JP2023005377A - Crosslinkable resin composition, and wire and cable - Google Patents

Abstract

To provide a crosslinkable resin composition which enables production of a crosslinked matter that has good scorch resistance and excellent thermal deformation resistance.SOLUTION: A crosslinkable resin composition contains 100 pts.mass of an ethylenic resin (A), 0.85-1.25 pts.mass of a crosslinking agent (B) composed of an organic peroxide, 0.07-0.60 pts.mass of a first crosslinking auxiliary (C1) composed of an allyl group-containing compound, and 0.15-0.38 pts.mass of a second crosslinking auxiliary (C2) composed of an α-methyl styrene dimer. The crosslinking agent (B) is a dicumyl peroxide, and the first crosslinking auxiliary (C1) is TAIC or TAC, especially particularly, TAIC.SELECTED DRAWING: Figure 2

Description

TECHNICAL FIELD The present invention relates to a crosslinkable resin composition containing an ethylene-based resin, and an electric wire/cable formed by forming a crosslinked product of the resin composition as an insulating coating layer on a conductor.

Insulated wires/cables for electric power are usually produced by coating a conductor with a crosslinkable resin composition by extrusion, followed by crosslinking treatment to form an insulating coating layer.
Here, scorch resistance, heat deformation resistance of the crosslinked product, and the like are required for the crosslinkable resin composition used for the insulation-coated electric wire/cable.

As a crosslinkable resin composition used for insulation-coated wires and cables, Patent Document 1 below discloses a polymer composition containing an ethylene-based polymer, an organic peroxide and a polyallyl crosslinking aid.
In Patent Document 1, an attempt is made to improve the scorch resistance by using a polyallyl cross-linking aid and reducing the content of the organic peroxide that is the cross-linking agent, but a sufficient improvement effect has not been obtained.

Patent Document 2 below describes a composition containing an ethylene-based polymer, an organic peroxide such as dicumyl peroxide, a dielectric fluid such as an alkylated naphthalene, and a cross-linking aid such as α-methylstyrene dimer. disclosed.
A cross-linking aid such as α-methylstyrene dimer is intended to improve the scorch resistance of the resulting composition and to improve the cured state of the cross-linked product of the composition, which is described in Patent Document 2. The crosslinked product of the composition does not have sufficient heat deformation resistance.

JP 2019-7013 A Japanese Patent Publication No. 2015-535864

Conventionally known crosslinkable resin compositions, including the compositions disclosed in Patent Document 1 and Patent Document 2, do not satisfy both the scorch resistance and the heat deformation resistance of the crosslinked product. A crosslinked product from a resin composition having good resistance to heat deformation tends to be poor in heat deformation resistance, and a resin composition capable of forming a crosslinked product having good heat deformation resistance tends to be poor in scorch resistance.

The present invention has been made based on the circumstances as described above.
An object of the present invention is to provide a cross-linkable resin composition which has good scorch resistance and which can give a cross-linked product which is excellent in heat deformation resistance.

The crosslinkable resin composition of the present invention comprises 100 parts by mass of an ethylene resin (A), 0.85 to 1.25 parts by mass of a cross-linking agent (B) comprising an organic peroxide, and a first cross-linking comprising an allyl group-containing compound. It is characterized by containing 0.07 to 0.60 parts by mass of auxiliary agent (C1) and 0.15 to 0.38 parts by weight of second cross-linking auxiliary agent (C2) composed of α-methylstyrene dimer.

In the crosslinkable resin composition of the present invention, the crosslinker (B) is dicumyl peroxide, and the first crosslinkable agent (C1) is preferably TAIC or TAC, particularly TAIC.

In the crosslinkable resin composition of the present invention, the mass ratio of the second cross-linking aid (C2) to the first cross-linking aid (C1) is preferably 0.4 to 2.5.

In the crosslinkable resin composition of the present invention, 0.90 to 1.20 parts by mass of a crosslinker (B) comprising dicumyl peroxide, and 0.10 to 0.10 parts by mass of a first crosslinker (C1) comprising TAIC or TAC. It preferably contains 55 parts by mass and 0.15 to 0.35 parts by mass of the second cross-linking aid (C2).

In the crosslinkable resin composition of the present invention, 0.91 to 1.16 parts by mass of a crosslinker (B) comprising dicumyl peroxide and 0.11 to 0.16 parts by mass of a first crosslinker (C1) comprising TAIC or TAC. It preferably contains 52 parts by mass and 0.16 to 0.35 parts by mass of the second cross-linking aid (C2).

The electric wire/cable of the present invention is characterized by covering a conductor with an insulating coating layer formed by cross-linking the cross-linkable resin composition of the present invention.

The crosslinkable resin composition of the present invention has good scorch resistance, and can be crosslinked to obtain a crosslinked product with excellent heat deformation resistance.

It is a figure which shows the relationship between content of a 1st crosslinking coagent, and the physical property of the resin composition obtained. FIG. 3 is a diagram showing the relationship between the content of the second cross-linking aid and the physical properties of the obtained resin composition. FIG. 2 is a diagram showing the relationship between the content of a cross-linking agent and the physical properties of the obtained resin composition.

The present invention will be described in detail below.
<Crosslinkable resin composition>
The crosslinkable resin composition of the present invention comprises an ethylene resin (A), a crosslinker (B) composed of an organic peroxide, a first crosslinker (C1) composed of an allyl group-containing compound, and α-methyl and a second cross-linking aid (C2) consisting of a styrene dimer.

<Ethylene resin (A)>
The ethylene-based resin (A) constituting the crosslinkable resin composition of the present invention is not particularly limited, and may be a high-pressure low-density ethylene homopolymer, a high-pressure low-density ethylene copolymer, or a high-density ethylene copolymer. Coalescing, medium-density ethylene copolymers, linear low-density ethylene copolymers, linear ultra-low-density ethylene copolymers, and the like can be mentioned.

These ethylene (co)polymers can be produced by conventionally known methods, and can be used as the ethylene-based resin (A) either singly or in combination of two or more.

Examples of the polymerization catalyst used in the production of the ethylene resin (A) include radical generation catalysts such as organic peroxides, azo compounds, and oxygen in high-pressure polymerization. Examples of legal catalysts include Ziegler catalysts, Phillips catalysts, and metallocene catalysts.

Examples of α-olefins to be copolymerized with ethylene when producing the ethylene-based resin (A) composed of a copolymer include propylene, butene-1, hexene-1, 4-methylpentene-1, octene-1, decene -1 can be exemplified.

Suitable ethylene-based resin (A) has a density of 0.91 to 0.94 g/cm ³ , particularly 0.915 to 0.930 g/cm ³ and a melt mass flow rate of 0.01 to 10 g/10 min. , in particular, high-pressure low-density ethylene homopolymers, high-pressure low-density ethylene copolymers and linear low-density ethylene copolymers, which are 0.5 to 5 g/10 min.

If an ethylene-based resin with too low a density is used, the abrasion resistance of the finally formed insulating coating layer will be poor. Flexibility tends to be poor.
Further, an ethylene resin with an excessively low melt mass flow rate is inferior in processability, while an ethylene resin with an excessively high melt mass flow rate causes mechanical strength, heat deformation resistance, Roundness tends to decrease.

<Crosslinking agent (B)>
The cross-linking agent (B) constituting the cross-linkable resin composition of the present invention comprises an organic peroxide.
Specific examples of the cross-linking agent (B) include di-t-butyl-peroxide, 1,1-bis-t-butyl-peroxybenzoate, 2,2-bis-t-butyl-peroxybutane, t- Butyl-peroxybenzoate, dicumyl peroxide, 2,5-dimethyl-2,5-di-t-butyl-peroxyhexane, t-butyl-cumyl peroxide, 2,5-dimethyl-2,5-di -t-butyl-peroxyhexyne-3 and the like, and these can be used alone or in combination of two or more. Among these, dicumyl peroxide is preferred.

In the crosslinkable resin composition of the present invention, the content of the crosslinker (B) is usually 0.85 to 1.25 parts by mass, preferably 0, per 100 parts by mass of the ethylene resin (A). .90 to 1.20 parts by mass, more preferably 0.91 to 1.16 parts by mass.

If the content of the cross-linking agent (B) is less than 0.85 parts by mass, the resulting cross-linked product of the resin composition will have poor heat deformation resistance (see Comparative Example 5 described later).
On the other hand, if the content exceeds 1.25 parts by mass, the scorch resistance of the obtained crosslinkable resin composition is inferior (see Comparative Example 6 described later).

<First cross-linking aid (C1)>
The first cross-linking aid (C1) constituting the cross-linkable resin composition of the present invention consists of an allyl group-containing compound.
Specific examples of the first cross-linking aid (C1) include TAIC (triallyl isocyanurate), TAC (triallyl cyanurate), TATM (triallyl trimellitate) and the like. More than one species can be used in combination. Among these, TAIC and TAC are preferred, and TAIC is particularly preferred.

The first cross-linking aid (C1) can promote the cross-linking reaction by the cross-linking agent (B) and improve the heat deformation resistance of the obtained cross-linked product by containing it in a suitable ratio described later.

In the crosslinkable resin composition of the present invention, the content of the first crosslinking aid (C1) is usually 0.07 to 0.60 parts by mass with respect to 100 parts by mass of the ethylene resin (A), It is preferably 0.10 to 0.55 parts by mass, more preferably 0.11 to 0.52 parts by mass.

If the content of the first cross-linking aid (C1) is less than 0.07 parts by mass, the resulting cross-linked product of the resin composition will have poor heat deformation resistance.
On the other hand, if the content exceeds 0.60 parts by mass, the scorch resistance of the obtained crosslinkable resin composition is inferior (see Comparative Example 2 described later).

<Second cross-linking aid (C2)>
The second cross-linking aid (C2) constituting the cross-linkable resin composition of the present invention comprises α-methylstyrene dimer (AMSD).
The second cross-linking aid (C2) can improve the scorch resistance of the resin composition by containing it in a suitable ratio described later.

In the crosslinkable resin composition of the present invention, the content of the second crosslinking aid (C2) is usually 0.15 to 0.38 parts by mass with respect to 100 parts by mass of the ethylene resin (A), It is preferably 0.15 to 0.35 parts by mass, more preferably 0.16 to 0.35 parts by mass.

If the content of the second cross-linking aid (C2) is less than 0.15 parts by mass, the resulting cross-linkable resin composition will have poor scorch resistance.
On the other hand, when the content exceeds 0.38 parts by mass, the resulting crosslinked product of the resin composition is inferior in heat deformation resistance (see Comparative Example 4 described later).

In the crosslinkable resin composition of the present invention, the mass ratio of the second cross-linking aid (C2) to the first cross-linking aid (C1) is preferably 0.4 to 2.5, more preferably 0.48. ~2.3.
If this mass ratio is too small, the resulting crosslinkable resin composition may not have sufficient scorch resistance.
On the other hand, if this mass ratio is too large, it may not be possible to obtain a crosslinked product with good heat deformation resistance from the obtained crosslinkable resin composition.

<Optional component>
In the crosslinkable resin composition of the present invention, in addition to the ethylene resin (A), the crosslinker (B), the first crosslinkable agent (C1) and the second crosslinkable agent (C2), the Olefin-based resins other than the ethylene-based resin (A), stabilizers, various additives, and auxiliary materials may be contained depending on the purpose of use as long as the properties of the resin composition are not impaired.

Examples of the optional olefin resin include ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-maleic acid Examples include copolymers, ethylene-diene compound copolymers, ethylene-vinylsilane copolymers, maleic anhydride-grafted ethylene-based polymers, acrylic acid-grafted ethylene-based polymers, and silane-grafted ethylene-based polymers.

Specific examples of optional stabilizers (light stabilizers, antioxidants, processing stabilizers) include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)butane-1,2,3 ,4-tetracarboxylate (LA-52 manufactured by ADEKA), 2,2,6,6-tetramethyl-4-piperidyl methacrylate (LA-87 manufactured by ADEKA), bis(2,2,6,6-tetra Hindered amine light stabilizers such as methyl-4-piperidyl) sebacate (ADEKA LA-77, or BASF TINUVIN 770); 4,4′-thiobis-(3-methyl-6-t-butylphenol) (cipro Synox BCS manufactured by Kasei Co., Ltd.), 4,4′-thiobis-(6-t-butyl-o-cresol) (Ethanox 736 manufactured by Ethyl Corporation), tetrakis[methylene-3-(3′,5′-di- t-butyl-4'-hydroxyphenyl)propionate]methane (Irganox 1010 manufactured by BASF), N,N'-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyl]hydrazine (BASF Irganox 1024), 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid (Cytec Cyanox 1790), 1,3,5 -trimethyl-2,4-6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene (Ethanox 330 manufactured by Albert Corporation), triethylene glycol-bis[3-(3-t-butyl- 5-methyl-4-hydroxyphenyl)propionate] (BASF Irganox 245), 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] ( BASF Irganox 259), octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate (BASF Irganox 1076), N,N'-hexamethylenebis(3,5 -di-t-butyl-4-hydroxy-hydrocinnamamide) (BASF Irganox 1098), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl -4-hydroxybenzyl)benzene (BASF Irganox 1330), tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate (BASF Irganox 3114), isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate (BASF Irganox 1135), 1,1,3-tris (2 -Methyl-4-hydroxy-5-t-butylphenyl)butane (Adeka Stub AO-30 manufactured by Asahi Denka Co., Ltd.), 4,4'-butylidenebis-(3-methyl-6-t-butylphenol (manufactured by Asahi Denka Co., Ltd.) Adeka Stab AO-40), hindered phenol stabilizers such as 2,2'-thiobis-(4-methyl-6-t-butylphenol); dilauryl thiodipropionate (DLTP "Yoshitomi" manufactured by Yoshitomi Pharmaceutical Co., Ltd.) ), distearyl thiodipropionate (DSTP "Yoshitomi" manufactured by Yoshitomi Pharmaceutical Co., Ltd.) and dimyristyl thiodipropionate (DMTP "Yoshitomi" manufactured by Yoshitomi Pharmaceutical Co., Ltd.). can.

Examples of optional additives and auxiliary materials include workability improvers, dispersants, copper damage inhibitors, antistatic agents, lubricants, carbon black, and the like.

The crosslinkable resin composition of the present invention contains essential components [ethylene resin (A), crosslinker (B), first crosslinkable agent (C1) and second crosslinkable agent (C2)] and optional components as predetermined. It can be prepared by blending in proportion, kneading and granulating.
The crosslinkable resin composition of the present invention is preferably in the form of pellets having an average particle size of about 2 to 7 mm, from the viewpoints of ease of insertion into a screw of an extruder, handleability, and the like.

<Electric wire/cable>
In the electric wire/cable of the present invention, a conductor is covered with an insulating coating layer formed by cross-linking the cross-linkable resin composition of the present invention, that is, an insulating coating layer made of a cross-linked product of the resin composition.
The electric wire/cable of the present invention is produced by coating a conductor mainly made of copper or aluminum with the crosslinkable resin composition of the present invention by extrusion and then cross-linking it to form an insulating coating layer. be able to.

Generally, in the case of low-voltage cables, only one layer is coated with a single-layer extruder, and in the case of high-voltage cables, a three-layer extruder is used to coat the first layer of the internal semi-conductive layer resin composition, the crosslinkable resin composition of the present invention. A laminate of a second layer made of a material and a third layer made of an outer semiconductive layer resin composition is coated on a conductor at a temperature equal to or higher than the melting temperature of each resin and lower than the decomposition temperature of the cross-linking agent (B), Thereafter, the resin composition is crosslinked by heating to the decomposition temperature of the crosslinking agent (B) or higher in an atmosphere of nitrogen, steam, silicone oil, molten salt, or the like.

The electric wire/cable of the present invention is excellent in various properties such as electrical properties (insulating properties of the coating layer) and mechanical properties, and is stably extruded for a long time during its production (extrusion molding process). can be done.

Examples of the present invention will be described below, but the present invention is not limited to these examples. Here, the ethylene-based resins, cross-linking agents and cross-linking aids used to produce the resin compositions of Examples and Comparative Examples are as follows.

・Resin (A-1):
High-pressure low-density ethylene homopolymer, melt mass flow rate (MFR) = 2.2 g/10 minutes, density 0.922 g/cm ³ (manufactured by ENEOS NUC Co., Ltd.)

- Crosslinking agent (B-1): dicumyl peroxide

- First cross-linking aid (C1-1): TAIC
- First cross-linking aid (C1-2): TAC
- Second cross-linking aid (C2): AMSD
- Crosslinking aid (C3): TMPTA (trimethylpropane triacrylate)

<Example 1>
According to the formulation shown in Table 1 below, the resin (A-1) 100 parts by mass, the cross-linking agent (B-1) 1.02 parts by mass, the first cross-linking aid (C1-1) 0.29 parts by mass, 0.25 parts by mass of the second cross-linking aid (C2) was mixed for 16 hours while being heated to 60° C., and then cooled to room temperature to obtain the cross-linkable resin composition of the present invention.

<Examples 1 to 7>
Example 1 except that the amount of at least one of the cross-linking agent (B-1), the first cross-linking aid (C1-1), and the second cross-linking aid (C2) was changed according to the formulation shown in Table 1 below. A crosslinkable resin composition of the present invention was obtained in the same manner as above.

<Example 8>
The crosslinkable resin composition of the present invention was prepared in the same manner as in Example 2 except that 0.15 parts by mass of the first crosslinking aid (C1-2) was used instead of the first crosslinking aid (C1-1). Obtained.

<Comparative Example 1>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 2, except that the first crosslinking aid (C1-1) was not used.

<Comparative Example 2>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 1, except that the amount of the first crosslinking aid (C1-1) used was changed to 0.72 parts by mass.

<Comparative Example 3>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 4, except that the second crosslinking aid (C2) was not used.

<Comparative Example 4>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 5, except that the amount of the first crosslinking aid (C2) used was changed to 0.47 parts by mass.

<Comparative Example 5>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 6, except that the amount of the crosslinking agent (B-1) used was changed to 0.76 parts by mass.

<Comparative Example 6>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 7, except that the amount of the crosslinking agent (B-1) used was changed to 1.38 parts by mass.

<Comparative Example 7>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 2, except that 0.15 parts by mass of the crosslinking aid (C3) was used instead of the first crosslinking aid (C1-1).

<Comparative Example 8>
A crosslinkable resin composition for comparison was obtained in the same manner as in Example 2, except that 0.20 parts by mass of the crosslinking aid (C3) was used instead of the first crosslinking aid (C1-1).

Each of the crosslinkable resin compositions obtained in Examples 1 to 8 and Comparative Examples 1 to 8 was evaluated for scorch resistance and heat deformation resistance. Evaluation methods are as follows. The results are shown in Table 1 and Figures 1-3.

FIG. 1 shows the content of the first cross-linking aid (C1-1) and the resulting resin when the contents of the cross-linking agent (B-1) and the second cross-linking aid (C2) are substantially constant. It shows the relationship with the physical properties of the composition (scorch resistance and heat deformation resistance of the crosslinked product).
FIG. 2 shows the content of the second cross-linking aid (C2) and the resulting resin when the contents of the cross-linking agent (B-1) and the first cross-linking aid (C1-1) are substantially constant. It shows the relationship with the physical properties of the composition (scorch resistance and heat deformation resistance of the crosslinked product).
FIG. 3 shows the amount of the cross-linking agent (B-1) added and the resulting resin when the contents of the first cross-linking aid (C1-1) and the second cross-linking aid (C2) are substantially constant. It shows the relationship with the physical properties of the composition (scorch resistance and heat deformation resistance of the crosslinked product).

[Method for evaluating scorch resistance]
Measurement was performed at a test temperature of 140° C. for 8 hours using an MDR (Moving Die Rheometer) in accordance with JIS K 6300-2. The time ts1 required for the torque to rise by 1.0 dNm from the minimum value was measured.
As the evaluation criteria, a case where ts1 was 45 minutes or more was defined as "pass", and a case where ts1 was within 45 minutes was defined as "fail".

[Evaluation method for heat deformation (hot set)]
The resin composition was press molded (temperature 120° C., preheating pressure 0.5 MPa×5 minutes, pressure pressure 15 MPa×15 minutes) to obtain a crosslinked product sheet with a thickness of 1 mm. A No. 6 dumbbell test piece was prepared from the obtained crosslinked sheet, and two marked lines were drawn at the center of this test piece (marked line distance (L ₀ )=20 mm).
A tensile load of 20 N/cm ² was applied to the test piece in a high temperature atmosphere of 200° C., and the marked line distance (L ₁ ) was measured after 15 minutes, and the hot set (%) was calculated by the following formula.
As the evaluation criteria, a case where the hot set was 80% or less was defined as "accepted", and a case where the hot set exceeded 80% was defined as "failed".

Formula: Hot set (%) = [(L ₁ - L ₀ )/L ₀ ] x 100

As shown in Table 1 above, all of the crosslinkable resin compositions obtained in Examples 1 to 8 have good scorch resistance, and all of these crosslinked products have excellent heat deformation resistance. there is
On the other hand, the composition according to Comparative Example 2 in which the content of the first cross-linking aid exceeds 0.60 parts by mass, the composition according to Comparative Example 3 that does not use the second cross-linking aid, and the cross-linking agent All of the compositions according to Comparative Example 6, in which the content exceeded 1.25 parts by mass, were inferior in scorch resistance.
In addition, the composition according to Comparative Example 1 that does not use the first cross-linking aid, the composition according to Comparative Example 4 in which the content of the second cross-linking aid exceeds 0.38 parts by mass, and the content of the cross-linking agent The composition according to Comparative Example 5 of less than 0.85 parts by mass and the composition according to Comparative Examples 7 and 8 containing a cross-linking aid composed of an acryloyl group-containing compound instead of the first cross-linking aid are both crosslinked. It was inferior in heat deformation resistance of the product.

Further, from FIGS. 1 to 3, good scorch resistance is achieved only by containing the first cross-linking aid (TAIC), the second cross-linking aid (AMSD), and the cross-linking agent (dicumyl peroxide) within specific ranges. It can be understood that a resin composition having excellent heat deformation resistance of the crosslinked product can be obtained.

Claims (7)

100 parts by mass of ethylene resin (A),
0.85 to 1.25 parts by mass of a cross-linking agent (B) composed of an organic peroxide;
0.07 to 0.60 parts by mass of the first cross-linking aid (C1) composed of an allyl group-containing compound, and 0.15 to 0.38 parts by mass of the second cross-linking aid (C2) composed of an α-methylstyrene dimer. A crosslinkable resin composition comprising: The cross-linking agent (B) is dicumyl peroxide,
2. The crosslinkable resin composition according to claim 1, wherein the first crosslinkable coagent (C1) is TAIC or TAC. 3. The crosslinkable resin composition according to claim 2, wherein the first crosslinkable coagent (C1) is TAIC. Crosslinkability according to any one of claims 1 to 3, wherein the mass ratio of the second crosslinking aid (C2) to the first crosslinking aid (C1) is 0.4 to 2.5. Resin composition. 0.90 to 1.20 parts by mass of a cross-linking agent (B) made of dicumyl peroxide;
Crosslinking according to claim 1, containing 0.10 to 0.55 parts by mass of the first cross-linking aid (C1) and 0.15 to 0.35 parts by mass of the second cross-linking aid (C2) composed of TAIC or TAC. elastic resin composition. 0.91 to 1.16 parts by mass of a cross-linking agent (B) made of dicumyl peroxide;
Crosslinking according to claim 1, containing 0.11 to 0.52 parts by mass of the first cross-linking aid (C1) and 0.16 to 0.35 parts by mass of the second cross-linking aid (C2) composed of TAIC or TAC. elastic resin composition. An electric wire/cable comprising a conductor covered with an insulating coating layer formed by crosslinking the crosslinkable resin composition according to any one of claims 1 to 6.

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