JP2022115943A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022115943A5 JP2022115943A5 JP2022075758A JP2022075758A JP2022115943A5 JP 2022115943 A5 JP2022115943 A5 JP 2022115943A5 JP 2022075758 A JP2022075758 A JP 2022075758A JP 2022075758 A JP2022075758 A JP 2022075758A JP 2022115943 A5 JP2022115943 A5 JP 2022115943A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- conductive resin
- composition according
- epoxy
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 12
- 239000003822 epoxy resin Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- -1 glycidyl ester Chemical class 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 5
- 239000003999 initiator Substances 0.000 claims 4
- 239000000178 monomer Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 3
- 239000003112 inhibitor Substances 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000012933 diacyl peroxide Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 150000002432 hydroperoxides Chemical class 0.000 claims 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 150000003852 triazoles Chemical class 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018200424 | 2018-10-24 | ||
| JP2018200424 | 2018-10-24 | ||
| PCT/JP2019/041504 WO2020085372A1 (ja) | 2018-10-24 | 2019-10-23 | 導電性樹脂組成物および半導体装置 |
| JP2020553425A JPWO2020085372A1 (ja) | 2018-10-24 | 2019-10-23 | 導電性樹脂組成物および半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020553425A Division JPWO2020085372A1 (ja) | 2018-10-24 | 2019-10-23 | 導電性樹脂組成物および半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022115943A JP2022115943A (ja) | 2022-08-09 |
| JP2022115943A5 true JP2022115943A5 (https=) | 2022-12-02 |
| JP7359252B2 JP7359252B2 (ja) | 2023-10-11 |
Family
ID=70331380
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020553425A Pending JPWO2020085372A1 (ja) | 2018-10-24 | 2019-10-23 | 導電性樹脂組成物および半導体装置 |
| JP2022075758A Active JP7359252B2 (ja) | 2018-10-24 | 2022-05-02 | 導電性樹脂組成物および半導体装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020553425A Pending JPWO2020085372A1 (ja) | 2018-10-24 | 2019-10-23 | 導電性樹脂組成物および半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JPWO2020085372A1 (https=) |
| CN (1) | CN112912427B (https=) |
| TW (1) | TWI824045B (https=) |
| WO (1) | WO2020085372A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4604230A (en) * | 1984-10-15 | 1986-08-05 | Stauffer Chemical Company | Thermally stable adhesive |
| JPH07101696B2 (ja) * | 1988-07-08 | 1995-11-01 | 株式会社住友金属セラミックス | 半導体素子塔載用セラミック基板 |
| US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| JPH06350000A (ja) * | 1993-06-04 | 1994-12-22 | Hitachi Ltd | リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法 |
| JP3343210B2 (ja) * | 1997-12-26 | 2002-11-11 | 株式会社ジャパンエナジー | エポキシブリ−ドアウト防止剤及び防止方法 |
| JP2000186261A (ja) * | 1998-12-21 | 2000-07-04 | Hitachi Chem Co Ltd | 銅フレーム用接着剤、半導体パッケージ及び半導体パッケージの製造法 |
| JP2001181482A (ja) * | 1999-12-27 | 2001-07-03 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| JP5352970B2 (ja) * | 2007-07-04 | 2013-11-27 | 住友ベークライト株式会社 | 樹脂組成物および半導体装置 |
| JP5513734B2 (ja) * | 2008-11-27 | 2014-06-04 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
| JP5540916B2 (ja) * | 2010-06-15 | 2014-07-02 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
| JP6747000B2 (ja) * | 2016-03-25 | 2020-08-26 | 住友ベークライト株式会社 | ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法 |
| CN109643662B (zh) * | 2016-08-19 | 2021-07-13 | 住友电木株式会社 | 芯片粘结膏和半导体装置 |
-
2019
- 2019-10-23 JP JP2020553425A patent/JPWO2020085372A1/ja active Pending
- 2019-10-23 CN CN201980070190.5A patent/CN112912427B/zh active Active
- 2019-10-23 WO PCT/JP2019/041504 patent/WO2020085372A1/ja not_active Ceased
- 2019-10-24 TW TW108138414A patent/TWI824045B/zh active
-
2022
- 2022-05-02 JP JP2022075758A patent/JP7359252B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5348261B2 (ja) | 回路接続材料、接続構造体及びその製造方法 | |
| JP5509738B2 (ja) | アクリル系絶縁性接着剤 | |
| JP5816752B2 (ja) | フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤 | |
| KR101083140B1 (ko) | 아크릴계 다이싱용 점착제 조성물 | |
| JP6445315B2 (ja) | ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 | |
| JP2005530024A5 (https=) | ||
| CN102597044A (zh) | 热聚合系引发剂体系和粘接剂组合物 | |
| JP2019021813A (ja) | ダイシング・ダイボンディングフィルムおよび熱硬化型ダイボンディングフィルム用フィルム状接着剤 | |
| JP2022115943A5 (https=) | ||
| US10968367B2 (en) | Low temperature curable adhesive composition and articles including the same | |
| CN101601122B (zh) | 涂有填充的、可旋涂的材料的半导体晶片 | |
| WO2016196936A1 (en) | Thermally conductive interface formulations and methods thereof | |
| JP7124936B2 (ja) | 接着剤組成物及び構造体 | |
| KR20210116425A (ko) | 유기 el 표시 소자용 봉지제 세트 및 유기 el 표시 소자 | |
| JP2025007018A5 (https=) | ||
| JP5971609B2 (ja) | 硬化性樹脂組成物及びこれを硬化した硬化物 | |
| JPWO2022138184A5 (https=) | ||
| KR101325039B1 (ko) | 자외선 감광성 아크릴계 점착제 조성물 및 이를 이용한 점착 필름의 제조방법 | |
| CN114774031A (zh) | 粘着剂及包含其的偏光板 | |
| CN107216840A (zh) | 一种光固化环氧丙烯酸酯型胶黏剂及其制备方法 | |
| KR20210116426A (ko) | 경화물 및 유기 el 표시 소자 | |
| US20100193973A1 (en) | Semiconductor wafer coated with a filled, spin-coatable material | |
| JP6107816B2 (ja) | 回路接続材料、接続構造体及びその製造方法 | |
| JP6789057B2 (ja) | 両面粘着テープ及びウエハの処理方法 | |
| TW200935529A (en) | Method of coating fine wires and curable composition therefor |