JP2020051965A - Breaking test device and method for recovering fragments - Google Patents

Abstract

To recover fragments of a broken chip.SOLUTION: A breaking test device for chips comprises: a chip breakdown unit capable of breaking a chip; and a fragment recovery unit provided below the chip breakdown unit and having a fragment retention surface for retaining fragments of the chip broken by the chip breakdown unit on its front face. The chip breakdown unit breaks the chip so that the original point of breakdown of the broken chip faces the fragment retention surface of the fragment recovery unit. The fragment retention surface of the fragment recovery unit may be along a horizontal plane. The chip breakdown unit includes: a first chip support part having a first face along the vertical direction; and a second chip support part having a second face along the vertical direction facing the first face, and may include a chip pinching unit capable of pinching a chip which is curved in the U shape, and a movement unit for relatively moving the first chip support part and the second chip support part in a direction approaching each other.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a destructive test apparatus used for analyzing a property of a chip by breaking the chip and a method for collecting broken pieces of the chip.

  A chip on which a device is mounted is formed by dividing a wafer made of a semiconductor material or the like. First, a plurality of divided lines that intersect each other are set on the surface of the wafer, and devices such as an IC (Integrated Circuit) and an LSI (Large-Scale Integrated circuit) are formed in each of the regions defined by the divided lines. . Then, when the wafer is divided along the dividing lines, individual chips having devices are formed.

  In recent years, there has been a remarkable tendency to reduce the size of electronic devices or the like on which the formed chip is mounted, and the need for a reduction in the size and thickness of the chip itself has increased. Therefore, in order to form a thin chip, the wafer may be thinned by grinding the back surface side of the wafer before dividing the wafer.

  By the way, if a large impact is applied to the formed chip, the chip may be damaged such as cracks or cracks, and the function of the device may be lost. For example, when the formed chip has low bending strength, the chip tends to be easily damaged.

  The die strength of the chip, for example, the shape of the irregularities formed on the back side by grinding performed when thinning the wafer, the thickness of the thinned wafer, the chip of the chip when the wafer is divided It varies depending on the state of chipping or crack formation on the outer peripheral edge. Further, the bending strength of the chip changes depending on the shape of the device pattern, the material of members constituting the device, and the like.

  Therefore, in order to manufacture chips having high bending strength, a wafer is processed under various processing conditions to produce chips, and the bending strength of various prototype chips is evaluated. Then, based on the result of the evaluation, a more preferable wafer processing condition is selected. As a method of evaluating the bending strength of a chip, for example, there is a three-point bending method defined by SEMI (Semiconductor Equipment and Materials International) standard G86-0303.

  In the three-point bending method, when measuring the bending strength of a plate-shaped measurement object, two columnar supports are tilted and arranged in parallel with each other, and the measurement object is placed on a side surface of the support. Place without fixing to the support. Then, a cylindrical indenter is arranged above the object to be measured between the two supports and parallel to the two supports. Then, the measurement object is pressed from above by the indenter and broken, and the load applied to the measurement object at that time is evaluated as the bending strength of the measurement object (see Patent Document 1).

  Furthermore, it is advantageous to derive the processing conditions for manufacturing a chip having a high transverse rupture strength and being difficult to break if the manner in which the chip is broken and the process and mechanism of the progress of the break are clear. Numerous analyzes have been made on the process of chip destruction by the three-point bending method, and the mechanism has been clarified.

JP 2014-222714 A

  In recent years, extremely thin chips having a thickness of 30 μm or less have been manufactured. If an attempt is made to measure the bending strength of this extremely thin chip by a three-point bending method, even if the chip is pressed with an indenter during the measurement, the chip will only bend and cannot be destroyed. Therefore, the bending strength of the chip cannot be measured. Therefore, development of a method that can break even an extremely thin chip is desired. If an extremely thin chip can be broken by a specific method, the strength of the chip can be evaluated.

  When a chip is broken by a method other than the three-point bending method, a process in which the chip breaks in the method is analyzed in order to derive processing conditions for manufacturing a chip having high bending strength and hard to break. It is desired. In order to analyze the process and mechanism in which the destruction of the chip proceeds, it is conceivable to collect pieces of the chip broken by the method and analyze the size and shape of each piece. In particular, if each piece can be collected in such a manner that the state of dispersion of each piece can be grasped, it becomes advantageous when analyzing the process and mechanism in which the destruction of the chip proceeds.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a destruction test apparatus and a debris collection method capable of collecting broken chips.

  According to one embodiment of the present invention, a chip breaking unit capable of breaking a chip and a fragment holding surface disposed below the chip breaking unit and holding a chip broken by the chip breaking unit are provided on the surface. And a debris recovery unit, wherein the chip destruction unit destroys the chip such that a destruction origin of the destructed chip faces the debris holding surface of the debris recovery unit. Provided.

  Preferably, the fragment holding surface of the fragment collection unit is along a horizontal plane.

  Preferably, the chip breaking unit has a first chip support portion having a first surface along a vertical direction, and a second surface along a vertical direction facing the first surface. A chip holding unit that can hold a chip curved in a U-shape, the first chip support, and the second chip support that are close to each other. A moving unit that relatively moves in the direction of the movement.

  Further, preferably, a plurality of pressure-sensitive adhesive sheets are laminated on the fragment holding surface of the fragment recovery unit, and the plurality of pressure-sensitive adhesive sheets are individually peelable.

  According to another aspect of the present invention, there is provided a fragment recovery method for recovering fragments generated by breaking a chip, the method comprising preparing a fragment recovery unit having a fragment holding surface on a surface. A breaking step for breaking the chip above the fragment collecting unit, and a collecting step for collecting the fragments by causing the fragments of the chip broken in the breaking step to fall and adhere to the fragment holding surface of the fragment collecting unit. And a method for recovering debris.

  A destruction test apparatus according to one embodiment of the present invention includes a fragment recovery unit below a chip destruction unit that destroys a chip. The debris collection unit has on its surface a debris holding surface that holds debris of the chip destroyed by the chip destruction unit. When a chip is destroyed using the destruction test apparatus, the chip is first loaded into the chip destruction unit, and the chip is destroyed by the chip destruction unit.

  The fragments generated from the chips broken by the chip breaking unit fall downward, are dispersed on the fragment holding surface of the fragment recovery unit, and are held by the fragment recovery unit. According to the destruction test apparatus and the debris collection method according to one embodiment of the present invention, since each debris of the destructed chip can be collected, the size and shape of each debris can be observed by observing each debris before the destruction of the chip. Of the chip in the chip can be obtained. This information is useful for analyzing the process of breaking the chip.

  In addition, when the chip is broken and falls downward, each fragment is dispersed to reflect the breaking process. In the destructive test device and the fragment collection method according to one embodiment of the present invention, since the relative positional relationship of each fragment is stored on the fragment holding surface, the dispersion state of each fragment held on the fragment holding surface is determined. Can also be analyzed. Therefore, it is possible to analyze the process and mechanism of breaking the chip in more detail.

  Therefore, according to one embodiment of the present invention, there is provided a destruction test apparatus and a debris collection method capable of collecting destructed chip debris.

FIG. 1A is a perspective view schematically illustrating a chip, and FIG. 1B is a perspective view schematically illustrating a U-shaped curved chip. It is a perspective view which shows a chip destruction test apparatus typically. It is a perspective view which shows typically the chip clamped by the chip clamping unit of the chip destruction test apparatus. FIG. 4A is a side view schematically showing how the moving unit is operated to increase the degree of bending of the chip, and FIG. 4B is a schematic view showing the state when the chip is broken. It is a side view. FIG. 5 (A) is a top view schematically showing a fragment collection unit that has collected chip fragments, and FIG. 5 (B) is a fragment where the remaining portion of the broken chip is adhered to the fragment holding surface. It is a top view which shows a collection unit typically. FIG. 6A is a top view schematically illustrating an example of a fragment recovery unit and a chip, and FIG. 6B is a cross-sectional view schematically illustrating an example of a fragment recovery unit and a chip. FIG. It is a flowchart which shows the flow of each step of the fragment collection method.

  A destructive test apparatus and a fragment recovery method according to the present embodiment will be described with reference to the drawings. First, a chip destroyed by the destructive test apparatus and the debris collection method according to the present embodiment will be described. FIG. 1A is a perspective view schematically showing the chip 1. The chip 1 is, for example, a chip that is prototyped in the development of a wafer processing method for manufacturing a chip on which a device such as an IC or an LSI is mounted from a semiconductor wafer.

  A plurality of division lines intersecting with each other are set on the surface of the wafer, devices are formed in the respective regions defined by the division lines, and the device is mounted when the wafer is divided along the division lines. Chips can be made. The division of the wafer is performed by, for example, a cutting device having an annular cutting blade or a laser processing device that performs laser processing on the wafer.

  The laser processing apparatus irradiates, for example, a laser beam having a wavelength that has absorptivity to the wafer along the planned dividing line, and forms a dividing groove from the front surface to the back surface of the wafer by ablation processing. Alternatively, the laser processing apparatus focuses, for example, a laser beam having a wavelength that is transparent to the wafer at a predetermined height position on the wafer along the dividing line, and modifies the laser beam through a multiphoton absorption process. Form a layer. When cracks from the modified layer to the front and back surfaces of the wafer are formed, the wafer is divided along the dividing lines.

  The wafer is formed of, for example, a semiconductor material such as Si or SiC. In order to form a thin chip, before dividing the wafer, the back side of the wafer is ground and the wafer is thinned to a predetermined thickness. The grinding of the wafer may be performed in two stages, for example, rough grinding for grinding the wafer from the back surface at a high speed and finish grinding for finishing the back surface of the wafer flat. The wafer is thinned to a thickness of 30 μm or less, for example, by grinding.

  Further, the back side of the wafer may be polished after the grinding so as to be finished more flat. Further, the wafer is formed with a processing groove having a depth not reaching the back surface along the planned dividing line on the front surface by the cutting device or the laser processing device, and then the back surface side is ground by the grinding device to form a bottom portion of the processing groove. May be divided by being removed.

  The bending strength of the chip changes depending on, for example, the unevenness formed on the back surface side by grinding and polishing performed when thinning the wafer, the thickness of the thinned wafer, and the like. That is, the bending strength of the chip changes depending on the processing state on the back surface side of the wafer. Further, the die strength of the chip changes depending on the material, shape, and position of the structure of the device formed on the wafer, and further changes depending on processing conditions when dividing the wafer.

  The chip 1 destroyed by the destructive test apparatus and the debris collection method according to the present embodiment is, for example, an experimentally produced chip for deriving suitable processing conditions for processing the back surface of the wafer. For example, the chip 1 is prototyped in a form suitable for evaluating a change in the bending strength of the chip due to a change in a particular processing condition of interest and analyzing a change in a process in which destruction proceeds.

  For example, there is no need to prototype a chip on which a device is formed, for example, when trying to obtain a processing condition capable of manufacturing a chip having a relatively high bending strength by focusing on a processing condition for processing a back surface side of a wafer. . In this case, it is sufficient to evaluate the bending strength by trial-producing the chip 1 on which no device is formed, and the chip 1 is trial-produced using a wafer having no device formed on the surface. Use of a wafer having no device formed thereon is cost-effective and efficient.

  In the destructive test apparatus and the debris collection method according to the present embodiment, the chip 1 is broken. The chip 1 is formed in a rectangular plate shape, for example, as shown in FIG. The chip 1 is prototyped and destroyed under various processing conditions. The prototype chip 1 is formed to have a width of 8 cm, a length of 1 cm, and a thickness of 30 μm, for example.

  However, the chip 1 is not limited to this. The shape of the chip 1 does not have to be a rectangular plate. Further, the device may not be formed on the surface 1a of the chip 1. Further, the chip 1 does not have to be formed from a wafer formed of a semiconductor material. The chip 1 may be formed from a glass substrate such as borosilicate glass or soda glass, for example. According to the destruction test apparatus and the debris collection method according to the present embodiment, for example, various chips 1 that are not easily broken by the three-point bending method can be broken.

  Next, a destructive test apparatus according to the present embodiment will be described. FIG. 2 is a perspective view schematically showing the destructive test device 2. The destruction test device 2 includes a chip destruction unit 4 that can destroy the chip 1 and a fragment recovery unit 12 disposed below the chip destruction unit 4. The chip breaking unit 4 has a chip holding unit 6 that can hold the chip 1.

  The chip holding unit 6 includes a first chip support 6a having a first surface 8a extending in a vertical direction, a second chip support 6b having a second surface 8b extending in a vertical direction, Having. The first face 8a of the first chip support 6a and the second face 8b of the second chip support 6b are parallel faces facing each other. The first chip support 6a can support one end 3a side of the chip 1 curved in a U-shape, and the second chip support 6b can support the other end 3b side of the chip 1.

  The first surface 8a of the first chip support 6a and the second surface 8b of the second chip support 6b are provided with an elastic member such as a silicone resin, an electrostatic chuck mechanism of the chip 1, and the like. It may be provided. When the elastic member, the electrostatic chucking mechanism, and the like are provided on both chip supporting portions 6a and 6b, slippage of the pinched chip 1 is suppressed, and furthermore, the chip 1 after being broken is attached to both chip supporting portions. 6a and 6b make it easier to continue holding.

  The chip breaking unit 4 has a moving unit 10. The moving unit 10 supports the proximal end (upper end) of each of the first chip support 6a and the second chip support 6b. The moving unit 10 includes, for example, a motive power (not shown) such as a motor, and relatively moves the first chip supporting portion 6a and the second chip supporting portion 6b of the chip holding unit 6 in directions approaching each other. it can.

  The U-shaped curved chip 1 is disposed between the first chip support 6a and the second chip support 6b, and the first chip support 6a and the second chip support 6a are moved by the moving unit 10. When the degree of curvature of the chip 1 is increased by moving the chip supporting portions 6b in directions approaching each other, the chip 1 is eventually broken. In the destructive test device 2 according to one embodiment of the present invention, since the chip 1 can be bent beyond the degree of bending that can be realized by the three-point bending method, the chip 1 that cannot be broken by the three-point bending method can be broken.

  For example, the moving unit 10 and the chip holding unit 6 are configured by industrial robot arms. In this case, for example, a guide rail (not shown) is provided inside the moving unit 10 along the direction in which the first chip support 6a and the second chip support 6b relatively move. Then, the base ends of the first chip support 6a and the second chip support 6b are attached to the guide rail so as to be movable along the guide rail.

  Further, the moving unit 10 includes a gear (not shown) fitted to the rotating shaft of a motor having a rotating shaft (not shown) along a direction perpendicular to the guide rail. In addition, a rack having a shape in which a plurality of teeth are formed on one surface of a flat bar-shaped member on the base end side of the first chip support portion 6a and the base end side of the second chip support portion 6b, respectively. (Not shown) are provided along the guide rail. The gear is sandwiched between the two racks in such a manner that the teeth of each rack mesh with the gear.

  When the gears are rotated by operating the power of the motor or the like, the respective racks move in opposite directions along the guide rails, and the first and second chip support portions 6a and 6b are moved. , Approach each other. However, the configuration of the mobile unit 10 is not limited to this. For example, the rack may be provided on only one of the first chip support 6a and the second chip support 6b, and in this case, the power of the motor or the like is provided by the chip support provided with the rack. Only can move.

  Alternatively, for example, a ball screw (not shown) is arranged inside the moving unit 10 along the direction in which the first chip support 6a and the second chip support 6b approach each other. A nut (not shown) provided on one base end of the first chip support 6a and the second chip support 6b is screwed to the ball screw. When the ball screw is rotated by a motor or the like, the nut moves, and the first chip support 6a and the second chip support 6b move in directions approaching each other.

  For example, the chip breaking unit 4 sets the distance between the first surface 8a of the first chip supporting portion 6a and the second surface 8b of the second chip supporting portion 6b on the side surface of the housing of the moving unit 10. It may have the scale shown. The motive power constituted by a motor or the like refers to the first chip support with reference to the scale so that the distance between the first chip support 6a and the second chip support 6b is a predetermined distance. The part 6a and the second chip supporting part 6b may be relatively moved.

  The fragment recovery unit 12 is disposed, for example, a predetermined distance below the chip destruction unit 4 and has a flat base 14 along a horizontal plane, and an adhesive sheet 16 disposed on an upper surface of the base 14. Is provided. The debris collection unit 12 and the chip breaking unit 4 may be supported by a support member while maintaining the predetermined distance. The upper surface of the adhesive sheet 16 has an adhesive property, and serves as a fragment holding surface 18 for holding the fragments of the chip 1. When the chip 1 is destroyed by the chip breaking unit 4, the fragments of the chip 1 fall and reach the fragment holding surface 18 of the fragment collecting unit 12, and the fragments are held on the fragment holding surface 18.

  When the chip 1 is broken, a fracture origin 1c (see FIG. 4B) is generated outside the curved portion of the chip 1, and fragments are dispersed from the fracture origin 1c. When the chip 1 is held by the chip holding unit 6, the destruction starting point 1 c is made to face the fragment holding surface 18 in order to appropriately collect each piece.

  The fragments generated when the chip 1 is destroyed by the chip breaking unit 4 are dispersed on the fragment holding surface 18 of the fragment recovery unit 12. At this time, the shape and size of each piece, the state of dispersion, and the like change depending on the structure of the chip 1 and the method of breaking the chip 1.

  Therefore, if the method of breaking the chip 1 by the chip breaking unit 4 is fixed, reproducibility to the extent that the size and shape of the generated fragments cannot be ignored is apparent. In particular, when the chip breaking unit 4 and the fragment collecting unit 12 are separated from each other so as to have a predetermined distance, and the chip 1 is held by the chip holding unit 6 at a predetermined position, the chip 1 adheres to the chip holding surface 18. The reproducibility of non-negligible degree also appears in the relative position of each fragment.

  After the chip 1 is broken, not only the size and shape of each piece but also the relative position of each piece on the piece holding surface 18 is analyzed to obtain information on which part of the chip 1 each piece originated from. can get. When the information is obtained, the processing conditions of the wafer for forming the chip 1 having high bending strength can be examined in more detail.

  Since the fragment recovery unit 12 can collect each fragment while maintaining the relative positional relationship of each fragment, the dispersion state of each fragment can be stored. When the pressure-sensitive adhesive sheet 16 is peeled off from the base 14 after the fragments are dispersed on the fragment holding surface 18, each fragment can be transported while preserving the state of dispersion of each fragment. For this reason, by transporting the pressure-sensitive adhesive sheet 16 to which the pieces are adhered to a place where various analyzes can be appropriately performed, more accurate analysis can be performed.

  Further, a plurality of pressure-sensitive adhesive sheets 16 may be stacked on the upper surface of the base 14, and the plurality of pressure-sensitive adhesive sheets 16 may be individually peelable. In this case, when the uppermost adhesive sheet 16 to which the fragments of the chip 1 broken by the chip breaking unit 4 are adhered is peeled off, the next adhesive sheet 16 is exposed upward. Preparation becomes easy.

  Note that the destructive test device 2 may include a detection unit that detects that the chip 1 has been destroyed. For example, the detection unit is connected to the power of a motor or the like of the moving unit 10 and monitors the torque output from the motor. As the curvature of the chip 1 increases, the repulsive force of the chip 1 received by the first chip supporting portion 6a and the second chip supporting portion 6b increases, so that the repelling force of the chip 1 is suppressed and the chip 1 is further curved. Then, the torque output by the motor increases.

  If the chip 1 is not able to withstand the bending and is damaged, the repulsive force generated by the chip 1 is rapidly reduced, and the torque output by the motor is rapidly reduced. Therefore, by monitoring the change in the torque output by the motor, it is possible to detect the destruction of the chip 1.

  However, the detection unit is not limited to this, and the destruction of the chip 1 may be detected by another method. For example, the destructive test device 2 may include a vibration sensor as the detection unit. In this case, the detection unit can detect the destruction of the chip 1 by observing the vibration transmitted to the destruction test device 2 with the destruction of the chip 1 by the vibration sensor.

  Further, the detection unit may be a camera unit disposed between the first chip support 6a and the second chip support 6b. In this case, the curved portion of the chip 1 may be photographed by the camera unit, and the destruction of the chip 1 may be detected by the image photographed by the camera unit. Further, the destructive test device 2 does not need to include the detection unit, and the user of the destructive test device 2 may visually detect the destruction of the chip 1.

  If the destruction of the chip 1 can be detected by the detection unit, the destruction of the chip 1 occurs due to the distance between the first chip supporting portion 6a and the second chip supporting portion 6b when the destruction of the chip 1 occurs. Information about the degree of curvature of the chip 1 when the chip 1 is bent is obtained. Then, the bending strength of the chip 1 can be evaluated from the information. When the bending strength of the chip 1 can be evaluated, the relationship between the manufacturing method of the chip 1 and the bending strength of the chip 1 can be obtained, which is advantageous in deriving a manufacturing method of the chip 1 having a high bending strength. It is.

  Next, a debris collection method according to the present embodiment for collecting debris generated by breaking the chip 1 will be described. The destruction and recovery method is performed, for example, by the destruction test device 2 shown in FIG. FIG. 7 is a flowchart showing the flow of each step of the debris collection method. Hereinafter, each step of the fragment collection method will be described in detail.

  In the debris collection method according to the present embodiment, first, a debris collection unit preparation step S1 for preparing a debris collection unit 12 having a debris holding surface 18 on the surface is performed. In the fragment recovery unit preparation step S1, for example, the adhesive sheet 16 is disposed on the base 14 of the destructive test apparatus 2. Then, the chip 1 is prepared to be broken by the chip breaking unit 4 above the fragment collecting unit 12.

  After the fragment collection unit preparation step S1, a chip holding step S2 of holding the chip 1 by the chip holding unit 6 of the chip breaking unit 4 may be performed. In the chip holding step S2, the chip holding unit 6 is operated by the moving unit 10, and the first chip supporting portion 6a and the second chip supporting portion 6b are relatively moved to the initial positions separated from each other by a predetermined distance. Hereinafter, a case will be described as an example where only the first chip support 6a is moved and the second chip support 6b is fixed.

  After that, as shown in FIG. 1B, the chip 1 is bent between the first chip supporting portion 6a and the second chip supporting portion 6b of the chip holding unit 6 in a state where the chip 1 is curved in a U-shape. Insert. FIG. 3A schematically shows the chip 1 held by the chip holding unit 6.

  Note that when the chip 1 is later broken and the fragments are dispersed, the position at which the chips 1 are clamped is always constant so that the influence of the position at which the chips 1 are clamped on the distribution of the fragments is substantially constant. It is desirable to be a position. When a plurality of chips 1 are destroyed, each piece is collected, and the dispersion state is analyzed, and when the position where the chips 1 are sandwiched is constant, the process of breaking each chip 1 is analyzed. Therefore, it is easy to exclude the influence on the dispersion state due to the difference in the position.

  As will be described later, when the first chip supporting portion 6a and the second chip supporting portion 6b are brought closer to each other to increase the degree of curvature of the chip 1, the chip 1 is deformed, and the first surface 8a and the second The area of the back surface 1b of the chip 1 that contacts the second surface 8b increases. Along with this, the curved portion of the chip 1 separates from the housing of the moving unit 10.

  Therefore, in the chip holding step S2, when breaking the chip 1 by increasing the degree of curvature of the chip 1, the chip 1 is positioned at a position where the chip 1 does not come off from the region between the chip support portions 6a and 6b. Preferably, even if the chip 1 is not broken and the two chip supporting portions 6a and 6b approach each other without limit, the curved portion of the chip 1 fits in the area between the two chip supporting portions 6a and 6b. Is pinched.

  Next, in the debris collection method according to the present embodiment, a destruction step S3 of breaking the chip 1 above the debris collection unit 12 is performed. In the breaking step S3, the moving unit 10 is operated to relatively move the first chip support 6a and the second chip support 6b in directions approaching each other. FIG. 4A is a side view schematically showing a state in which the first chip supporting portion 6a is moved from the initial position 6c to approach the second chip supporting portion 6b.

  When the first chip supporting portion 6a is brought closer to the second chip supporting portion 6b, the chip 1 is more strongly bent, and eventually the chip 1 is broken without enduring the bending. FIG. 4B is a side view schematically showing a state in which a curved portion of the chip 1 is broken and fragments 1d are scattered from a breaking start point 1c of the chip 1.

  In the fragment collecting method according to the present embodiment, next, a collecting step of collecting the fragments by causing the fragments of the chip 1 broken in the breaking step S3 to fall and adhere to the fragment holding surface 18 of the fragment collecting unit 12 Perform S4. As shown in FIG. 4B, when the chip 1 is broken, the fragments 1d of the chip 1 generated from the fracture starting point 1c are dispersed on the fragment holding surface 18 of the fragment collection unit.

  FIG. 5A is a top view schematically showing the fragment recovery unit 12 in which fragments 1d of the chip 1 are dispersed on the fragment holding surface 18. FIG. The fragment holding surface 18 is, for example, an adhesive surface of the adhesive sheet 16, and the fragments 1 d dispersed on the fragment holding surface 18 are attached to the adhesive sheet 16.

  The distribution state of each fragment 1d on the fragment holding surface 18 changes depending on the position on the chip 1 before the chip 1 is broken and the breaking process of the chip 1. Therefore, analyzing the relative position of each fragment 1 d on the fragment holding surface 18 is advantageous for obtaining information on the destruction process of the chip 1. For example, when the adhesive sheet 16 to which the pieces 1d are adhered is peeled from the base 14 of the piece collection unit 12, the pieces 1d can be transported while maintaining the relative positional relationship of the pieces 1d. The fragment 1d can be transported to a place suitable for the analysis.

  Further, in the collecting step S4, the fragment holding surface 18 has one end 3a of the chip 1 supported by the first chip support 6a and the other end 3b of the chip 1 supported by the second chip support 6b. And may be attached. FIG. 5B is a top view schematically showing the fragment recovery unit 12 to which the one end 3a side and the other end 3b side of the chip 1 are adhered in the vicinity of the location where the fragments 1d are dispersed. . The one end 3a side and the other end 3b side of the chip 1 may be stuck on the fragment holding surface 18 by a manual operation of an operator of the destructive test device 2.

  The shape that reflects the process of breaking the chip 1 remains on the broken surface of the broken chip 1. Therefore, by analyzing the fracture surface of the chip 1, useful information for analyzing the destruction process of the chip 1 can be obtained. When the one end 3a side and the other end 3b side of the chip 1 are attached to the adhesive sheet 16 together with the fragments 1d, the transport, management, and observation of the fragments 1d and the like become easy.

  As described above, according to the debris collection method according to the present embodiment, since each debris 1d can be collected while maintaining the relative positional relationship with each other, the dispersion of each debris 1d held on the debris holding surface 18 can be improved. Can analyze the situation. Therefore, the process of breaking the chip 1 can be analyzed in more detail. If the process of breaking the chip 1 can be analyzed, it is advantageous when deriving a wafer processing method for manufacturing the chip 1 having high bending strength and being hardly broken.

  Note that the present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, although the destruction test apparatus 2 and the debris collection method according to one embodiment of the present invention have been described in the case where the chip 1 is broken by the chip destruction unit 4 and the debris 1d is collected by the debris collection unit 12 separated by a predetermined distance, However, one embodiment of the present invention is not limited to this. That is, the fragment recovery unit may be attached to the chip 1, and the fragment holding surface of the fragment recovery unit may be curved.

  6 (A) and 6 (B) show a case where an adhesive tape 16a is adhered to each back surface 1b of the chip 1 on one end 3a side and the other end 3b side as a fragment collection unit 12a. FIG. 6A is a top view schematically illustrating the chip 1 and the fragment recovery unit 12a, and FIG. 6B is a cross-sectional view schematically illustrating the chip 1 and the fragment recovery unit 12a. FIG.

  As shown in FIG. 6B, the adhesive tape 16a, which is the debris collection unit 12a, hangs down between the portions attached to the back surface 1b of the chip 1 according to gravity. The fragment holding surface 18a is curved not along the horizontal plane. When the chip 1 is broken, the chip 1 to which the adhesive tape 16a is attached is curved in a U-shape as shown in FIG. 1 (B), and is carried into, for example, the breaking test apparatus 2 shown in FIG. The chip is held by the chip holding unit 6.

  Then, the one end 3a side and the other end 3b side of the chip 1 are brought closer to each other by the moving unit 10 to increase the degree of bending of the chip 1. When the curved portion is broken without the tip 1 being able to withstand bending, fragments 1d are generated from the breaking starting point. Then, each fragment 1d is dispersed and falls on the fragment holding surface 18a of the fragment collection unit 12a, and adheres to the adhesive tape 16a. At this time, since the adhesive tape 16a is curved, each fragment 1d is spread over a wider area on the fragment holding surface 18a.

  Thereafter, when the adhesive tape 16a is placed on a horizontal surface such as a table or the like, the fragments 1d are distributed while being spread over the entire exposed fragment holding surface 18a. Therefore, it is easy to observe the individual pieces 1d, and information on the size and shape of each piece 1d and information on the position of each piece 1d can be acquired with higher accuracy.

  Moreover, since the one end 3a side and the other end 3b side of the broken chip 1 are adhered to the adhesive tape 16a before the chip 1 is broken, the chip 1 is broken after the chip 1 is broken. The step of attaching one end 3a side and the other end 3b side to the adhesive tape 16a can be omitted. Therefore, analysis of the fracture surface of the chip 1 becomes easy.

  In addition, it is preferable that a region on the back surface 1b of the chip 1 to which the adhesive tape 16a is adhered and a region on the adhesive surface of the adhesive tape 16a to be adhered to the back surface 1b of the chip 1 be predetermined regions. In this case, the area of the adhesive surface of the adhesive tape 16a exposed as the fragment holding surface 18a of the fragment collecting unit 12a and the shape of the adhesive tape 16a are constant.

  When trying to analyze the state of dispersion of fragments by destroying a plurality of chips 1, the adhesive tape 16a is similarly adhered to each chip 1 so that the method of attaching the adhesive tape 16a changes to the state of dispersion of fragments 1d. The influence can be eliminated as much as possible.

  Further, in the above embodiment, the destruction test apparatus 2 includes the chip destruction unit 4 that destructs the chip 1 by a method different from the three-point bending method, and the case where the chip 1 is destructed by a method different from the three-point bending method. Although described, one embodiment of the present invention is not limited to this.

  For a chip 1 that can be broken by the three-point bending method, in order to derive a processing method of a wafer that can manufacture a chip 1 with higher bending strength, in order to analyze the process of breaking the chip 1 in more detail. There is. Therefore, even when the chip 1 is broken by the three-point bending method, there is a case where it is desired to appropriately collect the broken pieces of the chip 1.

  Therefore, the chip breaking unit 4 included in the breaking test apparatus 2 according to one embodiment of the present invention may break the chip 1 by a three-point bending method. Then, in the debris collection method according to one aspect of the present invention, in the breaking step S3, the chip 1 may be broken by a three-point bending method. If each piece 1d generated from the chip 1 broken by the three-point bending method can be collected by the piece collection unit 12, the process of breaking the chip 1 by the three-point bending method can be analyzed in more detail than before.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Reference Signs List 1 chip 1a front surface 1b back surface 1c destruction starting point 1d debris 3a one end 3b other end 2 destruction test device 4 chip destruction unit 6 chip holding unit 6a, 6b chip support unit 6c initial position 8a, 8b surface 10 moving unit 12, 12a debris collection unit 14 Base 16, 16a Adhesive sheet 18, 18a Debris holding surface

Claims (5)

A chip destruction unit that can destroy chips,
A fragment recovery unit disposed below the chip breaking unit and having a fragment holding surface on a surface thereof for holding the chip broken by the chip breaking unit,
A destructive test apparatus, wherein the chip breaking unit breaks the chip such that a breaking start point of the chip to be broken faces the fragment holding surface of the fragment collecting unit.   The destruction test apparatus according to claim 1, wherein the fragment holding surface of the fragment collection unit is along a horizontal plane. The chip breaking unit is
A first chip support having a first surface along the vertical direction; and a second chip support having a second surface along the vertical direction facing the first surface. A chip holding unit capable of holding a chip curved in a U-shape;
The destructive test according to claim 1, further comprising a moving unit configured to relatively move the first chip support and the second chip support in a direction approaching each other. apparatus. A plurality of adhesive sheets are laminated on the fragment holding surface of the fragment collection unit,
The destructive test apparatus according to claim 1, wherein the plurality of pressure-sensitive adhesive sheets are individually peelable. A fragment collection method for collecting fragments generated by destroying a chip,
A fragment collection unit preparing step of preparing a fragment collection unit having a fragment holding surface on the surface,
A destruction step of destroying a chip above the debris collection unit;
A debris collection method, comprising: a debris recovery step in which debris of the chip destroyed in the destruction step falls and adheres to the debris holding surface of the debris collection unit to collect debris.