JP2021110034A5 - - Google Patents

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Publication number
JP2021110034A5
JP2021110034A5 JP2020176293A JP2020176293A JP2021110034A5 JP 2021110034 A5 JP2021110034 A5 JP 2021110034A5 JP 2020176293 A JP2020176293 A JP 2020176293A JP 2020176293 A JP2020176293 A JP 2020176293A JP 2021110034 A5 JP2021110034 A5 JP 2021110034A5
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Japan
Prior art keywords
copper powder
less
particle diameter
powder according
bet
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JP2020176293A
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Japanese (ja)
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JP2021110034A (ja
JP7490528B2 (ja
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JP2020176293A 2020-01-10 2020-10-20 銅粉体 Active JP7490528B2 (ja)

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Application Number Priority Date Filing Date Title
JP2020176293A JP7490528B2 (ja) 2020-01-10 2020-10-20 銅粉体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020002803 2020-01-10
JP2020176293A JP7490528B2 (ja) 2020-01-10 2020-10-20 銅粉体

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JP2020002803 Division 2020-01-10 2020-01-10

Publications (3)

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JP2021110034A JP2021110034A (ja) 2021-08-02
JP2021110034A5 true JP2021110034A5 (https=) 2023-01-19
JP7490528B2 JP7490528B2 (ja) 2024-05-27

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JP (1) JP7490528B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026056381A (ja) * 2024-09-19 2026-04-01 東邦チタニウム株式会社 銅粉

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4204849B2 (ja) * 2002-11-12 2009-01-07 Dowaエレクトロニクス株式会社 微粒子銅粉の製法
JP4085049B2 (ja) * 2003-08-21 2008-04-30 Jfeミネラル株式会社 導電性ペースト用銅合金粉末及び耐酸化性に優れた導電性ペースト用銅合金粉末の製造方法、並びにインクジェット用銅合金粉末及びその製造方法
JP2012067327A (ja) * 2010-09-21 2012-04-05 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP5826435B1 (ja) * 2014-02-14 2015-12-02 三井金属鉱業株式会社 銅粉
US10307825B2 (en) * 2015-01-30 2019-06-04 Sumitomo Electric Industries, Ltd. Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
US20180315519A1 (en) * 2015-09-30 2018-11-01 Sumitomo Electric Industries, Ltd. Coating liquid for forming conductive layer and method for manufacturing conductive layer
JP6213584B2 (ja) * 2016-01-29 2017-10-18 住友金属鉱山株式会社 銅粉末の製造方法及び導電ペーストの製造方法
CN110325303B (zh) * 2017-03-31 2022-01-11 三井金属矿业株式会社 铜颗粒以及其制造方法
CN110799285B (zh) * 2017-07-05 2022-04-29 东邦钛株式会社 金属粉末及其制造方法

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