JP2521478Y2 - 集積回路パッケージ - Google Patents

集積回路パッケージ

Info

Publication number
JP2521478Y2
JP2521478Y2 JP935290U JP935290U JP2521478Y2 JP 2521478 Y2 JP2521478 Y2 JP 2521478Y2 JP 935290 U JP935290 U JP 935290U JP 935290 U JP935290 U JP 935290U JP 2521478 Y2 JP2521478 Y2 JP 2521478Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
package
attachment
molding
male connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP935290U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03101544U (https=
Inventor
哲郎 田岡
Original Assignee
ナイルス部品株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナイルス部品株式会社 filed Critical ナイルス部品株式会社
Priority to JP935290U priority Critical patent/JP2521478Y2/ja
Publication of JPH03101544U publication Critical patent/JPH03101544U/ja
Application granted granted Critical
Publication of JP2521478Y2 publication Critical patent/JP2521478Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP935290U 1990-02-01 1990-02-01 集積回路パッケージ Expired - Lifetime JP2521478Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP935290U JP2521478Y2 (ja) 1990-02-01 1990-02-01 集積回路パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP935290U JP2521478Y2 (ja) 1990-02-01 1990-02-01 集積回路パッケージ

Publications (2)

Publication Number Publication Date
JPH03101544U JPH03101544U (https=) 1991-10-23
JP2521478Y2 true JP2521478Y2 (ja) 1996-12-25

Family

ID=31512957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP935290U Expired - Lifetime JP2521478Y2 (ja) 1990-02-01 1990-02-01 集積回路パッケージ

Country Status (1)

Country Link
JP (1) JP2521478Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6384270B2 (ja) * 2014-03-26 2018-09-05 株式会社デンソー 半導体モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3110847U (ja) 2004-08-03 2005-07-07 日本ソリッド株式会社 細粒化された酸化還元水の製造材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3110847U (ja) 2004-08-03 2005-07-07 日本ソリッド株式会社 細粒化された酸化還元水の製造材

Also Published As

Publication number Publication date
JPH03101544U (https=) 1991-10-23

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