JP2020089034A

JP2020089034A - Switching element unit

Info

Publication number: JP2020089034A
Application number: JP2018219378A
Authority: JP
Inventors: 豊堀田; Yutaka Hotta; 誠二安井; Seiji Yasui; 慎也大須賀; Shinya Osuga; 康弘粂; Yasuhiro Kume
Original assignee: Aisin Seiki Co Ltd; Aisin AW Co Ltd
Current assignee: Aisin AW Co Ltd; Aisin Corp
Priority date: 2018-11-22
Filing date: 2018-11-22
Publication date: 2020-06-04

Abstract

To achieve a structure in which a switching element and a conductive material can be appropriately joined even when variation in a dimension of each part of a switching element unit is large.SOLUTION: The switching element unit is provided with a first conductive material 1 and a second conductive material 2 which are connected to a direct-current power source, and an output conductive material 5. A first switching element 31 connected to the first conductive material 1 and the output conductive material 5, and a second switching element 32 connected to the second conductive material 2 and the output conductive material 5 are arranged side by side in a first direction X. The output conductive material 5 has a first joining part 51 in contact with the first switching element 31, a second joining part 52 in contact with the second switching element 32, and a connection part 53 which connects the first joining part 51 and the second joining part 52, and is arranged along the first direction X. The first joining part 51 and the second joining part 52 consist of a tabular member, and the connection part 53 consists of a conductive member which has flexibility.SELECTED DRAWING: Figure 3

Description

本発明は、インバータ回路を構成するためのスイッチング素子組と、直流電源の正極及び負極にそれぞれ接続される導電体と、交流機器に接続される出力用導電体とを備えたスイッチング素子ユニットに関する。 The present invention relates to a switching element unit including a switching element group for forming an inverter circuit, conductors connected to the positive and negative electrodes of a DC power supply, and an output conductor connected to an AC device.

直流と複数相の交流との間で電力を変換するために、インバータ装置が用いられている。インバータ装置は、複数のスイッチング素子と正極及び負極の導電体と複数の出力用導電体とがモジュール化されたスイッチング素子ユニットを含んで構成される場合がある。このようなスイッチング素子ユニットの一例が、国際公開第２０１３／０８７３８２号に開示されている（以下、背景技術及び発明の概要において括弧内に付す符号は参照する文献のもの。）。この文献のＦｉｇ．１及びＦｉｇ．２等に示されているように、このスイッチング素子ユニット（１）では、階段状に屈曲した板状の出力用導電体（１３）の異なる段の面上に、それぞれ上段側及び下段側のスイッチング素子（３，４）が接合されている。また、それぞれのスイッチング素子（３，４）の出力用導電体（１３）に接続されていない側は、それぞれ正極及び負極の導電体（１０，１１）に接合されている。 Inverter devices are used to convert electrical power between direct current and multiple phases of alternating current. The inverter device may be configured to include a switching element unit in which a plurality of switching elements, positive and negative conductors, and a plurality of output conductors are modularized. One example of such a switching element unit is disclosed in International Publication No. 2013/087382 (hereinafter, the reference numerals in parentheses in the background art and the outline of the invention are those of the references). FIG. 1 and FIG. As shown in FIG. 2 etc., in this switching element unit (1), switching of the upper side and the lower side is performed on the surfaces of different steps of the plate-shaped output conductor (13) bent in a stepwise manner. The elements (3, 4) are joined. The side of each switching element (3, 4) that is not connected to the output conductor (13) is joined to the positive and negative conductors (10, 11), respectively.

国際公開第２０１３／０８７３８２号International Publication No. 2013/087382

スイッチング素子（３，４）は、出力用導電体（１３）と正極の導電体（１０又は１１）との間、及び、出力用導電体（１３）と負極の導電体（１１又は１０）との間に配置されている。スイッチング素子（３，４）が配置される場所の大きさ、つまり、出力用導電体（１３）と正極の導電体（１０又は１１）との間の距離、及び、出力用導電体（１３）と負極の導電体（１１又は１０）との間の距離は、階段状に屈曲した出力用導電体（１３）の段差部によって規定されている。多くの場合、スイッチング素子（３，４）と導電体（１０，１１，１３）とは、半田や金属ペースト（銀ペースト）等の接合材料を介して接合される。出力用導電体（１３）は、通常、高い剛性を有して形成されている。そのため、例えば製造時における接合材料の厚みのばらつきが大きい場合や、スイッチング素子（３，４）の寸法公差が大きい場合等には、その変動幅を吸収することが困難であり、導電体（１０，１１，１３）とスイッチング素子（３，４）との接合不良等を招く可能性があった。そのため、接合材料の厚みの変動やスイッチング素子（３，４）及び出力用導電体（１３）の寸法公差を小さく抑える必要があり、製造コストが増加する要因となっていた。 The switching elements (3, 4) are provided between the output conductor (13) and the positive electrode conductor (10 or 11), and between the output conductor (13) and the negative electrode conductor (11 or 10). It is located between. The size of the place where the switching elements (3, 4) are arranged, that is, the distance between the output conductor (13) and the positive electrode conductor (10 or 11), and the output conductor (13). The distance between the negative electrode conductor (11 or 10) is defined by the stepped portion of the output conductor (13) bent in a stepwise manner. In many cases, the switching elements (3, 4) and the conductors (10, 11, 13) are joined together with a joining material such as solder or metal paste (silver paste). The output conductor (13) is usually formed with high rigidity. Therefore, for example, when there is a large variation in the thickness of the bonding material during manufacturing, or when the dimensional tolerance of the switching elements (3, 4) is large, it is difficult to absorb the fluctuation range, and the conductor (10 , 11, 13) and the switching element (3, 4) may be defectively joined. Therefore, it is necessary to suppress the variation in the thickness of the bonding material and the dimensional tolerance of the switching elements (3, 4) and the output conductor (13), which is a factor of increasing the manufacturing cost.

上記背景に鑑みて、スイッチング素子と導電体とを接合させて構成されるスイッチング素子ユニットにおいて、スイッチング素子ユニットの各部の寸法のばらつきが大きい場合であっても適切にスイッチング素子と導電体とを接合することができる構造の実現が望まれる。 In view of the background described above, in a switching element unit configured by joining a switching element and a conductor, the switching element and the conductor are appropriately joined even when the dimensional variation of each part of the switching element unit is large. It is desirable to realize a structure that can do this.

上記に鑑みたスイッチング素子ユニットは、１つの態様として、インバータ回路を構成するためのスイッチング素子組と、直流電源の正極及び負極の一方に接続される第１導電体と、前記直流電源の正極及び負極の他方に接続される第２導電体と、交流機器に接続される出力用導電体と、を備え、前記スイッチング素子組は、前記第１導電体及び前記出力用導電体に接続される第１スイッチング素子と、前記第２導電体及び前記出力用導電体に接続される第２スイッチング素子と、を含み、前記第１スイッチング素子と前記第２スイッチング素子とは、第１方向に並んで配置され、前記出力用導電体は、前記第１スイッチング素子における前記第１導電体に接する面とは反対側の面に接する第１接合部と、前記第２スイッチング素子における前記第２導電体に接する面とは反対側の面に接する第２接合部と、前記第１接合部と前記第２接合部とを接続する接続部とを有して、前記第１方向に沿って配置され、前記第１接合部及び前記第２接合部は、板状部材で構成され、前記接続部は、可撓性を有する導電性部材で構成されている。 In one aspect, the switching element unit in view of the above has a switching element set for forming an inverter circuit, a first conductor connected to one of a positive electrode and a negative electrode of a DC power source, a positive electrode of the DC power source, and A second conductor connected to the other of the negative electrodes and an output conductor connected to an AC device, wherein the switching element set is connected to the first conductor and the output conductor. One switching element and a second switching element connected to the second conductor and the output conductor are included, and the first switching element and the second switching element are arranged side by side in the first direction. The output conductor is in contact with the second conductor of the second switching element and the first joint portion of the first switching element, which is in contact with the surface opposite to the surface of the first switching element in contact with the first conductor. A second joint portion that is in contact with a surface opposite to the surface, and a connection portion that connects the first joint portion and the second joint portion, and is arranged along the first direction. The 1st joint part and the said 2nd joint part are comprised by the plate-shaped member, and the said connection part is comprised by the conductive member which has flexibility.

第１スイッチング素子は、第１導電体と、出力用導電体の第１接合部との間に配置され、第２スイッチング素子は、第２導電体と、出力用導電体の第２接合部との間に配置される。第１接合部と第２接合部との間には接続部が位置しているので、第１導電体と第１接合部との間の距離、及び、第２導電体と第２接合部との間の距離は、接続部の長さに依存する。これらの距離が固定的であると、導電体（第１導電体、第２導電体、及び出力用導電体）の寸法のばらつき、スイッチング素子（第１スイッチング素子及び第２スイッチング素子）の寸法のばらつき、導電体とスイッチング素子とを接合する接合材料の量（厚み）のばらつきなどによって、導電体とスイッチング素子とが充分に接合されず、スイッチング素子ユニットの信頼性が低下する場合がある。しかし、本構成によれば、接続部が可撓性を有する導電性部材によって構成されるので、接続部の変形によって、第１導電体と第１接合部との間の距離、及び、第２導電体と第２接合部との間の距離の少なくとも一方の距離を変動させることができる。従って、上述したようなばらつきがある場合でも、導電体とスイッチング素子とを適切に接合することができる。つまり、本構成によれば、スイッチング素子ユニットの各部の寸法のばらつきが大きい場合であっても適切にスイッチング素子と導電体とを接合することができる。 The first switching element is arranged between the first conductor and the first joint portion of the output conductor, and the second switching element is connected to the second conductor and the second joint portion of the output conductor. Is placed between. Since the connection portion is located between the first joint portion and the second joint portion, the distance between the first conductor and the first joint portion, and the distance between the second conductor and the second joint portion. The distance between depends on the length of the connection. If these distances are fixed, variations in the dimensions of the conductors (first conductor, second conductor, and output conductor) and the dimensions of the switching elements (first switching element and second switching element) may occur. Due to variations and variations in the amount (thickness) of the bonding material that joins the conductor and the switching element, the conductor and the switching element may not be joined sufficiently, and the reliability of the switching element unit may decrease. However, according to this configuration, since the connecting portion is configured by the conductive member having flexibility, the distance between the first conductor and the first joining portion due to the deformation of the connecting portion, and the second connecting portion At least one of the distances between the conductor and the second joint can be varied. Therefore, even if there is such variation as described above, the conductor and the switching element can be appropriately joined. That is, according to this configuration, the switching element and the conductor can be appropriately joined even when the dimensional variation of each part of the switching element unit is large.

スイッチング素子ユニットのさらなる特徴と利点は、図面を参照して説明する実施形態についての以下の記載から明確となる。 Further characteristics and advantages of the switching element unit will become clear from the following description of the embodiments described with reference to the drawings.

スイッチング素子ユニットが樹脂モールドされた形態の一例を示す斜視図A perspective view showing an example of a form in which a switching element unit is resin-molded. スイッチング素子ユニットの一例を示す斜視図Perspective view showing an example of a switching element unit スイッチング素子ユニットの分解斜視図Exploded perspective view of switching element unit 樹脂モールドされた状態のスイッチング素子ユニットの断面図Sectional view of switching element unit in resin-molded state インバータ回路を含む電気系統の一例を示す回路ブロック図Circuit block diagram showing an example of an electric system including an inverter circuit 出力用導電体の他の形態の一例を示す断面図Sectional drawing which shows an example of the other form of the conductor for output. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor. 出力用導電体の他の形態の一例を示す斜視図FIG. 3 is a perspective view showing another example of the output conductor.

以下、スイッチング素子ユニットの実施形態について、図面を参照して説明する。尚、以下の説明において、各部材についての寸法、配置方向、配置位置等に関する用語は、誤差（製造上許容され得る程度の誤差）による差異を有する状態を含むものである。 Hereinafter, embodiments of the switching element unit will be described with reference to the drawings. In the following description, terms regarding dimensions, arrangement directions, arrangement positions, etc. of the respective members include a state having a difference due to an error (an error that can be tolerated in manufacturing).

本実施形態では、スイッチング素子ユニット１００は、直流電源６及び交流の回転電機８（交流機器）に接続されて、直流と交流との間で電力変換を行うインバータ回路３０（図５参照）に用いられる。回転電機８は、例えば、電動車両やハイブリッド車両等において車両（車輪）の駆動力源として用いられる。直流電源６は、例えば、ニッケル水素電池やリチウムイオン電池などの二次電池（バッテリ）や、電気二重層キャパシタなどにより構成されている。回転電機８は、電動機としても発電機としても機能することができる。つまり、回転電機８は、インバータ回路３０を介して直流電源６からの電力を動力に変換する（力行）。或いは、回転電機８は、車輪等から伝達される回転駆動力を電力に変換し、インバータ回路３０を介して直流電源６を充電する（回生）。直流電源６とインバータ回路３０との間には、インバータ回路３０の直流側の電圧（直流リンク電圧）を平滑化する直流リンクコンデンサ４（平滑コンデンサ）が設けられている。 In the present embodiment, the switching element unit 100 is used in an inverter circuit 30 (see FIG. 5) that is connected to a DC power supply 6 and an AC rotating electric machine 8 (AC device) and performs power conversion between DC and AC. Be done. The rotary electric machine 8 is used, for example, as a driving force source for a vehicle (wheel) in an electric vehicle, a hybrid vehicle, or the like. The DC power supply 6 is configured by, for example, a secondary battery (battery) such as a nickel hydrogen battery or a lithium ion battery, an electric double layer capacitor, or the like. The rotary electric machine 8 can function as both an electric motor and a generator. That is, the rotary electric machine 8 converts the electric power from the DC power supply 6 into power through the inverter circuit 30 (power running). Alternatively, the rotary electric machine 8 converts the rotational driving force transmitted from the wheels or the like into electric power, and charges the DC power supply 6 via the inverter circuit 30 (regeneration). Between the DC power supply 6 and the inverter circuit 30, a DC link capacitor 4 (smoothing capacitor) that smoothes the voltage on the DC side of the inverter circuit 30 (DC link voltage) is provided.

図５に示すように、インバータ回路３０は、ブリッジ回路により構成される。本実施形態では、このブリッジ回路は、複数相の交流に対応する数のアームが電気的に並列接続されて構成されている。本実施形態では、回転電機８は、３相の交流回転電機であり、ブリッジ回路は、３つのアームが電気的に並列接続されて構成されている。１つのアームは、上段側スイッチング素子３１と下段側スイッチング素子３２とが直列接続されたスイッチング素子組３により構成される。尚、それぞれのスイッチング素子には、フリーホイールダイオード３３が並列接続されている。スイッチング素子には、ＩＧＢＴ（Insulated Gate Bipolar Transistor）やパワーＭＯＳＦＥＴ（Power Metal Oxide Semiconductor Field Effect Transistor）やＳｉＣ−ＭＯＳＦＥＴ（Silicon Carbide Metal Oxide Semiconductor FET）やＳｉＣ−ＳＩＴ（Silicon Carbide Static Induction Transistor）、ＧａＮ−ＭＯＳＦＥＴ（Gallium Nitride MOSFET）などの高周波での動作が可能なパワー半導体素子を適用すると好適である。 As shown in FIG. 5, the inverter circuit 30 is composed of a bridge circuit. In the present embodiment, this bridge circuit is configured by electrically connecting in parallel a number of arms corresponding to a plurality of phases of alternating current. In the present embodiment, the rotary electric machine 8 is a three-phase AC rotary electric machine, and the bridge circuit is configured by electrically connecting three arms in parallel. One arm is configured by a switching element set 3 in which an upper stage switching element 31 and a lower stage switching element 32 are connected in series. A freewheel diode 33 is connected in parallel with each switching element. The switching elements include an IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Power Metal Oxide Semiconductor Field Effect Transistor), a SiC-MOSFET (Silicon Carbide Metal Oxide Semiconductor FET), a SiC-SIT (Silicon Carbide Static Induction Transistor), and a GaN- It is preferable to apply a power semiconductor element capable of operating at a high frequency, such as a MOSFET (Gallium Nitride MOSFET).

１つのスイッチング素子組３、つまり１つのアームの正極側の端部は、直流電源６の正極Ｐに接続され、負極側の端部は、直流電源６の負極Ｎに接続される。１つのスイッチング素子組３における上段側スイッチング素子３１と下段側スイッチング素子３２との接続点（アームの中間点）は、回転電機８の対応する相（例えばＵ相、Ｖ相、Ｗ相）のステータコイル８１に電気的に接続されている。 One switching element set 3, that is, the positive end of one arm is connected to the positive electrode P of the DC power supply 6, and the negative end is connected to the negative electrode N of the DC power supply 6. The connection point (the intermediate point of the arm) between the upper switching element 31 and the lower switching element 32 in one switching element set 3 is the stator of the corresponding phase (for example, U phase, V phase, W phase) of the rotary electric machine 8. It is electrically connected to the coil 81.

図２から図５等に示すように、スイッチング素子ユニット１００は、インバータ回路３０を構成するためのスイッチング素子組３と、直流電源６の正極Ｐ及び負極Ｎの一方に接続される第１導電体１と、直流電源６の正極Ｐ及び負極Ｎの他方に接続される第２導電体２と、回転電機８（ステータコイル８１）に接続される出力用導電体５とを備えている。また、スイッチング素子組３は、第１導電体１及び出力用導電体５に接続される第１スイッチング素子と、第２導電体２及び出力用導電体５に接続される第２スイッチング素子とを含む。 As shown in FIGS. 2 to 5, etc., the switching element unit 100 includes a switching element set 3 for forming the inverter circuit 30 and a first conductor connected to one of the positive electrode P and the negative electrode N of the DC power supply 6. 1, a second conductor 2 connected to the other of the positive electrode P and the negative electrode N of the DC power supply 6, and an output conductor 5 connected to the rotating electric machine 8 (stator coil 81). The switching element set 3 includes a first switching element connected to the first conductor 1 and the output conductor 5, and a second switching element connected to the second conductor 2 and the output conductor 5. Including.

以下の説明においては、直流電源６の正極Ｐに接続される導電体を第１導電体１とし、直流電源６の負極Ｎに接続される導電体を第２導電体２として説明する。また、直流電源６の正極Ｐに接続される第１導電体１及びステータコイル８１に接続される出力用導電体５に接続される上段側スイッチング素子３１を第１スイッチング素子、直流電源６の負極Ｎに接続される第２導電体２及びステータコイル８１に接続される出力用導電体５に接続される下段側スイッチング素子３２を第２スイッチング素子として説明する。当然ながら、直流電源６の正極Ｐに接続される導電体が第２導電体２であり、直流電源６の負極Ｎに接続される導電体が第１導電体１であってもよい。この場合、下段側スイッチング素子３２が第１スイッチング素子に対応し、上段側スイッチング素子３１が第２スイッチング素子に対応する。 In the following description, the conductor connected to the positive electrode P of the DC power supply 6 will be referred to as the first conductor 1, and the conductor connected to the negative electrode N of the DC power supply 6 will be referred to as the second conductor 2. Further, the upper-stage switching element 31 connected to the first conductor 1 connected to the positive electrode P of the DC power supply 6 and the output conductor 5 connected to the stator coil 81 is the first switching element, and the negative electrode of the DC power supply 6 is connected. The lower switching element 32 connected to the second conductor 2 connected to N and the output conductor 5 connected to the stator coil 81 will be described as a second switching element. Of course, the conductor connected to the positive electrode P of the DC power supply 6 may be the second conductor 2, and the conductor connected to the negative electrode N of the DC power supply 6 may be the first conductor 1. In this case, the lower switching element 32 corresponds to the first switching element, and the upper switching element 31 corresponds to the second switching element.

図５に示すように、インバータ回路３０は、インバータ制御装置２０（INV-CTRL）により制御される。インバータ制御装置２０は、マイクロコンピュータ等の論理回路を中核部材として構築されている。例えば、インバータ制御装置２０は、車両制御装置９０（VHL-CTRL）等の他の制御装置等から提供される回転電機８の目標トルクに基づいて、ベクトル制御法を用いた電流フィードバック制御を行って、インバータ回路３０を介して回転電機８を制御する。回転電機８の各相のステータコイル８１を流れる実電流は不図示の電流センサにより検出され、回転電機８のロータの各時点での磁極位置は、レゾルバなどの不図示の回転センサにより検出される。インバータ制御装置２０は、これらのセンサの検出結果を用いて、電流フィードバック制御を実行する。 As shown in FIG. 5, the inverter circuit 30 is controlled by the inverter control device 20 (INV-CTRL). The inverter control device 20 is constructed using a logic circuit such as a microcomputer as a core member. For example, the inverter control device 20 performs current feedback control using the vector control method based on the target torque of the rotating electric machine 8 provided from another control device such as the vehicle control device 90 (VHL-CTRL). The rotary electric machine 8 is controlled via the inverter circuit 30. The actual current flowing through the stator coil 81 of each phase of the rotary electric machine 8 is detected by a current sensor (not shown), and the magnetic pole position of the rotor of the rotary electric machine 8 at each time point is detected by a rotary sensor (not shown) such as a resolver. .. The inverter control device 20 executes the current feedback control using the detection results of these sensors.

インバータ回路３０などの回転電機８を駆動するための高圧系回路（直流電源６に接続された系統）と、マイクロコンピュータなどを中核とするインバータ制御装置などの低圧系回路（３．３ボルトから５ボルト程度の動作電圧の系統）とは、動作電圧（回路の電源電圧）が大きく異なる。このため、図５に示すように、インバータ回路３０を構成する各スイッチング素子の制御端子（ＩＧＢＴやＦＥＴの場合はゲート端子）は、ドライブ回路４０（DRV-CCT）を介してインバータ制御装置に接続されており、それぞれ個別にスイッチング制御される。ドライブ回路４０は、各スイッチング素子に対する駆動信号（スイッチング制御信号）の駆動能力（例えば電圧振幅や出力電流など、後段の回路を動作させる能力）をそれぞれ高めて中継する。 A high-voltage system circuit (system connected to the DC power source 6) for driving the rotating electric machine 8 such as the inverter circuit 30 and a low-voltage system circuit (3.3 V to 5 V) such as an inverter control device having a microcomputer as a core. The operating voltage (power supply voltage of the circuit) is significantly different from the operating voltage system of about volt. Therefore, as shown in FIG. 5, the control terminal (gate terminal in the case of IGBT or FET) of each switching element forming the inverter circuit 30 is connected to the inverter control device via the drive circuit 40 (DRV-CCT). The switching is controlled individually. The drive circuit 40 enhances the drive capability of the drive signal (switching control signal) for each switching element (for example, the capability of operating a circuit in the subsequent stage such as voltage amplitude and output current) and relays it.

尚、図５に示す例とは異なり、直流電源６の正負極間の電圧が、コンバータ等によって昇圧されて、インバータ回路３０の直流側に印加される構成とすることもできる。つまり、直流リンク電圧は、コンバータ等による昇圧後の電圧となる。正極Ｐ及び負極Ｎは、直流リンク電圧の正極及び負極を示すものであり、この場合、直流電源６は、コンバータを含む構成となり、正極Ｐ及び負極Ｎはコンバータを介したインバータ回路３０の側の直流電圧に対応する。 Unlike the example shown in FIG. 5, the voltage between the positive and negative electrodes of the DC power supply 6 may be boosted by a converter or the like and applied to the DC side of the inverter circuit 30. That is, the DC link voltage is the voltage after being boosted by the converter or the like. The positive electrode P and the negative electrode N indicate the positive electrode and the negative electrode of the DC link voltage. In this case, the DC power supply 6 has a configuration including a converter, and the positive electrode P and the negative electrode N are on the side of the inverter circuit 30 via the converter. Corresponds to DC voltage.

上述したように、スイッチング素子ユニット１００は、スイッチング素子組３と、第１導電体１と、第２導電体２と、出力用導電体５とを備えている（図２参照）。スイッチング素子ユニット１００は、図１に示すように、さらに樹脂等のモールド材料によるモールド部９を備えて構成されると好適である。この場合、スイッチング素子組３は、モールド部９に内包され、モールド部９によりスイッチング素子が環境変化（汚れや機械的負荷）から保護される。また、スイッチング素子及び導電体がモールド部９により保持されることにより、スイッチング素子と導電体との接合箇所も機械的負荷などの環境変化から保護され、スイッチング素子ユニット１００の信頼性を向上させることができる。 As described above, the switching element unit 100 includes the switching element set 3, the first conductor 1, the second conductor 2, and the output conductor 5 (see FIG. 2 ). As shown in FIG. 1, it is preferable that the switching element unit 100 further includes a molding portion 9 made of a molding material such as resin. In this case, the switching element set 3 is included in the mold portion 9, and the mold portion 9 protects the switching elements from environmental changes (dirt and mechanical load). In addition, since the switching element and the conductor are held by the mold portion 9, the joint between the switching element and the conductor is protected from environmental changes such as mechanical load, and the reliability of the switching element unit 100 is improved. You can

図２から図４に示すように、それぞれのスイッチング素子組３において、上段側スイッチング素子３１と下段側スイッチング素子３２とは、第１方向Ｘに並んで配置されている。また、図３及び図４に示すように、出力用導電体５は、第１接合部５１と、第２接合部５２と、接続部５３とを有している。第１接合部５１は、上段側スイッチング素子３１における第１導電体１に接する面とは反対側の面に接する部分である。第２接合部５２は、下段側スイッチング素子３２における第２導電体２に接する面とは反対側の面に接する部分である。接続部５３は、第１接合部５１と第２接合部５２とを接続する部分である。第１接合部５１と、第２接合部５２と、接続部５３とは、第１方向Ｘに沿って配置されている。本実施形態では、第１接合部５１と、接続部５３と、第２接合部５２とは、第１方向第１側Ｘ１から第１方向第２側Ｘ２に向かって記載の順に並んで配置されている。 As shown in FIGS. 2 to 4, in each switching element set 3, the upper switching element 31 and the lower switching element 32 are arranged side by side in the first direction X. Further, as shown in FIGS. 3 and 4, the output conductor 5 has a first joint portion 51, a second joint portion 52, and a connecting portion 53. The first joint portion 51 is a portion in contact with the surface of the upper switching element 31 opposite to the surface in contact with the first conductor 1. The second joint portion 52 is a portion that contacts the surface of the lower switching element 32 that is opposite to the surface that contacts the second conductor 2. The connection portion 53 is a portion that connects the first joint portion 51 and the second joint portion 52. The first joint portion 51, the second joint portion 52, and the connecting portion 53 are arranged along the first direction X. In the present embodiment, the first joint portion 51, the connecting portion 53, and the second joint portion 52 are arranged side by side in the order described from the first direction first side X1 to the first direction second side X2. ing.

本実施形態では、スイッチング素子ユニット１００は、スイッチング素子組３を複数（ここでは３つ）備えると共に、複数のスイッチング素子組３のそれぞれに対応するように複数の出力用導電体５を備えている。複数の上段側スイッチング素子３１は、第１方向Ｘに交差する第２方向Ｙに並んで配置され、複数の下段側スイッチング素子３２も、第２方向Ｙに並んで配置されている。それぞれのスイッチング素子組３の上段側スイッチング素子３１と下段側スイッチング素子３２とを接続する複数の出力用導電体５も、複数のスイッチング素子組３の配置に対応して、第２方向Ｙに並んで配置されている。例えば、３相交流の回転電機８のＵ相、Ｖ相、Ｗ相に応じて、第２方向第１側Ｙ１から第２方向第２側Ｙ２に向かってＵ相、Ｖ相、Ｗ相の順に、スイッチング素子組３及び出力用導電体５が配置されている。また、複数の上段側スイッチング素子３１を接続する第１導電体１、及び複数の下段側スイッチング素子３２を接続する第２導電体２のそれぞれは、第２方向Ｙに沿って配置されている。 In the present embodiment, the switching element unit 100 includes a plurality of switching element groups 3 (here, three), and a plurality of output conductors 5 corresponding to the plurality of switching element groups 3. .. The plurality of upper-stage switching elements 31 are arranged side by side in the second direction Y intersecting the first direction X, and the plurality of lower-stage switching elements 32 are also arranged side by side in the second direction Y. The plurality of output conductors 5 that connect the upper-side switching element 31 and the lower-side switching element 32 of each switching element set 3 are also arranged in the second direction Y corresponding to the arrangement of the plurality of switching element sets 3. It is located at. For example, depending on the U phase, V phase, and W phase of the three-phase AC rotating electric machine 8, the U phase, the V phase, and the W phase are arranged in this order from the second direction first side Y1 toward the second direction second side Y2. , The switching element set 3 and the output conductor 5 are arranged. In addition, each of the first conductor 1 that connects the plurality of upper-stage switching elements 31 and the second conductor 2 that connects the plurality of lower-side switching elements 32 is arranged along the second direction Y.

図２から図４に示すように、上段側スイッチング素子３１及び下段側スイッチング素子３２は、フリーホイールダイオード３３を内蔵したチップ型素子である。このチップ型素子は、矩形平板状に形成されている。下段側スイッチング素子３２は、エミッタ又はソースが第２導電体２に接続されるように、半田や銀ペースト（金属ペースト）などの接合材料により第２導電体２上に実装されている。下段側スイッチング素子３２のコレクタ又はドレインは、同様に接合材料を用いて出力用導電体５の第２接合部５２に接続される。第１方向Ｘ及び第２方向Ｙに直交する第３方向Ｚに見て、第２導電体２と下段側スイッチング素子３２と出力用導電体５の第２接合部５２とは少なくとも一部が重複するように配置されている。具体的には、第３方向第１側Ｚ１から第３方向第２側Ｚ２に向かって、第２導電体２と、下段側スイッチング素子３２と、出力用導電体５の第２接合部５２とは、記載の順に並んで配置されている。 As shown in FIGS. 2 to 4, the upper-stage switching element 31 and the lower-stage switching element 32 are chip-type elements that incorporate a freewheel diode 33. This chip-type element is formed in a rectangular flat plate shape. The lower switching element 32 is mounted on the second conductor 2 with a bonding material such as solder or silver paste (metal paste) so that the emitter or the source is connected to the second conductor 2. The collector or drain of the lower switching element 32 is similarly connected to the second joint 52 of the output conductor 5 by using a joint material. At least a part of the second conductor 2, the lower switching element 32, and the second joint portion 52 of the output conductor 5 overlap in the third direction Z orthogonal to the first direction X and the second direction Y. It is arranged to. Specifically, from the third-direction first side Z1 toward the third-direction second side Z2, the second conductor 2, the lower-stage side switching element 32, and the second joint portion 52 of the output conductor 5 are connected. Are arranged side by side in the order described.

上段側スイッチング素子３１は、エミッタ又はソースが出力用導電体５に接続されるように、接合材料により出力用導電体５の第１接合部５１上に実装されている。下段側スイッチング素子３２のコレクタ又はドレインは、同様に接合材料を用いて第１導電体１に接続される。第３方向Ｚに見て、出力用導電体５の第１接合部５１と第１導電体１と上段側スイッチング素子３１とは少なくとも一部が重複するように配置されている。具体的には、第３方向第１側Ｚ１から第３方向第２側Ｚ２に向かって、出力用導電体５の第１接合部５１と、上段側スイッチング素子３１と、第１導電体１とは、記載の順に並んで配置されている。 The upper switching element 31 is mounted on the first joint portion 51 of the output conductor 5 with a bonding material so that the emitter or the source is connected to the output conductor 5. The collector or drain of the lower switching element 32 is similarly connected to the first conductor 1 using a bonding material. When viewed in the third direction Z, the first joint portion 51 of the output conductor 5, the first conductor 1, and the upper switching element 31 are arranged so that at least a part thereof overlaps. Specifically, from the third-direction first side Z1 toward the third-direction second side Z2, the first joint portion 51 of the output conductor 5, the upper-stage switching element 31, and the first conductor 1 are connected. Are arranged side by side in the order described.

換言すれば、下段側スイッチング素子３２は、第２導電体２と出力用導電体５の第２接合部５２との間に、半田や銀ペースト（金属ペースト）などの接合材料を介して配置され、上段側スイッチング素子３１は、出力用導電体５の第１接合部５１と第１導電体１との間に、接合材料を介して配置されている。 In other words, the lower switching element 32 is arranged between the second conductor 2 and the second joint portion 52 of the output conductor 5 via a joint material such as solder or silver paste (metal paste). The upper switching element 31 is arranged between the first joint portion 51 of the output conductor 5 and the first conductor 1 via a joint material.

ここで、第２導電体２と出力用導電体５の第２接合部５２との間の距離に柔軟性がない場合、それぞれの導電体の第３方向Ｚにおける厚みのばらつき、チップ型素子としての下段側スイッチング素子３２の実装状態における第３方向Ｚにおける厚みのばらつき、接合材料の第３方向Ｚにおけるばらつきによっては、第２導電体２と出力用導電体５の第２接合部５２との間に、適切な接合強度を有して下段側スイッチング素子３２が配置されず、電気的接続が不充分となる場合がある。特に、ＳｉＣ−ＭＯＳＦＥＴやＳｉＣ−ＳＩＴは、耐熱性に優れており、より融点の高い接合材料（例えば銀ペースト等）を用いて接合される場合がある。このような融点の高い接合材料は、相対的に融点の低い半田等に比べて接合箇所の厚みが薄くなる傾向がある。このため、接合材料によって第２導電体２と第２接合部５２との間の距離のばらつきを吸収することが困難となる場合がある。 Here, when there is no flexibility in the distance between the second conductor 2 and the second joint portion 52 of the output conductor 5, variations in the thickness of the respective conductors in the third direction Z may cause a chip-type element. Depending on the variation in the thickness of the lower switching element 32 in the third direction Z in the mounted state and the variation in the bonding material in the third direction Z, the second conductor 2 and the second joint portion 52 of the output conductor 5 may be different from each other. In some cases, the lower switching element 32 is not arranged with an appropriate bonding strength and electrical connection may be insufficient. In particular, SiC-MOSFET and SiC-SIT are excellent in heat resistance and may be joined using a joining material having a higher melting point (for example, silver paste). Such a joining material having a high melting point tends to have a thinner thickness at the joining portion than solder or the like having a relatively low melting point. Therefore, it may be difficult to absorb the variation in the distance between the second conductor 2 and the second bonding portion 52 depending on the bonding material.

上述したように、第３方向第１側Ｚ１から第３方向第２側Ｚ２に向かって、第２導電体２と、下段側スイッチング素子３２と、出力用導電体５の第２接合部５２とが、記載の順に並んで配置されている。また、図４を参照して後述するように、出力用導電体５の第１接合部５１における上段側スイッチング素子３１に接する面（第１接合部第１面５１ａ）とは反対側の面（第１接合部第２面５１ｂ）と、第２導電体２の下段側スイッチング素子３２に接する面（第２導電体第１面２ａ）とは反対側の面（第２導電体第２面２ｂ）とは、共通の基準面ＳＲに接するように配置されている。第３方向Ｚにおいて、第２接合部５２は接続部５３を介して第１接合部５１と離間している。従って、第２導電体２と第２接合部５２との間の距離は、接続部５３の第３方向Ｚに沿った長さによって定まる。 As described above, from the third-direction first side Z1 toward the third-direction second side Z2, the second conductor 2, the lower-stage switching element 32, and the second joint portion 52 of the output conductor 5 are formed. Are arranged side by side in the order described. Further, as will be described later with reference to FIG. 4, a surface (first bonding portion first surface 51a) opposite to a surface (first bonding portion first surface 51a) of the first bonding portion 51 of the output conductor 5 which is in contact with the upper switching element 31 ( A surface (second conductor second surface 2b) opposite to the surface (second conductor first surface 2a) in contact with the lower-stage switching element 32 of the second conductor 2 and the first bonding portion second surface 51b). ) Are arranged so as to contact the common reference plane SR. In the third direction Z, the second joint portion 52 is separated from the first joint portion 51 via the connecting portion 53. Therefore, the distance between the second conductor 2 and the second joint portion 52 is determined by the length of the connecting portion 53 along the third direction Z.

同様に、出力用導電体５の第１接合部５１と第１導電体１との間の距離に柔軟性がない場合、それぞれの導電体の第３方向Ｚにおける厚みのばらつき、チップ型素子としての上段側スイッチング素子３１の実装状態における第３方向Ｚにおける厚みのばらつき、接合材料の第３方向Ｚにおけるばらつきによっては、出力用導電体５の第１接合部５１と第１導電体１との間に、適切な接合強度を有して上段側スイッチング素子３１が配置されず、電気的接続が不充分となる場合がある。但し、本実施形態では、第３方向第１側Ｚ１から第３方向第２側Ｚ２に向かって、出力用導電体５の第１接合部５１と、上段側スイッチング素子３１と、第１導電体１とが記載の順に並んで配置されており、第１接合部５１に対する第３方向Ｚに沿った第１導電体１の位置は比較的柔軟である。 Similarly, when there is no flexibility in the distance between the first bonding portion 51 of the output conductor 5 and the first conductor 1, variations in the thickness of the respective conductors in the third direction Z, chip type element Depending on the variation in the thickness of the upper switching element 31 in the third direction Z in the mounted state and the variation in the bonding material in the third direction Z, the first bonding portion 51 of the output conductor 5 and the first conductor 1 may be different from each other. In some cases, the upper switching element 31 is not arranged with an appropriate bonding strength, and electrical connection may be insufficient. However, in the present embodiment, from the third direction first side Z1 toward the third direction second side Z2, the first joint portion 51 of the output conductor 5, the upper stage side switching element 31, and the first conductor. 1 are arranged side by side in the order described, and the position of the first conductor 1 along the third direction Z with respect to the first joint portion 51 is relatively flexible.

一方、上述したように、第２導電体２と第２接合部５２との間の距離は、接続部５３の第３方向Ｚに沿った長さによって定まるから、第２導電体２と第２接合部５２との間の距離は、第１接合部５１と第１導電体１との間の距離に比べて柔軟性が低い。従って、下段側スイッチング素子３２の電気的接続が不充分となる可能性は、上段側スイッチング素子３１の電気的接続が不充分となる可能性に比べて高くなる。 On the other hand, as described above, the distance between the second conductor 2 and the second joint portion 52 is determined by the length of the connecting portion 53 along the third direction Z. The distance between the joint 52 and the first joint 51 is less flexible than the distance between the first joint 51 and the first conductor 1. Therefore, the possibility that the electrical connection of the lower-stage switching element 32 will be insufficient is higher than the possibility that the electrical connection of the upper-stage switching element 31 will be insufficient.

このため、本実施形態では、上述したようなばらつきが生じても、下段側スイッチング素子３２の電気的接続が不充分となることを抑制できるように、接続部５３の第３方向Ｚに沿った長さが柔軟性を有するように、出力用導電体５が形成されている。つまり、出力用導電体５は、第１接合部５１及び第２接合部５２が板状部材で構成され、接続部５３が可撓性を有する導電性部材で構成されている。第１接合部５１及び第２接合部５２と、接続部５３とは、別体として形成された後に接合されても良いが、本実施形態では、接続部５３は、第１接合部５１及び第２接合部５２と同じ材質で、第１接合部５１及び第２接合部５２と一体的に形成されている。このように、出力用導電体５が一体的に形成されると、出力用導電体５を比較的高い生産性を有して生産することができる。また、接続部５３が、第１接合部５１及び第２接合部５２と同じ材質で形成されることにより、可撓性を有する接続部５３を設けても、出力用導電体５の電気的特性を損なうことが抑制される。尚、出力用導電体５は、一体成型やプレス加工による打ち抜き、切削等によって一体的に生産することができる。 Therefore, in the present embodiment, even if the above-described variation occurs, the electrical connection of the lower switching element 32 can be prevented from being insufficient, and the connection portion 53 is arranged along the third direction Z. The output conductor 5 is formed so as to have flexibility in length. That is, in the output conductor 5, the first joint portion 51 and the second joint portion 52 are formed of plate-shaped members, and the connection portion 53 is formed of a flexible conductive member. The first joint portion 51 and the second joint portion 52 and the connecting portion 53 may be joined together after being formed as separate bodies, but in the present embodiment, the connecting portion 53 includes the first joint portion 51 and the first joint portion 51. It is made of the same material as the second joint portion 52 and is integrally formed with the first joint portion 51 and the second joint portion 52. Thus, when the output conductor 5 is integrally formed, the output conductor 5 can be produced with relatively high productivity. In addition, since the connecting portion 53 is formed of the same material as the first joining portion 51 and the second joining portion 52, even if the flexible connecting portion 53 is provided, the electrical characteristics of the output conductor 5 are improved. Is suppressed. The output conductor 5 can be integrally manufactured by integral molding, punching by pressing, cutting, or the like.

接続部５３が可撓性を有する場合、第２導電体２と出力用導電体５の第２接合部５２との間の距離を伸縮するように、接続部５３を変形させることができる。さらに、上述したように、モールド部９が形成されると、変形した接続部５３をその状態で維持し易くなる。 When the connecting portion 53 has flexibility, the connecting portion 53 can be deformed so as to expand or contract the distance between the second conductor 2 and the second joint portion 52 of the output conductor 5. Further, as described above, when the mold portion 9 is formed, it becomes easier to maintain the deformed connection portion 53 in that state.

本実施形態では、接続部５３は、第１接合部５１及び第２接合部５２よりも板厚が薄い薄板状の導体で形成されている。つまり、図４に示すように、第１接合部５１の板厚（第１板厚Ｔ１）及び第２接合部５２の板厚（第２板厚Ｔ２）に比べて、接続部５３の板厚（第３板厚Ｔ３）が薄くなるように、接続部５３が形成されている。尚、スイッチング素子組３が接合される第１接合部５１及び第２接合部５２は、スイッチング素子に生じた熱を放熱させるためのヒートシンクとしての機能も有する。このため、導電性よりも熱伝導性を考慮した板厚を有するように形成されている。接続部５３については、ヒートシンクの機能を持たせても良いが、少なくとも導電性を確保すれば良いので、第１板厚Ｔ１及び第２板厚Ｔ２よりも薄い第３板厚Ｔ３で形成することができる。このように接続部５３が導電性を確保すれば良い点については、図６から図１２を参照して後述する他の形態の接続部５３についても同様である。 In the present embodiment, the connecting portion 53 is formed of a thin plate-shaped conductor having a smaller plate thickness than the first joint portion 51 and the second joint portion 52. That is, as shown in FIG. 4, as compared with the plate thickness of the first joint portion 51 (first plate thickness T1) and the plate thickness of the second joint portion 52 (second plate thickness T2), the plate thickness of the connection portion 53 The connection portion 53 is formed so that the (third plate thickness T3) becomes thin. The first joint portion 51 and the second joint portion 52 to which the switching element set 3 is joined also have a function as a heat sink for radiating the heat generated in the switching element. Therefore, it is formed to have a plate thickness that takes thermal conductivity into consideration rather than conductivity. The connection portion 53 may have a function of a heat sink, but at least conductivity should be ensured, so that the connection portion 53 should be formed with a third plate thickness T3 smaller than the first plate thickness T1 and the second plate thickness T2. You can The fact that the connecting portion 53 needs to ensure conductivity in this way is the same for the connecting portions 53 of other forms described later with reference to FIGS. 6 to 12.

本実施形態では、図４に示すように、出力用導電体５の第１接合部５１における上段側スイッチング素子３１に接する面（第１接合部第１面５１ａ）とは反対側の面（第１接合部第２面５１ｂ）と、第２導電体２の下段側スイッチング素子３２に接する面（第２導電体第１面２ａ）とは反対側の面（第２導電体第２面２ｂ）とは、第２平面Ｓ２（基準面ＳＲ）に位置する。第２平面Ｓ２（基準面ＳＲ）には、例えば冷媒が循環する冷却部材２００も配置されている。第１接合部第２面５１ｂと第２導電体第２面２ｂとが、基準面ＳＲに配置されることによって、冷却部材２００によって適切にスイッチング素子ユニット１００を冷却することができる。 In the present embodiment, as shown in FIG. 4, the surface (first bonding portion first surface 51a) opposite to the surface (first bonding portion first surface 51a) of the first bonding portion 51 of the output conductor 5 that contacts the upper-stage switching element 31. 1 junction part second surface 51b) and a surface (second conductor second surface 2b) opposite to the surface (second conductor first surface 2a) in contact with the lower switching element 32 of the second conductor 2 And are located on the second plane S2 (reference plane SR). On the second plane S2 (reference plane SR), for example, the cooling member 200 in which the coolant circulates is also arranged. By disposing the first joint second surface 51b and the second conductor second surface 2b on the reference plane SR, the cooling member 200 can appropriately cool the switching element unit 100.

上述したように、接続部５３が、第１接合部５１及び第２接合部５２よりも板厚が薄い薄板状の導体で形成されることにより、接続部５３は可撓性を有することができる。このため、第２接合部５２及び第２導電体２の厚みのばらつき、下段側スイッチング素子３２の厚みのばらつきにより、第２導電体２と第２接合部５２との間の距離が長くなったり、下段側スイッチング素子３２と導電体（５２，２）との間の接合材料の厚みが薄かったりしても、適切な接合強度を有して下段側スイッチング素子３２が配置され、電気的接続を確保することができる。そして、第１接合部第２面５１ｂと第２導電体第２面２ｂとが、基準面ＳＲに接するように配置されることによって、冷却性が良好に確保される。 As described above, since the connecting portion 53 is formed of a thin plate-shaped conductor having a plate thickness smaller than that of the first joint portion 51 and the second joint portion 52, the connecting portion 53 can have flexibility. .. For this reason, the distance between the second conductor 2 and the second joint portion 52 becomes long due to the variation in the thickness of the second joint portion 52 and the second conductor 2 and the variation in the thickness of the lower switching element 32. Even if the thickness of the bonding material between the lower-stage switching element 32 and the conductor (52, 2) is thin, the lower-stage switching element 32 is arranged with an appropriate bonding strength and the electrical connection is made. Can be secured. Then, the first joint second surface 51b and the second conductor second surface 2b are arranged so as to be in contact with the reference surface SR, whereby good cooling performance is ensured.

尚、本実施形態では、図４に示すように、第１接合部第２面５１ｂと第２導電体第２面２ｂとが、基準面ＳＲに配置される形態を例示しているが、出力用導電体５の第２接合部５２における下段側スイッチング素子３２に接する面（第２接合部第１面５２ａ）とは反対側の面（第２接合部第２面５２ｂ）と、第１導電体１の上段側スイッチング素子３１に接する面（第１導電体第１面１ａ）とは反対側の面（第１導電体第２面１ｂ）とが、共に第１平面Ｓ１に配置され、当該第１平面Ｓ１が基準面ＳＲであってもよい。当然ながら、第１平面Ｓ１に冷却部材２００が配置されてもよい。 In the present embodiment, as shown in FIG. 4, the first joint second surface 51b and the second conductor second surface 2b are arranged on the reference plane SR. A surface (second bonding portion second surface 52b) opposite to a surface (second bonding portion first surface 52a) in contact with the lower switching element 32 in the second bonding portion 52 of the use conductor 5; A surface (first conductor first surface 1a) in contact with the upper-stage switching element 31 of the body 1 and a surface (first conductor second surface 1b) on the opposite side are both arranged on the first plane S1. The first plane S1 may be the reference plane SR. Of course, the cooling member 200 may be arranged on the first plane S1.

即ち、出力用導電体５の第１接合部５１における上段側スイッチング素子３１に接する面（第１接合部第１面５１ａ）とは反対側の面（第１接合部第２面５１ｂ）と、第２導電体２の下段側スイッチング素子３２に接する面（第２導電体第１面２ａ）とは反対側の面（第２導電体第２面２ｂ）との組、及び、出力用導電体５の第２接合部５２における下段側スイッチング素子３２に接する面（第２接合部第１面５２ａ）とは反対側の面（第２接合部第２面５２ｂ）と、第１導電体１の上段側スイッチング素子３１に接する面（第１導電体第１面１ａ）とは反対側の面（第１導電体第２面１ｂ）との組、の少なくとも一方の組が、共通の基準面ＳＲに接するように配置されていると好適である。 That is, a surface (first bonding portion second surface 51b) opposite to a surface (first bonding portion first surface 51a) of the first bonding portion 51 of the output conductor 5 which is in contact with the upper switching element 31, A pair of a surface (second conductor first surface 2a) opposite to a surface (second conductor first surface 2a) in contact with the lower switching element 32 of the second conductor 2, and an output conductor. 5 of the second conductor 52 and the surface of the second conductor 52 opposite to the surface (the second joint first surface 52a) in contact with the lower switching element 32, and the second conductor 52 of the first conductor 1. At least one of the set (the first conductor first face 1a) and the face (first conductor second face 1b) opposite to the face in contact with the upper switching element 31 is a common reference plane SR. It is preferable that it is arranged so as to contact with.

上記においては、出力用導電体５が階段状に形成される形態、つまり、接続部５３が第３方向Ｚに沿って真っ直ぐに形成される形態を例示した。しかし、接続部５３は、図６に示すように、第１方向Ｘに対して傾斜するように形成されて、第１方向Ｘにおいて第２接合部５２の側を向く第１接合部５１の第１端面５１ｔと、第１方向Ｘにおいて第１接合部５１の側を向く第２接合部５２の第２端面５２ｔとを接続する形態であってもよい。尚、図２から図４に例示した形態においても、図４に示すように、仮想的な第１端面５１ｔ及び第２端面５２ｔを設定することができる。従って、図２から図４に例示した形態の接続部５３も、第１端面５１ｔと第２端面５２ｔとを接続しているということができる。 In the above description, the form in which the output conductor 5 is formed stepwise, that is, the form in which the connecting portion 53 is formed straight along the third direction Z has been illustrated. However, as shown in FIG. 6, the connection portion 53 is formed so as to be inclined with respect to the first direction X, and the first joint portion 51 of the first joint portion 51 facing the second joint portion 52 side in the first direction X. The 1st end surface 51t and the 2nd end surface 52t of the 2nd junction part 52 which faces the 1st junction part 51 side in the 1st direction X may be connected. It should be noted that, also in the forms illustrated in FIGS. 2 to 4, virtual first end face 51t and second end face 52t can be set as shown in FIG. Therefore, it can be said that the connecting portion 53 having the form illustrated in FIGS. 2 to 4 also connects the first end surface 51t and the second end surface 52t.

また、接続部５３が第３方向Ｚに沿って真っ直ぐに形成される場合においても、図７に例示するように第１端面５１ｔと第２端面５２ｔとを接続するような薄板状の導体によって接続部５３が形成されてもよい。 Even when the connecting portion 53 is formed straight along the third direction Z, connection is made by a thin plate-shaped conductor that connects the first end surface 51t and the second end surface 52t as illustrated in FIG. 7. The part 53 may be formed.

また、図７に示すような薄板状ではなく、図８に示すように、第１端面５１ｔと第２端面５２ｔとを接続するようにメッシュ状に形成された導体によって接続部５３が形成されてもよい。接続部５３がメッシュ状に形成されることにより、薄板状の接続部５３よりも可撓性を高くすることができる。 Further, instead of the thin plate shape as shown in FIG. 7, as shown in FIG. 8, the connecting portion 53 is formed by a conductor formed in a mesh shape so as to connect the first end surface 51t and the second end surface 52t. Good. Since the connecting portion 53 is formed in a mesh shape, the flexibility can be made higher than that of the thin plate connecting portion 53.

また、接続部５３は、図９に示すように、第１端面５１ｔと第２端面５２ｔとを接続するように並列配置された複数本の導体線によって形成されてもよい。この場合も、複数本の導体線によって形成された接続部５３は、薄板状の接続部５３よりも可撓性を高くすることができる。 Further, as shown in FIG. 9, the connection portion 53 may be formed by a plurality of conductor wires arranged in parallel so as to connect the first end surface 51t and the second end surface 52t. In this case as well, the connection portion 53 formed by the plurality of conductor wires can have higher flexibility than the thin plate-shaped connection portion 53.

また、接続部５３は、第１端面５１ｔと第２端面５２ｔとを接続する形態に限らず、図１０に示すように、第１接合部第１面５１ａと第２接合部第２面５２ｂとを接続するボンディングワイヤー等によって形成されてもよい。 Further, the connecting portion 53 is not limited to the mode in which the first end surface 51t and the second end surface 52t are connected to each other, and as shown in FIG. 10, a first joint portion first surface 51a and a second joint portion second surface 52b. It may be formed by a bonding wire or the like for connecting

また、図９には、複数本の導体線が１列に並列配置された形態の接続部５３を例示したが、導体線は、図１１に示すように、複数列（ここでは２列）に並列配置された形態であってもよい。また、接続部５３がボンディングワイヤーによって形成される場合においても、図１０に例示したように、１列に並列配置された形態ではなく、図１２に示すように、複数列（ここでは２列）に並列配置された形態であってもよい。 Further, FIG. 9 exemplifies the connection portion 53 in which a plurality of conductor wires are arranged in parallel in one row, but the conductor wires are arranged in a plurality of rows (here, two rows) as shown in FIG. 11. It may be arranged in parallel. Further, even when the connecting portions 53 are formed by the bonding wires, they are not arranged in parallel in one row as illustrated in FIG. 10, but a plurality of rows (here, two rows) as shown in FIG. May be arranged in parallel with each other.

〔その他の実施形態〕
以下、その他の実施形態について説明する。尚、以下に説明する各実施形態の構成は、それぞれ単独で適用されるものに限られず、矛盾が生じない限り、他の実施形態の構成と組み合わせて適用することも可能である。 [Other Embodiments]
Hereinafter, other embodiments will be described. The configurations of the respective embodiments described below are not limited to being applied individually, and may be applied in combination with the configurations of other embodiments as long as no contradiction occurs.

（１）上記においては、図１から図５を参照して、スイッチング素子ユニット１００が、スイッチング素子組３を複数備え、複数のスイッチング素子組３のそれぞれに対応するように複数の出力用導電体５を備える形態を例示して説明した。しかし、スイッチング素子ユニット１００は、１つのスイッチング素子組３と、１つの出力用導電体５とを備える形態であってもよい。 (1) In the above description, referring to FIGS. 1 to 5, the switching element unit 100 includes a plurality of switching element groups 3 and a plurality of output conductors corresponding to the plurality of switching element groups 3. 5 has been described as an example. However, the switching element unit 100 may be configured to include one switching element set 3 and one output conductor 5.

（２）上記においては、交流機器として回転電機８を例示して説明した。しかし、交流機器は、変圧器や照明機器等であってもよい。 (2) In the above description, the rotary electric machine 8 has been described as an example of the AC device. However, the AC device may be a transformer, a lighting device, or the like.

〔実施形態の概要〕
以下、上記において説明したスイッチング素子ユニット（１００）の概要について簡単に説明する。 [Outline of Embodiment]
The outline of the switching element unit (100) described above will be briefly described below.

１つの態様として、スイッチング素子ユニット（１００）は、インバータ回路（３０）を構成するためのスイッチング素子組（３）と、直流電源（６）の正極（Ｐ）及び負極（Ｎ）の一方に接続される第１導電体（１）と、前記直流電源（６）の正極（Ｐ）及び負極（Ｎ）の他方に接続される第２導電体（２）と、交流機器（８）に接続される出力用導電体（５）と、を備え、前記スイッチング素子組（３）は、前記第１導電体（１）及び前記出力用導電体（５）に接続される第１スイッチング素子（３１）と、前記第２導電体（２）及び前記出力用導電体（５）に接続される第２スイッチング素子（３２）と、を含み、前記第１スイッチング素子（３１）と前記第２スイッチング素子（３２）とは、第１方向（Ｘ）に並んで配置され、前記出力用導電体（５）は、前記第１スイッチング素子（３１）における前記第１導電体（１）に接する面とは反対側の面に接する第１接合部（５１）と、前記第２スイッチング素子（３２）における前記第２導電体（２）に接する面とは反対側の面に接する第２接合部（５２）と、前記第１接合部（５１）と前記第２接合部（５２）とを接続する接続部（５３）とを有して、前記第１方向（Ｘ）に沿って配置され、前記第１接合部（５１）及び前記第２接合部（５２）は、板状部材で構成され、前記接続部（５３）は、可撓性を有する導電性部材で構成されている。 As one aspect, the switching element unit (100) is connected to a switching element set (3) for forming an inverter circuit (30) and one of a positive electrode (P) and a negative electrode (N) of a DC power supply (6). A first electric conductor (1), a second electric conductor (2) connected to the other of the positive electrode (P) and the negative electrode (N) of the DC power supply (6), and an AC device (8). And an output conductor (5) for outputting, wherein the switching element set (3) is connected to the first conductor (1) and the output conductor (5). And a second switching element (32) connected to the second conductor (2) and the output conductor (5), the first switching element (31) and the second switching element (32). 32) is arranged side by side in the first direction (X), and the output conductor (5) is opposite to the surface of the first switching element (31) in contact with the first conductor (1). A first joint portion (51) in contact with the side surface, and a second joint portion (52) in contact with the surface of the second switching element (32) opposite to the surface in contact with the second conductor (2). , The first joint portion (51) and the second joint portion (52) are connected to each other and are arranged along the first direction (X). The part (51) and the second joint part (52) are made of a plate-shaped member, and the connection part (53) is made of a flexible conductive member.

第１スイッチング素子（３１）は、第１導電体（１）と、出力用導電体（５）の第１接合部（５１）との間に配置され、第２スイッチング素子（３２）は、第２導電体（２）と、出力用導電体（５）の第２接合部（５２）との間に配置される。第１接合部（５１）と第２接合部（５２）との間には接続部（５３）が位置しているので、第１導電体（１）と第１接合部（５１）との間の距離、及び、第２導電体（２）と第２接合部（５２）との間の距離は、接続部（５３）の長さに依存する。これらの距離が固定的であると、導電体（第１導電体（１）、第２導電体（２）、及び出力用導電体（５））の寸法のばらつき、スイッチング素子（第１スイッチング素子（３１）及び第２スイッチング素子（３２））の寸法のばらつき、導電体とスイッチング素子とを接合する接合材料の量（厚み）のばらつきなどによって、導電体とスイッチング素子とが充分に接合されず、スイッチング素子ユニット（１００）の信頼性が低下する場合がある。しかし、本構成によれば、接続部（５３）が可撓性を有する導電性部材によって構成されるので、接続部（５３）の変形によって、第１導電体（１）と第１接合部（５１）との間の距離、及び、第２導電体（２）と第２接合部（５２）との間の距離の少なくとも一方の距離を変動させることができる。従って、上述したようなばらつきがある場合でも、導電体とスイッチング素子とを適切に接合することができる。つまり、本構成によれば、スイッチング素子ユニット（１００）の各部の寸法のばらつきが大きい場合であっても適切にスイッチング素子と導電体とを接合することができる。 The first switching element (31) is disposed between the first conductor (1) and the first joint portion (51) of the output conductor (5), and the second switching element (32) is The two conductors (2) and the second joint portion (52) of the output conductor (5) are arranged. Since the connecting portion (53) is located between the first joint portion (51) and the second joint portion (52), it is between the first conductor (1) and the first joint portion (51). And the distance between the second conductor (2) and the second joint portion (52) depend on the length of the connection portion (53). If these distances are fixed, variations in dimensions of the conductors (first conductor (1), second conductor (2), and output conductor (5)), switching elements (first switching element). (31) and the second switching element (32)), the conductor and the switching element are not sufficiently joined due to variations in the dimensions and the amount (thickness) of the bonding material that joins the conductor and the switching element. The reliability of the switching element unit (100) may be reduced. However, according to this configuration, since the connecting portion (53) is formed of the conductive member having flexibility, the deformation of the connecting portion (53) causes the first conductor (1) and the first joining portion ( At least one of the distance between the second conductor (2) and the second joint (52) can be varied. Therefore, even if there is such variation as described above, the conductor and the switching element can be appropriately joined. That is, according to this configuration, the switching element and the conductor can be appropriately joined even when the dimensional variation of each part of the switching element unit (100) is large.

ここで、前記出力用導電体（５）の前記第１接合部（５１）における前記第１スイッチング素子（３１）に接する面（５１ａ）とは反対側の面（５１ｂ）と前記第２導電体（２）の前記第２スイッチング素子（３２）に接する面（２ａ）とは反対側の面（２ｂ）との組、及び、前記出力用導電体（５）の前記第２接合部（５２）における前記第２スイッチング素子（３２）に接する面（５２ａ）とは反対側の面（５２ｂ）と前記第１導電体（１）の前記第１スイッチング素子（３１）に接する面（１ａ）とは反対側の面（１ｂ）との組、の少なくとも一方が、共通の基準面（ＳＲ）に接するように配置されていると好適である。 Here, a surface (51b) opposite to a surface (51a) in contact with the first switching element (31) in the first joint portion (51) of the output conductor (5) and the second conductor. A set of (2) a surface (2a) opposite to the surface (2a) in contact with the second switching element (32), and the second joint portion (52) of the output conductor (5). The surface (52b) opposite to the surface (52a) in contact with the second switching element (32) and the surface (1a) in contact with the first switching element (31) of the first conductor (1). At least one of the pair with the opposite surface (1b) is preferably arranged so as to contact the common reference surface (SR).

この構成では、スイッチング素子ユニット（１００）の各部材の基準面（ＳＲ）に直交する方向の位置が基準面（ＳＲ）によって規制されるため、スイッチング素子ユニットの各部の寸法のばらつきを出力用導電体（５）の接続部（５３）の変形により吸収する必要性が高い。よって、上記のような出力用導電体（５）を備えた構成が特に適している。また、基準面（ＳＲ）に例えば冷却装置（９０）等を配置することにより、第１スイッチング素子（３１）の熱を第１接合部（５１）又は第１導電体（１）を介して冷却装置（９０）へ伝達させ、第２スイッチング素子（３２）の熱を第２接合部（５２）又は第２導電体（２）を介して冷却装置（９０）へ伝達させて、両スイッチング素子を適切に冷却することができる。 In this configuration, since the position of each member of the switching element unit (100) in the direction orthogonal to the reference surface (SR) is regulated by the reference surface (SR), the variation in the dimension of each part of the switching element unit is suppressed by the conductive material for output. There is a high need for absorption by deformation of the connecting part (53) of the body (5). Therefore, the configuration including the output conductor (5) as described above is particularly suitable. Further, by disposing a cooling device (90) or the like on the reference surface (SR), the heat of the first switching element (31) is cooled via the first joint part (51) or the first conductor (1). And the heat of the second switching element (32) is transferred to the cooling device (90) via the second joint (52) or the second conductor (2), and both switching elements are transferred. It can be cooled appropriately.

また、前記接続部（５３）は、前記第１接合部（５１）及び前記第２接合部（５２）と同じ材質で、前記第１接合部（５１）及び前記第２接合部（５２）と一体的に形成されていると好適である。 The connection part (53) is made of the same material as the first joint part (51) and the second joint part (52), and is the same as the first joint part (51) and the second joint part (52). It is preferable that they are integrally formed.

出力用導電体５が一体的に形成されると、出力用導電体５を比較的高い生産性を有して生産することができる。また、接合部（５２）が、第１接合部（５１）及び第２接合部（５２）と同じ材質で形成されることにより、可撓性を有する接続部（５３）を設けても、出力用導電体（５）の電気的特性を損なうことが抑制される。 When the output conductor 5 is integrally formed, the output conductor 5 can be produced with relatively high productivity. Further, even if the flexible connecting portion (53) is provided by forming the joint portion (52) with the same material as the first joint portion (51) and the second joint portion (52), the output Impairment of the electrical characteristics of the conductor for use (5) is suppressed.

また、前記接続部（５３）は、前記第１方向（Ｘ）において前記第２接合部（５２）の側を向く前記第１接合部（５１）の第１端面（５１ｔ）と、前記第１方向（Ｘ）において前記第１接合部（５１）の側を向く前記第２接合部（５２）の第２端面（５２ｔ）とを接続していると好適である。 The connection portion (53) has a first end surface (51t) of the first joint portion (51) facing the second joint portion (52) in the first direction (X), and the first joint surface (51t). It is preferable to connect the second end face (52t) of the second joint portion (52) facing the first joint portion (51) side in the direction (X).

この構成によれば、出力用導電体（５）の第１接合部（５１）における第１スイッチング素子（３１）に接する面（５１ａ）とは反対側の面（５１ｂ）、出力用導電体（５）の第２接合部（５２）における第２スイッチング素子（３２）に接する面（５２ａ）とは反対側の面（５２ｂ）に接続部（５３）が配置されることがなく、第１接合部（５１）、第１スイッチング素子（３１）、第１導電体（１）が並ぶ方向（Ｚ）、及び、第２接合部（５２）、第２スイッチング素子（３２）、第２導電体（２）が並ぶ方向（Ｚ）において、スイッチング素子ユニット（１００）の寸法が大きくなることが抑制される。また、第１接合部（５１）における第１スイッチング素子（３１）に接する面（５１ａ）とは反対側の面（５１ｂ）、第２接合部（５２）における第２スイッチング素子（３２）に接する面（５２ａ）とは反対側の面（５２ｂ）に突起を生じさせることがないので、これらの面（５１ｂ，５２ｂ）を例えば冷却部材（９０）等に適切に接触させて、スイッチング素子を冷却し易くなる。また、出力用導電体（５）の第１接合部（５１）における第１スイッチング素子（３１）に接する面（５１ａ）、出力用導電体（５）の第２接合部（５２）における第２スイッチング素子（３２）に接する面（５２ａ）にも、接続部（５３）が配置されることがない。従って、第１スイッチング素子（３１）と第１接合部（５１）とを接合する際、及び第２スイッチング素子（３２）と第２接合部（５２）とを接合する際にも、接続部（５３）が妨げにならないようにでき、スイッチング素子ユニット（１００）の寸法が大きくなることが抑制される。 According to this configuration, the surface (51b) on the side opposite to the surface (51a) in contact with the first switching element (31) in the first joint portion (51) of the output conductor (5), the output conductor ( The connecting portion (53) is not arranged on the surface (52b) opposite to the surface (52a) in contact with the second switching element (32) of the second connecting portion (52) of 5), and the first connecting The part (51), the first switching element (31), the direction (Z) in which the first conductors (1) are lined up, the second joint part (52), the second switching element (32), the second conductor ( In the direction (Z) in which 2) are arranged, the size of the switching element unit (100) is suppressed from increasing. Further, the surface (51b) opposite to the surface (51a) in contact with the first switching element (31) in the first joint portion (51) and the second switching element (32) in the second joint portion (52) are in contact with each other. Since no protrusion is formed on the surface (52b) opposite to the surface (52a), these surfaces (51b, 52b) are appropriately brought into contact with, for example, the cooling member (90) to cool the switching element. Easier to do. In addition, a surface (51a) in contact with the first switching element (31) in the first joint portion (51) of the output conductor (5) and a second surface in the second joint portion (52) of the output conductor (5). The connecting portion (53) is not arranged on the surface (52a) in contact with the switching element (32). Therefore, even when the first switching element (31) and the first joint portion (51) are joined together and when the second switching element (32) and the second joint portion (52) are joined together, the connecting portion ( 53) can be prevented so as to prevent the switching element unit (100) from increasing in size.

前記接続部（５３）は、前記第１接合部（５１）及び前記第２接合部（５２）よりも板厚が薄い薄板状の導体、メッシュ状に形成された導体、及び、並列配置された複数本の導体線、の少なくとも一つを備えている。 The connection part (53) is a thin plate-shaped conductor having a smaller plate thickness than the first joint part (51) and the second joint part (52), a conductor formed in a mesh shape, and arranged in parallel. At least one of a plurality of conductor wires is provided.

接続部５３が薄板状の導体を備えていることにより、可撓性を有した接続部５３を適切に形成することができる。また、接続部５３がメッシュ状に形成された導体を備えていることにより、薄板状の導体よりもさらに可撓性を有した接続部５３を適切に形成することができる。同様に、接続部５３が並列配置された複数本の導体線を備えていることにより、薄板状の導体よりもさらに可撓性を有した接続部５３を適切に形成することができる。 Since the connecting portion 53 includes the thin plate conductor, the flexible connecting portion 53 can be appropriately formed. In addition, since the connecting portion 53 includes the conductor formed in the mesh shape, the connecting portion 53 having more flexibility than the thin plate conductor can be appropriately formed. Similarly, since the connecting portion 53 includes a plurality of conductor wires arranged in parallel, it is possible to appropriately form the connecting portion 53 that is more flexible than the thin plate conductor.

また、スイッチング素子ユニット（１００）は、前記スイッチング素子組（３）を複数備えると共に、複数の前記スイッチング素子組（３）のそれぞれに対応するように複数の前記出力用導電体（５）を備え、複数の前記第１スイッチング素子（３１）が、前記第１方向（Ｘ）に交差する第２方向（Ｙ）に並んで配置され、複数の前記第２スイッチング素子（３２）が、前記第２方向（Ｙ）に並んで配置され、複数の前記出力用導電体（５）が、複数の前記スイッチング素子組（３）の配置に対応して、前記第２方向（Ｙ）に並んで配置され、前記第１導電体（１）及び前記第２導電体（２）のそれぞれが前記第２方向（Ｙ）に沿って配置されていると好適である。 Further, the switching element unit (100) includes a plurality of the switching element groups (3) and a plurality of the output conductors (5) corresponding to the plurality of the switching element groups (3). , A plurality of the first switching elements (31) are arranged side by side in a second direction (Y) intersecting the first direction (X), and a plurality of the second switching elements (32) are arranged in the second direction. Are arranged side by side in the direction (Y), and the plurality of output conductors (5) are arranged side by side in the second direction (Y) corresponding to the arrangement of the plurality of switching element groups (3). It is preferable that each of the first conductor (1) and the second conductor (2) is arranged along the second direction (Y).

交流機器（８）は、単相の交流に限らず、複数相の交流によって駆動される場合がある。本構成によれば、複数相の交流によって駆動される交流機器（８）に接続されるスイッチング素子ユニット（１００）においても、適切に導電体とスイッチング素子とを接合することができる。 The AC device (8) is not limited to single-phase alternating current, and may be driven by multiple-phase alternating current. According to this configuration, even in the switching element unit (100) connected to the AC device (8) driven by AC of a plurality of phases, the conductor and the switching element can be appropriately joined.

１：第１導電体
１ａ：第１導電体第１面（第１導電体の第１スイッチング素子に接する面）
１ｂ：第１導電体第２面（第１スイッチング素子に接する面とは反対側の面）
２：第２導電体
２ａ：第２導電体第１面（第２導電体の第２スイッチング素子に接する面）
２ｂ：第２導電体第２面（第２スイッチング素子に接する面とは反対側の面）
３：スイッチング素子組
５：出力用導電体
６：直流電源
８：回転電機（交流機器）
３０：インバータ回路
３１：上段側スイッチング素子（第１スイッチング素子）
３２：下段側スイッチング素子（第２スイッチング素子）
５１：第１接合部
５１ａ：第１接合部第１面（第１接合部における第１スイッチング素子に接する面）
５１ｂ：第１接合部第２面（第１スイッチング素子に接する面とは反対側の面）
５１ｔ：第１端面
５２：第２接合部
５２ａ：第２接合部第１面（第２接合部における第２スイッチング素子に接する面）
５２ｂ：第２接合部第２面（第２スイッチング素子に接する面とは反対側の面）
５２ｔ：第２端面
５３：接続部
１００：スイッチング素子ユニット
Ｎ：負極
Ｐ：正極
ＳＲ：基準面
Ｔ１：第１板厚（第１接合部の板厚）
Ｔ２：第２板厚（第２接合部の板厚）
Ｔ３：第３板厚（接続部の板厚）
Ｘ：第１方向
Ｙ：第２方向 1: first conductor 1a: first conductor first surface (surface of the first conductor in contact with the first switching element)
1b: first conductor second surface (surface opposite to the surface in contact with the first switching element)
2: Second conductor 2a: Second conductor first surface (surface of second conductor in contact with second switching element)
2b: Second surface of second conductor (surface on the side opposite to the surface in contact with the second switching element)
3 :Switching element group 5 :Output conductor 6 :DC power supply 8 :Rotating electric machine (AC equipment)
30: Inverter circuit 31: Upper side switching element (first switching element)
32: Lower switching element (second switching element)
51: 1st junction part 51a: 1st surface of 1st junction part (surface which contacts the 1st switching element in 1st junction part)
51b: second surface of the first joint portion (surface opposite to the surface in contact with the first switching element)
51t: 1st end surface 52: 2nd joint part 52a: 2nd joint part 1st surface (surface which contacts the 2nd switching element in 2nd joint part)
52b: Second surface of the second joint portion (surface opposite to the surface in contact with the second switching element)
52t: 2nd end surface 53: Connection part 100: Switching element unit N: Negative electrode P: Positive electrode SR: Reference surface T1: 1st board thickness (board thickness of a 1st junction part)
T2: Second plate thickness (plate thickness of the second joint portion)
T3: Third plate thickness (plate thickness of connection part)
X: First direction Y: Second direction

Claims

A switching element set for forming an inverter circuit, a first conductor connected to one of a positive electrode and a negative electrode of a DC power supply, a second conductor connected to the other of the positive electrode and a negative electrode of the DC power supply, and an AC A switching element unit comprising an output conductor connected to a device,
The switching element set includes a first switching element connected to the first conductor and the output conductor, and a second switching element connected to the second conductor and the output conductor. ,
The first switching element and the second switching element are arranged side by side in the first direction,
The output conductor includes a first joint portion that contacts a surface of the first switching element opposite to a surface that contacts the first conductor, and a surface of the second switching element that contacts the second conductor. Has a second joint portion in contact with the opposite surface and a connecting portion that connects the first joint portion and the second joint portion, and is arranged along the first direction,
The first joint portion and the second joint portion are configured by plate members,
The said connection part is a switching element unit comprised by the conductive member which has flexibility.

A pair of a surface of the first conductor of the output conductor opposite to a surface in contact with the first switching element and a surface of the second conductor in contact with the second switching element, and the output At least a set of a surface of the electric conductor opposite to a surface of the second joint portion in contact with the second switching element and a surface of the first electric conductor opposite to a surface in contact with the first switching element. The switching element unit according to claim 1, wherein one of the switching element units is arranged so as to be in contact with a common reference plane.

3. The switching according to claim 1, wherein the connecting portion is made of the same material as the first joint portion and the second joint portion, and is integrally formed with the first joint portion and the second joint portion. Element unit.

The connection portion includes a first end surface of the first joint portion facing the second joint portion side in the first direction and a second end portion of the first joint portion facing the first joint portion side in the first direction. The switching element unit according to any one of claims 1 to 3, which is connected to the second end surface.

The connecting portion is at least one of a thin plate-shaped conductor having a plate thickness thinner than the first joint portion and the second joint portion, a conductor formed in a mesh shape, and a plurality of conductor wires arranged in parallel. The switching element unit according to any one of claims 1 to 4, comprising one.

With a plurality of the switching element groups, a plurality of the output conductors corresponding to each of the plurality of switching element groups,
A plurality of the first switching elements are arranged side by side in a second direction intersecting the first direction,
A plurality of the second switching elements are arranged side by side in the second direction,
A plurality of the output conductors are arranged side by side in the second direction corresponding to the arrangement of the plurality of switching element groups,
The switching element unit according to claim 1, wherein each of the first conductor and the second conductor is arranged along the second direction.