JP2022074783A - 発光装置及び発光装置の製造方法 - Google Patents
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 2
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- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
11 基板
13 素子載置部
15 ボンディング部
20 発光素子
21 支持基板
22 発光部
23 電極パッド
24 素子接合層
30 波長変換体
40 被覆部材
60 素子載置部
61 本体部
62 錐台部
Claims (8)
- 搭載基板と、
前記搭載基板上に配された金属からなる素子載置部と、
金属からなる素子接合層を有し、前記素子載置部の上面上に前記素子接合層を介して接合された支持基板並びに前記支持基板上に形成された半導体発光層を含む半導体層を有する発光素子と、を含み、
前記発光素子は、上面視において、前記支持基板の下面が前記素子載置部の上面に対して1の向きに偏倚しており、前記支持基板の下面が前記素子載置部の上面の外縁よりも前記1の向きに突出するように接合されていることを特徴とする発光装置。 - 前記素子載置部は、柱状の本体部と、前記本体部の上面上に形成された底面が前記本体部の上面端から側方に突出している錐台部と、を有し、
前記素子接合層が溶出してなる金属層が、前記錐台部の上面及び側面に亘って延在していることを特徴とする請求項1に記載の発光装置。 - 前記支持基板の前記素子載置部の上面の外縁よりも前記1の向きに突出している下面には、前記素子接合層が溶出してなる金属溜まりが形成されていることを特徴とする請求項1又は2に記載の発光装置。
- 前記支持基板の前記素子載置部の上面の前記1の向きと反対の向きを向いた側面には、前記素子接合層が溶出してなるフィレット部が形成されていることを特徴とする請求項1又は2に記載の発光装置。
- 前記素子載置部は前記搭載基板上に1の方向に複数配列されており、前記発光素子は当該複数配列された前記素子載置部の各々の上面上に配され、前記発光素子の各々は、上面視において、前記支持基板の各々の下面が前記素子載置部の各々の上面に対して1の向きに偏倚しており、前記支持基板の各々の下面が前記素子載置部の各々の上面の外縁よりも前記1の向きに突出するように接合されていることを特徴とする請求項1乃至4のいずれか1項に記載の発光装置。
- 前記発光素子は、上面視において、前記支持基板の下面が前記素子載置部の上面に対して前記1の向き及び前記1の向きと異なる向きの他の向きに偏倚しており、前記支持基板の下面が前記素子載置部の上面の外縁よりも前記1の向き及び前記他の向きに突出するように接合されていることを特徴とする請求項1乃至5のいずれか1項に記載の発光装置。
- 前記素子載置部は、Cu、Ni、Au又はCu、Ni、Pd、Auの金属層がこの順で前記搭載基板上に積層されて形成されており、前記素子接合層は金錫合金からなることを特徴とする請求項1乃至6のいずれか1項に記載の発光装置。
- 発光装置の製造方法であって、
金属からなる素子載置部を上面に有する搭載基板を用意する基板準備工程と、
金属からなる素子接合層を有する発光素子を、前記素子載置部上に、前記素子載置部の上面と前記素子接合層とが接するように載置する素子載置工程と、
前記発光素子を保持しつつ上方から押圧しつつ加熱及び冷却を行い前記素子接合層が前記素子載置部と前記発光素子とを接合する素子接合工程と、を含み、
前記素子接合工程において、前記発光素子は、上面視において、前記発光素子の下面が前記素子載置部の上面に対して1の向きに偏倚され、前記発光素子の下面が前記素子載置部の上面の外縁よりも前記1の向きに突出するように保持されることを特徴とする発光装置の製造方法。
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JP2020185121A JP2022074783A (ja) | 2020-11-05 | 2020-11-05 | 発光装置及び発光装置の製造方法 |
CN202111220576.5A CN114446938A (zh) | 2020-11-05 | 2021-10-20 | 发光装置和发光装置的制造方法 |
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