JP2021110034A5 - - Google Patents
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- JP2021110034A5 JP2021110034A5 JP2020176293A JP2020176293A JP2021110034A5 JP 2021110034 A5 JP2021110034 A5 JP 2021110034A5 JP 2020176293 A JP2020176293 A JP 2020176293A JP 2020176293 A JP2020176293 A JP 2020176293A JP 2021110034 A5 JP2021110034 A5 JP 2021110034A5
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- Prior art keywords
- copper powder
- less
- particle diameter
- powder according
- bet
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020176293A JP7490528B2 (ja) | 2020-01-10 | 2020-10-20 | 銅粉体 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020002803 | 2020-01-10 | ||
| JP2020176293A JP7490528B2 (ja) | 2020-01-10 | 2020-10-20 | 銅粉体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020002803 Division | 2020-01-10 | 2020-01-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021110034A JP2021110034A (ja) | 2021-08-02 |
| JP2021110034A5 true JP2021110034A5 (https=) | 2023-01-19 |
| JP7490528B2 JP7490528B2 (ja) | 2024-05-27 |
Family
ID=77061295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020176293A Active JP7490528B2 (ja) | 2020-01-10 | 2020-10-20 | 銅粉体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7490528B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026056381A (ja) * | 2024-09-19 | 2026-04-01 | 東邦チタニウム株式会社 | 銅粉 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4204849B2 (ja) * | 2002-11-12 | 2009-01-07 | Dowaエレクトロニクス株式会社 | 微粒子銅粉の製法 |
| JP4085049B2 (ja) * | 2003-08-21 | 2008-04-30 | Jfeミネラル株式会社 | 導電性ペースト用銅合金粉末及び耐酸化性に優れた導電性ペースト用銅合金粉末の製造方法、並びにインクジェット用銅合金粉末及びその製造方法 |
| JP2012067327A (ja) * | 2010-09-21 | 2012-04-05 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
| JP5826435B1 (ja) * | 2014-02-14 | 2015-12-02 | 三井金属鉱業株式会社 | 銅粉 |
| US10307825B2 (en) * | 2015-01-30 | 2019-06-04 | Sumitomo Electric Industries, Ltd. | Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder |
| US20180315519A1 (en) * | 2015-09-30 | 2018-11-01 | Sumitomo Electric Industries, Ltd. | Coating liquid for forming conductive layer and method for manufacturing conductive layer |
| JP6213584B2 (ja) * | 2016-01-29 | 2017-10-18 | 住友金属鉱山株式会社 | 銅粉末の製造方法及び導電ペーストの製造方法 |
| CN110325303B (zh) * | 2017-03-31 | 2022-01-11 | 三井金属矿业株式会社 | 铜颗粒以及其制造方法 |
| CN110799285B (zh) * | 2017-07-05 | 2022-04-29 | 东邦钛株式会社 | 金属粉末及其制造方法 |
-
2020
- 2020-10-20 JP JP2020176293A patent/JP7490528B2/ja active Active
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