JP2024171820A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2024171820A
JP2024171820A JP2023089063A JP2023089063A JP2024171820A JP 2024171820 A JP2024171820 A JP 2024171820A JP 2023089063 A JP2023089063 A JP 2023089063A JP 2023089063 A JP2023089063 A JP 2023089063A JP 2024171820 A JP2024171820 A JP 2024171820A
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JP
Japan
Prior art keywords
layer
buffer
alloy layer
expansion coefficient
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023089063A
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English (en)
Japanese (ja)
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JP2024171820A5 (https=
Inventor
聡 田中
Satoshi Tanaka
次郎 新開
Jiro Shinkai
弘 佐藤
Hiroshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Sumitomo Electric Industries Ltd
Original Assignee
National Institute of Advanced Industrial Science and Technology AIST
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Advanced Industrial Science and Technology AIST, Sumitomo Electric Industries Ltd filed Critical National Institute of Advanced Industrial Science and Technology AIST
Priority to JP2023089063A priority Critical patent/JP2024171820A/ja
Priority to PCT/JP2024/018981 priority patent/WO2024247875A1/ja
Publication of JP2024171820A publication Critical patent/JP2024171820A/ja
Publication of JP2024171820A5 publication Critical patent/JP2024171820A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023089063A 2023-05-30 2023-05-30 半導体装置 Pending JP2024171820A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023089063A JP2024171820A (ja) 2023-05-30 2023-05-30 半導体装置
PCT/JP2024/018981 WO2024247875A1 (ja) 2023-05-30 2024-05-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023089063A JP2024171820A (ja) 2023-05-30 2023-05-30 半導体装置

Publications (2)

Publication Number Publication Date
JP2024171820A true JP2024171820A (ja) 2024-12-12
JP2024171820A5 JP2024171820A5 (https=) 2026-04-07

Family

ID=93657357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023089063A Pending JP2024171820A (ja) 2023-05-30 2023-05-30 半導体装置

Country Status (2)

Country Link
JP (1) JP2024171820A (https=)
WO (1) WO2024247875A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822656B2 (ja) * 2011-10-31 2015-11-24 株式会社 日立パワーデバイス 半導体装置及びその製造方法
WO2020054688A1 (ja) * 2018-09-12 2020-03-19 ローム株式会社 半導体装置
JP7319295B2 (ja) * 2018-11-22 2023-08-01 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2024247875A1 (ja) 2024-12-05

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