JP2022110255A - power converter - Google Patents

Abstract

To provide a power converter that reduces both the number of components and the cost.SOLUTION: A motor integrated type inverter device comprises an inverter housing and a motor housing that accommodates part of a power converter by assembling the inverter housing. The power converter comprises a power semiconductor module, a control circuit board, and a metal base plate for holding the control circuit board. The control circuit board is arranged on the more motor housing side than the mounting face of the inverter housing to the motor housing. The metal base plate includes a protection wall that surrounds the outer periphery of the control circuit board and protrudes toward the motor housing side.SELECTED DRAWING: Figure 2

Description

The present invention relates to power converters.

Power converters in recent years tend to adopt a semi-integrated structure as a vehicle body mounting structure. The semi-integrated structure is a structure in which the internal parts of the power converter are sandwiched between the motor housing and the inverter case. Therefore, the internal parts of the power converter are exposed. There are known techniques for structures that protect the exposed internal parts.

As a background art of the present invention, Patent Literature 1 below discloses a technique of protecting a substrate during line handling by providing a holding portion in a resin case of an inverter module.

JP 2009-235965 A

In the configuration of Patent Document 1, the purpose is to protect the substrate during line handling, but it is also necessary to employ a structure for the purpose of protecting the substrate when assembling the inverter of the integrated structure. For example, if the board is mounted on the board base and the structure is such that the board always hits the contact surface first, the defective rate will increase due to board breakage during transportation or assembly to the motor. There is a problem that the production and shipment of the cover or the like is costly.

In view of the above, it is an object of the present invention to provide a power converter that achieves both a reduction in the number of parts and a reduction in cost.

The present invention is a motor-integrated inverter device that accommodates a motor and a power conversion device in a housing, wherein the housing includes an inverter housing that accommodates the power conversion device, and an inverter housing that is assembled with the inverter housing to generate the power. The motor housing that houses a part of the converter and houses the motor, and the power converter includes a power semiconductor module, a control circuit board that controls driving of the power semiconductor module, and the control circuit. a metal base plate for holding a board, wherein the power semiconductor module, the control circuit board, and the metal base plate are respectively accommodated and fixed in the inverter housing, and the control circuit board is fixed to the motor housing. The metal base plate has a protective wall that surrounds the outer periphery of the control circuit board and protrudes toward the motor housing.

Advantageous Effects of Invention According to the present invention, it is possible to provide a power conversion device that achieves both a reduction in the number of parts and a reduction in cost.

1 is an exploded perspective view of a power converter according to an embodiment of the present invention; FIG. 1 is an external perspective view of a power converter according to an embodiment of the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing of the power converter device which concerns on one Embodiment of this invention. FIG. 3 is an external view of a base plate according to one embodiment of the present invention; FIG. 4 is an installation process diagram of the inverter housing according to one embodiment of the present invention. A first modification of the present invention. A second modification of the present invention. A third modification of the present invention. A fourth modification of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are examples for explaining the present invention, and are appropriately omitted and simplified for clarity of explanation. The present invention can also be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

The position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc., in order to facilitate understanding of the invention. As such, the present invention is not necessarily limited to the locations, sizes, shapes, extents, etc., disclosed in the drawings.

(Configuration of one embodiment and power converter)
FIG. 1 is an exploded perspective view of a power converter according to one embodiment of the present invention.

The power conversion device 1 has a case 2 which is a box-shaped inverter housing. A water channel is provided at the bottom of the case 2, and cooling water flowing in from a pipe 3 press-fitted into the case 2 circulates in the water channel. The water channel is formed by sealing with the bottom cover 4 .

The smoothing capacitor 5 is housed in the case 2 and fixed with potting resin. The EMC filter 9 is housed in the case 2 and fixed to the case 2 with both potting resin and screws.

The power semiconductor module 8 is arranged on the water channel of the case 2 and fixed by screwing the PM plate 14 thereon. The DC molded bus bar 7 is arranged above the power semiconductor module 8 and the smoothing capacitor 5, fixed to the fixed boss portion of the case 2, and electrically connected to the smoothing capacitor 5, the EMC filter 9, and the power semiconductor module 8. .

The PMAC bus bar 10 is arranged above the power semiconductor module 8 and is electrically connected to the power semiconductor module 8 by being fixed to the fixed boss portion of the case 2 . The PM cap 11 intended to insulate the terminals of the power semiconductor module 8 has conventionally been structured to be fixed by being pressed from above by the lower surface of the PCB base 15 . However, due to layout reasons, the control circuit board is fixed above and below the PCB base 15, so the PM cap 11 is fixed above the PMAC bus bar 10 with a snap-fit structure.

The HVAC busbar 13 holds the AC sensor 12 in a snap-fit structure and is electrically connected to the PMAC busbar 10 and the motor. The AC sensor 12 is arranged so that the PMAC busbar 10 penetrates it, and is fixed to the fixed boss portion of the case 2 .

The PCB base 15 is a metal base plate that is arranged above the DC mold bus bar 7 and the PMAC bus bar 10 and fixed by the fixing bosses of the case 2. Connectors of the GD board, which are components of the PCB base 15, It is electrically connected with the AC sensor 12 and the power semiconductor module 8 .

FIG. 2 is an external perspective view of a power converter according to one embodiment of the present invention.

The power conversion device 1 shown in FIG. 2 is the device 1 after the mounted components that are deployed in FIG. 1 are accommodated. The case flange portion 16 serves as an attachment surface when the case 2 and the motor housing that accommodates the motor are assembled.

The PCB base 15 has a vertical wall portion 18, which is a protective wall that surrounds the outer circumference of the MC board 17, which is a control circuit board, and protrudes toward a motor housing (described later). Further, the vertical wall portion 18 has a cutout portion 25 partially cutout-shaped, thereby electrically connecting the components inside the case 2 to the control circuit board 17. A signal wiring (not shown) is inserted. The cutout portion 25 only needs to be cut in a minimum range through which the signal wiring can be inserted, thereby allowing the signal wiring to be inserted in the shortest distance while maintaining the performance of protecting the substrate 17 .

FIG. 3 is a cross-sectional view of a power converter according to one embodiment of the present invention. FIG. 3(a) is a top view of the power converter (view from above in FIGS. 1 and 2), and FIG. 3(b) is a cross-sectional view taken along line AA of FIG. 3(a).

As shown in FIG. 3B, the case flange portion 16 is formed below the PCB base 15 in the height direction. As a result, when the inverter housing (case 2) and the motor housing are assembled, the PCB base 15 assembled to the inverter housing is accommodated within the motor housing. The structure when the inverter housing and the motor housing are assembled will be described later in detail with reference to FIG.

The PCB base vertical wall portion 18 is formed, for example, to prevent the board 17 protruding from the case flange portion 16 from coming into face contact with the substrate 17 during assembly when the power conversion device 1 is transported. This has the effect of improving the EMC performance and reducing the heat effect from the HVAC bus bar. If the vertical wall portion 18 is not provided, a cover for protecting the substrate 17 is required.

With such a configuration, it is possible to prevent interference and breakage of the MC board 17 when the power conversion device 1 is assembled or transported, so that the quality of the device 1 can be improved. The height of the fixed position of the PCB base 15 is determined from the viewpoint of the positional relationship between the AC sensor 12 and the GD board and the formability of the boss on the case 2 side.

FIG. 4 is an external view of a base plate according to one embodiment of the present invention.

The GD board 20 is fixed to the PCB base 15 with screws, and a plurality of connectors 21 are soldered to the GD board 20, so that the terminals of the power semiconductor module 8 and the connectors 21 are electrically connected.

Since the power converter described in the present invention is a dual inverter, the layout is such that the GD board 20 is arranged on the lower surface of the PCB base 15 (on the case 2 side) in order to secure the required board area. The height position of the GD substrate 20 is determined by the height of the terminals of the AC sensor 12 .

The MC board 17 is fixed to the PCB base 15 and the transformer 19 is soldered to the MC board 17 . Although not shown, the GD substrate 20 and the MC substrate 17 are electrically connected by FPC (Flexible Printed Circuits) or the like. The PCB base 15 and assembly parts are fixed to the fixed portion of the case 2 by screwing.

For the purpose of protecting the MC board 17 during assembly, a vertical wall portion 18 is provided higher than the transformer 19 so as to protrude toward the motor housing. The vertical wall portion 18 and the PCB base 15 are integrally formed by die casting. Further, shielding the MC substrate 17 with the vertical wall portion 18, which is a metal plate, has the effect of improving the performance of the EMC filter 9 and reducing the heat effect from other mounted busbar components.

It is recommended that the vertical wall portion 18 be installed on the entire circumference of the MC board 17. However, depending on the layout restrictions, the FPC line may be cut off or the tall parts (transformer 19) of the MC board 17 may be cut. It is preferable to install a vertical wall 18 having a minimum height in the vicinity. Further, the vertical wall portion 18 may not only be formed only on the outer peripheral side of the MC board 17, but may also be laid out inside by cutting out the MC board 17. FIG.

FIG. 5 is an installation process diagram of the inverter housing according to one embodiment of the present invention. FIG. 5(a) is a diagram showing a state at the time of installation, and FIG. 5(b) is a diagram showing a state before installation. 5, the orientation of the power converter 1 is upside down as compared to FIGS. 1 to 3. FIG.

The power conversion device 1 is a device configured as a part of a motor-integrated inverter device that accommodates the motor 22 and the power conversion device 1 . When the power conversion device 1 (inverter housing 2) is attached to the motor housing 23, the case flange portion 16 of the power conversion device 1 functions as the mounting surface, and is attached by screwing with the motor housing flange surface 24. Fixed. As a result, a portion of the power conversion device 1 including the PCB base 15 positioned below the case flange portion 16 is accommodated in the motor housing 23 .

In the power converter 1, the vertical wall portion 18 of the PCB base 15 protrudes from the case flange portion 16 toward the motor housing 23 side. This prevents the motor housing flange surface 24 from coming into contact with the MC board 17 due to misalignment or the like when the power converter 1 is assembled to the motor housing 23 .

FIG. 6 shows a first modification of the invention.

In a first variant shown in FIG. 6 , the power conversion device 1 further has a PCB base cover 26 . The PCB base cover 26 is a cover that protects the board surrounded by the vertical wall portion of the PCB base 15 . The PCB base cover 26 is molded from a metal material and fixed to a flange portion formed for fixing the PCB base cover 26 to the vertical wall portion of the PCB base 15 by screws. In this case, the substrate surrounded by the PCB base 15 can be protected by the vertical wall portion, and the quality can be stabilized, and the effect of improving the EMC performance and the cooling property can be expected.

FIG. 7 shows a second modification of the invention.

In a second modification shown in FIG. 7, the power converter 1 has a PCB base cover 27 instead of the PCB base cover 26 of FIG. 6 described in the first modification. The PCB base cover 27 is molded from resin and fixed by a structure in which a snap fit portion 28 is combined with the vertical wall flange portion of the PCB base. The second modified example is a model aiming at cost reduction more than the first modified example. As a result, the substrate in the PCB base 15 can be protected at low cost.

FIG. 8 shows a third modification of the invention.

In a third modification shown in FIG. 8, the power conversion device 1 has a PCB base cover 26 as in the first modification. The PCB base cover 26 is made of metal and is fixed to the vertical wall flange portion of the PCB base 15 with a hinge structure portion 29 and screws. The third modification is a model aimed at reducing the cost of the first modification. Thereby, EMC performance and cooling performance can be maintained at low cost.

FIG. 9 shows a fourth modification of the invention.

In a fourth modification shown in FIG. 9, the power converter 1 has a PCB base cover 27 like the second modification. The PCB base cover 27 is molded from resin and fixed to the vertical wall portion of the PCB base 15 with snap fit portions 28 . Here, the PCB base cover 27 is not of a size that covers the entire surface, but is of a fixed size that covers a part of it, and is structured to have versatility with other models.

A fourth modification is a model aimed at reducing the cost of the first and second modifications. As a result, the size of the cover can be fixed at a low cost, and a general-purpose effect can be imparted. In addition, by giving the cover an expansion mechanism, it is possible to aim for further versatility.

In the first to fourth modifications described above, PCB base covers 26 and 27 are attached to the leading edge of the vertical wall of the PCB base 15, respectively. Therefore, the substrate in the PCB base 15 can be protected more reliably.

According to one embodiment of the present invention described above, the following effects are obtained.

(1) A motor-integrated inverter device that accommodates a motor 22 and a power conversion device 1 in a housing is an inverter housing 2 that accommodates the power conversion device 1 and an inverter housing 2 that are assembled to form a part of the power conversion device 1. and a motor housing 23 that houses a motor 22 and a motor housing 23 that houses a motor 22 . The power conversion device 1 has a power semiconductor module 8, a control circuit board 17 for controlling driving of the power semiconductor module 8, and a metal base plate 15 for holding the control circuit board 17. Circuit board 17 and metal base plate 15 are fixed to inverter housing 2 . The control circuit board 17 is arranged closer to the motor housing 23 than the mounting surface of the inverter housing 2 to the motor housing 23. The metal base plate 15 surrounds the outer periphery of the control circuit board 17 and protrudes toward the motor housing 23 side. has a protective wall 18 for By doing so, it is possible to provide the power conversion device 1 that achieves both a reduction in the number of parts and a reduction in cost.

(2) The protective wall 18 of the metal base plate 15 protrudes toward the motor housing 23 beyond the circuit components 19 mounted on the control circuit board 17 . By doing so, the control circuit board 17 is prevented from being damaged when the power conversion device 1 is assembled to the motor housing 23 .

(3) The protective wall 18 of the metal base plate 15 has a notch 25 for inserting the signal wiring connected to the control circuit board 17 . By doing so, the wiring of the shortest path can be inserted while ensuring the protection performance of the control circuit board 17 .

(4) The motor-integrated inverter device is provided with a cover member 26 (27) attached to the edge of the protective wall 18 of the metal base plate 15 and covering the control circuit board 17. As shown in FIG. By doing so, the effect of protecting the control circuit board 17 can be enhanced.

The present invention is not limited to the above-described embodiments, and various modifications and other configurations can be combined without departing from the scope of the invention. Moreover, the present invention is not limited to those having all the configurations described in the above embodiments, and includes those having some of the configurations omitted.

DESCRIPTION OF SYMBOLS 1... Power converter 2... Case 3... Pipe 4... Bottom cover 5... Smoothing capacitor 7... DC mold bus bar 8... Power semiconductor module 9... EMC filter 10... PMAC bus bar 11... PM cap 12... AC sensor 13... HVAC bus bar 14 PM plate 15 PCB base 16 Case flange 17 MC board 18 Vertical wall 19 Transformer 20 GD board 21 Connector 22 Motor 23 Motor housing 24 Motor housing flange surface 25 Notch 26 … PCB base cover (metal)
27... PCB base cover (resin)
28... Snap fit part 29... Hinge structure part

Claims (4)

A motor-integrated inverter device containing a motor and a power conversion device in a housing,
The housing includes an inverter housing that houses the power conversion device, and a motor housing that houses a part of the power conversion device and the motor by assembling the inverter housing,
The power converter includes a power semiconductor module, a control circuit board that controls driving of the power semiconductor module, and a metal base plate that holds the control circuit board,
the power semiconductor module, the control circuit board, and the metal base plate are each accommodated and fixed in the inverter housing;
The control circuit board is arranged closer to the motor housing than the mounting surface of the inverter housing with respect to the motor housing,
The motor-integrated inverter device, wherein the metal base plate has a protective wall that surrounds the outer periphery of the control circuit board and protrudes toward the motor housing. The motor-integrated inverter device according to claim 1,
The motor-integrated inverter device, wherein the protection wall protrudes toward the motor housing from the circuit components mounted on the control circuit board. The motor-integrated inverter device according to claim 1,
The motor-integrated inverter device, wherein the protective wall has a notch portion for inserting a signal wiring connected to the control circuit board. The motor-integrated inverter device according to any one of claims 1 to 3,
A motor-integrated inverter device including a cover member attached to a tip end edge of the protection wall and covering the control circuit board.

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