JP2025049872A - Sealing resin for use in compression molding and forming method and forming apparatus thereof - Google Patents

Abstract

To provide a sealing resin capable of implementing a compression molding apparatus and a compression molding method that prevent occurrence of molding defects caused by uneven winding, residual gas, and dust generated during molding, and can prevent formation of thin burrs in a sealing resin at exposed parts of a molded product, and a forming method and a forming apparatus for the sealing resin capable of facilitating handling before resin sealing.SOLUTION: A forming apparatus 1 for forming sealing resin R is a forming apparatus for forming sealing resin R to be used in compression molding of a workpiece W, and is equipped with a tableting mold 102 having an upper mold 104 and a lower mold 106 to accommodate base resin Rm therein and tablets the base resin Rm into a lattice-shaped sealing resin R having through holes Rh.SELECTED DRAWING: Figure 1

Description

The present invention relates to a sealing resin used in compression molding, as well as a method and device for forming the same.

One example of a resin sealing device and resin sealing method that uses a compression molding method to seal a workpiece having electronic components mounted on a substrate with sealing resin and process it into a molded product.

The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper and lower molds are clamped together to seal the workpiece. As an example, when a sealing mold with a cavity in the upper mold is used, a technique is known in which the sealing resin is supplied all at once to the center position of the workpiece and molded. On the other hand, when a sealing mold with a cavity in the lower mold is used, a technique is known in which a release film (hereinafter sometimes simply referred to as "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (see Patent Document 1: International Publication WO2015/159743).

International Publication No. WO2015/159743

Conventionally, the compression molding method was widely used, in which the workpiece is held in the upper die, a cavity is provided in the lower die, and the sealing resin (granular resin, for example) is supplied into the cavity, as it was thought to be advantageous in terms of preventing deformation of the workpiece due to the flow and contact of the sealing resin.

However, in a configuration in which the workpiece is held in the upper die and the cavity is provided in the lower die, there is an issue that if the workpiece is thin or large, it is difficult to hold it in the upper die and it is prone to falling. Furthermore, when granular resin is used as the sealing resin, there are issues such as dust generation during molding due to friction between the resin particles, and handling is difficult, as well as issues that it is difficult to supply (spray) the sealing resin evenly over the entire area inside the cavity provided in the lower die, which tends to result in uneven spreading. There is also an issue that the air contained in the gaps between the particles when the sealing resin is sprayed and the gas components caused by degassing from the sealing resin when melted do not escape and remain in the molded product as voids, which is likely to cause molding defects.

However, regardless of the cavity arrangement, when forming a molded product in which electronic components such as heat sinks or flip-chip connected chips are exposed, there is a problem in that thin burrs of the sealing resin are likely to form on the exposed areas of the molded product (for example, on the top surface of the electronic components), resulting in incomplete exposure.

The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding device and compression molding method that can prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and can prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product, and also to provide a sealing resin and a molding method and device therefor that can facilitate handling before resin sealing.

The present invention solves the above problems by the solution described below as one embodiment.

The sealing resin forming device according to one embodiment is a forming device that forms sealing resin used in compression molding of a workpiece, and is required to be equipped with a tableting die that has an upper die and a lower die, contains a base resin, and tablets the sealing resin into a lattice-like shape having through holes. The sealing resin according to one embodiment formed by the device is required to have a lattice-like configuration having through holes.

By performing compression molding using the above-mentioned sealing resin, it is possible to prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding. It is also possible to facilitate handling of the sealing resin and prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. Furthermore, by applying this to a configuration in which a cavity is provided in the upper mold and the workpiece is held in the lower mold, problems such as the workpiece falling can be solved.

The lower die has a cavity piece that forms the bottom of the cavity, a clamper that is arranged to surround the cavity piece and forms the inner wall of the cavity, and a number of movable pieces that protrude from the upper surface of the cavity piece, are arranged at predetermined positions, and can move up and down. The tableting die is configured to accommodate the base resin around the movable pieces in the cavity and tablet it, and the area of the movable pieces is preferably configured to be formed as the through-hole.

The upper die has a holding part that holds a heat sink on the lower surface of the upper plate, and the tableting die is configured to perform tableting with the heat sink held in the holding part of the upper die and with the base resin accommodated around the movable piece of the lower die, and it is preferable that the sealing resin is formed with the heat sink fixed. This makes it possible to form a sealing resin that is lattice-shaped with through holes and has a heat sink fixed to one side. The sealing resin according to one embodiment formed by the device is required to be lattice-shaped with through holes and has a heat sink fixed to one side.

The tableting die is preferably provided with a leg forming groove on at least one of the upper surface of the cavity piece of the lower die or the lower surface of the upper plate of the upper die, which forms a leg that is erected in the sealing resin.

It is also preferable that a powder resin is used as the base resin.

In one embodiment, the method for forming a sealing resin is a method for forming a sealing resin to be used in compression molding of a workpiece, and is required to include a forming step for forming the sealing resin in a lattice shape having through holes.

The molding device and molding method according to the present invention can form a sealing resin that provides the following effects. That is, by using the sealing resin according to the present invention, it is possible to realize a compression molding device and compression molding method that can prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. In addition, handling before resin sealing can be facilitated.

1 is a plan view illustrating an example of an apparatus for forming a sealing resin according to an embodiment of the present invention. 2 is a side view showing an example of a first pressing device of the forming apparatus shown in FIG. 1 . 2 is a front cross-sectional view showing an example of a first mold of the forming apparatus shown in FIG. 1 . 2A to 2C are explanatory diagrams illustrating an example of a method for forming a sealing resin using the forming apparatus shown in FIG. 1 . FIG. 5 is an explanatory diagram following FIG. 4 . FIG. 6 is an explanatory diagram continuing from FIG. 5 . 1 is a perspective view showing an example of a workpiece to be compressed and molded using a sealing resin according to an embodiment of the present invention; 2 is a perspective view showing an example of a sealing resin formed by the forming apparatus shown in FIG. 1 . 9 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 8 . 1. FIG. 4 is a perspective view showing another example of a sealing resin formed by the forming apparatus shown in FIG. 1. FIG. 4 is a front cross-sectional view showing another example of the first mold of the forming apparatus shown in FIG. 13 is a plan view showing another example of the sealing resin forming apparatus according to the embodiment of the present invention. FIG. 13 is a front cross-sectional view showing an example of a first mold of the forming apparatus shown in FIG. 12. 13A to 13C are explanatory diagrams illustrating an example of a method for forming a sealing resin using the forming apparatus illustrated in FIG. 12 . FIG. 15 is an explanatory diagram following FIG. 14 . FIG. 16 is an explanatory diagram following FIG. 15. 13 is a perspective view showing an example of a sealing resin formed by the forming apparatus shown in FIG. 12. 18 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 17. 13 is a perspective view showing another example of the sealing resin formed by the forming apparatus shown in FIG. 12. 13 is a front cross-sectional view showing another example of the first mold of the forming apparatus shown in FIG. 12. FIG. 2 is a plan view showing an example of a compression molding device in which a sealing resin according to an embodiment of the present invention is used. 22 is a side view showing an example of a second press device of the compression molding apparatus shown in FIG. 21. 22 is a front cross-sectional view showing an example of a second mold of the compression molding apparatus shown in FIG. 21. 24 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus including the second press apparatus shown in FIG. 22 and the second mold shown in FIG. 23 . FIG. This is an explanatory diagram following Figure 24. This is an explanatory diagram following Figure 25. This is an explanatory diagram following Figure 26. This is an explanatory diagram following Figure 27. This is an explanatory diagram following Figure 28. 22 is a front cross-sectional view showing another example of the second mold of the compression molding apparatus shown in FIG. 21. 31 is an explanatory diagram illustrating an example of a compression molding apparatus including the second press apparatus shown in FIG. 22 and the second mold shown in FIG. 30. FIG. This is an explanatory diagram following Figure 31. This is an explanatory diagram following Figure 32. This is an explanatory diagram following Figure 33. FIG. 22 is a side view showing an example of a third press device of the compression molding apparatus shown in FIG. 21 . 22 is a front cross-sectional view showing an example of a third mold of the compression molding apparatus shown in FIG. 21. FIG. 37 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with the third press apparatus shown in FIG. 35 and the third mold shown in FIG. 36 . This is an explanatory diagram following Figure 37. This is an explanatory diagram following Figure 38. This is an explanatory diagram following Figure 39. This is an explanatory diagram following Figure 40. This is an explanatory diagram following Figure 41. 22 is a front cross-sectional view showing another example of the third mold of the compression molding apparatus shown in FIG. 21. FIG. 44 is an explanatory diagram illustrating an example of a compression molding apparatus including the third press apparatus shown in FIG. 35 and the third mold shown in FIG. 43 . This is an explanatory diagram following Figure 44. This is an explanatory diagram following Figure 45. This is an explanatory diagram following Figure 46.

[First embodiment]
(Sealing resin forming device)
The sealing resin R according to the embodiment of the present invention is a resin used for compression molding of a workpiece (molded product) W. In the first embodiment, an example will be described in which the sealing resin R is formed as a lattice-shaped sealing resin R having through holes Rh (hereinafter, may be distinguished by being written as "R1").

First, the molding device 1 for molding the sealing resin R (hereinafter, sometimes simply referred to as the "forming device") will be described. The forming device 1 may be provided either inside or outside the compression molding device 2. Here, FIG. 1 is a plan view (schematic diagram) showing an example of the forming device 1. For ease of explanation, arrows in the figure indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the device. In addition, in all the figures for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations may be omitted.

The workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa (see FIG. 7). More specifically, examples of the substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of the electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and coil sheets (note that the workpiece W may be configured to consist only of electronic components Wb). The shape of the substrate Wa is generally rectangular (striped), square, circular, and the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more. In this embodiment, the workpiece W is described as an example in which electronic components Wb are flip-chip connected to the substrate Wa via bumps Wc, but is not limited thereto.

In this embodiment, a thermosetting resin (e.g., an epoxy resin containing a filler, but not limited thereto) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid resin having a predetermined shape (details will be described later) whose overall shape corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" of the required amount of sealing (one amount per workpiece W), but it may be configured so that several pieces (e.g., about two or three pieces) are divided to constitute the "whole" of the required amount of sealing. In addition, a powder resin (form) that is a thermosetting resin (property) is preferably used for the base resin Rm (details will be described later). However, it is not limited thereto, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of a plurality of these may be used.

As shown in FIG. 1, the forming device 1 mainly comprises a base resin supply unit 10D that supplies base resin Rm, and a resin forming unit 10E that uses base resin Rm to form sealing resin R. As an example, the base resin supply unit 10D and the resin forming unit 10E are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited, and the equipment configuration within the unit, the number of units, the order in which the units are arranged, etc. may be changed. In addition, the configuration may include units other than those described above (not shown).

The forming device 1 also has a guide rail 20 that is linearly arranged between the units, and a conveying device (first loader) 21 that conveys the base resin Rm is arranged to be movable between the units along the guide rail 20. However, this is not limited to the above configuration, and the conveying device may be configured to include a robot hand or the like instead of a loader.

In addition, in the forming device 1, a control unit 80 that controls the operation of each mechanism in each unit is disposed in the base resin supply unit 10D (it may also be configured to be disposed in another unit).

Next, the base resin supply unit 10D equipped in the forming device 1 will be described in detail. The base resin supply unit 10D is equipped with a base resin supply section 40 that supplies the base resin Rm. As an example, the base resin supply section 40 is configured with a dispenser that supplies the base resin Rm, a conveying device, etc. When conveying the base resin Rm from the base resin supply unit 10D to the resin forming unit 10E, the first loader 21 may be used as the conveying device, or another conveying device (not shown) may be used (direct spraying from a dispenser, etc. may also be used for the base resin Rm).

Next, the resin forming unit 10E provided in the forming device 1 will be described in detail. The resin forming unit 10E is provided with a resin forming section 50 as a device that forms the sealing resin R using the base resin Rm. In this embodiment, two resin forming units 10E (three or more or one) are provided, and one resin forming section 50 (two or more) is provided per resin forming unit 10E (see FIG. 1). However, this configuration is not limited to this.

The resin forming section 50 is equipped with a tableting die (first die) 102 having a pair of dies (for example, a combination of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel) that are opened and closed. It also has a press device (first press device) 150 that drives the first die 102 to open and close. A side view (schematic diagram) of the first press device 150 is shown in FIG. 2, and a front cross-sectional view (schematic diagram) of the first die 102 is shown in FIG. 3.

Here, as shown in FIG. 2, the first press device 150 is configured to include a pair of platens 154, 156, a plurality of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, this is not limited to this). In this embodiment, the upper platen 154 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the lower platen 156 is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, this is not limited to this, and the platens may be set upside down, i.e., the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (neither is shown).

On the other hand, as shown in FIG. 3, the first mold 102 is provided with a first upper mold 104 on the vertical side and a first lower mold 106 on the vertical side as a pair of molds arranged between the pair of platens 154, 156 in the first press device 150. The first upper mold 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the first lower mold 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The first upper mold 104 and the first lower mold 106 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction). In the first mold 102 according to this embodiment, the first upper mold 104 constitutes a so-called "pestle mold", and the first lower mold 106 constitutes a so-called "mortar mold".

Next, the first lower die 106 of the first mold 102 will be described in detail. As shown in FIG. 3, the first lower die 106 includes a first lower die chase 110, a first cavity piece 126 held therein, a first clamper 128, and the like. The first lower die chase 110 is fixed to the upper surface of the first support plate 114 via a first support pillar 112. A first cavity 108 is provided on the upper surface of the first lower die 106 (the surface facing the first upper die 104). A predetermined amount of base resin Rm is accommodated in this first cavity 108.

The first lower die 106 according to the present embodiment has the following configuration for pressing a predetermined amount of base resin Rm contained in the first cavity 108 to form (tablet) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). Specifically, in the first cavity piece 126 (within the area of the first cavity piece 126 in plan view), a movable piece 136 that can abut against the upper plate 142 of the first upper die 104 described later and can move up and down is provided at a predetermined position (a position corresponding to the electronic component Wb set to be exposed during compression molding). The movable piece 136 is supported in a state in which it is biased toward the first upper die 104 by the movable piece spring 134 via the pushing pin 132. As an example, the movable piece 136 is set to have an outer shape that is a predetermined dimension larger than the outer shape of the corresponding electronic component Wb in plan view. In the first lower mold 106 having the above configuration, a predetermined amount of base resin Rm is accommodated around the movable pieces 136 (specifically, in the recessed portion 138 between the movable pieces 136) (note that the base resin Rm may first be sprayed over the entire first cavity 108, including the top surface of the movable pieces 136, and then swept off with a squeegee or the like, so that it is finally accommodated in the recessed portion 138).

The first clamper 128 is annularly configured to surround the first cavity piece 126, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the first support plate 114 via the first pushing pin 122 and the first clamper spring 124 (e.g., a biasing member such as a coil spring) (however, this assembly structure is not limited). The first cavity piece 126 constitutes the inner part (bottom) of the first cavity 108, and the first clamper 128 constitutes the side part (inner wall part) of the first cavity 108. The shape and number of first cavities 108 provided in one first lower mold 106 are set appropriately (one or multiple).

Here, the first press device 150 is provided with a first lower die film supply section 111 that supplies a film F to cover the die surface 106a (predetermined area) including the inner surface of the first cavity 108 in the first lower die 106. As an example, the film F is in a roll shape, but it may also be in a strip shape.

The first lower mold 106 is also provided with suction paths (holes, grooves, etc.) (not shown) that communicate with a suction device on the top surface of the first clamper 128, the boundary between the first clamper 128 and the first cavity piece 126, etc. This allows the film F supplied from the first lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a including the inner surface of the first cavity 108.

In this embodiment, a first lower die heating mechanism (not shown) is provided to heat the first lower die 106 to a predetermined temperature. This first lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first lower die chase 110 and is configured to apply heat to the entire first lower die 106 and the base resin Rm contained in the first cavity 108. At this time, the first lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm does not thermally cure (mainly cure).

Next, the first upper die 104 of the first mold 102 will be described in detail. As shown in FIG. 3, the first upper die 104 has an upper plate (first plate) 142 that presses a predetermined amount of base resin Rm contained in the first cavity 108 of the first lower die 106 to form (compress) the sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The first plate 142 is held (fixed) by the first upper die chase 140. As an example, the first plate 142 has a flat lower surface (surface facing the first lower die 106) and is configured to be able to abut against all the movable pieces 136 of the first lower die 106 described above.

Here, the first press device 150 is provided with a first upper die film supply section 113 that supplies a film F to cover the die surface 104a (predetermined area) of the first upper die 104. As an example, the film F is in a roll shape, but it may also be in a strip shape.

The first upper mold 104 also has suction paths (holes, grooves, etc.) (not shown) in the first plate 142, etc., that communicate with a suction device. This allows the film F supplied from the first upper mold film supply unit 113 to be adsorbed and held on the mold surface 104a.

In this embodiment, a first upper die heating mechanism (not shown) is provided to heat the first upper die 104 to a predetermined temperature. This first upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first upper die chase 140 and is configured to apply heat to the entire first upper die 104. At this time, the first upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the base resin Rm held (contained) in the first lower die 106 does not thermally cure (mainly cure).

(Method of forming sealing resin)
Next, a method for forming the sealing resin R (R1) according to the first embodiment (hereinafter, may be simply referred to as a "forming method") will be described. As an example, the forming method can be carried out using the forming apparatus 1 according to the first embodiment. Here, Figs. 4 to 6 are explanatory diagrams of the main steps.

First, a preparation process is performed. Specifically, a heating process (first lower mold heating process) is performed in which the first lower mold 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) by the first lower mold heating mechanism and heated. In addition, a heating process (first upper mold heating process) is performed in which the first upper mold 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) by the first upper mold heating mechanism and heated. In addition, a lower mold film supply process (first lower mold film supply process) is performed in which the first lower mold film supply unit 111 is operated to supply a new film F and adsorb it so as to cover a predetermined area of the mold surface 106a including the inner surface of the first cavity 108 in the first lower mold 106. In addition, the first upper die film supply unit 113 is operated to supply new film F, and an upper die film supply process (first upper die film supply process) is carried out in which the film F is adsorbed to cover a predetermined area of the die surface 104a of the first upper die 104.

After the preparation process, a forming process is carried out to form sealing resin R (R1) having a predetermined shape that corresponds to the shape of the workpiece W.

The forming process according to this embodiment includes a tableting process in which the base resin Rm is tableted to form a solid resin having a predetermined shape corresponding to the shape of the workpiece W as the sealing resin R (R1). As another example of the forming process, a forming method that does not involve tableting may be used.

Specifically, the tableting process involves conveying a predetermined amount of base resin Rm supplied from the base resin supply unit 40 by a conveying device (e.g., the first loader 21, etc.) or directly dispersing the base resin Rm from a dispenser or the like, and storing the base resin Rm in the first cavity 108 of the first lower mold 106 (see FIG. 4). As described above, the base resin Rm is stored in the recessed portion 138 between the movable pieces 136 without being placed on the upper surface of the movable pieces 136 (note that the base resin Rm may first be dispersed over the entire first cavity 108, including the upper surface of the movable pieces 136, and then swept off by a squeegee or the like, and finally stored in the recessed portion 138). Next, the first press device 150 is operated to close the first mold 102, which has been heated to the predetermined temperature (see FIG. 5).

When the mold is closed, first the upper surface of the first clamper 128 and the lower surface of the first plate 142 come into contact. Next (or simultaneously), the upper surface of the movable piece 136 and the lower surface of the first plate 142 come into contact, covering the entire upper surface of the movable piece 136. Next, the base resin Rm is compressed (sandwiched and pressed) between the upper surface of the first cavity piece 126 (the area of the concave portion 138) and the lower surface of the first plate 142 (the area facing the concave portion 138). This forms a solid sealing resin R (R1) that has a "predetermined shape" (details will be described later) and is not fully cured. Note that "solid" includes those that have been melted to the so-called B stage or those that are just about to melt, because the tableting is performed while heating to a temperature that does not fully cure.

It is important that the above-mentioned tableting process is carried out at a temperature at which the main curing of the base resin Rm does not proceed easily (the first lower die 106 and the first upper die 104 are heated to a temperature at which the main curing does not proceed easily) so that the formed sealing resin R can be fully cured in the subsequent resin sealing (compression molding) process. As described above, the "temperature at which the main curing does not proceed easily" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

It is also preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be adjusted and supplied with extremely high precision compared to when granular or crushed resin is used. However, it is not limited to powder resin.

After the tableting process, the first mold 102 is opened and the sealing resin R is separated from the used film F to enable removal of the sealing resin R (see FIG. 6). In this embodiment, by providing the lower mold film supplying process and the upper mold film supplying process described above, the film F is placed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104, which makes it easier to release the sealing resin R formed by tableting and prevents damage caused by resin adhesion to the mold.

In addition, after the mold opening process, the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to send out the used film F from inside the first mold 102 and to send and set a new film F into the first mold 102, thereby carrying out a film supply process (first lower mold film supply process, first upper mold film supply process).

The above are the main steps in the method for forming the sealing resin R according to this embodiment. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

(Sealing resin)
An example of the configuration (shape) of the sealing resin R (R1) formed by the above-mentioned forming device 1 and forming method is shown in FIG. 8 (however, the present invention is not limited to this configuration). Specifically, the sealing resin R (R1) has a lattice shape in which a plurality of through holes Rh are arranged in a plate-shaped main body Ra. Here, the "lattice shape" in this application is exemplified as a matrix shape including a single row shape, but is not limited to this, and may be a matrix shape of multiple rows and columns, a random shape, etc. In addition, the sealing resin R (R1) may be configured so that one piece of the sealing resin R (R1) constitutes the "whole" of the required amount of sealing (one time per work W), or may be configured so that a plurality of pieces (for example, about two or three pieces) are assembled (connected) to constitute the "whole" of the required amount of sealing.

By performing resin sealing (compression molding) using the above-mentioned sealing resin R (R1), it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb, and to form a molded product Wp (see FIG. 9) in which the upper surface Wbf is reliably exposed (details will be described later). Therefore, in the above-mentioned forming process, it is important to set the position and shape of the through hole Rh of the sealing resin R so that the electronic component Wb of the work W to be sealed is accommodated in the through hole Rh of the sealing resin R and the upper surface Wbf of the electronic component Wb is exposed. The through hole Rh needs to be slightly larger in size than each electronic component Wb and have the same shape as the electronic component Wb. In addition, the resin amount (height) of the sealing resin R (R1) needs to be an amount that allows the resin to penetrate under the electronic component Wb and seal it without excess or deficiency.

Furthermore, since the sealing resin R (R1) is formed as a solid resin, it is possible to realize a compression molding device 2 and a compression molding method that can prevent molding defects caused by uneven spreading, residual gas, and dust generation during molding, compared to conventional granular resins. It also makes it easier to handle the resin before sealing.

As a modified example of the sealing resin R (R1), it may be configured to have legs Rb on either one of the surfaces (see FIG. 10). In order to form the legs Rb, a leg forming groove (recess) 143 may be provided on at least one of the upper surface of the first cavity piece 126 of the first lower die 106 in the first die 102 or the lower surface of the first plate 142 of the first upper die 104 (see FIG. 11). With this sealing resin R (R1), it is possible to easily adjust the lower surface (the surface facing the workpiece W) of the sealing resin R (R1) so that it does not come into contact with the electronic component Wb of the workpiece W by appropriately setting the position and length of the legs Rb.

Second Embodiment
(Sealing resin forming device)
In the second embodiment, an example will be described in which the sealing resin R is formed in a lattice shape having through holes Rh, and a heat sink H is fixed to one side to block the through holes Rh (all or part) (hereinafter, this may be distinguished as "R2"). Here, a plan view of the forming device 1 according to the second embodiment is shown in FIG. 12, and a front cross-sectional view (schematic diagram) of the first mold 102 is shown in FIG. 13. Note that the heat sink H is, as an example, a plate-like member formed of a metal material (e.g., copper alloy, aluminum alloy, etc.) with a thickness of about 0.1 mm to several mm, but is not limited thereto.

The forming device 1 according to the second embodiment has a similar basic configuration to the first embodiment described above, so the following explanation will focus on the differences.

The base resin supply unit 10D according to this embodiment includes a heat sink supply section 30 that supplies a heat sink H, in addition to the base resin supply section 40 similar to that of the first embodiment. As an example, the heat sink supply section 30 is configured with a storage section (e.g., a stocker, etc.) in which a plurality of heat sink plates H are stored (a pickup, stage, etc. may be provided as appropriate). When transporting the heat sink H from the base resin supply unit 10D to the resin formation unit 10E, the first loader 21 may be used as the transport device, or another transport device (not shown) may be used.

Next, the resin forming unit 10E according to this embodiment is equipped with a press device (first press device) 150 similar to that of the first embodiment, but has a difference in the first upper die 104 of the first die 102 that is opened and closed by the first press device 150.

As shown in FIG. 13, the first upper mold 104 according to this embodiment has a holding portion 146 that holds a heat sink H (which can also be another electronic component Wb) on the lower surface of the upper plate (first plate) 142. As an example, the holding portion 146 is configured to have a plurality of fine through holes in the film F that is adsorbed to the mold surface 104a of the first upper mold 104, and to generate suction force of a suction device through suction paths (holes, grooves, etc.) in the first plate 142 to adsorb and hold the heat sink H on the holding portion 146. Note that the configuration of the holding portion 146 is not limited to this.

The above-mentioned forming device 1 makes it possible to form a sealing resin R (R2) in a lattice shape having through holes Rh, with a heat sink H fixed to one side to block the through holes Rh. Details of the forming method are shown below.

(Method of forming sealing resin)
Next, a method for forming the sealing resin R (R2) according to the second embodiment (hereinafter, may be simply referred to as the "forming method") will be described. As an example, the forming method can be carried out using the forming apparatus 1 according to the second embodiment. Here, Figs. 14 to 16 are explanatory diagrams of the main steps.

The formation method according to the second embodiment has a similar basic configuration to the first embodiment described above, so the following explanation will focus on the differences.

First, a preparation process similar to that of the first embodiment is carried out. After the preparation process, a formation process is carried out to form a sealing resin R (R2) having a predetermined shape corresponding to the shape of the workpiece W.

The forming process according to this embodiment includes a tableting process in which the base resin Rm is tableted together with the heat sink H in the resin forming section 50 to form a solid sealing resin R (R2) formed in a predetermined shape to which the heat sink H is fixed. Note that as another example of the forming process, a forming method that does not involve tableting may be adopted.

Specifically, in the above tableting process, the heat sink H supplied from the heat sink supply unit 30 is transported by a transport device (e.g., the first loader 21, etc.) and held at a predetermined position on the underside of the first plate 142 of the first upper mold 104 (see FIG. 14). Before or after this, or in parallel with this, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is transported by a transport device (e.g., the first loader 21, etc.) or directly sprayed from a dispenser or the like, and is contained in the first cavity 108 of the first lower mold 106 (see FIG. 14). As described above, the base resin Rm is placed in the recessed portion 138 between the movable pieces 136 without being placed on the upper surface of the movable pieces 136 (note that the base resin Rm may first be spread over the entire first cavity 108 including the upper surface of the movable pieces 136, and then the upper surface of the movable pieces 136 may be swept off with a squeegee or the like, and finally placed in the recessed portion 138. After that, the heat sink H may be placed on the upper surface of the movable pieces 136 in the first cavity 108. In this case, the heat sink H is of a size that can be placed in the first cavity 108, and it is not necessary to hold it at a predetermined position on the lower surface of the first plate 142 of the first upper mold 104.). Next, the first press device 150 is operated to close the first mold 102 that has been heated to the above-mentioned predetermined temperature (see FIG. 15).

When the mold is closed, the upper surface of the first clamper 128 and the lower surface of the first plate 142 (at a position where the heat sink H is not held) come into contact with each other. Next (or at the same time), the upper surface of the movable piece 136 comes into contact with the lower surface of the heat sink H held by the first plate 142, so that the entire upper surface of the movable piece 136 is covered. Next, the base resin Rm is compressed (sandwiched and pressed) between the upper surface (the area of the concave portion 138) of the first cavity piece 126 and the lower surface (the area facing the concave portion 138) of the heat sink H held by the first plate 142. This forms a solid sealing resin R (R2) that has a "predetermined shape" (details will be described later) and is not fully cured. Note that "solid" includes a state in which the resin has melted to the so-called B stage or is in a state immediately before melting, because the resin is compressed while being heated to a temperature that does not fully cure.

It is important that the above-mentioned tableting process is carried out at a temperature at which the main curing of the base resin Rm does not proceed easily (the first lower die 106 and the first upper die 104 are heated to a temperature at which the main curing does not proceed easily) so that the formed sealing resin R can be fully cured in the subsequent resin sealing (compression molding) process. As described above, the "temperature at which the main curing does not proceed easily" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

It is also preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be adjusted and supplied with extremely high precision compared to when granular or crushed resin is used. However, it is not limited to powder resin.

After the tableting process, the first mold 102 is opened and the mold opening process is carried out to separate the sealing resin R (with the heat sink H attached to the upper surface) from the used film F so that the sealing resin R can be removed (see Figure 16).

The steps following the above mold opening step are the same as those in the first embodiment, and will not be described again.

(Sealing resin)
An example of the configuration (shape) of the sealing resin R (R2) formed by the above-mentioned forming device 1 and forming method is shown in Fig. 17 (however, the present invention is not limited to this configuration). Specifically, the sealing resin R (R2) has a lattice shape in which a plurality of through holes Rh are arranged in parallel on a plate-shaped main body Ra, and a heat sink H is fixed to one side to block the through holes Rh (all or part). The sealing resin R (R2) may be configured so that one piece constitutes the "whole" of the required amount of sealing (one amount per work W), or may be configured so that a plurality of pieces (e.g., about two or three pieces) are assembled (connected) to constitute the "whole" of the required amount of sealing.

By performing resin sealing (compression molding) using the above-mentioned sealing resin R (R2), a molded product Wp (see FIG. 18) in which the heat sink H is exposed on the upper surface can be easily formed (details will be described later). At that time, it is possible to prevent thin burrs from being formed on the upper surface of the heat sink H, and the upper surface can be reliably exposed. In addition, since it is not necessary to carry the sealing resin R and the heat sink H separately into the sealing mold when performing compression molding (i.e., they can be carried in as a single component in a single process), the process can be simplified and the time can be reduced.

As a modified example of the sealing resin R (R2), the surface to which the heat sink H is not fixed may have legs Rb (see FIG. 19). In order to form the legs Rb, the upper surface of the first cavity piece 126 of the first lower die 106 in the first die 102 may be provided with a leg forming groove (recess) 143 (see FIG. 20). With this sealing resin R (R2), the position and length of the legs Rb can be appropriately set, making it easy to adjust the lower surface (the surface facing the workpiece W) of the sealing resin R (R2) so that it does not come into contact with the electronic component Wb of the workpiece W.

(Compression molding device and compression molding method)
Next, an outline of a compression molding apparatus 2 and a compression molding method for resin sealing (compression molding) a workpiece W using the sealing resin R according to the first and second embodiments will be described. Here, FIG. 21 is a plan view (schematic view) showing an example of the compression molding apparatus 2.

As shown in FIG. 21, the compression molding device 2 mainly comprises a supply unit 10A for supplying the workpiece W, a press unit 10B for sealing the workpiece W with resin and processing it into a molded product Wp, and a storage unit 10C for storing the molded product Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in this order along the X direction in FIG. 9. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, and the order of arrangement of the units may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse in the X direction, or may be arranged to be concentrated in one position (not shown). In addition, the configuration may include units other than those described above (not shown).

In addition, the compression molding device 2 has a guide rail 22 that is linearly provided between each unit, and a transport device (second loader) 23 that transports the work W and the sealing resin R (may be used for transporting items other than the work W and the sealing resin R) and a transport device (third loader) 24 that transports the molded product Wp (may be used for transporting items other than the molded product Wp) are provided so as to be movable between predetermined units along the guide rail 22. However, the configuration is not limited to the above, and a configuration may be provided with a common (single) transport device (loader) that transports the work W, the sealing resin R, the molded product Wp, etc. (not shown). In addition, the transport device may be configured to include a robot hand or the like instead of a loader.

In addition, in the compression molding device 2, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may also be configured to be disposed in another unit).

The press unit 10B is equipped with a resin sealing section 70 that seals the workpiece W with resin and processes it into a molded product Wp. In this embodiment, two press units 10B (three or more, or one) equipped with the resin sealing section 70 are provided, and one press unit 10B is provided with one resin sealing section 70 (two or more) (see FIG. 21). However, this configuration is not limited to this. The resin sealing section 70 is equipped with a pair of sealing dies (for example, a pair of dies (for example, dies made of alloy tool steel, dies plates, dies pillars, etc., and other members assembled thereto) that are opened and closed by a press device.

Here, as an example, the steps of a compression molding method performed using a compression molding device 2 equipped with a second press device 250 (see FIG. 22) and a second mold 202 (see FIG. 23) will be described with reference to FIGS. 24 to 34.

First, a sealing preparation process is performed. Specifically, a heating process (second upper mold heating process) is performed in which the second upper mold 204 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the second upper mold heating mechanism (second upper mold heating process). In addition, a heating process (second lower mold heating process) is performed in which the second lower mold 206 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the second lower mold heating mechanism (second lower mold heating process). In addition, an upper mold film supply process (second upper mold film supply process) is performed in which the second upper mold film supply unit 213 is operated to supply new film F and adsorb it to cover a predetermined area of the mold surface 204a including the inner surface of the second cavity 208 in the second upper mold 204.

After the sealing preparation process, a workpiece holding process is carried out in which the workpiece W is held by the workpiece holding portion 205 of the second lower die 206 (see FIG. 24). Specifically, the workpiece W supplied from the supply magazine 12 is held by a conveying device (such as the second loader 23) and carried into the second die 202, where it is held by the workpiece holding portion 205 of the lower plate (second plate) 242 (die surface 206a).

After the workpiece holding step, a resin placing step is performed in which the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (see FIG. 25). Specifically, the sealing resin R formed in the forming device 1 described above is held by a conveying device (such as the second loader 23) and carried into the second mold 202, and placed on the workpiece W held by the workpiece holding portion 205. When forming a molded product Wp in which the top surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R are aligned with each other and placed so that the electronic component Wb is accommodated in the through hole Rh of the sealing resin R.

Alternatively, as another example of the resin placement process, the sealing resin R formed in the forming device 1 may be placed on the workpiece W before the above-mentioned workpiece holding process. In this case, the workpiece holding process is a process in which the workpiece W with the sealing resin R placed thereon is held by the workpiece holding section 205. That is, the transport device (second loader 23, etc.) holds the workpiece W with the sealing resin R placed thereon, carries it into the second mold 202, and holds it in the workpiece holding section 205. This has the advantage of carrying out the workpiece W and sealing resin R in the second mold 202 in one go, rather than separately.

Next, a resin sealing process is performed in which the work W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the second mold 202 is closed, and the second cavity piece 226 is lowered relatively in the second cavity 208 surrounded by the second clamper 228 to perform a mold closing process in which the sealing resin R is heated and pressurized against the work W. As shown in FIG. 23, the second upper mold 204 (204A) of the second mold 202 is provided with a movable piece 236 that abuts against the entire upper surface Wbf of the electronic component Wb to be exposed in the second cavity piece 226 and can move up and down. The movable piece 236 is supported in a state in which it is biased toward the second lower mold 206 by the movable piece spring 234 via the push pin 232.

Here, when forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed using the sealing resin R (R1), the mold closing process is as follows. Specifically, the second upper mold 204 (204A) and the second lower mold 206 are moved closer to each other. At this time, the movable piece 236 abuts against the upper surface Wbf of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 26). Next, the second clamper 228 abuts against the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 27). These steps may be set in the reverse order or simultaneously. Next, the lower surface of the second cavity piece 226 (the area where the movable piece 236 is not provided) abuts against the sealing resin R (R1) placed on the base material Wa of the work W and is further pressurized. As a result, the sealing resin R (R1) is thermally cured, and the resin sealing (compression molding) is completed (see FIG. 28). In this way, it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb. Next, the second mold 202 is opened, and a mold opening process is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 29).

On the other hand, when forming a molded product Wp in which the heat sink H is exposed using the sealing resin R (R2), the second upper die 204B (see FIG. 30) having a general configuration without a movable piece may be used as the second upper die 204 instead of the second upper die 204A (see FIG. 23) having the above-mentioned movable piece. In this case, the mold closing process is as follows. Specifically, the second upper die 204 (204B) and the second lower die 206 are moved closer to each other. At this time, the clamper 228 abuts against the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 31). Next, the second cavity piece 226 abuts against the upper surface of the heat sink H of the sealing resin R (R2) and covers the upper surface of the heat sink H (see FIG. 32). These may be set to occur simultaneously. Next, the lower surface of the heat sink H, which is in contact with the second cavity piece 226, presses the sealing resin R (R2) placed on the base material Wa of the work W. This causes the sealing resin R (R2) to harden thermally, completing the resin sealing (compression molding) (see FIG. 33). In this way, it is possible to prevent a thin burr from being formed on the upper surface of the heat sink H. Note that, although the sealing resin R2 with the heat sink H of the shape shown in FIG. 17 is used in this example, it is not necessary to use the heat sink H. After the sealing resin R1 without the heat sink is placed on the base material Wa, only the heat sink H may be placed on the sealing resin R1 and molded. Next, the second mold 202 is opened, and a mold opening process is performed in which the molded product Wp and the used film F are separated so that the molded product Wp can be taken out (see FIG. 34). In this case, an elastic heat conductive resin sheet or the like (not shown) is placed between the surface of the electronic component Wb mounted on the work W that faces the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the work that faces the electronic component Wb to prevent gaps from occurring, thereby preventing the top surface of the electronic component Wb from being sealed with resin.

Next, a molded product unloading process is carried out in which the molded product Wp is unloaded from the second mold 202 by a transport device (such as the third loader 24) and transported to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product unloading process, a process is carried out in which the second upper mold film supply section 213 is operated to send out the used film F from the second mold 202 and send a new film F into the second mold 202 and set it there.

The above are the main steps of the compression molding method performed using the compression molding device 2 equipped with the second press device 250 and the second mold 202. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there are no problems.

As another example, the steps of a compression molding method performed using a compression molding device 2 equipped with a third press device 350 (see FIG. 35) and a third mold 302 (see FIG. 36) are described with reference to FIGS. 37 to 47.

First, a sealing preparation process is performed. Specifically, a heating process (third upper mold heating process) is performed in which the third upper mold 304 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the third upper mold heating mechanism (third upper mold heating process). In addition, a heating process (third lower mold heating process) is performed in which the third lower mold 306 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the third lower mold heating mechanism (third lower mold film supply process). In addition, a lower mold film supply process (third lower mold film supply process) is performed in which the third lower mold film supply unit 311 is operated to supply new film F and adsorb it so as to cover a predetermined area of the mold surface 306a of the third lower mold 306.

After the sealing preparation process, a workpiece holding process is performed in which the workpiece W is held by the workpiece holding portion 305 of the third upper die 304 (see FIG. 37). Specifically, the workpiece W supplied from the supply magazine 12 is held by a transport device (such as the second loader 23) and carried into the third die 302, where it is held by the workpiece holding portion 305 of the upper plate (third plate) 342 (die surface 304a). As an example of holding the workpiece W, a suction hole (not shown) may be opened in the workpiece holding portion 305 to suck the workpiece W, but the method of holding the workpiece W does not need to be limited to suction.

After or in parallel with the workpiece holding process, a resin holding process is performed in which the sealing resin R is held in the third cavity 308 of the third lower die 306 (see FIG. 38). Specifically, the sealing resin R formed in the forming device 1 described above is held by a conveying device (such as the second loader 23) and carried into the third die 302, and housed in the third cavity 308 (specifically, placed on the top surface of the third cavity piece 326). When forming a molded product Wp in which the top surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R are aligned with each other and held so that the electronic component Wb is housed in the through hole Rh of the sealing resin R.

Next, a resin sealing process is performed in which the work W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the third mold 302 is closed, and the third cavity piece 326 is relatively raised in the third cavity 308 surrounded by the third clamper 328 to perform a mold closing process in which the sealing resin R is heated and pressurized against the work W. As shown in FIG. 36, the third lower mold 306 (306A) of the third mold 302 is provided with a movable piece 336 that abuts against the entire upper surface Wbf of the electronic component Wb to be exposed in the third cavity piece 326 and can move up and down. The movable piece 336 is supported in a state in which it is biased toward the third upper mold 304 by the movable piece spring 334 via the push pin 332.

Here, when forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed using the sealing resin R (R1), the mold closing process is as follows. Specifically, the third upper mold 304 and the third lower mold 306 are moved closer to each other. At this time, the movable piece 336 abuts against the upper surface Wbf (facing down) of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 39). Next, the third clamper 328 abuts against the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 40). These steps may be set in the reverse order or simultaneously. Next, the sealing resin R (R1) is pressed by the upper surface (area where the movable piece 336 is not provided) of the third cavity piece 326 and the base material Wa of the work W. As a result, the sealing resin R (R1) is thermally cured, and the resin sealing (compression molding) is completed (see FIG. 41). In this way, it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb. Next, the third mold 302 is opened, and a mold opening process is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 42).

On the other hand, when forming a molded product Wp in which the heat sink H is exposed using the sealing resin R (R2), the third lower die 306B (see FIG. 43) having a general configuration without a movable piece can be used as the third lower die 306 instead of the third lower die 306A (see FIG. 36) having the above-mentioned movable piece. In this case, the mold closing process is as follows. Specifically, the sealing resin R (R2) is placed on the upper surface of the third cavity piece 326 so that the heat sink H of the sealing resin R (R2) abuts against the upper surface of the third cavity piece 326. Next, the third upper die 304 and the third lower die 306 are moved closer to each other. At this time, the third clamper 328 abuts against the base material Wa of the workpiece W via the film F, and the workpiece W is clamped (see FIG. 44). Next, the base material Wa of the work W comes into contact with the upper surface (the surface to which the heat sink H is not fixed) of the sealing resin R (R2) (see FIG. 45). These may be set to occur simultaneously. Next, the sealing resin R (R2) is pressed by the heat sink H that is in contact with the third cavity piece 326 and the base material Wa of the work W. This causes the sealing resin R (R2) to be thermally cured, completing the resin sealing (compression molding) (see FIG. 46). Note that in this example, the sealing resin R2 with the heat sink H in the shape of FIG. 17 is used, but it is not necessary to have the heat sink H. After placing only the heat sink H on the upper surface of the third cavity piece 326, the sealing resin R1 without the heat sink may be placed on the heat sink H and molded. In this way, it is possible to prevent a thin burr from being formed on the upper surface of the heat sink H. Next, the third mold 302 is opened, and the molded product Wp is separated from the used film F to enable the molded product Wp to be removed (see FIG. 47). In this case, an elastic heat conductive resin sheet or the like (not shown) is placed between the surface of the electronic component Wb mounted on the work W that faces the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the third cavity piece 326 that faces the electronic component Wb to prevent a gap from being generated, thereby preventing the upper surface of the electronic component Wb from being sealed with resin.

Next, a molded product unloading process is carried out in which the molded product Wp is unloaded from the third mold 302 by a transport device (such as the third loader 24) and transported to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. In addition, after or in parallel with the molded product unloading process, a process is carried out in which the third lower mold film supply section 311 is operated to send out the used film F from the third mold 302 and send a new film F into the third mold 302 and set it there.

The above are the main steps of the compression molding method performed using the compression molding device 2 equipped with the third press device 350 and the third mold 302. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there are no problems.

As explained above, the molding device and method according to the present invention can form a sealing resin that provides the following effects. That is, by using the lattice-shaped solid sealing resin according to the present invention, it is possible to prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and it is possible to realize a compression molding device and compression molding method that can prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. In addition, it is possible to facilitate handling before resin sealing.

Furthermore, by using a lattice-shaped solid sealing resin to which the heat sink is fixed, it is possible to easily form a molded product in which the heat sink is exposed on the upper surface, and it is possible to simplify the forming process and reduce the time required.

The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

Reference Signs List 1 Molding resin forming device 2 Compression molding device 102 Tableting mold 136 Movable piece 202, 302 Molding mold 236, 336 Movable piece H Heat sink Rm Base resin R Molding resin Rh Through hole W Work Wa Substrate Wb Electronic component

Claims (12)

A forming apparatus for forming a sealing resin used in compression molding of a workpiece,
1. An apparatus for forming an encapsulating resin, comprising: a tableting die having an upper die and a lower die for accommodating a base resin therein, and for tableting the encapsulating resin into a lattice shape having through holes. the lower die has a cavity piece which becomes a bottom of a cavity, a clamper which is disposed to surround the cavity piece and which becomes an inner wall of the cavity, and a plurality of movable pieces which protrude from an upper surface of the cavity piece, are disposed at predetermined positions, and are movable up and down;
The sealing resin forming device according to claim 1, characterized in that the tableting die is configured to accommodate the base resin around the movable piece in the cavity and tablet it, and the area of the movable piece is configured to be formed as the through hole. the upper die has a holding portion for holding a heat sink on a lower surface of the upper plate,
The device for forming a sealing resin according to claim 2, characterized in that the tableting mold is configured to tablet with the heat sink plate held in the holding portion of the upper mold and with the base resin contained around the movable piece of the lower mold, and is configured to form the sealing resin with the heat sink plate fixed thereto. The sealing resin forming device according to claim 2, characterized in that the tableting die has a leg forming groove formed on at least one of an upper surface of the cavity piece of the lower die or a lower surface of the upper plate of the upper die, the leg forming groove forming a leg to be erected in the sealing resin. 5. The sealing resin forming apparatus according to claim 1, wherein a powder resin is used as the base resin. A method for forming a sealing resin used in compression molding of a workpiece, comprising the steps of:
A method for forming a sealing resin, comprising the step of forming the sealing resin in a lattice shape having through holes. 7. The method for forming an encapsulating resin according to claim 6, wherein the forming step includes a step of forming the encapsulating resin by tableting a base resin. The method for forming a sealing resin according to claim 7, characterized in that the forming step includes a step of filling the base resin around a movable piece provided in a cavity and tableting the base resin to form the sealing resin so that the area of the movable piece becomes the through hole. The method for forming a sealing resin according to claim 8, characterized in that the forming process includes a step of holding a heat sink plate in a holding portion of an upper mold, and placing the base resin around the movable piece of a lower mold and tableting it to form the sealing resin with the heat sink plate fixed thereto. 10. The method for forming a sealing resin according to claim 7, wherein a powder resin is used as the base resin. A sealing resin used in compression molding of a workpiece,
A sealing resin formed in a lattice shape having through holes. The sealing resin according to claim 11, wherein a heat sink is fixed to one surface side of the sealing resin, and the through hole is blocked.

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