JP2024121220A5 - - Google Patents

Download PDF

Info

Publication number
JP2024121220A5
JP2024121220A5 JP2023028190A JP2023028190A JP2024121220A5 JP 2024121220 A5 JP2024121220 A5 JP 2024121220A5 JP 2023028190 A JP2023028190 A JP 2023028190A JP 2023028190 A JP2023028190 A JP 2023028190A JP 2024121220 A5 JP2024121220 A5 JP 2024121220A5
Authority
JP
Japan
Prior art keywords
semiconductor device
terminal
sealing material
housing
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023028190A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024121220A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2023028190A priority Critical patent/JP2024121220A/ja
Priority claimed from JP2023028190A external-priority patent/JP2024121220A/ja
Priority to DE102023136759.5A priority patent/DE102023136759A1/de
Priority to US18/405,394 priority patent/US20240290695A1/en
Priority to CN202410197426.4A priority patent/CN118553692A/zh
Publication of JP2024121220A publication Critical patent/JP2024121220A/ja
Publication of JP2024121220A5 publication Critical patent/JP2024121220A5/ja
Pending legal-status Critical Current

Links

JP2023028190A 2023-02-27 2023-02-27 半導体装置および電力変換装置 Pending JP2024121220A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2023028190A JP2024121220A (ja) 2023-02-27 2023-02-27 半導体装置および電力変換装置
DE102023136759.5A DE102023136759A1 (de) 2023-02-27 2023-12-28 Halbleitervorrichtung und Leistungsumwandlungseinrichtung
US18/405,394 US20240290695A1 (en) 2023-02-27 2024-01-05 Semiconductor device and power conversion apparatus
CN202410197426.4A CN118553692A (zh) 2023-02-27 2024-02-22 半导体装置及电力转换装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023028190A JP2024121220A (ja) 2023-02-27 2023-02-27 半導体装置および電力変換装置

Publications (2)

Publication Number Publication Date
JP2024121220A JP2024121220A (ja) 2024-09-06
JP2024121220A5 true JP2024121220A5 (https=) 2025-02-19

Family

ID=92423048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023028190A Pending JP2024121220A (ja) 2023-02-27 2023-02-27 半導体装置および電力変換装置

Country Status (4)

Country Link
US (1) US20240290695A1 (https=)
JP (1) JP2024121220A (https=)
CN (1) CN118553692A (https=)
DE (1) DE102023136759A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007256962A (ja) * 2007-04-20 2007-10-04 Dainippon Printing Co Ltd 防眩フィルム、偏光フィルム及び透過型表示装置
WO2013121491A1 (ja) * 2012-02-13 2013-08-22 パナソニック株式会社 半導体装置およびその製造方法
US10490469B2 (en) 2015-10-28 2019-11-26 Mitsubishi Electric Corporation Power converting device
JP6870531B2 (ja) * 2017-08-21 2021-05-12 三菱電機株式会社 パワーモジュールおよび電力変換装置

Similar Documents

Publication Publication Date Title
CN103314437B (zh) 功率半导体模块及电源单元装置
JP5118888B2 (ja) 互いに電気絶縁された端子要素を備えたパワー半導体モジュール
JP6012533B2 (ja) 電力用半導体装置
CN111587528B (zh) 功率半导体装置
CN103493200A (zh) 半导体装置、具备该半导体装置的逆变器装置、以及具备该半导体装置及逆变器装置的车用旋转电机
CN109103146B (zh) 半导体装置
US20190214340A1 (en) Power module
CN106486436B (zh) 包括多个子模块和压力装置的功率半导体模块及其布置
KR100990527B1 (ko) 휨저항성 기부판을 갖는 전력 반도체 모듈
CN111354710A (zh) 半导体装置及其制造方法
JP2024121220A5 (https=)
JPWO2022264834A5 (https=)
JP2008294219A (ja) 半導体装置及びその製造方法
JP6292066B2 (ja) 電力用半導体装置
WO2019179955A1 (en) Busbar, method for manufacturing the same and power module comprising the same
JP2012238749A (ja) 半導体装置
WO2019171795A1 (ja) 半導体モジュール
US7750448B2 (en) Semiconductor package and method for manufacturing the same
JP4329187B2 (ja) 半導体素子
JP6975599B2 (ja) 電子部品
CN115380377A (zh) 半导体模块
JP2021072358A (ja) 半導体装置
JPWO2021161526A5 (https=)
JP7548089B2 (ja) 回路装置
US20250038057A1 (en) Semiconductor device