JP2020092081A - Communication module, electronic equipment, and imaging apparatus - Google Patents

Abstract

To reduce a radiant quantity of noise.SOLUTION: A communication module comprises: a wiring board 141 including a ground wiring 4G; an electronic component provided for the wiring board 141; and a connector 143 provided for the wiring board 141 and electrically connected to the electronic component through the wiring board 141. The connector 143 has: a ground terminal 407electrically connected to the ground wiring 4G; and a plurality of pins 408to 408arranged in an arrangement direction. The pins 408, 408, 408and 408are high-frequency signal pins used in transmission of a high-frequency signal. The pins 408to 408are non-high-frequency signal pins. The pins 408and 408are continuously arranged in the arrangement direction. None of the pins 408to 408is interposed between a pin group 421composed of the pins 408and 408and the ground terminal 407.SELECTED DRAWING: Figure 4

Description

The present invention relates to noise countermeasures.

Some electronic devices include a wireless communication unit. A digital camera, which is an example of this kind of electronic device, is equipped with a wireless communication unit, so that it is possible to remotely control an imaging operation or the like by another device such as a PC or transmit a captured image to another device. Has become.

In this kind of electronic device, there is a problem in that the electromagnetic communication radiated from the cable arranged inside is received by the wireless communication unit, so that the wireless communication speed decreases.

As one of means for solving the problem of reducing the reliability of wireless communication, in Non-Patent Document 1, a cable is inserted through a ring-shaped ferrite core, and electromagnetic noise radiated from the cable is reduced by the ferrite core. The method is described.

Mitsutoshi Hatori Supervised "The Practice of EMC Design" Maruzen Publishing Division (Published June 30, 2000, P.238)

However, due to the miniaturization of electronic devices and the increase in radio wave reception sensitivity in wireless communication units, noise countermeasures by conventional methods are not sufficient, and further improvements have been demanded. Even if the electronic device does not have a wireless communication unit, noise may not interfere with other electronic devices because other electronic devices that perform wireless communication may be arranged around the electronic device. As described above, it has been required to reduce the radiation amount of noise.

An object of the present invention is to reduce the radiation amount of noise.

A communication module of the present invention includes a wiring board including ground wiring, an electric component provided on the wiring board, and a first connector provided on the wiring board and electrically connected to the electric component through the wiring board. And the first connector is used for a purpose other than the transmission of the high frequency signal, the metal member electrically connected to the ground wiring, the plurality of high frequency signal pins used for the transmission of the high frequency signal. A plurality of pins arranged in the arrangement direction including a plurality of non-high frequency signal pins, wherein the plurality of high frequency signal pins include a plurality of first pins continuously arranged in the arrangement direction, It is characterized in that none of the plurality of non-high frequency signal pins is interposed between the plurality of first pins and the metal member.

According to the present invention, the radiation amount of noise can be reduced.

(A) And (b) is a perspective view of the imaging device which is an example of the electronic device concerning a 1st embodiment. (A) And (b) is a perspective view which shows the radio|wireless communication apparatus which concerns on 1st Embodiment. FIG. 3A is a block diagram of the wireless communication device according to the first embodiment. (B) is an explanatory view of the harness according to the first embodiment. (A) And (b) is sectional drawing which shows the connection structure of the connector of the harness which concerns on 1st Embodiment, and the connector of an image processing unit. It is explanatory drawing of the structure of the connector which concerns on 1st Embodiment. It is a top view of a communication module concerning a 1st embodiment. FIG. 11 is a cross-sectional view showing a connection structure between a connector of a harness of Modification 1 and a connector of an image processing unit. It is a top view of the communication module of the modification 2. (A) is a sectional view showing a connection structure of a connector of a harness and a connector of an image processing unit concerning a 2nd embodiment. (B) is a cross-sectional view showing a connection structure between a connector of a harness of Modification 3 and a connector of an image processing unit. It is explanatory drawing of the image processing unit in the communication module which concerns on 3rd Embodiment. It is a figure which shows the simulation model of the communication module of an Example. (A) And (b) is sectional drawing of the connector part in an Example. (A)-(e) is sectional drawing of the connector part which shows the wiring structure of the simulation model simulated in the Example.

[First Embodiment]
FIG. 1A and FIG. 1B are perspective views of an image pickup apparatus 100 that is an example of the electronic apparatus according to the first embodiment. FIG. 1A is a perspective view of the image pickup apparatus 100 when the image pickup apparatus 100 is viewed from the liquid crystal screen 301 side. FIG. 1B is a perspective view of the image pickup apparatus 100 when the image pickup apparatus 100 is viewed from the lens barrel 302 side. The image capturing apparatus 100 is a digital camera and has a function of capturing a still image and/or a moving image. The imaging device 100 has a housing 101 that is an outer case, a liquid crystal screen 301 provided on the housing 101, and a grip 304 provided on the housing 101. The grip 304 is provided with a shutter button 303. A lens barrel 302 is attachable to and detachable from the housing 101.

A memory connector 162 having a slot 162A is arranged inside the housing 101. A memory card 110, which is a memory such as an SD card or a CF card, can be attached to and detached from the slot 162A of the memory connector 162. By removing a lid (not shown) from the housing 101, the slot 162A of the memory connector 162 is exposed to the outside of the housing 101. By inserting the memory card 110 into the slot 162A, the image data obtained by imaging can be written in the memory card 110 and the image data written in the memory card 110 can be read.

FIG. 2A and FIG. 2B are perspective views showing the wireless communication device arranged inside the housing of the imaging device according to the first embodiment. FIG. 3A is a block diagram of the wireless communication device according to the first embodiment. FIG.3(b) is explanatory drawing of a harness. The imaging device 100 includes a housing 101 and a wireless communication device 102 arranged inside the housing 101. 2A is a perspective view of the wireless communication device 102 viewed from the same direction as FIG. 1A, and FIG. 2B is a perspective view of the wireless communication device 102 viewed from the same direction as FIG. 1B. FIG.

The wireless communication device 102 includes an imaging unit 130, an image processing unit 140, a wireless communication unit 150, and an accessory unit 160. The image processing unit 140 is electrically connected to the imaging unit 130, the wireless communication unit 150, and the accessory unit 160 so that they can communicate with each other. The image processing unit 140 and the accessory unit 160 are communicably connected to each other by a harness 201 including a plurality of lines. The image processing unit 140 and the imaging unit 130 are communicably connected to each other by a harness 202 including a plurality of lines. The image processing unit 140 and the wireless communication unit 150 are communicably connected to each other by a harness 203 including a plurality of lines.

A support member 108 made of resin or metal is arranged inside the housing 101, and the imaging unit 130, the image processing unit 140, the wireless communication unit 150, and the accessory unit 160 are supported by the support member 108. ing. The imaging unit 130 is arranged on the lens barrel 302 side shown in FIG. 1B with respect to the support member 108. The image processing unit 140 is fixed to the support member 108 with a fixing member 105 such as a screw.

The imaging unit 130 includes a wiring board 131, an imaging element 132 that is a semiconductor device mounted on the wiring board 131, and a connector 133 mounted on the wiring board 131. Wiring board 131 is a printed wiring board. The image sensor 132 is an image sensor such as a CMOS image sensor or a CCD image sensor. The image sensor 132 photoelectrically converts the incident optical image and outputs a data signal which is a digital signal indicating a captured image. The connector 133 is electrically connected to the image sensor 132 by the wiring of the wiring board 131.

The wireless communication unit 150 performs wireless communication in the GHz band. The wireless communication unit 150 is a modularized wireless communication module. The wireless communication unit 150 has a wiring board 151 provided with an antenna 153 and a wireless communication IC 152 mounted on the wiring board 151. Wiring board 151 is a printed wiring board. Further, the wireless communication unit 150 has a connector 154 mounted on the wiring board 151 and electrically connected to the wireless communication IC 152 by the wiring of the wiring board 151. The wireless communication IC 152 transmits and receives image data by wirelessly communicating with an external device such as a PC or a wireless router via the antenna 153. That is, the wireless communication IC 152 modulates a digital signal indicating image data, and transmits the modulated digital signal from the antenna 153 as a radio wave having a communication frequency of a wireless standard. Further, the wireless communication IC 152 demodulates the radio wave received by the antenna 153 into a digital signal indicating image data. The wireless communication IC 152 wirelessly communicates with an external device based on, for example, the WiFi (registered trademark) standard. In the first embodiment, the case where the wireless communication unit 150, that is, the wireless communication IC 152 performs wireless communication according to the WiFi (registered trademark) standard will be described, but the wireless communication unit is not limited to this wireless communication standard. .. For example, it may be a Bluetooth (registered trademark) standard.

The image processing unit 140 includes a wiring board 141 and an image processing IC 142 mounted on the wiring board 141. Wiring board 141 is a printed wiring board. Further, the image processing unit 140 has connectors 143, 144, 145 mounted on the wiring board 141 and electrically connected to the image processing IC 142 by the wiring of the wiring board 141.

The accessory unit 160 has a wiring board 161 and the above-mentioned memory connector 162 mounted on the wiring board 161. Wiring board 161 is a printed wiring board. Further, the accessory unit 160 has a connector 163 mounted on the wiring board 161 and electrically connected to the memory connector 162 by the wiring of the wiring board 161.

The first end of the harness 201 is attached to the connector 143 of the image processing unit 140, and the second end of the harness 201 is attached to the connector 163 of the accessory unit 160. The connector 144 of the image processing unit 140 is attached with the first end of the harness 202, and the connector 133 of the imaging unit 130 is attached with the second end of the harness 202. The first end of the harness 203 is attached to the connector 145 of the image processing unit 140, and the second end of the harness 203 is attached to the connector 154 of the wireless communication unit 150.

The data signal communicated through the harness 201 between the image processing unit 140 and the accessory unit 160 is a high frequency signal, for example, a digital signal having a communication speed of 100 [Mbps] or more. This data signal is a digital signal of image data in the first embodiment. This data signal may be either a single-ended signal or a differential signal, but in the first embodiment, it is a differential signal that enables higher-speed transmission than the single-ended signal.

The image processing IC 142 and the memory card 110 communicate with each other in accordance with the PCI Express (registered trademark) standard, more specifically, the PCI Express (registered trademark) 2.0 standard. That is, the interface in the communication network between the image processing IC 142 and the memory card 110 is based on the PCI Express (registered trademark) 2.0 standard. Although the case where the communication method between the image processing IC 142 and the memory card 110 is PCI Express (registered trademark) 2.0 has been described, the invention is not limited to this. For example, it may be a communication method of another standard such as Serial ATA, USB, HDMI (registered trademark) or a communication method of a different transfer speed.

The image processing IC 142 can acquire a digital signal, which is an electric signal indicating a captured image, from the image sensor 132, perform image processing, and generate image data. Further, the image processing IC 142 can perform a process of writing the image data in the memory card 110 and a process of reading the image data from the memory card 110. Furthermore, the image processing IC 142 can perform processing of acquiring image data from the wireless communication IC 152 and processing of sending image data to the wireless communication IC 152.

In the first embodiment, as shown in FIG. 3A, the image processing unit 140, the accessory unit 160, and the harness 201 constitute a communication module 170. The image processing IC 142 of the image processing unit 140 shown in FIGS. 2A and 2B is a semiconductor device as an example of an electric component. The memory connector 162 of the accessory unit 160 is an example of an electric component. The harness 201 includes a data signal line, that is, a data signal transmission line that is a digital signal indicating image data. Further, the harness 201 includes lines other than the data signal line, for example, lines other than the data signal transmission line such as a control line, a power line, and a ground line. Note that another signal may be added to the data signal transmitted through the transmission line that is the data signal line. Another signal is, for example, a synchronization signal.

When transferring a digital signal using the harness 201, a shielded cable is used for the harness 201 in order to prevent electromagnetic noise from being emitted or to prevent external electromagnetic noise from being superimposed on the digital signal. As shown in FIG. 3B, the harness 201 is provided at the cable portion 210, the connector 211 provided at the first end of the cable portion 210 in the longitudinal direction, and the connector 211 provided at the second end of the cable portion 210 in the longitudinal direction. Connector 212.

The connector 211 of the harness 201 shown in FIG. 3B can be attached to and detached from the connector 143 of the image processing unit 140 shown in FIG. The connector 212 of the harness 201 shown in FIG. 3B can be attached to and detached from the connector 163 of the accessory unit 160 shown in FIG. 2B. The connector structure of the accessory unit 160 is similar to that of the image processing unit 140. Hereinafter, the connector structure of the image processing unit 140 will be described, and the connector structure of the accessory unit 160 will not be described.

4A and 4B are cross-sectional views showing a connection structure between the connector 211 of the harness 201 and the connector 143 of the image processing unit 140 according to the first embodiment. FIG. 4A is a cross-sectional view of the connector 211 removed from the connector 143. FIG. 4B is a cross-sectional view of the connector 211 attached to the connector 143. The wiring board 141 is provided with a connector 143 which is a first connector. The harness 201 has a connector 211, which is a second connector, provided at the end of the cable portion 210 in the longitudinal direction.

The connector 143 has a plurality of, for example, eight pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 ₈ arranged in a line in the Y direction which is the arrangement direction. The connector 143 is a pin 408 ₁ a ground terminal 407 _1, which is an example of a metal member disposed adjacent in the Y direction, the pin 408 ₈ is an example of a metal member disposed adjacent in the Y direction It has a ground terminal 407 _2. That is, the eight pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 ₈ are arranged between the ground terminal 407 ₁ and the ground terminal 407 ₂ . In the first embodiment, the ground terminal 407 ₁ is an example of a first metallic member, the ground terminal 407 ₂ is an example of the second metal member.

The wiring board 141 has a ground wiring 4G. On the main surface 141A of the wiring board 141, a plurality of, for example, eight conductor patterns 41 ₁ , 41 ₂ , 41 ₃ , 41 ₄ , 41 ₅ , 41 ₆ , 41 _7, and 41 ₈ and a part of the ground wiring 4G are provided. A ground pattern 41G, which is a conductor pattern, is formed. That is, the conductor patterns 41 ₁ , 41 ₂ , 41 ₃ , 41 ₄ , 41 ₅ , 41 ₆ , 41 ₇ and 41 ₈ and the ground pattern 41G are arranged on the first conductor layer of the wiring board 141. The first conductor layer is the first surface layer 1101 of the first surface layer 1101 and the second surface layer opposite to the first surface layer 1101.

Each of the pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 ₈ of the connector 143 is a conductor pattern 41 ₁ , 41 ₂ , 41 ₃ , 41 ₄ , 41 of the wiring board 141. ₅ , 41 ₆ , 41 ₇ and 41 ₈ are joined by solder or the like. Accordingly, the pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 ₈ of the connector 143 are connected to the conductor patterns 41 ₁ , 41 ₂ , 41 ₃ , 41 of the wiring board 141. ₄ , 41 ₅ , 41 ₆ , 41 ₇ and 41 ₈ are electrically connected. Ground terminal 407 ₁ and the ground terminal 407 ₂ of the connector 143 is joined by soldering or the like to both the ground pattern 41G of the circuit board 141. Thus, the ground terminal 407 ₁ and the ground terminal 407 ₂ is electrically connected to the ground pattern 41G. The pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 ₈ and the ground terminals 407 ₁ and 407 ₂ are supported by an insulating member (not shown). Ground terminals 407 ₁ and 407 _2, as the metal case 410 to be described later is attachable, are erected on the ground pattern 41G of the circuit board 141. The ground terminal 407 ₁ has an engaging portion 409 ₁ , and the ground terminal 407 ₂ has an engaging portion 409 ₂ .

The cable part 210 has a plurality of, for example, eight coaxial cables 220 ₁ , 220 ₂ , 220 ₃ , 220 ₄ , 220 ₅ , 220 ₆ , 220 ₇ and 220 ₈ . Each of the coaxial cables 220 ₁ , 220 ₂ , 220 ₃ , 220 ₄ , 220 ₅ , 220 ₆ , 220 ₇ and 220 ₈ is a shielded cable and includes a core wire 221, an insulating layer 222 covering the core wire 221, and an insulating layer. An outer conductor 223 that is a metal shield that covers 222. The outer conductor 223 is a conductor for shielding noise radiated from the core wire 221 and shielding noise coming from the outside.

The connector 211 has a metal case 410 which is an example of a fourth metal member. The plurality of coaxial cables 220 are supported by an insulating member (not shown) attached to the metal case 410. The metal case 410 has a U-shaped cross section. The outer conductors 223 of the eight coaxial cables are brought into contact with or joined to the metal case 410 to be electrically connected together. The metal case 410 has two engaging portions 411 ₁ and 411 ₂ that are end portions in the Y direction. The engaging portion 411 ₁ of the metal case 410 engages (contacts) with the engaging portion 409 ₁ of the ground terminal 407 ₁ , and the engaging portion 411 ₂ of the metal case 410 engages with the engaging portion 409 ₂ of the ground terminal 407 _2. By mating (contacting), the connector 211 is attached to the connector 143. That is, by attaching the connector 211 to the connector 143, the metal case 410 and the ground terminal 407 ₁ and 407 ₂ and are electrically connected.

FIG. 5 is an explanatory diagram of a structure of the connector 211 of the harness 201 and the connector 143 of the image processing unit 140 according to the first embodiment. In FIG. 5, the harness 201 is shown in an exploded manner. In FIG. 5, the shaded portion is resin. In FIG. 5, for convenience, only one of the eight coaxial cables 220 ₁ , 220 ₂ , 220 ₃ , 220 ₄ , 220 ₅ , 220 ₆ , 220 ₇ and 220 ₈ that serves as a data signal transmission line is used. Illustrated. In addition, in FIG. 5, for convenience, only one of the eight pins 408 ₁ , 408 ₂ , 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ and 408 _{8 serving} as a data signal transmission line is 408. Illustrated. Further, in FIG. 5, for the sake of convenience, one of the eight conductor patterns 41 ₁ , 41 ₂ , 41 ₃ , 41 ₄ , 41 ₅ , 41 ₆ , 41 ₇ and 41 ₈ that serves as a data signal transmission line is shown. Only 41 is shown.

When the connector 211 is attached to the connector 143, as shown in FIG. 5, the connector 211 is opposed to the connector 143 and moved in the Z direction perpendicular to the main surface 141A. As a result, the pin 408 and the core wire 221 are brought into contact with each other to be electrically connected, and a data signal transmission line is formed including the conductor pattern 41 of the wiring board 141, the pin 408, and the core wire 221 of the harness 201. It By mounting the connector 211 on the connector 143, the engaging portion 411 ₁ of the metal case 410 and the engaging portion 409 _{1 of the} connector 143 engage (contact) with each other, and the engaging portion 411 ₂ of the metal case 410 and the connector 143. and the engaging portion 409 ₂ of engagement (contact). As a result, the metal case 410 is electrically connected to the ground pattern 41G of the wiring board 141.

As shown in FIG. 5, when the signal current I _S passes through the core wire 221 in the direction indicated by the chain line, it flows from the core wire 221 to the pin 408 and from the pin 408 to the conductor pattern 41 in the connectors 143 and 211. On the other hand, the return current I _{R of the} signal bypasses the ground pattern 41G from the ground terminal 407 ₁ or 407 ₂ and the metal case 410 as shown by the chain double-dashed line, and is separated from the signal current I _S along the outer conductor 223. It will flow in the opposite direction. Therefore, the path of the return current I _R is amount that the return current I _R is bypassed in the connection portion between the connector 211 and the connector 143 is longer than the path of the signal current I _S. A path of the signal current I _S, if there is a difference in path length between the path of the return current I _R, the phase difference between the signal current I _S and the return current I _R is produced. The greater the phase difference, the greater the amount of radiated electromagnetic noise.

When transmitting a high-speed data signal through a harness, radiated electromagnetic noise may exist in the same band as a wireless communication frequency. In this case, when the electromagnetic noise is received by the wireless communication IC 152 via the antenna 153 shown in FIG. 2B, the higher the received noise level, the lower the wireless communication speed. In particular, as shown in FIG. 2B, when a part of the harness 201 is arranged close to one side surface of the housing 101, the distance between the harness 201 which is a noise source and the wireless communication unit 150 which is a damaged circuit. , The wireless communication IC 152 is easily affected by electromagnetic noise.

In the first embodiment, the cable section 210 shown in FIGS. 4A and 4B includes four coaxial cables that serve as data signal transmission lines and four other coaxial cables. That is, the connector 143 includes four pins which are transmission lines for data signals and four other pins.

The pin 408 ₁ and the pin 408 ₂ are arranged adjacent to each other. Each of the pins 408 ₁ and 408 ₂ is a first pin which is a transmission line of a data signal which is a differential signal. A pin group 421 ₁ is configured by the pins 408 ₁ and 408 ₂ arranged continuously in the Y direction. The pin 408 ₇ and the pin 408 ₈ are arranged adjacent to each other. Each of the pins 408 ₇ and 408 ₈ is a second pin which is a transmission line of a data signal which is a differential signal. A pin group 421 ₂ is composed of the pins 408 ₇ and 408 ₈ which are continuously arranged in the Y direction. The plurality of pins 408 ₁ , 408 ₂ , 408 ₇ and 408 ₈ are a plurality of high frequency signal pins used for transmitting a high frequency signal. The pin 408 ₃ , pin 408 ₄ , pin 408 ₅ , and pin 408 ₆ are arranged adjacent to each other. Each of the pin 408 ₃ , the pin 408 ₄ , the pin 408 ₅ , and the pin 408 ₆ is a non-high frequency signal pin used for a purpose other than the transmission of the high frequency signal, that is, a line other than the data signal transmission line. A pin group 422 is configured by the pins 408 ₃ , 408 ₄ , pins 408 ₅ , and 408 ₆ which are continuously arranged in the Y direction.

The conductor pattern 41 ₁ electrically connected to the pin 408 ₁ is a data signal line which is a data signal transmission line. Electrically connected to the conductor pattern 41 ₂ to pin _{408. 2} is a data signal line. The conductor pattern 41 ₃ electrically connected to the pin 408 ₃ is a wiring other than the data signal line. Pin 408 ₄ conductor pattern 41 ₄ electrically connected to is a wiring other than the data signal line. Pin 408 ₅ conductor patterns 41 ₅ electrically connected to is a wiring other than the data signal line. Pin 408 ₆ conductor pattern 41 ₆ electrically connected to is a wiring other than the data signal line. Conductor patterns 41 ₇ electrically connected to the pin _{408. 7} is a data signal line. The conductive pattern 41 ₈ electrically connected to the pin _{408. 8} is a data signal line.

Ground terminal 407 ₁ is close from the pin group 422 in pin group 421 _1. Ground terminal 407 ₂ is close from the pin group 422 in pin group 421 _2. That is, the pin group 421 ₁ is arranged near the ground terminal 407 ₁ , and the pin group 421 ₂ is arranged near the ground terminal 407 ₂ . This makes it possible to reduce the path difference, that is, the phase difference between the signal current passing through each of the pins 408 ₁ and 408 ₂ forming the pin group 421 ₁ and the return current with respect to the signal current. The radiated electromagnetic noise can be reduced. Similarly, the path difference, that is, the phase difference between the signal current passing through each of the pins 408 ₇ and 408 ₈ forming the pin group 421 ₂ and the return current with respect to the signal current can be reduced, and due to the phase difference, The radiated electromagnetic noise can be reduced. Since the electromagnetic noise radiated is reduced, the wireless communication unit 150 stabilizes the wireless communication speed.

The ground terminal 407 ₁ is adjacent to the pin 408 ₁ located at the end in the Y direction of the pin group 421 ₁ , and there is no other pin between the ground terminal 407 ₁ and the pin 408 ₁ . That is, none of the plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , and 408 ₆ is interposed between the ground terminal 407 ₁ and the pin 408 ₁ . The ground terminal 407 ₂ is adjacent to the pin 408 ₈ located at the end in the Y direction of the pin group 421 ₂ , and no other pin exists between the ground terminal 407 ₂ and the pin 408 ₈ . That is, between the ground terminal 407 ₂ and pin 408 _8, a plurality of pins _{408 3,} 408 4, 408 _5, and 408 none ₆ not interposed. Thereby, the path difference between the signal current and the return current, that is, the phase difference can be effectively reduced, and the radiated electromagnetic noise can be effectively reduced.

In the first embodiment, the connector 143 has the two pin groups 421 ₁ and 421 ₂ and the two ground terminals 407 ₁ and 407 ₂ as described above. The two pin groups 421 ₁ and 421 ₂ are arranged side by side in the Y direction with the pin group 422 interposed therebetween. The two ground terminals 407 ₁ and 407 ₂ are arranged side by side in the Y direction with the two pin groups 421 ₁ and 421 ₂ and the pin group 422 interposed therebetween. That is, the pin group 422 is arranged at the center in the Y direction, and the pin groups 421 ₁ and 421 ₂ are arranged at the ends in the Y direction. With such a pin arrangement, the return current is evenly distributed to the ground terminals 407 ₁ and 407 ₂ on both sides, and the radiated electromagnetic noise can be effectively reduced.

The difference in the number of pins between the _two pin groups 421 ₁ and 421 ₂ is preferably 0. Accordingly, two ground respectively the return current of the terminals 407 ₁ and 407 ₂ are evenly distributed, it is possible to effectively reduce the electromagnetic noise emitted. Since the number of pins of the pin group 421 ₁ is an even number and the number of pins of the pin group 421 ₂ is an even number, the difference in the number of pins is 0, but one of the pin group 421 ₁ and the pin group 421 ₂ is If the number of pins is even and the number of other pins is odd, the difference in the number of pins is preferably 1. When the number of pins on one side is odd and the number of pins on the other side is odd, it is preferable that the difference in the number of pins is zero.

The case where the number of data signal lines is four has been described above as an example, but the number of data signal lines is not limited to this and may be two or more. Further, when the data amount increases like image data, it is preferable that the number is four or more. As the number of data signal lines increases, the path length of the return current tends to increase. Therefore, by distributing the data signal lines to the two pin groups 421 ₁ and 421 _{2 as} in the first embodiment, the radiation The electromagnetic noise generated can be effectively reduced.

The structure of the connector 212 of the harness 201 of FIG. 3B is similar to that of the connector 211 shown in FIGS. 4A and 4B, and the structure of the connector 163 of the accessory unit 160 of FIG. , Connector 143 shown in FIGS. 4(a) and 4(b). Therefore, even in the connection structure between the connector 163 and the connector 212, radiated electromagnetic noise can be effectively reduced.

As a measure for reducing electromagnetic noise emitted from the cable portion 210, a ring-shaped ferrite core surrounding the cable portion 210 may be provided. However, since the cable portion 210 has the outer conductor 223, the ferrite core can be omitted. Is. Since the ferrite core is omitted, the device can be downsized.

FIG. 6 is a plan view of the communication module 170 according to the first embodiment. In the wiring board 141 shown in FIG. 6, the data signal line 103 which is the first wiring connected to each of the pins 408 ₁ , 408 ₂ , 408 ₇ and the pin 408 ₈ of FIG. 4A is shown by a solid line. Further, in the wiring board 141 shown in FIG. 6, the wiring 104, which is the second wiring other than the data signal line 103, is connected to the pins 408 ₃ , 408 ₄ , 408 ₅ , and 408 ₆ of FIG. 4A. It is indicated by a broken line. The data signal line 103 is illustrated as conductor patterns 41 ₁ , 41 ₂ , 4 ₁₇ and 41 _{8 in} FIG. 4A. Line 104 is shown as a conductor pattern _{41 3,} 41 4, 41 ₅ and 41 ₆ in FIG. 4 (a). In the wiring board 141, the data signal line 103 is arranged on the first surface layer 1101 which is the first conductor layer on which the connector 143 is mounted. The shorter the data signal line 103 is, the better. In the first embodiment, it is arranged only on the first surface layer 1101. In order to make the pins of the connector 143 have the pin arrangements shown in FIGS. 4A and 4B, the wirings 104 other than the data signal line 103 are provided on the first surface layer 1101 and a second surface layer different from the first surface layer 1101. It is arranged across two conductor layers, for example, the inner layer or the second surface layer. The wiring board 161 also has the same wiring structure as the wiring board 141. In this way, the wiring 104 on the wiring board 141 may be arranged over the conductor layers other than the first surface layer 1101 depending on the pin arrangement of the image processing IC 142.

[Modification 1]
FIG. 7 is a cross-sectional view showing a connection structure between the connector of the harness of the first modification and the connector of the image processing unit. The structure of the connector 143, which is the first connector, and the structure of the connector 211, which is the second connector, of Modification 1 are the same as those of the first embodiment, but the usage of each pin is different. As shown in FIG. 7, the connector 143 includes a plurality of pins ₄₀₈ 1-408 _8. The plurality of high frequency signal pins included in the plurality of pins 408 _{1 to} 408 ₈ are composed of pins 408 ₁ and 408 ₂ . The plurality of pins 408 ₁ and 408 ₂ are the first pins continuously arranged in the Y direction. The plurality of pins 408 ₁ and 408 ₂ are data signal transmission lines. A plurality of pins 408 ₁ and 408 _{2 form} a pin group 421. In this case, the plurality of non-high frequency signal pins included in the plurality of pins 408 _{1 to} 408 ₈ are the plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₇ , which are continuously arranged in the Y direction. _It consists of ₈ . A plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , and 408 _{8 form} a pin group 422. Of the ground terminals 407 ₁ and 407 ₂ , the ground terminal 407 ₁ corresponds to the metal member.

As shown in FIG. 7, it is preferable that the pin group 421 and the ground terminal 407 ₁ are adjacent to each other. That is, none of the plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , and 408 ₈ is interposed between the pin group 421 and the ground terminal 407 ₁ .

[Modification 2]
FIG. 8 is a plan view of the communication module according to the second modification. In the wiring board 141 shown in FIG. 8, the data signal line 103 that is the first wiring connected to each of the pins 408 ₁ , 408 ₂ , 408 ₇ , and 408 ₈ is shown by a solid line. In the wiring board 141 shown in FIG. 8, the wiring 104, which is the second wiring other than the data signal line 103 and is connected to the pins 408 ₃ , 408 ₄ , 408 ₅ , and 408 ₆ , is indicated by a broken line. The pin arrangement of the image processing IC 142 may be matched with the pin arrangement of the connector 143. Thereby, the wiring 104 can be arranged only on the first surface layer 1101, and it is not necessary to arrange the wiring 104 on another conductor layer of the wiring board 141, so that the wiring structure is simplified. Thereby, the wiring board 141 can be downsized.

[Second Embodiment]
The pin arrangement of the connector according to the second embodiment will be described. FIG. 9A is a cross-sectional view showing the connection structure between the connector of the harness according to the second embodiment and the connector of the image processing unit. In the second embodiment, the description of the same configuration as the first embodiment will be omitted.

A first connector, connector 143B of the image processing unit includes a plurality arranged in a line in the Y direction which is the arrangement direction, having a pin ₄₀₈ 1-408 _20, for example 20. The connector 143B is similar to the first embodiment, has a ground terminal 407 ₂ is one example of which is an example ground terminal 407 ₁ and the second metal member of the first metal member. Furthermore, the connector 143B is a ground pattern 41G is part of the ground wire 4G are joined by solder or the like is electrically connected to the ground pattern 41G, has a ground terminal 407 ₃ is an example of a third metal member. Ground terminal 407 _3, between the ground terminal 407 ₁ and the ground terminal 407 _2, the second embodiment is arranged in the center portion of the Y-direction in the connector 143B.

The cable portion of the harness includes a plurality of, for example, 20 coaxial cables 220. The harness connector 211B includes a metal case 410B that is an example of a fourth metal member. The plurality of coaxial cables 220 are supported by an insulating member (not shown) attached to the metal case 410B. The outer conductors of the 20 coaxial cables 220 are brought into contact with or joined to the metal case 410B to be electrically connected together. Metal case 410B includes a Y-direction of the two engaging portions ₄₁₁ 1 is an end, 411 _2, the engaging portion 411 ₃ in the center portion of the Y direction. When the connector 211B is attached to the connector 143B, the engaging portion 411 ₁ contacts the ground terminal 407 ₁ , the engaging portion 411 ₂ contacts the ground terminal 407 ₂ , and the engaging portion 411 ₃ contacts the ground terminal 407 ₃ , respectively.

The plurality of pins 408 _{1 to} 408 ₂₀ include a plurality of high frequency signal pins 408 ₁ , 408 ₂ , 408 ₉ , 408 ₁₀ , 408 ₁₁ , 408 ₁₂ , 408 ₁₉ , 408 ₂₀ . Further, the plurality of pins 408 _{1 to} 408 ₂₀ are the plurality of non-high frequency signal pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₈ , 408 ₁₃ , 408 ₁₄ , 408 ₁₅ , 408 _16. , 408 ₁₇ , and 408 ₁₈ are included.

The plurality of pins 408 ₁ and 408 ₂ are continuously arranged in the Y direction. Each of the plurality of pins 408 ₁ and 408 ₂ is a first pin that is a transmission line of a data signal that is a differential signal. The pin group 421 ₁ is configured by the pins 408 ₁ and 408 ₂ . The plurality of pins 408 ₁₉ and 408 ₂₀ are continuously arranged in the Y direction. Each of the plurality of pins 408 ₁₉ and 408 ₂₀ is a second pin that is a transmission line of a data signal that is a differential signal. The pins 408 ₁₉ and the pins 408 _{20 form} a pin group 421 ₂ .

The plurality of pins 408 ₉ and 408 ₁₀ are continuously arranged in the Y direction. Each of the plurality of pins 408 ₉ and 408 ₁₀ is a third pin that is a transmission line of a data signal that is a differential signal. The pins 408 ₉ and 408 _{10 form} a pin group 421 ₃ . The plurality of pins 408 ₁₁ and 408 ₁₂ are continuously arranged in the Y direction. Each of the plurality of pins 408 ₁₁ and 408 ₁₂ is a fourth pin that is a transmission line of a data signal that is a differential signal. The pins 408 ₁₁ and the pins 408 _{12 form} a pin group 421 ₄ .

The pin group 421 ₁ is arranged adjacent to the ground terminal 407 ₁ , and the pin group 421 ₂ is arranged adjacent to the ground terminal 407 ₂ . The two pin groups 421 ₃ and 421 ₄ are arranged side by side in the Y direction with one ground terminal 407 ₃ interposed therebetween. The two pin groups 421 ₃ and 421 ₄ are arranged adjacent to the ground terminal 407 ₃ .

The plurality of pins 408 _{3 to} 408 ₈ are continuously arranged in the Y direction. A plurality of pins 408 _{3 to} 408 _{8 form} a pin group 422 ₁ . The plurality of pins 408 _{13 to} 408 ₁₈ are continuously arranged in the Y direction. A plurality of pins 408 _{13 to} 408 _{18 form} a pin group 422 ₂ . The pin group 422 ₁ is arranged between the pin group 421 ₁ and the pin group 421 ₃ . A pin group 422 ₂ is arranged between the pin group 421 ₄ and the pin group 421 ₂ .

That is, between the ground terminal 407 ₁ and the pin group 421 ₁ , a plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₈ , 408 ₁₃ , 408 ₁₄ , 408 ₁₅ , 408 ₁₆ , Neither 408 ₁₇ nor 408 ₁₈ is interposed. In addition, a plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₈ , 408 ₁₃ , 408 ₁₄ , 408 ₁₅ , 408 ₁₆ , between the ground terminal 407 ₂ and the pin group 421 ₂ . Neither 408 ₁₇ nor 408 ₁₈ is interposed. In addition, a plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₈ , 408 ₁₃ , 408 ₁₄ , 408 ₁₅ , 408 ₁₆ , between the ground terminal 407 ₃ and the pin group 421 ₃ . Neither 408 ₁₇ nor 408 ₁₈ is interposed. A plurality of pins 408 ₃ , 408 ₄ , 408 ₅ , 408 ₆ , 408 ₇ , 408 ₈ , 408 ₁₃ , 408 ₁₄ , 408 ₁₅ , 408 ₁₆ , 408 ₁₇ are provided between the ground terminal 407 ₃ and the pin group 421 _4. , 408 ₁₈ is not present.

As described above, when the engaging portion 411 ₃ is provided at the center of the metal case 410B in the Y direction, the pin groups 421 ₃ and 421 ₄ are adjacent to the ground terminal 407 ₃ that engages with the engaging portion 411 _3. May be arranged. By placing close to each pin group 421 _3, and 421 ₄ to the ground terminal 407 _3, the path difference between the signal current passing through each pin constituting the pin group 421 _3, and 421 _4, the return current to the signal current, i.e., The phase difference can be reduced. Therefore, the electromagnetic noise emitted due to the phase difference can be reduced. Since the radiated electromagnetic noise is reduced, the wireless communication speed becomes stable in the wireless communication unit 150 of FIG.

The difference in the number of pins between the two pin groups 421 ₃ and 421 ₄ is preferably 0. Thereby, each pin in the two pin groups 421 ₃ and 421 ₄ can be brought as close as possible to the ground terminal 407 ₃ , and the radiated electromagnetic noise can be effectively reduced. Since the number of pins of the pin group 421 ₃ is an even number and the number of pins of the pin group 421 ₄ is an even number, the difference in the number of pins is 0, but one of the pin group 421 ₃ and the pin group 421 ₄ is If the number of pins is even and the number of other pins is odd, the difference in the number of pins is preferably 1. When the number of pins on one side is odd and the number of pins on the other side is odd, it is preferable that the difference in the number of pins is zero.

[Modification 3]
FIG. 9B is a cross-sectional view showing a connection structure between the connector of the harness of Modification 3 and the connector of the image processing unit. The structure of the connector 143B, which is the first connector, and the structure of the connector 211B, which is the second connector, of Modification 3 are the same as those of the second embodiment, but the usage of each pin is different. As shown in FIG. 9B, the connector 143B has a plurality of pins 408 _{1 to} 408 ₂₀ . Among the plurality of pins 408 _{1 to} 408 ₂₀ , the plurality of pins 408 ₉ , 408 ₁₀ , 408 ₁₁ , 408 ₁₂ are a plurality of high frequency signal pins. Other plurality of pins ₄₀₈ 1-408 _{8, 408} 13 to 408 ₂₀ are a plurality of non-high-frequency signal pin. Of the ground terminals 407 ₁ , 407 ₂ , and 407 ₃ , the ground terminal 407 ₃ corresponds to the metal member adjacent to the high frequency signal pin.

The plurality of pins 408 ₉ and 408 ₁₀ are continuously arranged in the Y direction. A plurality of pins 408 ₉ and 408 _{10 form} a pin group 421 ₃ . The plurality of pins 408 ₁₁ and 408 ₁₂ are continuously arranged in the Y direction. A plurality of pins 408 ₁₁ and 408 _{12 form} a pin group 421 ₄ . The pin group 421 ₄ is arranged on the opposite side of the pin group 421 ₃ with the ground terminal 407 ₃ interposed therebetween. That is, the ground terminal 407 ₃ is arranged so as to be sandwiched between the pin groups 421 ₃ and 421 ₄ .

The plurality of pins 408 _{1 to} 408 ₈ are continuously arranged in the Y direction. A plurality of pins 408 _{1 to} 408 _{8 form} a pin group 422 ₁ . The plurality of pins 408 _{13 to} 408 ₂₀ are continuously arranged in the Y direction. A plurality of pins 408 _{13 to} 408 _{20 form} a pin group 422 ₂ . Pin group 422 ₂ is disposed on the opposite side to the pin group 422 ₁ across the ground terminal 407 _3.

Pin groups 421 ₃ and 421 ₄ are arranged adjacent to the ground terminal 407 ₃ . That is, between the ground terminal 407 ₃ and the pin group 421 _3, and between the ground terminal 407 ₃ and the pin group 421 ₄ , other pins, that is, a plurality of pins 408 _{1 to} 408 ₈ and 408 _{13 to} 408 _20. None of them intervene. In this case, the pin included in each of the pin groups 421 ₃ and 421 ₄ is the first pin.

Also in the third modification, the engaging portion 411 ₃ is provided at the center of the metal case 410B in the Y direction, and the pin groups 421 ₃ and 421 ₄ are provided adjacent to the ground terminal 407 ₃ that engages with the engaging portion 411 _3. It is arranged. By placing close to each pin group 421 _3, and 421 ₄ to the ground terminal 407 _3, the path difference between the signal current passing through each pin constituting the pin group 421 _3, and 421 _4, the return current to the signal current, i.e., The phase difference can be reduced. Therefore, the electromagnetic noise emitted due to the phase difference can be reduced. Since the radiated electromagnetic noise is reduced, the wireless communication speed becomes stable in the wireless communication unit 150 of FIG.

The difference in the number of pins between the two pin groups 421 ₃ and 421 ₄ is preferably 0. Thereby, each pin in the two pin groups 421 ₃ and 421 ₄ can be brought as close as possible to the ground terminal 407 ₃ , and the radiated electromagnetic noise can be effectively reduced. Since the number of pins of the pin group 421 ₃ is an even number and the number of pins of the pin group 421 ₄ is an even number, the difference in the number of pins is 0, but one of the pin group 421 ₃ and the pin group 421 ₄ is If the number of pins is even and the number of other pins is odd, the difference in the number of pins is preferably 1. When the number of pins on one side is odd and the number of pins on the other side is odd, it is preferable that the difference in the number of pins is zero.

Note that, in the second embodiment and the third modification thereof, as shown in FIGS. 9A and 9B, there are pin groups 421 ₃ and 421 _{4 on} both sides of the ground terminal 407 _{3 in} the Y direction. Although explained, it is not limited to this. Either one of the pin groups 421 ₃ and 421 ₄ may be omitted.

[Third Embodiment]
The structure of the communication module according to the third embodiment will be described. In the third embodiment, the configuration of the wiring board of the image processing unit in the communication module is different from that in the first and second embodiments. FIG. 10 is an explanatory diagram of the image processing unit 140C in the communication module according to the third embodiment. The image processing unit 140C includes a wiring board 141C, and an image processing IC 142 and a connector 143 as in the first embodiment. The wiring board 141C is a printed wiring board. The image processing IC 142 and the connector 143 are provided on the wiring board 141C.

The wiring board 141C is a three-layer board in the third embodiment. Wiring board 141C includes a first surface layer 1101, a second surface layer 1103 opposite to first surface layer 1101, and an inner layer 1102. The first surface layer 1101 is a first conductor layer. The second surface layer 1103 is a second conductor layer different from the first conductor layer. The inner layer 1102 is a third conductor layer between the first conductor layer and the second conductor layer. These three conductor layers are arranged in the Z direction in the order of the first surface layer 1101, the inner layer 1102, and the second surface layer 1103. The image processing IC 142 and the connector 143 are mounted on the first surface layer 1101. An insulator layer (not shown) is provided between the first surface layer 1101 and the inner layer 1102, and an insulator layer (not shown) is provided between the inner layer 1102 and the second surface layer 1103. When the wiring board 141C is a substrate having four or more layers, the second conductor layer may be an inner layer.

The wiring board 141C has a plurality of data signal lines 103 that are the first wirings. Further, the wiring board 141C has a plurality of wirings 104 that are second wirings other than the data signal line 103. The data signal line 103 is illustrated as conductor patterns 41 ₁ , 41 ₂ , 4 ₁₇ and 41 _{8 in} FIG. 4A. Line 104 is shown as a conductor pattern _{41 3,} 41 4, 41 ₅ and 41 ₆ in FIG. 4 (a). The data signal line 103 is arranged only on the first surface layer 1101, and the wiring 104 is arranged across the first surface layer 1101 and the second surface layer 1103.

In the above-described first embodiment, the memory card 110 is attached to the memory connector 162 of the accessory unit 160, as shown in FIG. 6, for example. When a high speed signal is transmitted to the memory card 110, the control line is terminated in the wiring board 161.

On the other hand, the wiring board 161 may be provided with electronic parts such as an electronic viewfinder that performs high-speed transmission of signals and a strobe that does not perform high-speed transmission, which are accessories for the camera. When the electronic viewfinder is electrically connected to the connector 163, the strobe control line and the power line are not electrically connected to the connector 163, so that one side is a floating line with no termination. Floating wiring has high antenna efficiency.

The wiring 104 shown in FIG. 10 includes a strobe control line and a power supply line. In the third embodiment, the wiring board 141C has a ground pattern 41CG which is a part of the ground wiring and is arranged in the inner layer 1102 between the first surface layer 1101 and the second surface layer 1103. The ground pattern 41CG is, for example, a solid pattern, and when viewed in the Z direction perpendicular to the main surface of the wiring board 141C, that is, in a plan view, half or more, preferably 90% or more of the data signal line 103, and in the third embodiment. It overlaps with everything. The presence of the ground pattern 41CG can prevent electromagnetic coupling, that is, crosstalk, between the strobe control line or power supply line and the data signal line 103. Moreover, the noise level received by the antenna can be reduced by the structure of the connector similar to that of the first embodiment.

[Example]
As an example, a three-dimensional electromagnetic field simulation was performed using a simulation model of a communication module. A three-dimensional electromagnetic field simulator MW-STUDIO manufactured by CST was used for the calculation. FIG. 11 is a diagram showing a simulation model of the communication module of the embodiment. In the model of FIG. 11, the printed wiring board 601 on the data signal transmitting side and the printed wiring board 602 on the data signal receiving side are connected by two connector portions 603 and 20 shielded cables 604. There is. Each connector unit 603 includes a first connector and a second connector. Each of the printed wiring boards 601 and 602 is electrically connected to the metal plate 606 by columnar metal spacers 605 arranged at four corners thereof and having a height of 6.6 mm and a diameter of 4 mm. On the printed wiring boards 601 and 602, four data signal lines 607 are arranged in the central part of the connector, and wirings 608 other than the data signal lines 607 corresponding to control lines, power supply lines or ground lines are connected to the data signal lines 607. Are located on both sides of. The wiring 608 is connected to the ground pattern 609 on the printed wiring board 601 and connected to the ground pattern 610 on the printed wiring board 602. In the simulation, a wave source was set between the data signal line 607 of the printed wiring board 601 and the ground pattern 609, and the data signal line 607 was fed assuming the common mode due to the phase shift. The data signal line 607 of the printed wiring board 602 was terminated by disposing a resistance of 50Ω between the data signal line 607 and the ground pattern 610.

The dimensions of each part in FIG. 11 will be described. The printed wiring boards 601 and 602 were four-layer boards of 55 mm in the X direction and 70 mm in the Y direction. The data signal line 607 is arranged on the first conductor layer, that is, the surface layer. Solid conductor patterns of the ground were arranged on the second, third, and fourth conductor layers. The thickness of the first and fourth conductor layers was 0.1 mm, the thickness of the second and third conductor layers was 0.035 mm, and the material of the conductor was copper. The thickness of the insulator layer between the first layer and the second layer is 0.1 mm, the thickness of the insulator layer between the second layer and the third layer is 1.13 mm, the third layer. The thickness of the insulator layer between the fourth layer and the fourth layer was 0.1 mm, and the material of the insulator was FR4. The metal plate 606 was 242 mm in the X direction and 102 mm in the Y direction, and the material was copper. The length of the shielded cable 604 was 110 mm.

12A and 12B are cross-sectional views of the connector unit 603 in the embodiment. FIG. 12A is a diagram in which the connector portion 603 is cut along the YZ plane at the center of the connector portion 603. FIG. 12B is a diagram in which the connector portion 603 is cut along the XZ plane at the center of the connector portion 603. The diameter a of the core wire of the shielded cable 604 was 0.09 mm, and the material of the core wire was copper. The diameter b of the internal resin material of the shielded cable 604 was 0.28 mm, and the material of the internal resin material was Teflon (registered trademark). The diameter c of the outer conductor of the shielded cable 604 was 0.31 mm, and the material of the outer conductor was copper. The distance between two adjacent shielded cables 604 was 0.09 mm. The metal cover 701 is a copper plate having a thickness of 1 mm, and is formed by bending it into a U-shape in the section of the ZY plane and an L-shape in the section of the XZ plane. When viewed in the ZY plane, the dimension d of the metal cover 701 in the Y direction was 10.74 mm, and the dimension e of the metal cover 701 in the Z direction was 1.34 mm. When viewed in the XZ plane, the dimension f of the metal cover 701 in the X direction was 2.53 mm, and the dimension g of the metal cover 701 in the Z direction was 1.45 mm. The ground terminal 702 is a copper plate having a thickness of 1 mm, and is formed by bending it into a Z shape in a cross section of the YZ plane. In the ground terminal 702, the dimension h in the Y direction is 0.5 mm and the dimension i is 1.2 mm. The dimension j of the ground terminal 702 in the Z direction was 1.3 mm, and the dimension in the X direction was 1 mm. The dimension k of the pin 703 in the X direction was 1 mm, and the dimension l was 0.86 mm. The dimension m of the pin 703 in the Z direction was 1 mm, and the dimension n was 1.28 mm. The dimension of the pin 703 in the Y direction was 1 mm. The line widths of the data signal line 607 and the wiring 608 were each 1 mm, and the distance from the connector unit 603 to the wave source or the terminating resistor was 4 mm.

13(a), 13(b), 13(c), 13(d), and 13(e) are cross-sectional views of the connector section showing the wiring structure of the simulation model simulated in the example. is there. FIG. 13A, FIG. 13B, and FIG. 13C show a case where four pins connected to the four data signal lines 607 are arranged adjacent to each other.

In FIG. 13A, among 16 pins connected to wirings other than the data signal line 607, 8 pins are shown in FIG. 13A, the left side and the remaining 8 pins are shown in FIG. 13A. , Shows the case of arranging on the right side. In FIG. 13B, among 16 pins connected to wirings other than the data signal line 607, four pins are shown in FIG. 13B, the remaining 12 pins are shown in FIG. 13B. , Shows the case of arranging on the right side. FIG. 13C shows a case where four pins connected to the four data signal lines 607 are arranged adjacent to each other. In FIG. 13C, one of 16 pins connected to wirings other than the data signal line 607 is shown in FIG. 13C, the left side and the remaining 15 pins are shown in FIG. 13C. , Shows the case of arranging on the right side. That is, between the ground terminal 702 and the four pins connected to the four data signal lines 607, only one pin is arranged, which is connected to the wiring other than the data signal lines. This pin is connected to the ground wire.

FIG. 13D shows a case where 16 pins connected to wirings other than the data signal line 607 are arranged on the right side in FIG. 13D. That is, one of the four pins connected to the four data signal lines 607 is arranged next to the ground terminal 702. In FIG. 13E, two pin groups in which two pins connected to the two data signal lines 607 are arranged adjacent to each other are arranged, and between the two pin groups, except the data signal line 607. The case where 16 pins connected to the wiring are arranged is shown. Therefore, one of the two pin groups is arranged adjacent to one of the two ground terminals 702, and the other of the two pin groups is arranged adjacent to the other of the two ground terminals 702. ..

FIG. 13A shows “model 1”, FIG. 13B shows “model 2”, FIG. 13C shows “model 3”, FIG. 13D shows “model 4”, and FIG. It is called "model 5". For each model, in order to observe the amount of noise leaked from the connector unit 603 propagated to the outer conductor of the cable, the magnetic field strength 6 mm above the cable at the center of the cable was calculated. The observation frequency was set to the 2.432 GHz band (5 channels) used in the frequency band of WiFi (registered trademark) communication. The calculation results are summarized in Table 1.

Model 1 is Comparative Example 1. Model 2 is Comparative Example 2. Model 3 is Comparative Example 3. Model 4 is Example 1. Model 5 is the second embodiment. In Table 1, comparing Model 1, Model 2, Model 3, and Model 4, it can be confirmed that the closer the data signal line 607 is to the ground terminal 702, the more the leakage amount of electromagnetic noise decreases. It can be seen that the model 4 can suppress the leakage amount of electromagnetic noise more than the models 1 to 3. It is understood that the model 5 has the smallest leakage amount of electromagnetic noise among the models 1 to 5.

In the present embodiment, the simulation was performed assuming 2.432 GHz (5 channels) used in the frequency band of WiFi (registered trademark) communication, but the present invention is not limited to this frequency band. WiFi (registered trademark) can be applied to other frequency bands such as the band from 2.412 GHz to 2.472 GHz, the band from 5.18 GHz to 5.32 GHz, and the band from 5.5 GHz to 5.7 GHz. Furthermore, the communication system of the wireless communication unit that is the damaged circuit is not limited to WiFi (registered trademark), but may be public communication such as LTE and 5G, or other communication system such as Bluetooth (registered trademark). Further, in the present embodiment, the case where the simulation is performed has been described, but the electromagnetic noise may be actually measured. In this case, as in this simulation, a commercially available magnetic field probe can be placed in the center of the cable or directly above the connector, and the electromagnetic noise in the communication frequency band can be verified with a spectrum analyzer.

The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention. In addition, the effects described in the embodiments are merely enumeration of the most suitable effects that occur from the present invention, and the effects according to the present invention are not limited to those described in the embodiments.

In the embodiment described above, the structure of the connector 143 in the image processing unit 140 shown in FIG. 2A and the structure of the connector 163 in the accessory unit 160 shown in FIG. 2B have been described. It may also be applied to connectors. For example, it may be applied to the connector 144 shown in FIG. 2A and the connector 133 shown in FIG. Further, it may be applied to the connector 154 and the connector 145 which are connected to the wireless communication IC 152 by wire.

In the above-described embodiment, the image pickup apparatus, which is an example of the electronic apparatus, has been described, but the present invention is not limited to this, and the electronic apparatus can be applied to an image forming apparatus such as a printer.

In the above embodiment, the case where the electronic device includes the wireless communication unit that is the damaged circuit has been described, but the present invention is not limited to this. Even when the electronic device itself does not include the wireless communication unit, the electromagnetic noise leaking to the outside of the electronic device can be reduced, so that the electromagnetic noise can be prevented from interfering with other electronic devices. .. Further, the damaged circuit is not limited to the wireless communication unit.

100... Imaging device (electronic device), 101... Housing, 141... Wiring board, 143... Connector (first connector), 170... Communication module, 211... Connector (second connector), 407 ₁ ... Ground terminal (metal member) ), 408 ₁ ... pin (first pin), 408 ₂ ... pin (first pin)

Claims (19)

A wiring board including ground wiring,
Electrical parts provided on the wiring board,
A first connector provided on the wiring board and electrically connected to the electric component through the wiring board;
The first connector is
A metal member electrically connected to the ground wiring,
A plurality of high frequency signal pins used for transmission of high frequency signals, and a plurality of pins arranged in the arrangement direction, including a plurality of non-high frequency signal pins used for applications other than the transmission of the high frequency signals,
The plurality of high-frequency signal pins include a plurality of first pins arranged continuously in the arrangement direction,
The communication module, wherein none of the plurality of non-high frequency signal pins is interposed between the plurality of first pins and the metal member. The metal member is a first metal member,
The first connector is
A second metal member, which is arranged at a distance from the first metal member in the arrangement direction and is electrically connected to the ground wiring,
The plurality of high frequency signal pins include a plurality of second pins continuously arranged in the arrangement direction,
The communication module according to claim 1, wherein none of the plurality of non-high frequency signal pins are interposed between the plurality of second pins and the second metal member. The communication module according to claim 2, wherein the difference between the numbers of the plurality of first pins and the plurality of second pins is 0 or 1. The first connector includes a first metal member and a second metal member that are arranged at a distance from each other in the arrangement direction,
The communication module according to claim 1, wherein the metal member is a third metal member arranged between the first metal member and the second metal member. The first connector has a third metal member arranged between the first metal member and the second metal member,
The plurality of high frequency signal pins include a plurality of third pins continuously arranged in the arrangement direction,
The communication module according to claim 2, wherein none of the plurality of non-high frequency signal pins is interposed between the plurality of third pins and the third metal member. The plurality of high-frequency signal pins are arranged on the opposite side of the plurality of third pins with the third metal member interposed therebetween, and include a plurality of fourth pins continuously arranged in the arrangement direction,
The communication module according to claim 5, wherein none of the plurality of non-high frequency signal pins is interposed between the plurality of fourth pins and the third metal member. The communication module according to claim 6, wherein the difference in the number of the plurality of third pins and the number of the plurality of fourth pins is 0 or 1. A second connector detachably attached to the first connector,
The communication module according to any one of claims 1 to 7, wherein the second connector has a fourth metal member that comes into contact with the metal member when attached to the first connector. A plurality of coaxial cables attached to the second connector,
Each of the plurality of coaxial cables includes a core wire and an outer conductor,
The communication module according to claim 8, wherein the plurality of outer conductors are electrically connected to the fourth metal member. 10. The wiring board has a plurality of first wirings arranged on a first conductor layer and electrically connecting the electric component and the plurality of high-frequency signal pins to the wiring board. Communication module according to paragraph. The wiring board is arranged across the first conductor layer and a second conductor layer different from the first conductor layer, and electrically connects the electrical component and the plurality of non-high frequency signal pins. A second wiring,
The communication module according to claim 10, wherein the ground wiring includes a ground pattern arranged in a third conductor layer between the first conductor layer and the second conductor layer. The communication module according to claim 1, wherein the electrical component is a semiconductor device. The communication module according to claim 12, wherein the semiconductor device is an image processing IC. 12. The communication module according to claim 1, wherein the electric component is a memory connector to which a memory is attachable/detachable. The communication module according to any one of claims 1 to 14, wherein the high-frequency signal is a digital signal having a communication speed of 100 [Mbps] or more. The communication module according to claim 15, wherein the digital signal is a differential signal. The communication module according to claim 15, wherein the digital signal is a data signal. Housing and
A wireless communication unit disposed inside the housing,
An electronic device, comprising: the communication module according to claim 1 disposed inside the housing. Housing and
A wireless communication unit disposed inside the housing,
An image sensor arranged inside the casing;
An imaging apparatus comprising: the communication module according to any one of claims 1 to 17, which is disposed inside the housing.

Images