JP2020151880A - Head module, head unit, head for discharging liquid and device for discharging liquid - Google Patents

Abstract

To make a thickness of an adhesive agent for joining a cover member to a flow channel substrate thin.SOLUTION: A head module includes: multiple heads 1; and a cover member 111 for covering a peripheral edge part of all the sides of a discharge surface 12a of a nozzle plate 12 of each head 1. The cover member 111 is joined to an outer side region of the nozzle plate 12 by an adhesive agent 20 at a surface on a side of the nozzle plate 12 of a flow channel substrate 13. A joint surface 111a between the cover member 111 and the flow channel substrate 13 is positioned closer to a side of the flow channel substrate 13 than the discharge surface 12a of the nozzle plate 12.SELECTED DRAWING: Figure 5

Description

The present invention relates to a head module, a head unit, a head for discharging a liquid, and a device for discharging a liquid.

As a head for discharging a liquid (liquid discharge head), there is a head provided with a cover member covering the peripheral edge of the nozzle surface on which the nozzle is formed.

Conventionally, a nozzle plate, a flow path member in which the nozzle plate is joined to form an individual flow path through which the nozzles communicate, and a head protection member that covers at least the surface peripheral edge of the nozzle plate are provided, and the flow path member and the head protection are provided. It is known that the member is joined by an adhesive provided in the groove of the flow path member (Patent Document 1).

Japanese Unexamined Patent Publication No. 2011-056922

However, as disclosed in Patent Document 1, in the configuration in which the flow path member and the head protection member are adhesively bonded in the outer region of the nozzle plate, the adhesive thickness is at least equal to the thickness of the nozzle plate. When it becomes necessary, the thickness of the adhesive becomes thick, and there is a possibility that the position shift may occur due to a temperature change.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce the thickness of the adhesive that joins the cover member and the flow path substrate.

In order to solve the above problems, the head module according to the present invention
A nozzle plate on which a nozzle for discharging liquid is formed and
A head including a flow path substrate forming an individual flow path leading to the nozzle, and
A cover member that covers at least the peripheral edges of a pair of opposite sides of the discharge surface of the nozzle plate of the head is provided.
The outer shape of the nozzle plate is smaller than the outer shape of the flow path substrate.
The cover member is bonded to the outer region of the nozzle plate with an adhesive on the surface of the flow path substrate on the nozzle plate side.
The joint surface of the cover member with the flow path substrate is located closer to the flow path substrate than the discharge surface of the nozzle plate.

According to the present invention, the thickness of the adhesive that joins the cover member and the flow path substrate can be reduced.

It is an external perspective explanatory view of the head module which concerns on 1st Embodiment of this invention. Similarly, it is a perspective cross-sectional explanatory view in the head arrangement direction. Similarly, it is an external perspective explanatory view seen from the cover member side. It is the same perspective explanatory view as FIG. 3 with the cover member removed. It is sectional drawing which shows the attachment part of the head and a cover member in the same embodiment. Similarly, it is an enlarged cross-sectional perspective explanatory view of the main part of FIG. Similarly, it is an enlarged cross-sectional explanatory view of a main part. It is an external perspective explanatory view of the head module which concerns on 2nd Embodiment of this invention. Similarly, it is an external perspective explanatory view seen from the side opposite to FIG. It is also an exploded perspective explanatory view. It is also a schematic cross-sectional explanatory view. It is an external perspective explanatory view of the head module which concerns on 3rd Embodiment of this invention. It is also a cross-sectional perspective explanatory view. Similarly, it is an enlarged perspective explanatory view of a main part. It is a side explanatory view of the liquid discharge head which concerns on 4th Embodiment of this invention. It is a plane explanatory view of the nozzle surface part of one head which concerns on 5th Embodiment of this invention. It is sectional drawing of the joint part of the head and the cover member which are used for the description of the 6th Embodiment of this invention. It is sectional drawing of the joint part of the head and the cover member which are used for the description of 7th Embodiment of this invention. FIG. 5 is a cross-sectional explanatory view of a joint portion between a head and a cover member, which is used for explaining the eighth embodiment of the present invention. FIG. 5 is a cross-sectional explanatory view of a joint portion between a head and a cover member, which is used for explaining the ninth embodiment of the present invention. It is the schematic explanatory drawing of an example of the apparatus which discharges a liquid which concerns on this invention. It is a plane explanatory view of an example of the head unit of this apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The first embodiment of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 is an explanatory view of an external perspective of the head module according to the same embodiment, FIG. 2 is an explanatory view of a cross-sectional view of the head module in the same head arrangement direction, FIG. 3 is an explanatory view of the external perspective seen from the cover member side, and FIG. It is a perspective explanatory view similar to FIG. 3 in the state where is removed.

The head module 100 includes a head 1 which is a liquid discharge head that discharges a plurality of (here, four) liquids. A wiring member 2 such as an FPC is pulled out from the head 1.

The head 1 includes a nozzle plate 12 on which a nozzle 11 for discharging a liquid is formed, a flow path substrate 13 for forming an individual flow path through which the nozzle 11 passes, a holding substrate 14, and a frame member 15. In the head 1, the outer shape of the nozzle plate 12 is smaller than the outer shape of the flow path substrate 13.

The plurality of heads 1 are held by the base member 102. A cover member 111 that covers the peripheral edge of the discharge surface (nozzle surface) 12a of the nozzle plate 12 of each head 1 is attached to the base member 102. In the present embodiment, the cover member 111 is configured to cover the peripheral edges of all sides of the discharge surface 12a of each head 1, and has an opening 112 corresponding to each head 1.

Further, in the head module 100, a flow path component 103 including a flow path for supplying a liquid to each head 1 and a printed circuit board 108 to which the wiring member 2 is connected are arranged above the plurality of heads 1. The flow path component 103 and the printed circuit board 108 are housed in the case member 105. The liquid port 103a is connected to the flow path component 103.

The printed circuit board 108 is provided with a connector 181. The case member 105 is provided with an opening 153 that allows the connector 181 and the like to be accessed from the outside.

Next, the details of the cover member in this embodiment will be described with reference to FIGS. 5 to 7. 5 is a cross-sectional perspective explanatory view showing a mounting portion of the head and the cover member, FIG. 6 is an enlarged cross-sectional perspective explanatory view of a main part of FIG. 5, and FIG. 7 is a cross-sectional explanatory view.

The cover member 111 is bonded to the outer region of the nozzle plate 12 with an adhesive 20 on the surface of the flow path substrate 13 on the nozzle plate 12 side. At this time, the joint surface 111a of the cover member 111 with the flow path substrate 13 is located closer to the flow path substrate 13 than the discharge surface 12a of the nozzle plate 12.

The cover member 111 is provided with a step portion 111b on the side facing the flow path substrate 13 side. The stepped portion 111b is a surface 111f connecting the joint surface 111a with the flow path substrate 13, the facing surface 111e of the portion 111c facing the peripheral edge of the discharge surface 12a of the nozzle plate 12, and the joining surface 111a and the facing surface 111e. It is composed.

Due to the stepped portion 111b, the thickness t1 of the portion 111c of the cover member 111 facing the peripheral edge portion of the discharge surface 12a of the nozzle plate 12 is thinner than the thickness t2 of the portion 111d joined to the flow path substrate 13.

With this configuration, the cover member 111 covers the peripheral edge of the nozzle plate 12 while reducing the thickness of the adhesive 20 that joins the cover member 111 and the flow path substrate 13, thereby covering the edge of the nozzle plate 12. Can be protected.

Further, a gap 110 is provided between the portion 111c of the cover member 111 facing the peripheral edge of the discharge surface 12a and the discharge surface 12a.

With this configuration, the thickness of the adhesive 20 that joins the cover member 111 and the flow path substrate 13 can be reduced.

Further, a gap 110 is provided between the portion 111c of the cover member 111 facing the peripheral edge of the discharge surface 12a and the discharge surface 12a.

As a result, the cover member 111 does not move due to a temperature change or the like, and reliability is improved.

Further, since the gap 110 is not filled with the adhesive 20, the discharge surface 12a of the nozzle plate 12 and the cover member 111 are not adhesively bonded.

As a result, a liquid-repellent film (also referred to as a water-repellent film or an ink-repellent film) can be formed on the discharge surface 12a of the nozzle plate 12 not only near the nozzle 11 but also to the peripheral edge of the discharge surface 12a of the nozzle plate 12. it can. With this configuration, the liquid adhering to the vicinity of the peripheral edge of the discharge surface 12a can be easily removed from the discharge surface 12a.

Next, the second embodiment of the present invention will be described with reference to FIGS. 8 to 11. 8 is an explanatory view of an external perspective of the head module according to the same embodiment, FIG. 9 is an explanatory view of an external perspective seen from the opposite side of FIG. 8, FIG. 10 is an explanatory view of an exploded perspective, and FIG. 11 is a schematic cross-sectional explanation. It is a figure.

The head module 100 includes a plurality of sub-head modules 101 (here, 4) composed of a head 1, a wiring member 2 such as an FPC connected to the head 1, and an element 3 such as a drive IC mounted on the wiring member 2. I have).

A base member 102 that holds the four sub-head modules 101 is provided. Similar to the first embodiment, the lower surface of the base member 102 (the surface of the head 1 on the discharge surface side) is a cover member that covers the peripheral edge of the discharge surface 12a of the nozzle plate 12 of each head 1 of the sub head module 101. 111 is attached. Since the configuration of the cover member 111 and the configuration related to the adhesive bonding to each head 1 are the same as those of the first embodiment, the description thereof will be omitted.

Further, the head module 100 includes a heat radiating member 104 that is thermally coupled to the element 3 mounted on the wiring member 2 of the sub head module 101, and at least a case member 105 that surrounds the heat radiating member 104.

In addition, "bonding" means that the element 3 and the heat radiating member 104 are bonded to each other via a member having thermal conductivity (eg, a heat conductive tape), and the element 3 is attached to the heat radiating member 104 by an elastic member such as a spring. Examples thereof include a configuration in which they are directly contacted and connected by being pressed. Further, the base material of the wiring member 2 on which the element 3 is mounted may be coupled to the heat radiating member 104 via a member having thermal conductivity.

Here, the heat radiating member 104 is preferably a metal material (metal member) having a high thermal conductivity, and examples thereof include metals including aluminum, silver, copper, and gold.

The heat radiating member 104 has a first plate-shaped portion 141 having a main surface along the direction of gravity and a second plate-shaped portion 142 having a main surface along the horizontal direction. Here, the first plate-shaped portion 141 is a plate-shaped portion in the direction perpendicular to the discharge surface 12a, and the second plate-shaped portion 142 is a plate-shaped portion along the in-plane direction of the discharge surface 12a. is there. The heat radiating member 104 is a member in which the first plate-shaped portion 141 and the second plate-shaped portion 142 form a substantially L-shape.

The second plate-shaped portion 142 of the heat radiating member 104 is provided with a through-hole portion 142a through which the wiring member 2 is passed, and connects the wall surface of the through-hole portion 142a and the element 3 on the wiring member 2.

A printed circuit board 108 is fixed to the first plate-shaped portion 141 of the heat radiating member 104, and is connected to each head 1 by a wiring member 2.

Next, the third embodiment of the present invention will be described with reference to FIGS. 12 to 14. FIG. 12 is an explanatory view of an external perspective of the head module according to the embodiment, FIG. 13 is an explanatory view of a cross-sectional perspective, and FIG. 14 is an explanatory view of an enlarged perspective of a main part.

The present embodiment includes one head 1 and one cover member 111. Other configurations related to one head 1 are the same as those in the first embodiment, and thus the description thereof will be omitted.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 15 is a side explanatory view of the liquid discharge head according to the same embodiment.

The head 1 has a cover member 111 bonded to the flow path substrate 13 with an adhesive 20. Since the configuration of the cover member 111 and the joining to the flow path substrate 13 are the same as those in the first embodiment, the description thereof will be omitted.

Next, a different example of the fifth embodiment of the present invention will be described with reference to FIG. FIG. 16 is a plan explanatory view of a nozzle surface portion of one head according to the same embodiment.

In the first example shown in FIG. 16A, a cover member 111 that covers the peripheral edges of the short sides 12b and 12b of the nozzle plate 12 is provided.

In the second example shown in FIG. 16B, a cover member 111 that covers the peripheral edges of the long sides 12c and 12c of the nozzle plate 12 is provided.

That is, in the present embodiment, the cover member 111 is configured to cover the peripheral edges of the pair of opposite sides of the discharge surface 12a of the nozzle plate 12.

Next, the sixth embodiment of the present invention will be described with reference to FIG. FIG. 17 is a cross-sectional explanatory view of a joint portion between the head and the cover member, which is used for explaining the embodiment.

In the present embodiment, the surface 111f connecting the joint surface 111a and the facing surface 111e of the stepped portion 111b of the cover member 111 is an inclined surface.

With this configuration, it is possible to prevent the liquid that has entered the gap 110 between the cover member 111 and the nozzle plate 12 from accumulating. As a result, it is possible to suppress the liquid from coming into contact with the adhesive 20 and reduce the deterioration of the adhesive 20.

Next, the seventh embodiment of the present invention will be described with reference to FIG. FIG. 18 is a cross-sectional explanatory view of a joint portion between the head and the cover member, which is used for explaining the embodiment.

In the present embodiment, the cover member 111 is not provided with a stepped portion, but is provided with an inclined surface 111g facing the discharge surface 12a of the nozzle plate 12 from the joint surface 111a.

With this configuration, the liquid is less likely to collect in the gap 110.

Next, the eighth embodiment of the present invention will be described with reference to FIG. FIG. 19 is a cross-sectional explanatory view of a joint portion between the head and the cover member, which is used for explaining the embodiment.

In the present embodiment, the step portion 111h is also provided on the side opposite to the flow path substrate 13 corresponding to the step portion 111b on the flow path substrate 13 side of the cover member 111.

With this configuration, the cover member can be formed of a plate material having a constant plate thickness.

Next, a ninth embodiment of the present invention will be described with reference to FIG. FIG. 20 is a cross-sectional explanatory view of a joint portion between the head and the cover member, which is used for explaining the embodiment.

In the present embodiment, the gap 110 between the cover member 111 and the nozzle plate 12 is filled with the adhesive 20.

As a result, the liquid adhering to the discharge surface of the nozzle plate 12 can be reliably prevented from entering the joint portion between the flow path substrate 13 and the cover member 111, and the sealing performance is improved.

The configurations of the fifth to ninth embodiments can be applied to both the head module and the head.

Next, an example of the device for discharging the liquid according to the present invention will be described with reference to FIGS. 21 and 22. FIG. 21 is a schematic explanatory view of the device, and FIG. 22 is a plan explanatory view of an example of the head unit of the device.

The printing device 500, which is a device for discharging this liquid, includes a carry-in means 501 for carrying in the continuum 510, a guide transport means 503 for guiding and transporting the continuum 510 carried in from the carry-in means 501 to the printing means 505, and a continuous body. It includes a printing means 505 that discharges a liquid to 510 to form an image, a drying means 507 that dries the continuum 510, and a unloading means 509 that carries out the continuum 510.

The continuum 510 is sent out from the original winding roller 511 of the carrying-in means 501, guided and conveyed by the rollers of the carrying-in means 501, the guiding and transporting means 503, the drying means 507, and the carrying-out means 509, and is guided and conveyed by the winding roller 591 of the carrying-out means 509. It is wound up at.

The continuum 510 is conveyed in the printing means 505 facing the head unit 550, and an image is printed by the liquid discharged from the head unit 550.

Here, as shown in FIG. 15, the head unit 550 includes three head modules 100A, 100B, and 100C according to the present invention in the common base member 552.

In the present application, when the head is a liquid discharge head, the liquid to be discharged may have a viscosity and surface tension that can be discharged from the head, and is not particularly limited, but at room temperature, under normal pressure, or by heating and cooling. It is preferable that the viscosity is 30 mPa · s or less. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functionalizing materials such as surfactants, biocompatible materials such as DNA, amino acids and proteins, and calcium. , Solvents, suspensions, emulsions, etc. containing edible materials such as natural dyes, etc., for example, inks for inkjets, surface treatment liquids, constituents of electronic elements and light emitting elements, and formation of electronic circuit resist patterns. It can be used for applications such as liquids for three-dimensional modeling.

Further, the device for discharging the liquid includes a device including a head module, a head unit, and the like, and driving the head to discharge the liquid. The device for discharging the liquid includes not only a device capable of discharging the liquid to a device to which the liquid can adhere, but also a device for discharging the liquid into the air or the liquid.

The "device for discharging the liquid" can also include means for feeding, transporting, and discharging paper to which the liquid can adhere, and also includes a pretreatment device, a posttreatment device, and the like.

For example, as a "device that ejects a liquid", an image forming device that is a device that ejects ink to form an image on paper, and a powder is formed in layers in order to form a three-dimensional model (three-dimensional model). There is a three-dimensional modeling device (three-dimensional modeling device) that discharges the modeling liquid into the powder layer.

Further, the "device for discharging a liquid" is not limited to a device in which a significant image such as characters and figures is visualized by the discharged liquid. For example, those that form patterns that have no meaning in themselves and those that form a three-dimensional image are also included.

The above-mentioned "material to which a liquid can adhere" means a material to which a liquid can adhere at least temporarily, such as one that adheres and adheres, and one that adheres and permeates. Specific examples include media such as paper, recording paper, recording paper, film, cloth and other recording media, electronic substrates, electronic components such as piezoelectric elements, powder layers (powder layers), organ models, and inspection cells. Yes, including anything to which the liquid adheres, unless otherwise specified.

The material of the above-mentioned "material to which liquid can be attached" may be paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics or the like as long as the liquid can be attached even temporarily.

Further, the "device for discharging the liquid" includes, but is not limited to, a device in which the liquid discharge head and the device to which the liquid can adhere move relatively. Specific examples include a serial type device that moves the liquid discharge head, a line type device that does not move the liquid discharge head, and the like.

In addition, as a "device for ejecting a liquid", a treatment liquid coating device for ejecting a treatment liquid to a paper in order to apply the treatment liquid to the surface of the paper for the purpose of modifying the surface of the paper, etc. There is an injection granulator that injects a composition liquid in which a raw material is dispersed in a solution through a nozzle to granulate fine particles of the raw material.

In addition, image formation, recording, printing, printing, printing, modeling, etc. in the terms of the present application are all synonymous.

1 Head 2 Wiring member 3 Element 11 Nozzle 12 Nozzle plate 13 Flow path board 100 Head module 101 Sub head module 102 Base member 105 Case member 111 Cover member 111b Step 500 Printing device (device that discharges liquid)
501 Carry-in means 505 Printing means 510 Continuum 507 Drying means 509 Carry-out means 550 Head unit

Claims (15)

A nozzle plate on which a nozzle for discharging liquid is formed and
A head including a flow path substrate forming an individual flow path leading to the nozzle, and
A cover member that covers at least one side of the discharge surface of the nozzle plate of the head is provided.
The outer shape of the nozzle plate is smaller than the outer shape of the flow path substrate.
The cover member is bonded to the outer region of the nozzle plate with an adhesive on the surface of the flow path substrate on the nozzle plate side.
A head module characterized in that the joint surface of the cover member with the flow path substrate is located closer to the flow path substrate than the discharge surface of the nozzle plate. The head module according to claim 1, wherein the cover member is provided with a stepped portion between a portion of the nozzle plate facing the discharge surface and a portion joined to the flow path substrate. .. The head module according to claim 2, wherein the stepped portion of the cover member has a portion of the nozzle plate facing the discharge surface thinner than the thickness of the portion joined to the flow path substrate. The stepped portion of the cover member according to claim 2 or 3, wherein a portion of the nozzle plate facing the discharge surface and a portion connecting with the flow path substrate are inclined. Head module. The head module according to any one of claims 1 to 4, wherein there is a gap between the region of the cover member facing the discharge surface of the nozzle plate and the discharge surface of the nozzle plate. The area of the cover member facing the discharge surface of the nozzle plate and the discharge surface of the nozzle plate are filled with an adhesive that joins the cover member and the flow path substrate. The head module according to claim 1. With multiple heads
The head module according to any one of claims 1 to 6, wherein the cover member is provided with one. A head unit characterized in that a plurality of head modules according to any one of claims 1 to 7 are provided in a common base member. A nozzle plate on which a nozzle for discharging liquid is formed and
A flow path substrate forming an individual flow path leading to the nozzle,
A cover member that covers at least one side of the discharge surface of the nozzle plate is provided.
The outer shape of the nozzle plate is smaller than the outer shape of the flow path substrate.
The cover member is bonded to the outer region of the nozzle plate with an adhesive on the surface of the flow path substrate on the nozzle plate side.
A liquid discharge head characterized in that the joint surface of the cover member with the flow path substrate is located closer to the flow path substrate than the discharge surface of the nozzle plate. The liquid discharge head according to claim 9, wherein the cover member is provided with a stepped portion between a portion of the nozzle plate facing the discharge surface and a portion joined to the flow path substrate. .. The liquid discharge head according to claim 10, wherein the stepped portion of the cover member has a portion of the nozzle plate facing the discharge surface thinner than the thickness of the portion joined to the flow path substrate. .. The liquid discharge head according to claim 10 or 11, wherein the stepped portion of the cover member has an inclined portion connecting a portion facing the nozzle plate and a portion joining the flow path substrate. .. The invention according to any one of claims 9 to 12, wherein there is a gap between the region of the cover member facing the discharge surface of the nozzle plate and the peripheral edge of the discharge surface of the nozzle plate. Liquid discharge head. The area of the cover member facing the discharge surface of the nozzle plate and the peripheral edge of the discharge surface of the nozzle plate are filled with an adhesive that joins the cover member and the flow path substrate. The liquid discharge head according to claim 9, wherein the liquid discharge head is provided. The head module according to any one of claims 1 to 7, the head unit according to claim 8, or the liquid discharge head according to any one of claims 9 to 14 is provided. A device that discharges liquid.

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