JP2024019962A - 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 - Google Patents

情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 Download PDF

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Publication number
JP2024019962A
JP2024019962A JP2022122766A JP2022122766A JP2024019962A JP 2024019962 A JP2024019962 A JP 2024019962A JP 2022122766 A JP2022122766 A JP 2022122766A JP 2022122766 A JP2022122766 A JP 2022122766A JP 2024019962 A JP2024019962 A JP 2024019962A
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JP
Japan
Prior art keywords
polishing
information
reliability
end point
state information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022122766A
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English (en)
Japanese (ja)
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JP2024019962A5 (https=
Inventor
隆一郎 三谷
Ryuichiro Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022122766A priority Critical patent/JP2024019962A/ja
Priority to PCT/JP2023/023932 priority patent/WO2024029236A1/ja
Priority to US18/998,420 priority patent/US20260034636A1/en
Priority to CN202380055328.0A priority patent/CN119631164A/zh
Priority to KR1020257002803A priority patent/KR20250047726A/ko
Priority to TW112128538A priority patent/TW202406675A/zh
Publication of JP2024019962A publication Critical patent/JP2024019962A/ja
Publication of JP2024019962A5 publication Critical patent/JP2024019962A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • General Factory Administration (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022122766A 2022-08-01 2022-08-01 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法 Pending JP2024019962A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022122766A JP2024019962A (ja) 2022-08-01 2022-08-01 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
PCT/JP2023/023932 WO2024029236A1 (ja) 2022-08-01 2023-06-28 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
US18/998,420 US20260034636A1 (en) 2022-08-01 2023-06-28 Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method
CN202380055328.0A CN119631164A (zh) 2022-08-01 2023-06-28 信息处理装置、推论装置、机器学习装置、信息处理方法、推论方法、及机器学习方法
KR1020257002803A KR20250047726A (ko) 2022-08-01 2023-06-28 정보 처리 장치, 추론 장치, 기계 학습 장치, 정보 처리 방법, 추론 방법 및 기계 학습 방법
TW112128538A TW202406675A (zh) 2022-08-01 2023-07-31 資訊處理裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022122766A JP2024019962A (ja) 2022-08-01 2022-08-01 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法

Publications (2)

Publication Number Publication Date
JP2024019962A true JP2024019962A (ja) 2024-02-14
JP2024019962A5 JP2024019962A5 (https=) 2025-04-23

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JP2022122766A Pending JP2024019962A (ja) 2022-08-01 2022-08-01 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法

Country Status (6)

Country Link
US (1) US20260034636A1 (https=)
JP (1) JP2024019962A (https=)
KR (1) KR20250047726A (https=)
CN (1) CN119631164A (https=)
TW (1) TW202406675A (https=)
WO (1) WO2024029236A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025234424A1 (ja) * 2024-05-08 2025-11-13 株式会社荏原製作所 基板研磨装置および膜厚算出方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013176828A (ja) * 2012-02-29 2013-09-09 Ebara Corp 研磨終点検出装置の遠隔監視システム
TW202044394A (zh) * 2019-05-22 2020-12-01 日商荏原製作所股份有限公司 基板處理系統
JP2021028099A (ja) 2019-08-09 2021-02-25 株式会社荏原製作所 終点検知装置、終点検知方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025234424A1 (ja) * 2024-05-08 2025-11-13 株式会社荏原製作所 基板研磨装置および膜厚算出方法

Also Published As

Publication number Publication date
WO2024029236A1 (ja) 2024-02-08
TW202406675A (zh) 2024-02-16
CN119631164A (zh) 2025-03-14
US20260034636A1 (en) 2026-02-05
KR20250047726A (ko) 2025-04-04

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