JP2020048223A - Vibration device and electronic equipment - Google Patents

Abstract

To provide a vibration device that can avoid the contact between an electrode of an electronic element and a joint member of an external member and suppress degradation of fixing strength of the electronic element.SOLUTION: A crystal oscillator 1 has a crystal oscillation piece 10, a thermistor 20 having electrodes 21, 22 at both the ends thereof, and a package base 31 containing the crystal oscillation piece 10 mounted at a first principal face 33 side and the thermistor 20 mounted in a second recess portion 36 provided to a second principal face 35. Electrode terminals 37a to 37d connected to the crystal oscillation piece 10 or the thermistor 20 are provided at four corners on the second principal face 35 side of the package base 31. The thermistor 20 is disposed so that the longitudinal direction intersects to the longitudinal direction of the package base 31. The distance L1 between the electrode terminal 37a (37c) and the electrode terminal 37b (37d) which are provided along the short-length direction of the package base 31 to be adjacent to each other is longer than the length L2 in a direction along which the electrodes 21, 22 of the thermistor 20 are connected to each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vibration device and an electronic device including the vibration device.

Conventionally, as a vibration device, a concave portion is provided on an outer bottom surface of a package accommodating a piezoelectric vibrator (hereinafter, referred to as a piezoelectric vibrating piece), a chip-type electronic component is mounted in the concave portion, and a chip-type electronic component and a piezoelectric 2. Description of the Related Art A piezoelectric device is known in which a vibrating reed and an electrode terminal of a package are electrically connected by a conductive pattern (for example, see Patent Documents 1 and 2).
Further, a piezoelectric oscillator is known in which a resin is filled in a second concave portion corresponding to the concave portion on which an integrated circuit element corresponding to the chip-type electronic component is mounted (for example, see Patent Document 3). ).

JP-A-10-322129 JP-A-11-145768 JP 2008-263564 A

In the piezoelectric devices of Patent Documents 1 and 2, for example, electrode terminals are provided at four corners on the outer bottom surface of the package for mounting on an external member such as a wiring board.
In recent years, vibrating devices typified by the above-described piezoelectric devices and piezoelectric oscillators have been reduced in size and thickness, and their components have been laid out at tight intervals.

For this reason, in the piezoelectric devices of Patent Documents 1 and 2, the electrode terminal and the external member are joined due to a displacement at the time of mounting to the external member. There is a risk of contact with electrodes of components (hereinafter referred to as electronic elements).
Accordingly, in the piezoelectric devices of Patent Documents 1 and 2, there is a possibility that the electronic element and the electrode terminal which is not connected to the electronic element among the electrode terminals may be short-circuited via the joining member.

As a measure to avoid this, for example, a resin is filled in a second concave portion (concave portion) on which an integrated circuit element (hereinafter, referred to as an electronic element) is mounted as in the piezoelectric oscillator of Patent Document 3 described above. A configuration that covers the electronic element and prevents contact between the electronic element and the joining member is conceivable.
However, according to this measure, the performance of the electronic element deteriorates due to the problem that the replacement of the electronic element becomes difficult, and the generation of thermal stress due to a change in ambient temperature caused by a difference in the thermal expansion coefficient between the electronic element and the resin. For example, when the electronic element is a temperature-sensitive element, there is a problem that the sensitivity to a change in ambient temperature is reduced due to a delay in heat conduction caused by the thermal conductivity of the resin.

  Further, in the piezoelectric devices of Patent Documents 1 and 2, since the longitudinal direction of the electronic element is along the longitudinal direction of the package in the embodiment, the fixing strength (bonding strength) of the electronic element is reduced due to the warpage of the package. There is a fear.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A vibration device according to this application example includes a resonator element, an electronic element having a pair of electrodes at both ends, the resonator element mounted on a first main surface side, and an opposite side to the first main surface. The electronic element is accommodated in a concave accommodating portion provided on the second main surface of the second main surface, and the outer shape of the second main surface is rectangular. At each of the corners, an electrode terminal connected to the vibrating reed or the electronic element is provided, and the electronic element is disposed so that a longitudinal direction thereof intersects a longitudinal direction of the container body. A distance between the adjacent electrode terminals provided along the hand direction is longer than a length in a direction connecting the pair of electrodes of the electronic element.

According to this, in the vibration device, a distance between mutually adjacent electrode terminals provided along a short direction (a direction orthogonal to the longitudinal direction) of the container body (corresponding to the main body of the package) is: Since the length is longer than the length in the direction connecting the pair of electrodes of the electronic element, the electrodes of the electronic element due to the displacement of the vibrating device at the time of mounting can be formed without filling the resin like the piezoelectric oscillator of Patent Document 3 described above. It is possible to avoid contact between the electrode terminal bonding surface (land) of the external member and a bonding member such as solder.
As a result, the vibration device can avoid a short circuit between the electronic element and the electrode terminal which is originally not connected to the electronic element among the electrode terminals via the joining member.
In addition, since the vibrating device is arranged so that the longitudinal direction of the electronic element intersects the longitudinal direction of the container, the fixing of the electronic element to the warp (the warp in the longitudinal direction tends to be large) of the container is fixed. A decrease in strength (joining strength) can be suppressed.

  Application Example 2 In the vibrating device according to the application example, three of the four electrode terminals provided at the four corners have the corners on the storage unit side cut in a chamfered shape. Is preferred.

According to this, since the corners of the four electrode terminals on the storage part side of the three electrode terminals are cut into a chamfered shape, the distance from the electrode of the electronic element to the electrode terminal is further increased. can do.
In addition, since the corners of one of the four electrode terminals are not cut, the vibration device can identify a reference electrode terminal at the time of mounting or the like.

  Application Example 3 In the vibration device according to the application example, the first main surface side is hermetically sealed with a metal lid covering the resonator element, and the two electrodes connected to the electronic element. One of the terminals is preferably electrically connected to the lid.

  According to this, the vibrating device is hermetically sealed by the metal lid covering the first main surface side with the vibrating piece, and one of the two electrode terminals connected to the electronic element is electrically connected to the lid. As a result, the shielding property can be improved.

  Application Example 4 In the vibration device according to the application example described above, it is preferable that the electrode terminal electrically connected to the lid be a ground terminal.

  According to this, in the vibration device, since the electrode terminal electrically connected to the lid is a ground terminal (synonymous with the GND terminal), the shielding property can be further improved.

  Application Example 5 In the vibration device according to the above application example, it is preferable that the electronic element is a thermistor.

  According to this, since the electronic element of the vibration device is a thermistor, the temperature of the vibration piece can be accurately detected by the thermistor stored in the container body on which the vibration piece is mounted.

  Application Example 6 An electronic apparatus according to this application example includes the vibration device according to any one of the above application examples.

  According to this, since the electronic device of the present configuration includes the vibration device according to any of the above-described application examples, it is possible to provide an electronic device that has the effects described in any of the above-described application examples.

  Application Example 7 In the electronic apparatus according to the application example, it is preferable that the electronic device include an oscillation circuit that drives the resonator element and a temperature compensation circuit that corrects a frequency change due to a temperature change of the resonator element.

  According to this, the electronic device of the present configuration includes the oscillation circuit that drives the resonator element and the temperature compensation circuit that corrects the frequency variation due to the temperature change of the resonator element. The temperature can be compensated, and an electronic device having excellent temperature characteristics can be provided.

It is a schematic diagram which shows the schematic structure of the crystal resonator of 1st Embodiment, (a) is the top view seen from the lid (lid) side, (b) is the AA line of (a). It is sectional drawing, (c) is a top view seen from the bottom surface side. It is a schematic diagram which shows the schematic structure of the crystal resonator of the modification 1, (a) is the top view seen from the lid side, (b) is sectional drawing in the AA line of (a), (C) is a plan view seen from the bottom side. It is a schematic diagram which shows the schematic structure of the crystal resonator of the modification 2, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA line of (a), (C) is a plan view seen from the bottom side. FIG. 9 is a schematic perspective view showing a mobile phone according to a second embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1st Embodiment)
First, a crystal resonator as an example of the vibration device will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. FIG. 1A is a plan view seen from a lid (lid) side, and FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. Is a plan view seen from the bottom surface side. In FIG. 1A, the lid is omitted. Also, for simplicity, the dimensional ratio of each component is different from the actual one.

  As shown in FIG. 1, the crystal resonator 1 includes a crystal resonator element 10 as a resonator element, a thermistor 20 functioning as a temperature sensor (thermosensitive element) as an electronic element, the crystal resonator element 10 and the thermistor 20. And a package 30 as a container in which is mounted (stored).

The quartz vibrating reed 10 is, for example, an AT cut type cut out from a rough quartz crystal at a predetermined angle, has a substantially rectangular planar shape, and includes a vibrating unit 11 and a vibrating unit 11 for exciting thickness shear vibration. It has a connected base 12 integrally.
The quartz-crystal vibrating reed 10 has base electrodes 12 formed on extraction electrodes 15 a, 16 a drawn from substantially rectangular excitation electrodes 15, 16 formed on one main surface 13 and the other main surface 14 of the vibrating part 11. I have.
The extraction electrode 15a is drawn out from the excitation electrode 15 on one main surface 13 to the base 12 along the longitudinal direction of the quartz-crystal vibrating piece 10 (the left-right direction on the paper surface), and is connected to the other main surface 14 along the side surface of the base 12. It wraps around and extends to the vicinity of the excitation electrode 16 on the other main surface 14.
The extraction electrode 16a is drawn out from the excitation electrode 16 on the other main surface 14 to the base 12 along the longitudinal direction of the quartz-crystal vibrating reed 10 and wraps around the one main surface 13 along the side surface of the base 12. The surface 13 extends to the vicinity of the excitation electrode 15.
The excitation electrodes 15 and 16 and the extraction electrodes 15a and 16a are, for example, metal coatings having a structure in which Cr is used as a base layer and Au is stacked thereon.

The thermistor 20 is, for example, a chip-type (rectangular parallelepiped) temperature-sensitive element (temperature-sensitive resistance element), and has a pair of electrodes 21 and 22 at both ends in the longitudinal direction. It is a resistor with a large change.
As the thermistor 20, for example, a thermistor called an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with an increase in temperature is used. NTC thermistors are often used as temperature sensors because the change in resistance value is proportional to the change in temperature.
The thermistor 20 is housed in the package 30 and functions as a temperature sensor to detect a temperature in the vicinity of the quartz-crystal vibrating piece 10, thereby contributing to correction of a frequency change caused by a temperature change of the quartz-crystal vibrating piece 10.

The package 30 has a package base 31 as a substantially flat container body having a substantially rectangular planar shape and a lid 32 as a flat lid covering one side of the package base 31, and has a substantially rectangular parallelepiped shape. It is configured.
The package base 31 is made of an aluminum oxide sintered body formed by laminating and firing ceramic green sheets, quartz, glass, silicon (high-resistance silicon), or the like.
The lid 32 is made of the same material as the package base 31, or a metal such as Kovar, 42 alloy, or stainless steel.

A first concave surface 34 on which the quartz-crystal vibrating piece 10 is mounted is provided on a first main surface 33 which is a main surface on one side of the package base 31, and a first concave surface 34 on the other side opposite to the first main surface 33 is provided. A certain second main surface 35 is provided with a second concave portion 36 as a concave storage portion in which the thermistor 20 is stored.
The first concave portion 34 and the second concave portion 36 have a substantially rectangular planar shape, and are provided at substantially central portions of the first main surface 33 and the second main surface 35, respectively. In the crystal unit 1, the size of the package 30 is reduced by providing the first concave portion 34 and the second concave portion 36 of the package base 31 so as to overlap in a plan view.

Internal terminals 34b and 34c are provided on the bottom surface 34a of the first concave portion 34 of the package base 31 at positions facing the extraction electrodes 15a and 16a of the crystal resonator element 10.
In the quartz-crystal vibrating piece 10, the extraction electrodes 15a and 16a are bonded to the internal terminals 34b and 34c via a conductive adhesive 40 such as an epoxy-based, silicone-based, or polyimide-based mixed with a conductive material such as a metal filler. Have been. Thus, the quartz-crystal vibrating piece 10 is mounted in the first concave portion 34 on the first main surface 33 side.

In the crystal resonator 1, the first concave portion 34 of the package base 31 is covered with the lid 32 in a state where the crystal resonator element 10 is bonded to the internal terminals 34 b and 34 c of the package base 31, and the package base 31 and the lid 32 are connected. The first concave portion 34 of the package base 31 is hermetically sealed by being joined by a joining member 38 such as a seam ring, low-melting glass, or an adhesive.
The inside of the first concave portion 34 of the package base 31 which is hermetically sealed is in a reduced pressure vacuum state (high vacuum degree) or a state filled with an inert gas such as nitrogen, helium, or argon. I have.

On the bottom surface 36a of the second concave portion 36 of the package base 31, electrode pads 36b and 36c are provided at positions facing the electrodes 21 and 22 of the thermistor 20.
In the thermistor 20, the electrodes 21 and 22 are joined to the electrode pads 36b and 36c via a joining member 41 such as solder. Thus, the thermistor 20 is housed in the second recess 36.
Here, the thermistor 20 is arranged so that the longitudinal direction (here, the direction connecting the electrode 21 and the electrode 22) intersects with the longitudinal direction of the package base 31 (horizontal direction on the paper) (here, orthogonal). Are located.

Rectangular electrode terminals 37a, 37b, 37c, 37d are provided at the four corners of the second main surface 35 having a rectangular outer shape of the package base 31, respectively.
Of the four electrode terminals 37a to 37d, for example, two electrode terminals 37b and 37d located at one diagonal are connected to the internal terminals 34b and 34c connected to the extraction electrodes 15a and 16a of the crystal vibrating piece 10, and the other. Are connected to the electrode pads 36b and 36c that are connected to the electrodes 21 and 22 of the thermistor 20.

Here, between the electrode terminals 37a and 37b adjacent to each other (along the electrode terminals 37c and 37d) provided along the short direction (the direction orthogonal to the long direction) of the package base 31. The distance L1 between them is configured to be longer than the length L2 in the direction connecting the pair of electrodes 21 and 22 of the thermistor 20.
Note that the distance L1 is between the outer end of the electrode pad 36b to which the thermistor 20 is joined (the end farther from the electrode pad 36c) and the outer end of the electrode pad 36c (the end farther from the electrode pad 36b). It is more preferably configured to be longer than the distance L3 connecting the end portion (the end portion).

  The internal terminals 34b and 34c, the electrode pads 36b and 36c, and the electrode terminals 37a to 37d are made of, for example, a metal film obtained by laminating a film of Ni, Au, or the like on a metallized layer of W, Mo, or the like by plating.

In the crystal resonator 1, the crystal resonator element 10 is subjected to thickness-shear vibration by a driving signal applied from the outside via the electrode terminals 37b and 37d, the internal terminals 34b and 34c, the extraction electrodes 15a and 16a, and the excitation electrodes 15 and 16. Is excited to resonate (oscillate) at a predetermined frequency.
In the crystal resonator 1, the thermistor 20 detects the temperature in the second concave portion 36 near the crystal resonator element 10 in the package base 31 as a temperature sensor, and outputs a detection signal via the electrode terminals 37a and 37c.

As described above, the crystal resonator 1 of the present embodiment is configured such that the electrode terminal 37a and the electrode terminal 37b (the electrode terminal 37c and the electrode terminal 37d) are provided between the adjacent electrode terminals 37a and 37b provided along the short direction of the package base 31. Is longer than the length L2 in the direction connecting the pair of electrodes 21 and 22 of the thermistor 20, without filling with a resin such as the piezoelectric oscillator of Patent Document 3 described above. In addition, it is possible to avoid contact between the electrodes 21 and 22 of the thermistor 20 due to the displacement of the crystal unit 1 during mounting and a bonding member such as solder on the electrode terminal bonding surface (land) of the external member.
As a result, the crystal unit 1 avoids a short circuit between the thermistor 20 and the electrode terminals 37b and 37d which are originally not connected to the thermistor 20 among the electrode terminals 37a to 37d via the joining member. Can be.

  In addition, since the quartz resonator 1 is arranged so that the longitudinal direction of the thermistor 20 is orthogonal to the longitudinal direction of the package base 31, the longitudinal direction of the thermistor 20 extends along the longitudinal direction of the package base 31. , The fixing strength (bonding strength) of the thermistor 20 to the warpage of the package base 31 (the warpage in the longitudinal direction is likely to be large) can be suppressed.

  Further, since the electronic element of the crystal unit 1 is the thermistor 20, the thermistor 20 is disposed outside the package base 31 by the thermistor 20 housed in the package base 31 on which the crystal resonator element 10 is mounted. In this case, the temperature of the quartz-crystal vibrating piece 10 can be detected more accurately than in the case where it is performed.

The electrode terminal 37c has a conductive via (through hole is filled with a metal or a conductive material) penetrating the package base 31, as shown by a broken line in FIG. 1B or FIG. 3B described later. The electrical connection to the lid 32 by either a conductive electrode) or a conductive film formed in a castellation (concave portion) (not shown) provided at an outer corner of the package base 31 provides a shielding property. It is preferable from the viewpoint of improvement.
In addition, the crystal resonator 1 can further improve the shielding property by grounding the electrode terminal 37c as a ground terminal (GND terminal).

Next, a modified example of the first embodiment will be described.
(Modification 1)
FIG. 2 is a schematic diagram illustrating a schematic configuration of a crystal resonator according to a first modification. 2A is a plan view as viewed from the lid side, FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A, and FIG. It is the top view seen from.
The same parts as those in the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and the description will focus on the parts different from the first embodiment.

As shown in FIG. 2, the crystal resonator 2 of the first modification is different from the first embodiment in the shape of the electrode terminals 37 a to 37 d.
The crystal unit 2 has three electrode terminals 37 a, 37 b, and 37 d among four electrode terminals 37 a to 37 d provided at four corners of the second main surface 35 of the package base 31. Is cut into a chamfer. Here, the corners on the second recess 36 side are not cut in the electrode terminals 37c connected to the electrodes 22 of the thermistor 20.

According to this, in the crystal unit 2, since the corners of the three electrode terminals 37 a, 37 b, and 37 d on the second concave portion 36 side among the four electrode terminals 37 a to 37 d are cut in a chamfered shape, The distance from the electrodes 21, 22 of the thermistor 20 to the electrode terminals 37a, 37b, 37d can be made longer than in the first embodiment.
As a result, since the distance L1 between the electrode terminals 37a to 37d on the side closer to the thermistor 20 is substantially longer than that in the first embodiment, the crystal resonator 2 is displaced by the crystal resonator 1 during mounting. The contact between the electrodes 21 and 22 of the thermistor 20 and the joining members on the joining surfaces of the electrode terminals (37a to 37d) of the external member can be reliably avoided.

In addition, since the corner portion of one of the four electrode terminals 37a to 37d on the side of the second recess 36 is not cut, the crystal resonator 2 has an electrode terminal ( Here, the identification of 37c) becomes possible.
The cut amount of the corners of the electrode terminals 37a, 37b, 37d is appropriately set according to the required fixing strength (joining strength) of the crystal unit 2. The cut of the corners of the electrode terminals 37a, 37b, and 37d can be applied to a modified example 2 described later.

(Modification 2)
FIG. 3 is a schematic diagram illustrating a schematic configuration of a crystal resonator according to a second modification. 3A is a plan view as viewed from the lid side, FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A, and FIG. It is the top view seen from.
The same parts as those in the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and the description will focus on the parts different from the first embodiment.

As shown in FIG. 3, the configuration of the crystal unit 3 of the modification 2 on the first main surface 133 side of the package 130 is different from that of the first embodiment.
In the crystal resonator 3, the first main surface 133 of the package base 131 is formed of a flat surface without a concave portion, and the first main surface 133 is provided with internal terminals 34 b and 34 c for mounting the crystal resonator element 10. .

The crystal resonator 3 is hermetically sealed on the first main surface 133 side of the package base 131 by a lid 132 as a metal lid that covers the crystal resonator element 10. The lid 132 is formed of a metal such as Kovar, 42 alloy, stainless steel, or the like, and is formed in a cap shape having a flange portion 132a provided all around.
In the crystal resonator 3, an internal space in which the crystal resonator element 10 can vibrate is secured by the bulging of the cap portion of the lid 132.
The lid 132 has a flange portion 132a joined to the first main surface 133 of the package base 131 via a conductive joining member 138 such as a seam ring, a brazing material, or a conductive adhesive.
As in the first embodiment, the quartz resonator 3 has a reduced vacuum state (high vacuum degree) or a state filled with an inert gas such as nitrogen, helium, or argon, as in the first embodiment. .

The crystal resonator 3 has an internal structure in which one of the two electrode terminals 37 a and 37 c connected to the thermistor 20 among the four electrode terminals 37 a to 37 d extends from the electrode pad 36 c of the package base 131. It is electrically connected to the lid 132 via a wiring 36e, conductive vias (through holes filled with a conductive member) 131a and 131b, and a conductive bonding member 138.
The electrode terminal 37c is connected to the electrode 22 on the ground side (GND side) of the thermistor 20, and serves as a ground terminal (GND terminal).

As described above, the crystal resonator 3 is hermetically sealed on the first principal surface 133 side by the metal lid 132 covering the crystal resonator element 10, and the two electrode terminals 37 a and 37 c connected to the thermistor 20. Since the one electrode terminal 37c is electrically connected to the lid 132, the shielding property can be improved.
Further, in the crystal unit 3, since the electrode terminal 37c electrically connected to the lid 132 is a ground terminal (GND terminal), the shielding properties can be further improved.
The configuration on the first main surface 133 side of the crystal resonator 3 is applicable to the first modification.

(2nd Embodiment)
Next, a mobile phone will be described as an example of an electronic apparatus including the above-described crystal resonator.
FIG. 4 is a schematic perspective view showing a mobile phone according to the second embodiment.
The mobile phone 700 is a mobile phone including the crystal resonator of the first embodiment and each of the modifications.
The mobile phone 700 shown in FIG. 4 uses the above-described crystal oscillator (any of 1 to 3) as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and a receiver. A mouth 703 and a mouthpiece 704 are provided. The form of the mobile phone is not limited to the type shown in the figure, but may be a so-called smartphone type.

  Vibration devices such as the above-described crystal oscillator (crystal oscillator) are not limited to the above-described mobile phones, but may be electronic books, personal computers, televisions, digital still cameras, video cameras, video recorders, navigation devices, pagers, electronic notebooks, calculators, An electronic device that can be suitably used as a timing device such as a word processor, a workstation, a videophone, a POS terminal, or a device equipped with a touch panel, and that provides the effects described in the above embodiments and modifications in any case. can do.

Note that an electronic device typified by the mobile phone 700 includes an oscillation circuit that drives the crystal resonator element 10 of the crystal resonator (any one of the above-described ones), and corrects a frequency change caused by a temperature change of the crystal resonator element 10. And a temperature compensating circuit.
According to this, the electronic device represented by the mobile phone 700 includes the oscillation circuit that drives the crystal resonator element 10 and the temperature compensation circuit that corrects the frequency fluctuation due to the temperature change of the crystal resonator element 10. In addition, the resonance frequency at which the oscillation circuit oscillates can be temperature compensated, and an electronic device having excellent temperature characteristics can be provided.

Note that the shape of the resonator element is not limited to the flat plate type shown in the figure, and the center portion is thick and the peripheral portion is thin (convex type, bevel type, mesa type). Conversely, the central portion is thin and the peripheral portion is thin. A thick type (inverted mesa type) may be used.
Note that the material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zircon titanate A piezoelectric material such as lead oxide (PZT), zinc oxide (ZnO), aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the thickness shear vibration may be electrostatic driving by Coulomb force in addition to the driving by the piezoelectric effect of the piezoelectric body.

  1, 2, 3: Quartz vibrator as vibrating device, 10: Quartz vibrating piece as vibrating piece, 11: vibrating part, 12: base, 13: one main surface, 14: other main surface, 15, 16 ... Exciting electrodes, 15a, 16a ... Extraction electrodes, 20 ... Thermistor as electronic element, 21,22 ... Electrode, 30 ... Package, 31 ... Package base as container, 32 ... Lid as lid, 33 ... 1 main surface, 34 first concave portion, 34a bottom surface, 34b, 34c internal terminal, 35 second main surface, 36 second concave portion, 36a bottom surface, 36b, 36c electrode pad, 36e internal wiring, 37a, 37b, 37c, 37d: electrode terminal, 38: joining member, 40: conductive adhesive, 41: joining member, 130: package, 131: package base, 131a, 131b: conductive via, 132 Lid, 132a ... flange portion, 133 ... first main surface, 138 ... conductive bonding member, 700 ... mobile phone, 701 ... liquid crystal display device, 702 ... operation button, 703 ... earpiece, 704 ... mouthpiece.

Claims (7)

A resonator element,
An electronic element having a pair of electrodes at both ends,
The resonator element is mounted on the first main surface side, the electronic element is stored in a concave storage portion provided on the second main surface opposite to the first main surface, and the outer shape of the second main surface is And a rectangular container body,
An electrode terminal connected to the vibrating reed or the electronic element is provided at each of the four corners on the second main surface side of the container body,
The electronic element is disposed such that a longitudinal direction intersects a longitudinal direction of the container body,
A vibrating device, wherein a distance between the adjacent electrode terminals provided along a short direction of the container body is longer than a length in a direction connecting the pair of electrodes of the electronic element. .   2. The vibrating device according to claim 1, wherein three of the four electrode terminals provided at the four corners have the corners on the storage unit side cut in a chamfered shape. 3. Vibrating device. 3. The vibration device according to claim 1, wherein the first main surface side is hermetically sealed by a metal lid that covers the vibrating piece. 4.
A vibrating device, wherein one of the two electrode terminals connected to the electronic element is electrically connected to the lid.   The vibration device according to claim 3, wherein the electrode terminal electrically connected to the lid is a ground terminal.   The vibration device according to any one of claims 1 to 4, wherein the electronic element is a thermistor.   An electronic apparatus comprising the vibration device according to claim 1. The electronic device according to claim 6, wherein the oscillation circuit drives the resonator element;
An electronic device, comprising: a temperature compensation circuit that corrects a frequency change due to a temperature change of the resonator element.

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