JP2022525851A - 発光素子を有するユニットピクセル、ピクセルモジュール及びディスプレイ装置 - Google Patents
発光素子を有するユニットピクセル、ピクセルモジュール及びディスプレイ装置 Download PDFInfo
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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Abstract
Description
Claims (19)
- 透明基板;
前記透明基板上に整列した複数の発光素子;
前記各発光素子を前記透明基板に接着させる接着層;
前記発光素子を覆い、前記接着層に接着された段差調節層;及び
前記段差調節層上に配置され、前記各発光素子に電気的に接続された各接続層;を含み、
前記段差調節層は、縁部に沿って凹凸パターンを有する、ユニットピクセル。 - 前記複数の発光素子は、互いに異なる色の光を放出する少なくとも3個の発光素子を含み、
前記少なくとも3個の発光素子は一列に配列された、請求項1に記載のユニットピクセル。 - 前記複数の発光素子は、赤色、緑色及び青色を放出する発光素子を含む、請求項1に記載のユニットピクセル。
- 前記各発光素子のそれぞれは、
第1導電型半導体層、第2導電型半導体層、及び前記第1導電型半導体層と第2導電型半導体層との間に介在した活性層を含む発光構造体;及び
前記発光構造体上に配置された第1及び第2電極パッド;を含み、
前記段差調節層は、前記第1及び第2電極パッドを露出させる各開口部を有し、
前記各接続層は、前記段差調節層の各開口部を介して前記第1及び第2電極パッドに電気的に接続された、請求項3に記載のユニットピクセル。 - 前記各発光素子は、それぞれ複数個の連結チップを含む、請求項4に記載のユニットピクセル。
- 前記各発光素子のうちいずれか一つの連結チップは、他の発光素子の各連結チップと異なる位置に整列された、請求項5に記載のユニットピクセル。
- 前記各発光素子上に整列された複数個の連結チップは、少なくとも一つの整列方向に対して非対称に配置された、請求項5に記載のユニットピクセル。
- 前記接着層と前記透明基板との間に配置された光遮断層をさらに含み、
前記光遮断層は、前記発光素子で生成された光を透過する窓を有する、請求項1に記載のユニットピクセル。 - 前記窓の幅は前記発光素子の幅より狭い、請求項8に記載のユニットピクセル。
- 前記段差調節層及び各接続層を覆う保護層をさらに含み、
前記保護層は、前記各接続層上に位置する各開口部を有する、請求項1に記載のユニットピクセル。 - 前記保護層の各開口部内に配置された各バンプをさらに含み、
前記各バンプは、それぞれ前記各接続層に電気的に接続された、請求項10に記載のユニットピクセル。 - 透明基板;
前記透明基板上に整列し、互いに異なる色の光を放出する少なくとも3個の発光素子;
前記各発光素子を前記透明基板に接着させる接着層;
前記発光素子を覆い、前記接着層に接着された段差調節層;及び
前記段差調節層上に配置され、前記各発光素子に電気的に接続された各接続層;を含み、
前記少なくとも3個の発光素子は一列に配列された、ユニットピクセル。 - 回路基板;
前記回路基板上に配置された複数のユニットピクセル;及び
前記複数の各ユニットピクセルを覆うカバー層;を含み、
前記ユニットピクセルのそれぞれは、
透明基板;
前記透明基板上に整列した複数の発光素子;
前記各発光素子を前記透明基板に接着させる接着層;
前記発光素子を覆い、前記接着層に接着された段差調節層;及び
前記段差調節層上に配置され、前記各発光素子に電気的に接続された各接続層;を含み、
前記段差調節層は、縁部に沿って凹凸パターンを有する、ピクセルモジュール。 - 前記ユニットピクセルは、
前記段差調節層及び各接続層を覆う保護層をさらに含み、
前記保護層は、前記各接続層上に位置する各開口部を有する、請求項13に記載のピクセルモジュール。 - 前記各発光素子と前記回路基板とをボンディングするボンディング材をさらに含み、
前記ボンディング材は、前記保護層の各開口部の少なくとも一部を充填する、請求項14に記載のピクセルモジュール。 - 前記各発光素子と前記回路基板とをボンディングするボンディング材をさらに含み、
前記ユニットピクセルは、前記保護層の各開口部内に配置された各バンプをさらに含み、
前記回路基板は、上面に露出した各パッドを含み、
前記ボンディング材は、前記各バンプと前記各パッドとをボンディングする、請求項14に記載のピクセルモジュール。 - 前記回路基板は、底に配置された各ボトムパッドをさらに含み、
前記各ボトムパッドの個数は、前記各パッドの個数より少ない、請求項16に記載のピクセルモジュール。 - 前記複数の発光素子は、互いに異なる色の光を放出する少なくとも3個の発光素子を含み、前記少なくとも3個の発光素子は一列に配列された、請求項14に記載のピクセルモジュール。
- パネル基板;及び
前記パネル基板上に配列された複数のピクセルモジュール;を含み、
前記各ピクセルモジュールは、それぞれ回路基板、前記回路基板上に配置された複数のユニットピクセル、及び前記複数のユニットピクセルを覆うカバー層を含み、
前記ユニットピクセルのそれぞれは、
透明基板;
前記透明基板上に整列した複数の発光素子;
前記各発光素子を前記透明基板に接着させる接着層;
前記発光素子を覆い、前記接着層に接着された段差調節層;及び
前記段差調節層上に配置され、前記各発光素子に電気的に接続された各接続層;を含み、
前記段差調節層は、縁部に沿って凹凸パターンを有する、ディスプレイ装置。
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US201962826033P | 2019-03-29 | 2019-03-29 | |
US62/826,033 | 2019-03-29 | ||
US16/831,973 | 2020-03-27 | ||
US16/831,973 US11355686B2 (en) | 2019-03-29 | 2020-03-27 | Unit pixel having light emitting device, pixel module and displaying apparatus |
PCT/KR2020/004284 WO2020204512A1 (ko) | 2019-03-29 | 2020-03-30 | 발광 소자를 갖는 유닛 픽셀, 픽셀 모듈 및 디스플레이 장치 |
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JPWO2020204512A5 JPWO2020204512A5 (ja) | 2023-04-10 |
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EP (1) | EP3951896B1 (ja) |
JP (1) | JP7520030B2 (ja) |
KR (1) | KR20210134309A (ja) |
CN (2) | CN113632249A (ja) |
BR (1) | BR112021016971A2 (ja) |
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KR20240117457A (ko) | 2023-01-25 | 2024-08-01 | 나노마테리얼 레버러토리 코., 엘티디. | 디스플레이 장치를 제조하는 방법 및 디스플레이 장치 |
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KR20210142464A (ko) * | 2020-05-18 | 2021-11-25 | 삼성전자주식회사 | 발광 소자 기판 및 이를 포함하는 발광 소자 패키지 |
US11881363B2 (en) | 2022-03-31 | 2024-01-23 | Darfon Electronics Corp. | Lighting keyboard, backlight module and lighting board |
TWI797730B (zh) | 2021-08-25 | 2023-04-01 | 達方電子股份有限公司 | 背光模組及發光鍵盤 |
CN219892083U (zh) | 2021-08-25 | 2023-10-24 | 达方电子股份有限公司 | 光源电路板、背光模组及发光按键 |
CN114141912B (zh) * | 2021-11-24 | 2023-05-23 | 东莞市中麒光电技术有限公司 | Led显示模组及制作方法 |
US20230178700A1 (en) * | 2021-11-29 | 2023-06-08 | Seoul Viosys Co., Ltd. | Pixel module and display apparatus having the same |
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