JP2020096098A - Capacitor terminal - Google Patents

Capacitor terminal Download PDF

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JP2020096098A
JP2020096098A JP2018233345A JP2018233345A JP2020096098A JP 2020096098 A JP2020096098 A JP 2020096098A JP 2018233345 A JP2018233345 A JP 2018233345A JP 2018233345 A JP2018233345 A JP 2018233345A JP 2020096098 A JP2020096098 A JP 2020096098A
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capacitor
terminal
substrate
resin portion
slit
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JP7084294B2 (en
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泰輔 藁科
Taisuke Warashina
泰輔 藁科
浩晶 伊美
Hiroaki Imi
浩晶 伊美
森　隆志
Takashi Mori
隆志 森
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Toyota Motor Corp
Nichicon Corp
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Toyota Motor Corp
Nichicon Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

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Abstract

To provide a capacitor terminal capable of suppressing or eliminating the influence of soldering on a resin portion existing near the terminal.SOLUTION: A capacitor terminal 7 in which a substrate 3 and a capacitor 2 are provided so as to be connected via bus bars 4A and 4B and to project from a resin portion 5c on the side of the substrate 3, and separated by sandwiching the resin portion 5c, and the bus bars 4A and 4B on the capacitor 2 side are soldered to connect the substrate 3 and the capacitor 2 includes a joint hole 7a which is a target portion of the soldering, and a slit 7b located between the joint hole 7a and the resin portion 5c, and extending along the width direction orthogonal to the protruding direction from the resin portion 5c.SELECTED DRAWING: Figure 4

Description

本発明は、コンデンサ側のバスバがハンダ接合されることにより基板とコンデンサとを接続するコンデンサ用端子に関する。 The present invention relates to a capacitor terminal for connecting a substrate and a capacitor by soldering a bus bar on the capacitor side.

複数のコンデンサと放電制御用の基板とが樹脂製のケースに収容され、それらのコンデンサと基板とがバスバを介して互いに接続されたコンデンサモジュールが知られている（特許文献１参照）。 There is known a capacitor module in which a plurality of capacitors and a discharge control substrate are housed in a resin case, and the capacitors and the substrate are connected to each other via a bus bar (see Patent Document 1).

特開２０１８−０３２８３１号公報JP, 2008-032831, A

コンデンサと基板とを接続する構造として、基板側の端子とコンデンサ側のバスバとをハンダ接合によって接続する構造が採用されることがある。その場合、基板側の端子がケース等の樹脂部から突出するように設けられていると、ハンダが樹脂部側に流れて樹脂部の炭化、あるいは変形といった不具合が生じるおそれがある。 As a structure for connecting the capacitor and the substrate, a structure may be adopted in which a terminal on the substrate side and a bus bar on the capacitor side are connected by soldering. In that case, if the terminal on the board side is provided so as to project from the resin portion such as the case, the solder may flow to the resin portion side, which may cause a problem such as carbonization or deformation of the resin portion.

そこで、本発明は端子付近に存在する樹脂部に対してハンダ接合が与える影響を抑制し又は排除することが可能なコンデンサ用端子を提供することを目的とする。 Therefore, an object of the present invention is to provide a capacitor terminal capable of suppressing or eliminating the influence of soldering on the resin portion existing near the terminal.

本発明の一態様に係るコンデンサ用端子は、基板とコンデンサとが、バスバを介して接続されるとともに樹脂部を挟んで隔てられた前記基板側の樹脂部から突出するように設けられ、コンデンサ側のバスバがハンダ接合されることにより前記基板と前記コンデンサとを接続するコンデンサ用端子であって、前記ハンダ接合の対象箇所となる接合孔と、前記接合孔と前記樹脂部との間に位置し、かつ前記樹脂部からの突出方向と直交する幅方向に沿って延ばされたスリットと、を備えたものである。 A capacitor terminal according to an aspect of the present invention is provided such that a substrate and a capacitor are connected to each other via a bus bar and project from a resin portion on the substrate side that is separated by sandwiching a resin portion. Is a capacitor terminal for connecting the substrate and the capacitor by soldering the bus bar, and is located between the joint hole that is the target portion of the solder joint and the joint hole and the resin portion. And a slit extending along the width direction orthogonal to the protruding direction from the resin portion.

本発明の一形態に係るコンデンサ用の信号端子を備えたコンデンサモジュールの一例を示す平面図。The top view which shows an example of the capacitor module provided with the signal terminal for capacitors which concerns on one form of this invention. 図１の状態から基板を取り外した状態を示す図。The figure which shows the state which removed the board|substrate from the state of FIG. 図１のIII部を拡大して示す図。The figure which expands and shows the III section of FIG. 図１〜図３の信号端子及びその周囲を拡大して示す斜視図。The perspective view which expands and shows the signal terminal of FIG. 図４の信号端子をさらに拡大して示す斜視図。The perspective view which further expands and shows the signal terminal of FIG.

以下、添付図面を参照して本発明の一形態を説明する。まず、図１〜図３を参照して、本形態に係るコンデンサ用端子を備えたコンデンサモジュールの一例を説明する。本形態に係るコンデンサモジュールは、例えば電気自動車等の車両に搭載される電力変換装置に用いられるものである。 An embodiment of the present invention will be described below with reference to the accompanying drawings. First, an example of a capacitor module including a capacitor terminal according to this embodiment will be described with reference to FIGS. 1 to 3. The capacitor module according to this embodiment is used for a power conversion device mounted on a vehicle such as an electric vehicle.

図１に示すように、コンデンサモジュール１は、複数のコンデンサ２と、それらのコンデンサ２の放電を制御するための放電抵抗基板（以下、基板と略称する。）３と、コンデンサ２の正極側及び負極側のそれぞれと基板３とを接続するための一対のバスバ４Ａ、４Ｂとを備えている。以下の説明においては、コンデンサモジュール１の方向を区別するため、コンデンサ２及び基板３が並べられた方向をＸ方向とし、図１の紙面と平行でかつＸ方向と直交する方向をＹ方向とし、図１の紙面と直交する方向をＺ方向と定める。ただし、これらの定義はコンデンサモジュール１の方向を説明の便宜のために区別するためのものであって、何らかの技術的意義を有するものではない。図１においてコンデンサ２はバスバ４Ａ、４Ｂの背後に配置されており、それらの一部が見えている。 As shown in FIG. 1, a capacitor module 1 includes a plurality of capacitors 2, a discharge resistance substrate (hereinafter abbreviated as a substrate) 3 for controlling discharge of the capacitors 2, a positive electrode side of the capacitor 2, and It is provided with a pair of bus bars 4A and 4B for connecting each of the negative electrodes and the substrate 3. In the following description, in order to distinguish the directions of the capacitor module 1, the direction in which the capacitors 2 and the substrate 3 are arranged is the X direction, and the direction parallel to the paper surface of FIG. 1 and orthogonal to the X direction is the Y direction. The direction orthogonal to the paper surface of FIG. 1 is defined as the Z direction. However, these definitions are for distinguishing the direction of the capacitor module 1 for convenience of description, and do not have any technical significance. In FIG. 1, the capacitor 2 is arranged behind the bus bars 4A and 4B, and some of them are visible.

基板３は、例えば車両のメインスイッチがオフになった場合等にコンデンサ２に蓄えられた電荷を強制的に放電させるように機能する。ただし、基板の機能はこれに限らず適宜の機能を有する基板がコンデンサモジュール１に実装されてよい。バスバ４Ａ、４Ｂのそれぞれには、コンデンサモジュール１とは異なる外部の回路等とコンデンサ２とを接続するための複数の外部接続端子４ａ、４ｂがＸ方向に一例に並べて設けられている。外部接続端子４ａ、４ｂは一例としてＺ方向に延ばされている。 The substrate 3 functions to forcibly discharge the electric charge stored in the capacitor 2 when, for example, the main switch of the vehicle is turned off. However, the function of the substrate is not limited to this, and a substrate having an appropriate function may be mounted on the capacitor module 1. Each of the bus bars 4A and 4B is provided with a plurality of external connection terminals 4a and 4b for connecting an external circuit or the like different from the capacitor module 1 and the capacitor 2 side by side in the X direction as an example. The external connection terminals 4a and 4b are extended in the Z direction as an example.

コンデンサ２、基板３、及びバスバ４Ａ、４Ｂは樹脂製のケース５に収容されている。図２に示すように、ケース５には、コンデンサ２が収容されるコンデンサ収容部５ａと、基板３が収容される基板収容部５ｂとが設けられている。基板収容部５ｂには、信号取り出し用の一対のバスバ６Ａ、６Ｂが設けられている。以下では、バスバ４Ａ、４Ｂに「コンデンサ側」の語を、バスバ６Ａ、６Ｂに「基板側」の語を付してバスバを区別することがある。基板側のバスバ６Ａ、６Ｂはケース５の成形時にインサート部品として金型内に配置され、ケース５と一体化されている。基板３はバスバ６Ａ、６Ｂと適宜に接続されるようにしてケース５に取り付けられる。 The capacitor 2, the substrate 3, and the bus bars 4A and 4B are housed in a case 5 made of resin. As shown in FIG. 2, the case 5 is provided with a capacitor housing portion 5a for housing the capacitor 2 and a substrate housing portion 5b for housing the substrate 3. The board housing portion 5b is provided with a pair of bus bars 6A and 6B for taking out signals. In the following, the word "capacitor side" may be attached to the bus bars 4A and 4B, and the word "board side" may be attached to the bus bars 6A and 6B to distinguish the bus bars. The board-side bus bars 6A and 6B are arranged in the mold as insert parts when the case 5 is molded, and are integrated with the case 5. The board 3 is attached to the case 5 so as to be appropriately connected to the bus bars 6A and 6B.

基板側のバスバ６Ａ、６Ｂのそれぞれには、コンデンサ用端子の一例として、コンデンサ側のバスバ４と接続するための信号端子７が一体に設けられている。なお、ケース５には、信号端子７とは異なる方向（一例としてＹ方向）に突出する一対の端子ピン８も設けられている。これらの端子ピン８は基板３と外部回路とを接続するためものである。 Each of the board-side bus bars 6A and 6B is integrally provided with a signal terminal 7 for connection with the capacitor-side bus bar 4 as an example of a capacitor terminal. The case 5 is also provided with a pair of terminal pins 8 protruding in a direction different from the signal terminals 7 (Y direction as an example). These terminal pins 8 are for connecting the substrate 3 and an external circuit.

図３に示すように、各信号端子７は、ケース５のコンデンサ収容部５ａと基板収容部５ｂとを区切る壁部５ｃからコンデンサ収容部５ａ側に突出するように設けられている。信号端子７の壁部５ｃからの突出方向はＸ方向と概ね一致する。壁部５ｃは樹脂部の一例に相当する。信号端子７のそれぞれは、コンデンサ側のバスバ４Ａ、４Ｂとハンダ接合によって選択的に接続される。その接続は機械的かつ電気的な接続である。図３ではハンダ接合箇所を参照符号Ｐｓにて示している。コンデンサ２、基板３等の各種部品の組付けが完了すると、ケース５に樹脂がさらに充填されてコンデンサモジュール１の構成部品がモールドされる。 As shown in FIG. 3, each signal terminal 7 is provided so as to project from the wall portion 5c that separates the capacitor housing portion 5a and the substrate housing portion 5b of the case 5 toward the capacitor housing portion 5a side. The protruding direction of the signal terminal 7 from the wall portion 5c substantially coincides with the X direction. The wall portion 5c corresponds to an example of the resin portion. Each of the signal terminals 7 is selectively connected to the capacitor-side bus bars 4A, 4B by soldering. The connection is a mechanical and electrical connection. In FIG. 3, the solder joint portion is indicated by reference symbol Ps. When the assembling of various components such as the capacitor 2 and the substrate 3 is completed, the case 5 is further filled with resin and the components of the capacitor module 1 are molded.

図４及び図５に示すように、信号端子７には、接合孔７ａと、その接合孔７ａと壁部５ｃとの間、言い換えれば信号端子７の根元側に位置するスリット７ｂとを備えている。接合孔７ａは、その長手方向が壁部５ｃからの信号端子７の突出方向（Ｘ方向）に向けられるようにして形成された長孔状であって、かつ信号端子７をその厚さ方向（Ｚ方向）に貫く貫通孔として設けられている。図３から明らかなように、接合孔７ａはハンダ接合の対象箇所とされる部分である。つまり、コンデンサ側のバスバ４Ａ、４Ｂと基板側のバスバ６Ａ、６Ｂとの間のハンダ接合は、接合孔７ａを中心にして行われる。接合孔７ａが信号端子７の突出方向に沿って延ばされることにより、信号端子７の断面積の低下を抑えつつハンダ接合に必要な大きさの接合孔７ａを比較的容易に確保できる。 As shown in FIGS. 4 and 5, the signal terminal 7 is provided with a joint hole 7a and a slit 7b located between the joint hole 7a and the wall portion 5c, in other words, on the base side of the signal terminal 7. There is. The joint hole 7a has a long hole shape formed so that its longitudinal direction is oriented in the protruding direction (X direction) of the signal terminal 7 from the wall portion 5c, and the signal terminal 7 is formed in the thickness direction ( It is provided as a through hole penetrating in the Z direction). As is clear from FIG. 3, the joint hole 7a is a portion targeted for solder joint. That is, the solder joining between the capacitor-side bus bars 4A and 4B and the board-side bus bars 6A and 6B is performed with the joining hole 7a as the center. By extending the joining hole 7a along the protruding direction of the signal terminal 7, it is possible to relatively easily secure the joining hole 7a of a size necessary for solder joining while suppressing a decrease in the cross-sectional area of the signal terminal 7.

一方、スリット７ｂは、その長手方向が信号端子７の突出方向と直交する幅方向（図示例ではＹ方向）に向けられるようにして形成された長孔状であって、信号端子７をその厚さ方向に貫く貫通孔として設けられている。ただし、スリット７ｂの長手方向は、信号端子７の幅方向と厳密に一致することを必ずしも要しない。スリット７ｂは、その少なくとも一部において信号端子７の幅方向に対して多少の傾きを伴なっていてもよい。あるいはスリット７ｂの少なくとも一部が湾曲を伴なっていてもよい。いずれにしてもスリット７ｂは、その全体からみて信号端子７の幅方向に沿って延ばされた形状であればよい。 On the other hand, the slit 7b is an elongated hole formed so that its longitudinal direction is oriented in the width direction (Y direction in the illustrated example) orthogonal to the protruding direction of the signal terminal 7, and the signal terminal 7 has a thickness It is provided as a through hole penetrating in the vertical direction. However, the longitudinal direction of the slit 7b does not necessarily have to exactly match the width direction of the signal terminal 7. At least a part of the slit 7b may be slightly inclined with respect to the width direction of the signal terminal 7. Alternatively, at least a part of the slit 7b may be curved. In any case, the slit 7b may have a shape extending along the width direction of the signal terminal 7 when viewed from the whole.

信号端子７の幅方向におけるスリット７ｂの全長は、信号端子７を流れる電流値と関連付けて設定されてよい。スリット７ｂを設けた場合、そのスリット７ｂの位置で信号端子７の断面積は減少する。一方、信号端子７の断面積は、信号端子７を経由して流し得る電流の最大値と相関し、断面積が小さいほど流し得る電流の最大値が低下する。したがって、
信号端子７を通過する電流の最大値を想定し、その最大値の電流を流すために必要な断面積の最小値を割り出し、当該最小値以上の断面積が確保される範囲でスリット７ｂの全長を定めることが適当である。 The total length of the slit 7b in the width direction of the signal terminal 7 may be set in association with the current value flowing through the signal terminal 7. When the slit 7b is provided, the cross-sectional area of the signal terminal 7 decreases at the position of the slit 7b. On the other hand, the cross-sectional area of the signal terminal 7 correlates with the maximum value of the current that can flow through the signal terminal 7, and the smaller the cross-sectional area, the lower the maximum value of the current that can flow. Therefore,
Assuming the maximum value of the current passing through the signal terminal 7, determine the minimum value of the cross-sectional area required to flow the maximum value of the current, and the total length of the slit 7b within the range in which the cross-sectional area of the minimum value or more is secured. Is appropriate.

信号端子７の接合孔７ａ及びスリット７ｂのそれぞれはバスバ６Ａ、６Ｂの製造時に同時に形成されてよい。例えば、バスバ６Ａ、６Ｂのそれぞれを金属板からの打ち抜き加工によって製造する場合、その打ち抜き加工によって接合孔７ａ及びスリット７ｂを含めて信号端子７を同時に形成することが可能である。 Each of the joint hole 7a and the slit 7b of the signal terminal 7 may be formed at the same time when the bus bars 6A and 6B are manufactured. For example, when each of the bus bars 6A and 6B is manufactured by punching from a metal plate, the signal terminal 7 including the joining hole 7a and the slit 7b can be simultaneously formed by the punching.

以上の信号端子７によれば、ハンダ接合の対象箇所となるべき接合孔７ａと樹脂製の壁部５ｃとの間に、スリット７ｂが信号端子７の幅方向に沿って延びるように設けられているため、ハンダ付け時にハンダが壁部５ｃ側に流れたとしても、その流れをスリット７ｂで塞き止め、壁部５ｃへのハンダの到達を防ぐことができる。また、スリット７ｂを設けることにより、スリット７ｂの位置における信号端子７の断面積が減少するため、ハンダ接合時の熱引けが壁部５ｃに与える影響を低減することもできる。これにより、ハンダ接合が壁部５ｃに与える影響を抑止し、あるいは排除することが可能である。さらに、スリット７ｂは信号端子７の製造時、さらには基板側のバスバ６Ａ、６Ｂの製造時に同時に形成することができるので、スリット７ｂを形成するために別工程を追加することを要しない。これにより、コスト低減を図ることができる。しかも、信号端子７の外周形状はスリット７ｂの有無を問わず同じでよいため、信号端子７の周囲における他部品の配置に影響が生じるおそれもない。 According to the signal terminal 7 described above, the slit 7b is provided so as to extend along the width direction of the signal terminal 7 between the joining hole 7a to be the target portion of the solder joining and the resin wall portion 5c. Therefore, even if the solder flows toward the wall portion 5c at the time of soldering, the flow can be blocked by the slit 7b and the solder can be prevented from reaching the wall portion 5c. In addition, since the cross-sectional area of the signal terminal 7 at the position of the slit 7b is reduced by providing the slit 7b, it is possible to reduce the influence of thermal shrinkage on the wall portion 5c at the time of soldering. As a result, it is possible to suppress or eliminate the influence of the solder joint on the wall portion 5c. Further, since the slit 7b can be formed at the same time when the signal terminal 7 is manufactured and further when the bus bars 6A and 6B on the substrate side are manufactured, it is not necessary to add another step to form the slit 7b. Thereby, the cost can be reduced. Moreover, since the outer peripheral shape of the signal terminal 7 may be the same regardless of the presence or absence of the slit 7b, there is no possibility of affecting the arrangement of other components around the signal terminal 7.

本発明は上記の形態に限定されず、種々の変形又は変更が施された形態にて実施されてよい。例えば、上記の形態ではコンデンサ用端子の一例としての信号端子７の壁部５ｃからの突出方向がコンデンサ２及び基板３の並び方向（Ｘ方向）に設定されているが、コンデンサ用端子の突出方向はコンデンサ側のバスバと基板との接続に適したものである限り適宜に変更されてよい。コンデンサ用端子は、基板側のバスバ６Ａ、６Ｂと一体に形成される例に限らず、基板とコンデンサ側のバスバとの間に介在してコンデンサと基板との接続に用い得る限り適宜の態様で設けられてよい。 The present invention is not limited to the above-mentioned modes, and may be carried out in various modified or changed modes. For example, in the above-described embodiment, the protruding direction of the signal terminal 7 as an example of the capacitor terminal from the wall portion 5c is set to the alignment direction of the capacitor 2 and the substrate 3 (X direction). May be appropriately changed as long as it is suitable for connection between the bus bar on the capacitor side and the substrate. The capacitor terminal is not limited to the example formed integrally with the board-side bus bars 6A and 6B, but may be in any suitable form as long as it can be interposed between the board and the capacitor-side bus bar and used to connect the capacitor and the board. May be provided.

上述した実施の形態及び変形例から導かれる本発明の態様を以下に説明する。なお、以下では、図中の参照符号を括弧書きにて付記するが、それにより本発明の態様が図示の形態に限定されるものではない。 Aspects of the present invention derived from the above-described embodiments and modifications will be described below. In the following, reference numerals in the drawings are added in parentheses, but the embodiments of the present invention are not limited to the illustrated embodiments.

本発明の一態様に係るコンデンサ用端子（７）は、基板（３）とコンデンサ（２）とが、バスバ（４Ａ、４Ｂ）を介して接続されるとともに樹脂部（５ｃ）を挟んで隔てられた前記基板（３）側の樹脂部（５ｃ）から突出するように設けられ、コンデンサ（２）側のバスバ（４Ａ、４Ｂ）がハンダ接合されることにより前記基板（３）と前記コンデンサ（２）とを接続するコンデンサ用端子であって、前記ハンダ接合の対象箇所となる接合孔（７ａ）と、前記接合孔と前記樹脂部との間に位置し、かつ前記樹脂部からの突出方向（例えばＸ方向）と直交する幅方向（例えばＹ方向）に沿って延ばされたスリット（７ｂ）とを備えたものである。 In the capacitor terminal (7) according to one aspect of the present invention, the substrate (3) and the capacitor (2) are connected via the bus bars (4A, 4B) and are separated by the resin portion (5c). Further, it is provided so as to project from the resin portion (5c) on the side of the substrate (3), and the bus bars (4A, 4B) on the side of the capacitor (2) are soldered to each other, whereby the substrate (3) and the capacitor (2) are connected. ) Is a capacitor terminal, and is located between the joint hole (7a), which is the target portion of the solder joint, and the joint hole and the resin portion, and the protruding direction from the resin portion ( For example, a slit (7b) extending along a width direction (eg, Y direction) orthogonal to the X direction) is provided.

上記態様によれば、ハンダ接合時にハンダが樹脂部側に流れても、その流れをスリットで塞き止めて樹脂部へのハンダの到達を防ぐことができる。また、スリットの位置でコンデンサ用端子の断面積が減少することにより、ハンダ接合時に生じる熱引けが樹脂部に与える影響を低減することもできる。これらの作用により、端子付近に存在する樹脂部に対してハンダ接合が与える影響を抑制し又は排除することが可能である。しかも、スリットを設けてもコンデンサ用端子の外周形状は変化しないため、コンデンサ用端子の周囲における他部品の配置に影響が及ぶおそれがない。 According to the above aspect, even if the solder flows toward the resin portion at the time of solder joining, the flow can be blocked by the slit to prevent the solder from reaching the resin portion. In addition, since the cross-sectional area of the capacitor terminal is reduced at the position of the slit, it is possible to reduce the influence of thermal shrinkage that occurs during soldering on the resin portion. By these actions, it is possible to suppress or eliminate the influence of the solder joint on the resin portion existing near the terminal. Moreover, since the outer peripheral shape of the capacitor terminal does not change even if the slit is provided, there is no possibility that the arrangement of other components around the capacitor terminal is affected.

上記の態様において、接合孔はコンデンサ用端子の突出方向に沿って延ばされた形状であってもよい。この場合には、コンデンサ用端子の断面積を確保しつつハンダ接合に必要な大きさの接合孔を比較的容易に設けることが可能である。また、コンデンサ用端子は、コンデンサ側のバスバと基板との間に介在する基板側のバスバ（６Ａ、６Ｂ）と一体に形成されてもよい。これによれば、基板側のバスバを製造する場合、これと同時的に信号端子を形成できるので、製造コストの低減及び部品点数の削減に有利である。さらに、基板側のバスバは、基板を収容する樹脂製のケースにインサート部品として設けられたものであってもよい。この場合は樹脂部とコンデンサ用端子とが一体不可分となるために、ハンダ接合時にはコンデンサ用端子の根元側に樹脂部が必然的に存在することになる。したがって、スリットを設けることによる作用効果を確実かつ効果的に発揮させることができる。さらに、基板側のバスバは金属板の打ち抜き加工品として構成されてもよい。これによれば、コンデンサ用端子を製造するためのコスト削減することが可能である。なお、上記態様では、スリット７ｂとして信号端子（コンデンサ用端子）の厚み方向（Ｚ方向）に貫通する孔を形成したが、ハンダの壁部５ｃ側への流れを塞き止める限りにおいては、貫通する孔に限定されず、幅方向（Ｙ方向）に沿って延ばされた溝状の孔（凹部）であってもよい。 In the above aspect, the bonding hole may have a shape extending along the protruding direction of the capacitor terminal. In this case, it is possible to relatively easily form the bonding hole having a size required for soldering while securing the cross-sectional area of the capacitor terminal. Further, the capacitor terminal may be formed integrally with the board-side bus bar (6A, 6B) interposed between the capacitor-side bus bar and the board. According to this, when the board-side bus bar is manufactured, the signal terminals can be formed at the same time as this, which is advantageous in reducing the manufacturing cost and the number of parts. Furthermore, the board-side bus bar may be provided as an insert component in a resin case that houses the board. In this case, since the resin portion and the capacitor terminal are inseparable from each other, the resin portion inevitably exists on the base side of the capacitor terminal during soldering. Therefore, the function and effect of providing the slit can be reliably and effectively exhibited. Further, the bus bar on the substrate side may be configured as a stamped product of a metal plate. According to this, it is possible to reduce the cost for manufacturing the capacitor terminal. In the above aspect, the slit 7b is formed with a hole penetrating in the thickness direction (Z direction) of the signal terminal (capacitor terminal). However, as long as it blocks the flow of solder toward the wall portion 5c, the penetrating hole is formed. The holes are not limited to the above-described holes, and may be groove-shaped holes (recesses) extended along the width direction (Y direction).

１ コンデンサモジュール
２ コンデンサ
３ 放電抵抗基板（基板）
４Ａ、４Ｂ コンデンサ側のバスバ
５ｃ 壁部（樹脂部）
６Ａ、６Ｂ 基板側のバスバ
７ 信号端子（コンデンサ用端子）
７ａ 接合孔
７ｂ スリット 1 Capacitor module 2 Capacitor 3 Discharge resistance board (board)
4A, 4B Bus bar on the condenser side 5c Wall part (resin part)
6A, 6B Bus bar on board side 7 Signal terminal (capacitor terminal)
7a Joint hole 7b Slit

Claims (1)

基板とコンデンサとが、バスバを介して接続されるとともに樹脂部を挟んで隔てられた前記基板側の樹脂部から突出するように設けられ、コンデンサ側のバスバがハンダ接合されることにより前記基板と前記コンデンサとを接続するコンデンサ用端子であって、前記ハンダ接合の対象箇所となる接合孔と、前記接合孔と前記樹脂部との間に位置し、かつ前記樹脂部からの突出方向と直交する幅方向に沿って延ばされたスリットと、を備えたコンデンサ用端子。 A board and a capacitor are provided so as to project from a resin portion on the side of the board which is connected via a bus bar and is separated by a resin portion, and the bus bar on the side of the capacitor is solder-bonded to the board. A capacitor terminal for connecting to the capacitor, which is located between the joint hole and the resin portion, the joint hole being a target portion of the solder joint, and orthogonal to a protruding direction from the resin portion. A capacitor terminal provided with a slit extending along the width direction.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005278296A (en) * 2004-03-24 2005-10-06 Toyota Motor Corp Capacitor device and power supply system having the same
US9107319B2 (en) * 2012-12-17 2015-08-11 Lsis Co., Ltd. DC link capacitor assembly
JP2016091700A (en) * 2014-10-31 2016-05-23 住友電気工業株式会社 Power storage device module
WO2018016349A1 (en) * 2016-07-21 2018-01-25 パナソニックＩｐマネジメント株式会社 Capacitor
JP2018032831A (en) * 2016-08-26 2018-03-01 トヨタ自動車株式会社 Capacitor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005278296A (en) * 2004-03-24 2005-10-06 Toyota Motor Corp Capacitor device and power supply system having the same
US9107319B2 (en) * 2012-12-17 2015-08-11 Lsis Co., Ltd. DC link capacitor assembly
JP2016091700A (en) * 2014-10-31 2016-05-23 住友電気工業株式会社 Power storage device module
WO2018016349A1 (en) * 2016-07-21 2018-01-25 パナソニックＩｐマネジメント株式会社 Capacitor
JP2018032831A (en) * 2016-08-26 2018-03-01 トヨタ自動車株式会社 Capacitor module

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