JP2024516742A5 - - Google Patents
Info
- Publication number
- JP2024516742A5 JP2024516742A5 JP2023568590A JP2023568590A JP2024516742A5 JP 2024516742 A5 JP2024516742 A5 JP 2024516742A5 JP 2023568590 A JP2023568590 A JP 2023568590A JP 2023568590 A JP2023568590 A JP 2023568590A JP 2024516742 A5 JP2024516742 A5 JP 2024516742A5
- Authority
- JP
- Japan
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163185768P | 2021-05-07 | 2021-05-07 | |
| US63/185,768 | 2021-05-07 | ||
| PCT/US2022/027846 WO2022235914A1 (en) | 2021-05-07 | 2022-05-05 | Microelectronics package assemblies and processes for making |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024516742A JP2024516742A (ja) | 2024-04-16 |
| JPWO2022235914A5 JPWO2022235914A5 (https=) | 2025-05-07 |
| JP2024516742A5 true JP2024516742A5 (https=) | 2025-05-07 |
Family
ID=81927461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023568590A Pending JP2024516742A (ja) | 2021-05-07 | 2022-05-05 | マイクロエレクトロニクスパッケージアセンブリおよび作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12074099B2 (https=) |
| JP (1) | JP2024516742A (https=) |
| KR (1) | KR102914493B1 (https=) |
| CN (1) | CN117280457A (https=) |
| TW (1) | TW202249583A (https=) |
| WO (1) | WO2022235914A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12224218B2 (en) * | 2022-02-11 | 2025-02-11 | Wolfspeed, Inc. | Semiconductor packages with increased power handling |
| USD1056862S1 (en) | 2022-08-24 | 2025-01-07 | Wolfspeed, Inc. | Semiconductor package |
| GB2635648A (en) * | 2023-10-17 | 2025-05-28 | Trak Microwave Ltd | Radio frequency components and manufacturing of radio-frequency components |
| TWI866712B (zh) * | 2023-12-21 | 2024-12-11 | 矽品精密工業股份有限公司 | 散熱結構及其電子封裝件 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819385B2 (ja) * | 1974-09-04 | 1983-04-18 | 日本電気株式会社 | ロウヅケホウホウ |
| JPS58500463A (ja) * | 1981-03-23 | 1983-03-24 | モトロ−ラ・インコ−ポレ−テッド | めっきのしてないパッケ−ジを含む半導体デバイス |
| SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
| US6903013B2 (en) * | 2003-05-16 | 2005-06-07 | Chartered Semiconductor Manufacturing Ltd. | Method to fill a trench and tunnel by using ALD seed layer and electroless plating |
| US7731078B2 (en) * | 2004-11-13 | 2010-06-08 | Stats Chippac Ltd. | Semiconductor system with fine pitch lead fingers |
| JP2006196810A (ja) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | セラミック回路基板および電子部品モジュール |
| JP4816049B2 (ja) * | 2005-12-13 | 2011-11-16 | 大日本印刷株式会社 | センサーパッケージおよびその製造方法 |
| US8617926B2 (en) * | 2010-09-09 | 2013-12-31 | Advanced Micro Devices, Inc. | Semiconductor chip device with polymeric filler trench |
| EP2973672B1 (en) | 2013-03-15 | 2018-07-11 | Materion Corporation | Method of spot-welding a die bond sheet preform containing gold and tin to a die bond area on a semiconductor package |
| US10211115B2 (en) | 2014-05-21 | 2019-02-19 | Materion Corporation | Method of making a ceramic combo lid with selective and edge metallizations |
| US20170069560A1 (en) | 2014-05-23 | 2017-03-09 | Materion Corporation | Air cavity package |
| US9543170B2 (en) * | 2014-08-22 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming the same |
| WO2017201260A1 (en) * | 2016-05-20 | 2017-11-23 | Materion Corporation | Copper flanged air cavity packages for high frequency devices |
| US11646255B2 (en) * | 2021-03-18 | 2023-05-09 | Taiwan Semiconductor Manufacturing Company Limited | Chip package structure including a silicon substrate interposer and methods for forming the same |
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2022
- 2022-05-05 US US17/737,564 patent/US12074099B2/en active Active
- 2022-05-05 WO PCT/US2022/027846 patent/WO2022235914A1/en not_active Ceased
- 2022-05-05 KR KR1020237042365A patent/KR102914493B1/ko active Active
- 2022-05-05 JP JP2023568590A patent/JP2024516742A/ja active Pending
- 2022-05-05 CN CN202280033171.7A patent/CN117280457A/zh active Pending
- 2022-05-09 TW TW111117271A patent/TW202249583A/zh unknown