JP2514911Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2514911Y2
JP2514911Y2 JP1990128569U JP12856990U JP2514911Y2 JP 2514911 Y2 JP2514911 Y2 JP 2514911Y2 JP 1990128569 U JP1990128569 U JP 1990128569U JP 12856990 U JP12856990 U JP 12856990U JP 2514911 Y2 JP2514911 Y2 JP 2514911Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
package
insulating substrate
frame
sintered body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990128569U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0485733U (US06342305-20020129-C00040.png
Inventor
達海 坂元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990128569U priority Critical patent/JP2514911Y2/ja
Publication of JPH0485733U publication Critical patent/JPH0485733U/ja
Application granted granted Critical
Publication of JP2514911Y2 publication Critical patent/JP2514911Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1990128569U 1990-11-29 1990-11-29 半導体素子収納用パッケージ Expired - Lifetime JP2514911Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990128569U JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990128569U JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0485733U JPH0485733U (US06342305-20020129-C00040.png) 1992-07-24
JP2514911Y2 true JP2514911Y2 (ja) 1996-10-23

Family

ID=31876024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990128569U Expired - Lifetime JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2514911Y2 (US06342305-20020129-C00040.png)

Also Published As

Publication number Publication date
JPH0485733U (US06342305-20020129-C00040.png) 1992-07-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term