JP2023549254A - カチオン性エポキシ組成物 - Google Patents
カチオン性エポキシ組成物 Download PDFInfo
- Publication number
- JP2023549254A JP2023549254A JP2023528646A JP2023528646A JP2023549254A JP 2023549254 A JP2023549254 A JP 2023549254A JP 2023528646 A JP2023528646 A JP 2023528646A JP 2023528646 A JP2023528646 A JP 2023528646A JP 2023549254 A JP2023549254 A JP 2023549254A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- epoxy
- salts
- epoxy composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20207701.2 | 2020-11-16 | ||
| EP20207701.2A EP4001338B1 (en) | 2020-11-16 | 2020-11-16 | Cationic epoxy compositions |
| PCT/EP2021/077223 WO2022100927A1 (en) | 2020-11-16 | 2021-10-04 | Cationic epoxy compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023549254A true JP2023549254A (ja) | 2023-11-22 |
| JPWO2022100927A5 JPWO2022100927A5 (https=) | 2024-10-11 |
| JP2023549254A5 JP2023549254A5 (https=) | 2024-10-11 |
Family
ID=73452018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023528646A Withdrawn JP2023549254A (ja) | 2020-11-16 | 2021-10-04 | カチオン性エポキシ組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230287168A1 (https=) |
| EP (1) | EP4001338B1 (https=) |
| JP (1) | JP2023549254A (https=) |
| KR (1) | KR20230107244A (https=) |
| CN (1) | CN116438222A (https=) |
| ES (1) | ES2973297T3 (https=) |
| TW (1) | TW202227579A (https=) |
| WO (1) | WO2022100927A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250026050A (ko) | 2023-08-16 | 2025-02-25 | 주식회사 케이엠더블유 | 필터 구조체 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4276407B2 (ja) * | 2002-05-08 | 2009-06-10 | ヘンケル コーポレイション | 光カチオン硬化型エポキシ樹脂組成物 |
| DE102013018088B4 (de) * | 2013-02-10 | 2017-01-26 | Karim El Kudsi | Beschichtungen auf Epoxydharzbasis und ein Verfahren zu ihrer Herstellung und ihre Verwendungen |
| ES2736398T3 (es) * | 2015-07-02 | 2019-12-30 | Huntsman Adv Mat Licensing Switzerland Gmbh | Una composición de resina epoxi termoendurecible para la preparación de artículos de exterior y artículos obtenidos a partir de los mismos |
| AT521316A1 (de) * | 2018-06-07 | 2019-12-15 | All Bones Gmbh | Polymermischung sowie deren Verwendung im 3D-Druck |
| EP3725820B1 (en) * | 2019-04-16 | 2022-04-06 | Henkel AG & Co. KGaA | Use of functionalized alpha-angelica lactones |
| CN110804161B (zh) * | 2019-11-20 | 2022-03-08 | 长春工业大学 | 低粘度生物基环氧树脂组合物及碳纤维复合材料 |
-
2020
- 2020-11-16 EP EP20207701.2A patent/EP4001338B1/en active Active
- 2020-11-16 ES ES20207701T patent/ES2973297T3/es active Active
-
2021
- 2021-10-04 WO PCT/EP2021/077223 patent/WO2022100927A1/en not_active Ceased
- 2021-10-04 CN CN202180076989.2A patent/CN116438222A/zh active Pending
- 2021-10-04 JP JP2023528646A patent/JP2023549254A/ja not_active Withdrawn
- 2021-10-04 KR KR1020237016051A patent/KR20230107244A/ko active Pending
- 2021-10-27 TW TW110139770A patent/TW202227579A/zh unknown
-
2023
- 2023-05-16 US US18/198,215 patent/US20230287168A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ES2973297T3 (es) | 2024-06-19 |
| EP4001338B1 (en) | 2024-01-31 |
| TW202227579A (zh) | 2022-07-16 |
| US20230287168A1 (en) | 2023-09-14 |
| WO2022100927A1 (en) | 2022-05-19 |
| EP4001338A1 (en) | 2022-05-25 |
| KR20230107244A (ko) | 2023-07-14 |
| CN116438222A (zh) | 2023-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241003 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241003 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20250515 |