JP2022107951A - 補助装置 - Google Patents
補助装置 Download PDFInfo
- Publication number
- JP2022107951A JP2022107951A JP2021002677A JP2021002677A JP2022107951A JP 2022107951 A JP2022107951 A JP 2022107951A JP 2021002677 A JP2021002677 A JP 2021002677A JP 2021002677 A JP2021002677 A JP 2021002677A JP 2022107951 A JP2022107951 A JP 2022107951A
- Authority
- JP
- Japan
- Prior art keywords
- axis direction
- cutting
- axis
- holding
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 258
- 230000003028 elevating effect Effects 0.000 description 14
- 238000003384 imaging method Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T483/00—Tool changing
- Y10T483/17—Tool changing including machine tool or component
- Y10T483/1733—Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
- Y10T483/1736—Tool having specific mounting or work treating feature
- Y10T483/174—Abrading wheel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Automatic Tool Replacement In Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Details Of Cutting Devices (AREA)
Abstract
Description
4:切削ブレード保管手段
6:搬出入手段
8:Y軸方向位置付け手段
10:Z軸移動手段
12:X軸移動手段
14:回転軸
16:駆動歯車
18:回転軸
20:従動歯車
22:無限軌道
24:支持軸
36:切削ブレード
38a:中央開口部
46:Z回転軸
48:ブレード保持部
50:固定ナット保持部
74:枠体
76:昇降テーブル
80:底部(枠体)
84:天井部(枠体)
92:ガイドレール(昇降テーブル)
112:第一の移動体
114:第二の移動体
116:第一のガイドレール
118:第二のガイドレール
142:ドレッシングボード
144:ドレッシングボード収容部
146:保持手段
156:端面修正治具
158:端面修正治具収容部
Claims (3)
- 被加工物を保持する保持面を備えたチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードを装着した切削手段と、該チャックテーブルをX軸方向に加工送りするX軸送り手段と、該切削手段を該X軸方向と直交するY軸方向に割り出し送りするY軸送り手段と、該X軸方向および該Y軸方向と直交するZ軸方向に該切削手段を切り込み送りするZ軸送り手段とを備え、該保持面は該X軸方向および該Y軸方向で規定された切削装置に連結される補助装置であって、
切削ブレードをドレッシングするためのドレッシングボードを収容するドレッシングボード収容部と、該ドレッシングボード収容部に収容されたドレッシングボードを保持する保持手段とを備え、該チャックテーブルに隣接して配設されたサブテーブルに該保持手段が保持したドレッシングボードを搬入する補助装置。 - 該保持手段は、枠体の内部に配設された第一の移動体に配設され、該第一の移動体は第二の移動体の下部に配設されたX軸方向に延びる第一のガイドレールに吊り下げられた状態で摺動可能に支持され、該第二の移動体は該枠体の天井部に配設されたX軸方向に延びる第二のガイドレールに吊り下げられた状態で摺動可能に支持され、該保持手段は該第一の移動体および該第二の移動体によってX軸方向に進出自在に構成される請求項1記載の補助装置。
- 該枠体は昇降テーブルに配設される請求項2記載の補助装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021002677A JP2022107951A (ja) | 2021-01-12 | 2021-01-12 | 補助装置 |
KR1020210179812A KR20220102101A (ko) | 2021-01-12 | 2021-12-15 | 보조 장치 |
CN202210004085.5A CN114762993A (zh) | 2021-01-12 | 2022-01-04 | 辅助装置 |
TW111100667A TW202227226A (zh) | 2021-01-12 | 2022-01-07 | 輔助裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021002677A JP2022107951A (ja) | 2021-01-12 | 2021-01-12 | 補助装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2022107951A true JP2022107951A (ja) | 2022-07-25 |
Family
ID=82365131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021002677A Pending JP2022107951A (ja) | 2021-01-12 | 2021-01-12 | 補助装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2022107951A (ja) |
KR (1) | KR20220102101A (ja) |
CN (1) | CN114762993A (ja) |
TW (1) | TW202227226A (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007203429A (ja) | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | ドレッシング・ツルーイングボード,及びドレッシング・ツルーイング方法 |
-
2021
- 2021-01-12 JP JP2021002677A patent/JP2022107951A/ja active Pending
- 2021-12-15 KR KR1020210179812A patent/KR20220102101A/ko unknown
-
2022
- 2022-01-04 CN CN202210004085.5A patent/CN114762993A/zh active Pending
- 2022-01-07 TW TW111100667A patent/TW202227226A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202227226A (zh) | 2022-07-16 |
CN114762993A (zh) | 2022-07-19 |
KR20220102101A (ko) | 2022-07-19 |
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