JP2022110940A - Probe card and electronic component testing device - Google Patents

Abstract

To provide a probe card capable of accelerating a test signal.SOLUTION: A probe card 20 comprises a probe head 30 having a probe 31 in contact with a plurality of DUTs 101 formed on a semiconductor wafer 100, a wiring board 40, and a relay member 50 interposed between the probe head 30 and the wiring board 40. The relay member 50 includes a plurality of interposers 51 electrically connecting the probe head 30 and the wiring board 40, and a housing 52 that holds the plurality of interposers 51 while opposing the plurality of interposers 51 to the probe head 30 and the wiring board 40.SELECTED DRAWING: Figure 3

Description

The present invention relates to a probe card used for testing an electronic component under test (DUT: Device Under Test) such as an integrated circuit element formed on a semiconductor wafer, and an electronic component testing apparatus equipped with the same.

The probe card includes a first substrate on which probe needles are mounted, a second substrate electrically connected to the test apparatus main body, and a substrate interposed between the first and second substrates. an interposer for electrically connecting the two substrates. An anisotropically conductive rubber sheet is used as this interposer (see, for example, Patent Document 1).

JP 2009-002865 A

By combining a plurality of divided anisotropically conductive rubber sheets to configure the above-described interposer, it is possible to cope with an increase in size of a semiconductor wafer. However, since the arrangement of signal wiring is restricted at the boundary between the anisotropically conductive rubber sheets, there is a problem that speeding up of the test signal is hindered.

The problem to be solved by the present invention is to provide a probe card capable of increasing the speed of test signals, and an electronic component test apparatus including the same.

[1] A probe card according to the present invention includes a probe head having probes that contact a plurality of DUTs formed on a wafer, a wiring board, a relay member interposed between the probe head and the wiring board, wherein the relay member includes a plurality of interposers electrically connecting the probe head and the wiring board, and holding the plurality of interposers while facing the probe head and the wiring board. A probe card comprising a holding member.

[2] In the above invention, the holding member may be a plate-shaped housing having a plurality of openings each having a size capable of accommodating the interposer, and each of the openings may pass through the housing. .

[3] In the above invention, the plurality of openings are arranged so as to individually correspond to the plurality of DUTs, and each of the openings is a plurality of probes contacting one of the DUTs in a plan view. may include the tip of the

[4] In the above invention, the plurality of openings may be non-uniformly arranged.

[5] In the above invention, the housing has a plurality of opening groups each composed of a plurality of the openings arranged side by side, and the interval between the mutually adjacent opening groups is equal to the above-mentioned A portion wider than the opening may be included.

[6] In the above invention, the plurality of openings forming the opening group may be arranged in a non-linear manner.

[7] In the above invention, the plurality of openings may include an opening positioned on the centerline of the housing.

[8] In the above invention, the plurality of openings may have substantially the same shape, and the plurality of interposers may also have substantially the same shape.

[9] In the above invention, the housing may have a holding portion that protrudes toward the inside of the opening and holds the interposer.

[10] In the above invention, the holding part may be positioned on the probe head side with respect to the interposer.

[11] In the above invention, the holding portion may be located on a first main surface of the housing facing the probe head.

[12] In the above invention, the housing may have a positioning portion that protrudes toward the inside of the opening and positions the interposer relative to the opening.

[13] In the above invention, the positioning portion may be exposed from a second main surface of the housing facing the wiring board.

[14] In the above invention, the housing may have a restraining portion that protrudes toward the inside of the opening and restrains the interposer in the opening.

[15] In the above invention, the restraining portion may be located on the wiring board side with respect to the interposer.

[16] In the above invention, the restraining portion may be located on a second main surface of the housing facing the wiring board.

[17] In the above invention, the housing may have a notch communicating with the opening around the opening.

[18] In the above invention, the notch may be exposed from a second main surface of the housing facing the wiring board.

[19] In the above invention, the housing may have a substantially circular shape.

[20] In the above invention, the probe card further includes a stiffener attached to the wiring board, and the wiring board has a connector mounted on the main surface opposite to the main surface facing the relay member. may have.

[21] An electronic device testing apparatus according to the present invention is an electronic device testing apparatus for testing a DUT formed on a wafer, comprising: a test head to which the probe card is connected; and a tester for testing the electronic component test apparatus.

In the present invention, the relay member includes a plurality of interposers and a holding member that holds the plurality of interposers. Therefore, the interposer can be arranged at any position, and the arrangement of the signal wiring is not restricted, so that the speed of the test signal can be increased.

FIG. 1 is a schematic diagram showing an electronic device testing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the connection relationship among the test head, probe card, and prober in the embodiment of the present invention. FIG. 3 is an exploded perspective view showing the probe card in the embodiment of the invention. FIG. 4 is an exploded cross-sectional view of the probe card according to the embodiment of the present invention, corresponding to the IV section in FIG. FIG. 5 is a perspective view showing a relay member in the embodiment of the invention. 6 is an enlarged view showing the VI section of FIG. 5. FIG. FIG. 7 is a perspective view showing an interposer in an embodiment of the invention. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7. FIG. FIG. 9 is a perspective view showing a housing in an embodiment of the invention; 10 is a perspective view showing the opening in the embodiment of the present invention, and an enlarged view showing the X section of FIG. 9. FIG. FIG. 11 is a perspective plan view showing the positional relationship of the housing opening, probe, and DUT in the embodiment of the present invention. FIG. 12 is a plan view showing the layout of the openings in the housing according to the embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing an electronic device testing apparatus according to this embodiment, and FIG. 2 is a sectional view showing the connection relationship among a test head, a probe card, and a prober according to this embodiment.

An electronic device testing apparatus 1 according to the present embodiment includes a test head 10, a tester 70, and a prober 90, as shown in FIG. The tester 70 is electrically connected to the test head 10 via a cable 71, and inputs a test signal to a DUT 101 (see FIG. 11) such as an IC device formed on a semiconductor wafer 100 (see FIG. 2). By outputting, it is possible to test the electrical characteristics of the DUT 101 . The test head 10 is turned over by the manipulator 95 from the maintenance position (indicated by the dashed line in FIG. 1) and placed above the prober 90 .

The test head 10 incorporates a plurality of pin electronics cards (not shown) that exchange test signals with the DUT 101 . Also, as shown in FIGS. 1 and 2, a motherboard 11 is attached to the lower portion of the test head 10 . A connector 12 such as a ZIF (Zero Insertion Force) connector or a LIF (Low Insertion Force) connector is provided on the bottom surface of the motherboard 11 . A coaxial cable 13 is connected to this connector 12 , and via this coaxial cable 13 , the connector 12 on the mother board 11 and pin electronics etc. are electrically connected. A probe card 20 for establishing electrical connection between the DUT 101 and the test head 10 is mounted on the motherboard 11 .

3 is an exploded perspective view showing the probe card in this embodiment, and FIG. 4 is an exploded cross-sectional view of the probe card in this embodiment, corresponding to the IV section in FIG.

The probe card 20 includes a probe head 30, a wiring board 40, a relay member 50, and stiffeners 60, as shown in FIGS. 4, illustration of the stiffener 60 is omitted. The wiring board 40 in this embodiment corresponds to an example of the "wiring board" in the present invention.

As shown in FIG. 4, the probe head 30 includes a plurality of probes 31 electrically contacting the pads 102 of the DUT 101 formed on the semiconductor wafer 100, and a wiring board 32 on which the probes 31 are mounted. there is

The probe 31 is a probe needle formed from a semiconductor substrate such as a silicon substrate using MEMS (Micro Electro Mechanical Systems) technology. Each probe 31 is mounted on the lower surface of the wiring board 32 so that the tip 311 of the probe 31 faces the pad 102 of the DUT 101 . As the probe 31, a vertical type such as a pogo pin or a membrane type in which bumps are formed on an insulating film may be used.

The wiring board 32 includes a base material 33 made of a material having a relatively small coefficient of thermal expansion, such as ceramics. A wiring pattern 34 is formed on the lower surface of the base material 33 , and the probes 31 are mounted on the wiring board 32 by being connected to the wiring pattern 34 via solder connection portions 35 . The plurality of probes 31 are provided on the lower surface of the wiring board 32 in a portion facing the DUTs 101 of the plurality of DUTs 101 formed on the semiconductor wafer 100 so as to be able to simultaneously contact the DUTs 101 . Locally located. A conductive path 36 penetrating through the substrate 33 is connected to the end of the wiring pattern 34 . This conductive path 36 is connected to an upper pad 37 provided on the upper surface of the substrate 33 .

On the other hand, the wiring board 40 is a multilayer printed wiring board, and includes a base material 41 made of, for example, glass epoxy resin. One end of the conductive path 42 penetrating the base material 41 is connected to a lower pad 43 provided on the bottom surface of the base material 31 . This lower pad 43 is arranged at a position facing the upper pad 37 of the wiring board 32 .

A plurality of connectors 44 are mounted on the upper surface of the base material 41 . The connector 44 is connected to the other end of the conductive path 42 described above. As this connector 44, for example, a ZIF connector, a LIF connector, or the like can be used. The connector 12 of the motherboard 11 described above is fitted to this connector 44 . As shown in FIG. 3, a plurality of connectors 44 are circumferentially arranged on the upper surface of wiring board 40 . The stiffener 60 is provided on the upper surface of the wiring board 40 so as to surround the circularly arranged connectors 44 and reinforces the probe card 20 .

FIG. 5 is a perspective view showing the relay member in this embodiment, and FIG. 6 is an enlarged view showing the VI section of FIG.

The probe card 20 of this embodiment includes a relay member 50 interposed between the probe head 30 and the wiring board 40 . This relay member 50 includes a plurality of interposers 51 and a housing 52, as shown in FIGS. The interposer 51 electrically connects the probe head 30 and the wiring board 40 . The housing 52 holds the interposer 51 while facing the probe head 30 and the wiring board 40 . In this embodiment, all the interposers 51 included in the relay member 50 have the same shape.

FIG. 7 is a perspective view showing an interposer according to this embodiment, and FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG.

The interposer 51 is an anisotropically conductive film that electrically conducts in the vertical direction at the applied portion when pressure is applied in the thickness direction. This interposer 51 includes a frame 511 and a plurality of conductive portions 515, as shown in FIGS.

The frame 511 is made of an electrically insulating material such as a resin material, and has a substantially plate-like shape as a whole. A central portion 512 of the frame 511 holds a plurality of conductive portions 515 , while an outer peripheral portion 513 of the frame 511 is thinner than the central portion 512 . The interposer 51 is held by the housing 52 by placing the thin outer peripheral portion 513 on a projecting portion 522 (described later) of the housing 52 (see FIG. 4).

Notches 514 are formed at the four corners of the outer peripheral portion 513 of the frame 511 . Each notch 514 has a straight portion 514a extending inward from the outer edge of the frame 511 and a circular portion 514b located at the tip of the straight portion 514a. As will be described later, when the interposer 51 is inserted into the opening 521 of the housing 52 , the positioning pin 523 of the housing 52 fits into the notch 514 , thereby positioning the interposer 51 with respect to the opening 521 of the housing 52 . be done.

Each conductive portion 515 includes a cylindrical portion 516 made of an elastic resin material and conductive particles 517 dispersed in the cylindrical portion 516, as shown in FIG. Although not particularly limited, examples of the material forming the cylindrical portion 516 include silicone rubber. In the present embodiment, the columnar portion 516 is made of the same resin material as the resin material forming the frame 511, but it is not particularly limited to this. In this embodiment, as shown in FIG. 7, the plurality of conductive portions 515 are regularly arranged in a matrix in the central portion 512 of the frame 511 .

9 is a perspective view showing a housing in this embodiment, FIG. 10 is a perspective view showing an opening in this embodiment, and is an enlarged view showing a portion X in FIG. FIG. 11 is a perspective plan view showing the positional relationship between the housing opening, probe, and DUT in this embodiment, and FIG. 12 is a plan view showing the layout of the openings in the housing in this embodiment.

The housing 52 has a substantially circular shape with a plurality of openings 521 formed therein, as shown in FIG. 9, and has a shape corresponding to the semiconductor wafer 100 . Although not particularly limited, as the metal material forming the housing 52, a material having a low coefficient of thermal expansion can be used, for example, 42 alloy can be exemplified. In this embodiment, all the openings 521 formed in the housing 52 have the same shape.

9 and 10, each opening 521 has a rectangular planar shape corresponding to the outer shape of the interposer 51 and penetrates the housing 52 in the thickness direction thereof. . In this embodiment, one interposer 51 can be accommodated in one opening 521 . The plurality of openings 521 are arranged so as to individually correspond to some DUTs 101 among the plurality of DUTs 101 formed on the semiconductor wafer 100. Since one opening 521 corresponds to one DUT 101, One interposer 51 corresponds to one DUT 101 . More specifically, each opening 521 includes the tips 311 of all the probes 31 contacting all the pads 102 of the same DUT 101 in plan view shown in FIG.

In this embodiment, as shown in FIG. 12, the housing 52 has five aperture groups 520A-520E. Each aperture group 520A to 520E is composed of a plurality of apertures 521 arranged side by side. Each opening group 520A to 520E is arranged in a non-linear manner, and as a result, the plurality of openings 521 in the housing 52 are arranged non-uniformly.

In this embodiment, each of the aperture groups 520A to 520E is composed of a plurality of apertures 521 arranged in a substantially arc shape. The interval L ₁ between the mutually adjacent aperture groups 520A and 520B includes a portion larger than the length L ₀ (see FIG. 10) of the aperture 521 (L ₁ >L ₀ ).

Similarly, the interval L ₂ between the mutually adjacent opening groups 520B and 520C also includes a portion larger than the length L ₀ of the opening 521 (L ₂ >L ₀ ). The interval L ₃ between the mutually adjacent opening groups 520C and 520D also includes a portion larger than the length L ₀ of the opening 521 (L ₃ >L ₀ ). The interval L ₄ between the mutually adjacent aperture groups 520D and 520E also includes a portion larger than the length L ₀ of the aperture 521 (L ₄ >L ₀ ).

Also, the plurality of openings 521 includes an opening 521 a located on the centerline CL of the housing 52 . Similarly, the multiple openings 521 also include openings 521b positioned on an orthogonal line OL that is substantially orthogonal to the centerline CL.

The arrangement of the plurality of openings 521 formed in the housing 52 is not particularly limited to the above, and can be arbitrarily set according to the arrangement of DUTs to be tested simultaneously on the semiconductor wafer.

As shown in FIG. 10 , the housing 52 of this embodiment further includes protrusions 522 , positioning pins 523 , restraining pieces 524 and notches 525 in each opening 521 .

The projecting portion 522 in this embodiment corresponds to an example of the "holding portion" in the present invention, the positioning pin 523 in the present embodiment corresponds to an example of the "positioning portion" in the present invention, and the restraining piece 524 in the present embodiment It corresponds to an example of a "restraining portion" in the present invention, and the notch 525 in this embodiment corresponds to an example of a "notch" in the present invention.

The protruding portion 522 protrudes from the periphery of the opening 521 toward the inside of the opening 521 and is positioned on the lower surface 52b (see FIG. 4) of the housing 52 facing the probe head 30. As shown in FIG. Therefore, the lower portion of the opening 521 is narrowed by the projecting portion 522 . The interposer 51 is held by the housing 52 by placing the outer peripheral portion 513 of the frame 511 of the interposer 51 inserted into the opening 521 on the projecting portion 522 .

In this embodiment, the protruding portion 522 is provided along the entire circumference of the opening 521, but is not particularly limited to this as long as the interposer 51 can be stably held. It may partially protrude from the peripheral edge.

The positioning pin 523 protrudes from the periphery of the opening 521 toward the inside of the opening 521 and is exposed from the upper surface 52 a of the housing 52 facing the wiring board 40 . More specifically, the positioning pin 523 has a shape corresponding to the notch 514 of the interposer 51 described above, and has a linear portion 523a extending from the periphery of the opening 521 toward the inside of the opening 521. , and a circular portion 523b located at the tip of the straight portion 523a. In this embodiment, four positioning pins 523 are arranged near four corners of the opening 521 so as to correspond to the cutouts 511c of the interposer 51 . The interposer 51 is positioned with respect to the opening 521 of the housing 52 by fitting the positioning pin 523 into the notch 514 of the frame 511 of the interposer 51 inserted into the opening 521 .

The restraining piece 524 protrudes from the peripheral edge of the opening 521 toward the inside of the opening 521 and is positioned on the upper surface 52 a of the housing 52 facing the wiring board 40 . More specifically, the restraining piece 524 has a substantially triangular shape and spans between the peripheral edge of the opening 521 and the linear portion 523 a of the positioning pin 523 . Although not particularly limited, the housing 52 of this embodiment has two restraining pieces 524 arranged at a pair of corners facing each other on the diagonal line of the opening 521, and on the other diagonal line facing each other. No restraining piece is provided at the other pair of corners.

A part of the outer peripheral portion 513 of the interposer 51 inserted into the opening 521 and held by the projecting portion 522 is covered from above by the restraining piece 524 . As a result, the upward movement of the interposer 51 with respect to the housing 52 can be restrained, and the interposer 51 can be prevented from jumping out of the opening 521 of the housing 52 .

The notch 525 is arranged around the opening 521 and communicates with the opening 521 . This notch 525 is exposed from the upper surface 52 a of the housing 52 . The interposer 51 can be removed from the housing 52 by inserting a jig or the like between the interposer 51 and the housing 52 through the notch 525 .

The housing 52 of this embodiment can be manufactured as follows. That is, by preparing a plurality of metal plates and individually performing an etching process on the metal plates, the openings 521, the protrusions 522, the positioning pins 523, the restraining pieces 524, and the cutouts 525 are formed at the stacked positions. It is formed on a metal plate according to the requirements. Then, the housing 52 is formed by stacking these metal plates on each other and bonding the metal plates together by, for example, diffusion bonding. Therefore, in this embodiment, the protrusion 522 , the positioning pin 523 and the restraining piece 524 are formed integrally with the housing 52 .

Next, by inserting the interposers 51 into the openings 521 of the housing 52, the relay members 50 are formed. At this time, the interposer 51 is restrained by the restraining piece 524 by overcoming the restraining piece 524 while partially deforming the outer peripheral portion 513 of the frame 511 of the interposer 51 . In this state, the projecting portion 522 is located on the probe head 30 side with respect to the interposer 51 , while the restraining piece 524 is located on the wiring board 40 side with respect to the interposer 51 . Next, with the relay member 50 sandwiched between the probe head 30 and the wiring board 40, the probe card 20 is completed by fixing the probe head 30 to the stiffener 60 by bolting or the like (not shown).

Returning to FIG. 2, the probe card 20 is held by the annular holder 80 in such a posture that the probes 31 face downward through the openings 81 . The holder 80 holding the probe card 20 is held by an annular adapter 85 , and this adapter 85 is held in an opening 92 formed in a top plate 91 of the prober 90 . This adapter 85 is for fitting probe cards 20 of different sizes corresponding to the types of semiconductor wafers 100 and the shapes of the test heads 10 to the openings 92 of the prober 90 . As shown in FIG. 2, the probe card 20 and the motherboard 11 are mechanically connected by engaging the hooks 14 provided on the bottom of the motherboard 11 with the hooks 86 provided on the adapter 85. there is

The prober 90 has a transfer arm 94 capable of moving the semiconductor wafer 100 sucked and held by the suction stage 93 in the XYZ directions and rotating the semiconductor wafer 100 around the Z axis by θ. During testing, the transfer arm 94 causes the semiconductor wafer 100 to face the probe card 20 facing the inside of the prober 90 through the opening 92 , presses the wafer 100 against the probe card 20 , and brings the probes 31 into contact with the pads 102 of the DUT 101 . Let In this state, the tester 70 inputs a test signal to the DUT 101, receives a response signal from the DUT 101, and compares the response signal with a predetermined expected value to evaluate the electrical characteristics of the DUT 101. .

In this embodiment, as described above, the plurality of probes 31 are provided on the lower surface of the wiring board 32 so as to be able to simultaneously contact some of the plurality of DUTs 101 formed on the semiconductor wafer 100. Locally located. Therefore, by repeating the touchdown a plurality of times, testing of all the DUTs 101 formed on the semiconductor wafer 100 is completed.

As described above, in the present embodiment, the relay member 50 includes the multiple interposers 51 and the housing 52 that holds the multiple interposers 51 . Therefore, the interposer 51 can be arranged at any position, and the arrangement of signal wiring is not restricted at the boundary between interposers as in the conventional case. Therefore, since more accurate impedance matching is possible, it is possible to increase the speed of the test signal.

Further, in the present embodiment, the relay member 50 can be formed simply by inserting the interposer 51 into the opening 521 of the housing 52 and holding it in the housing 52 , so that the relay member 50 can be assembled easily.

In addition, in this embodiment, since the relay member 50 holding a plurality of interposers 51 with one housing 52 is interposed between the probe head 30 and the wiring board 40, the assembling of the probe card 20 is also excellent. .

In addition, in this embodiment, the interposer 51 is provided only at a location where the relay member 50 is required, and the total number of the conductive portions 515 interposed between the probe head 30 and the wiring board 40 is reduced compared to the conventional art. be able to. Therefore, the number of bolts for fixing the probe head 30 to the stiffener 60 can be reduced, and the flexibility of wiring layout in the probe card 20 is improved.

Furthermore, in the present embodiment, the plurality of openings 521 are arranged so as to individually correspond to the plurality of DUTs 101, and each opening 521 corresponds to the tips of the plurality of probes 31 contacting one DUT 101 in plan view. is included. All the openings 521 of the housing 52 have substantially the same shape, and all the interposers 51 of the relay member 50 have substantially the same shape. there is Therefore, when the arrangement of the DUTs 91 that are in contact with the probe card 20 is changed, only the housing 52 corresponding to the arrangement of the DUTs 101 after the change needs to be prepared, so that the cost of the probe card 20 can be reduced. .

It should be noted that the embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is meant to include all design changes and equivalents that fall within the technical scope of the present invention.

For example, in the above-described embodiment, a so-called anisotropic conductive film is used as the interposer 51, but the configuration of the interposer is not particularly limited to this as long as the interposer has a function of electrically relaying.

Further, in the above-described embodiment, the metal housing 52 is used as the holding member, but the holding member is not particularly limited to this as long as it can hold the interposer 51 .

DESCRIPTION OF SYMBOLS 1... Electronic component testing apparatus 10... Test head 11... Motherboard 20... Probe card 30... Probe head 31... Probe 32... Wiring board 40... Wiring board 44... Connector 50... Relay member 51... Interposer 511... Frame 515... Conductive part 52 Housing 520A to 520E Aperture group 521 Aperture 522 Projection 523 Positioning pin 524 Restraining piece 525 Notch 60 Stiffener 70 Tester 90 Prober 91 Top plate 100 Semiconductor wafer 101 DUT
102 Pad

Claims (15)

a probe head having probes that contact a plurality of DUTs formed on a wafer;
a wiring board;
a relay member interposed between the probe head and the wiring board,
The relay member is
a plurality of interposers electrically connecting the probe head and the wiring board;
a holding member that holds the plurality of interposers while facing the plurality of interposers to the probe head and the wiring board. The probe card according to claim 1,
The holding member is a plate-shaped housing having a plurality of openings each having a size capable of accommodating the interposer,
Each said opening extends through said housing. The probe card according to claim 2,
The plurality of openings are arranged to individually correspond to the plurality of DUTs,
A probe card in which each of the openings contains tips of a plurality of the probes contacting one of the DUTs in plan view. The probe card according to claim 2 or 3,
The probe card, wherein the plurality of openings are non-uniformly arranged. The probe card according to any one of claims 2 to 4,
The housing has a plurality of opening groups each composed of a plurality of the openings arranged side by side,
The probe card, wherein a space between the groups of openings adjacent to each other includes a portion wider than the openings. The probe card according to claim 5,
The probe card, wherein the plurality of openings forming the opening group are arranged in a non-linear manner. The probe card according to any one of claims 2 to 6,
The probe card, wherein the plurality of apertures includes an aperture located on a centerline of the housing. The probe card according to any one of claims 2 to 7,
the plurality of openings have substantially the same shape as each other;
The probe card, wherein the plurality of interposers also have substantially the same shape. The probe card according to any one of claims 2 to 8,
The housing includes a probe card having a holding portion that protrudes toward the inside of the opening and holds the interposer. The probe card according to any one of claims 2 to 9,
The probe card, wherein the housing has a positioning portion that protrudes toward the inside of the opening and positions the interposer relative to the opening. The probe card according to any one of claims 2 to 10,
The probe card, wherein the housing has a restraining portion that protrudes toward the inside of the opening and restrains the interposer in the opening. The probe card according to any one of claims 2 to 11,
The probe card, wherein the housing has a notch around the opening communicating with the opening. The probe card according to any one of claims 2 to 12,
The probe card, wherein the housing has a substantially circular shape. The probe card according to any one of claims 1 to 13,
The probe card further comprises a stiffener attached to the wiring board,
The probe card, wherein the wiring board has a connector mounted on the main surface opposite to the main surface facing the relay member. An electronic component testing apparatus for testing DUTs formed on wafers,
A test head to which the probe card according to any one of claims 1 to 14 is connected;
and a tester for testing the DUT via the test head.

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