12b near the outer periphery of the upper surface is provided near the tip of the arm 17 via a support shaft 12a. The operation of the in-furnace seal shutter device 13 will be described. When the quartz boat 7 on which wafers are loaded is lifted and inserted by the lifting device 9 from the open port 11 of the manifold 10 below the reaction furnace 5 shown in FIG. , The seal shutter 12 is located beside the manifold 10, and the quartz boat 7 is located in the reaction furnace 5.
As shown in FIG. 5, the air oscillating motor 16 operates to rotate the arm 17 so that the seal shutter 12 is positioned directly below the manifold 10, and then the air cylinder 14
Raises the plate 15 along the guide bar 18 attached between the frame 1a and the bracket 1b, so that the arm 17, and therefore the seal shutter 12, also rises to seal the opening 11 of the manifold 10 (see FIG. 4). . The opening of the opening 11 is the reverse of the above.

[0004]

By the way, a sealed intermediate chamber 2a is provided below the heater section 3 as shown in FIG. 1 so as to handle the piping joints around the manifold 10 in the process chamber 2. _{(2) In} the case of an improved frame that eliminates the need to repeatedly discharge and refill gas, the conventional in-furnace shutter type shutter device 13 is too long in the vertical direction and is not caused by the improved frame. However, there is a problem that the use of the air swing motor 16 has a disadvantage that there is a shock at the final stage of the operation.

[0005]

According to the present invention, a drive chamber of the in-furnace seal type shutter device is provided above the intermediate chamber to accommodate the drive unit of the seal type shutter device according to the present invention, and a gear and a rack driven by an electric motor are provided. And rotating the seal shutter through two ball joints, raising and lowering the seal shutter with the first air cylinder, and pushing the rack in one direction with the second air cylinder to eliminate backlash. Solved the above problem.

[0006]

A drive chamber is provided above the intermediate chamber to accommodate the drive section of the in-furnace seal type shutter device. Since the intermediate chamber has only a shaft for rotating the seal shutter and its seal guide, the manifold has There is no hindrance to the handling of various pipes, and the linear motion of the rack, in which the backlash is removed by constantly pushing the rack in one direction with the second air cylinder, is given without shock by the gears driven by the electric motor. The seal shutter is rotated by the joint, and the rotation shaft is moved up and down by the first air cylinder to open and close the opening of the manifold.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In-furnace seal type shutter device 20 according to the present invention
FIG. 1 is a vertical sectional front view showing a configuration of a CVD apparatus provided with
FIG. 2 is a front elevation view of the in-furnace seal shutter device 20.
FIG. 3 is a cross-sectional plan view taken along the line AA of FIG. 2, and the same parts as those in FIGS. As shown in FIG. 1, an intermediate chamber 2 partitioned by upper and lower frames 1a and 1c.
A drive chamber 2b is defined by a side plate 1d and a ceiling plate 1e on a, and a first air cylinder 14 is attached to a bracket 1f fixed to the frame 1 as shown in FIG. The rod extension 14b is integrally provided by a sleeve or a screw connection (not shown).
4b passes through the hole 1'a of the upper frame 1a, is guided by the seal guide 21 attached to the lower frame 1c, and the arm 17 is fixed horizontally. 3, one end of an arm 22 is fixed to the rod 14a, and the other end of the arm 22 has one ball of a pair of ball joints 24 and 25 in which a movable portion is connected to each other by a shaft 23. A joint 24 is attached, and the other ball joint 25 is fixed to a tip 27a of a rack 27 that slides linearly on a slide guide 26 fixed to the upper frame 1a, and the vicinity of the tip 27a adjacent to the rack teeth. A plate-like arm 28 is fixed at right angles to the sliding direction of the rack 27, and the rod of the second air cylinder 29 constantly presses the side surface 28 a of the arm 28 in parallel with the sliding direction of the rack 27. A gear 31 driven by an electric motor 30 fixed to the upper frame 1a is engaged with the rack 27.
Next, the operation will be described. When the rod extension 14b is lowered by the operation of the first air cylinder 14 from the position indicated by the two-dot chain line in which the seal shutter 12 shown in FIG. When the seal shutter 12 is lowered to the position indicated by the solid line and the electric motor 30 is operated, the rack 27 moves downward along the slide guide 26 via the gear 31 as shown in FIG. The arm 22 pivots to the position indicated by the two-dot chain line in FIG. 3 via the joints 25 and 24, and the rod extension 14b,
The seal shutter 12 pivots from the position indicated by the alternate long and short dash line in FIG. 3 to the position indicated by the alternate long and two short dashes line in FIG. On the other hand, the rod of the second air cylinder 29 always pushes the arm 28 in one direction in parallel with the sliding direction of the rack 27, and serves to eliminate the backlash between the rack 27 and the gear 31. In the operation of contracting the second air cylinder 29, it is effective to use a so-called damper that eliminates the air.

[0008]

[Effect of the Invention] Since the drive unit of the in-furnace seal type shutter device is located above the intermediate chamber, the operation of the manifold pipe joints is not hindered, and the backlash-removed rack and the electric motor driven gear are used. Does not cause a shock when the rotation of the seal shutter is stopped.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view showing the configuration of a semiconductor manufacturing apparatus provided with an in-furnace seal type shutter device according to the present invention.

FIG. 2 is a front elevation view of the in-furnace seal type shutter device according to the present invention;

FIG. 3 is a sectional plan view taken along the line AA of FIG. 2;

FIG. 4 is a vertical sectional front view showing the configuration of a semiconductor manufacturing apparatus provided with a conventional in-furnace seal shutter device.

FIG. 5 is a front elevation view of a conventional in-furnace seal shutter device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 2 Process room 2a Intermediate room 2b Drive room 3 Heater part 4 Clean unit part 5 Reactor 6 Clean unit 7 Quartz boat 9 Elevating device 10 Manifold 11 Bottom opening 12 Seal shutter 13 Furnace sealed shutter device 14 First Air cylinder 19 Robot 19A Carrier stage 20 Furnace sealed shutter device 27 Rack 29 Second air cylinder 30 Electric motor 31 Gear

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/31 H01L 21/205 H01L 21/22 511 C23C 16/44

Claims (1)

(57) [Scope of request for utility model registration] 1. An inner process chamber surrounded by a frame is partitioned into a heater section and a clean unit section. The heater section is configured such that an elevating device raises and lowers a quartz boat into a reaction furnace, and a lower portion of the reaction furnace. In a semiconductor manufacturing apparatus provided with an in-furnace sealed shutter device including a seal shutter for opening and closing a bottom opening of a manifold located in the above, the semiconductor manufacturing apparatus has an intermediate chamber sealed around the manifold, The in-furnace seal type shutter device has a drive unit disposed in a drive chamber above the intermediate chamber, the drive unit is provided with a first air cylinder for opening and closing the seal shutter, and a backlash for opening and closing the seal shutter. A gear and a rack driven by an electric motor are provided to remove the gears, and a second air series is provided for the engagement between the gear and the rack. An in-furnace type shutter device in a semiconductor manufacturing apparatus, wherein a shutter is provided.