JP2020012077A - Manufacturing method of substrate with adhesive layer, substrate with adhesive layer and adherend - Google Patents

Abstract

To easily manufacture a substrate with an adhesive layer that enables adhesion to an adherend with simple steps.SOLUTION: A manufacturing method of a substrate with an adhesive layer includes: a step of preparing a substrate (step S101); a step of preparing an adhesive tape having a plurality of adhesive layers intermittently arranged (step S103); and a step of transferring the adhesive layer to the substrate from the adhesive tape (step S106).SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing a substrate with an adhesive layer, a substrate with an adhesive layer, and an adherend of the substrate with an adhesive layer.

  2. Description of the Related Art Conventionally, an adhesive product, an adhesive tape, and the like including an adhesive layer in which dot-shaped adhesives are intermittently arranged, and a base supporting the adhesive layer on the entire surface on which the adhesive layer is laid are known (for example, And Patent Document 1).

JP 2010-174148 A

  However, Patent Document 1 does not disclose a method for producing an adhesive product described in the document or a specific method of using an adhesive product for an adherend, and thus a method for producing the adhesive product or It has been difficult to improve and improve the method of use.

  The method for producing a substrate with an adhesive layer of the present application includes a step of preparing a substrate, a step of preparing an adhesive tape having a plurality of adhesive layers intermittently arranged, and applying the adhesive layer from the adhesive tape to the substrate. Transferring).

  In the above-described method for producing a substrate with an adhesive layer, the adhesive tape preferably has a width of the adhesive layer smaller than an interval between the adjacent adhesive layers in a plan view.

  In the above-mentioned method for producing a substrate with an adhesive layer, it is preferable that the adhesive tape has the adhesive layer provided on a substrate, the adhesive layer is fully cut, and the substrate is half-cut.

  In the above-described method for manufacturing a substrate with an adhesive layer, it is preferable that the adhesive tape has the adhesive layer disposed on a substrate, and the adhesive layer is formed by a discharge method.

  In the above-mentioned method for producing a substrate with an adhesive layer, it is preferable that the adhesive tape has the adhesive layer disposed on a substrate, and the adhesive layer is formed by a printing method.

  The substrate with an adhesive layer of the present application includes a substrate and a plurality of adhesive layers intermittently arranged on the substrate, and in plan view, an outer edge of an area where the plurality of adhesive layers are arranged is the substrate. Are disposed on the inner side than the outer edge.

  In the above-mentioned substrate with an adhesive layer, the distance between the outer edge of the region where the plurality of adhesive layers are provided and the outer edge of the substrate is preferably 0.1 mm or more and 0.5 mm or less.

  An adherend according to the present application includes the substrate with an adhesive layer according to any one of the above, and an attaching portion to which the substrate with an adhesive layer is attached.

The top view which shows the board | substrate with an adhesive layer. The front view which shows the board | substrate with an adhesive layer. FIG. 2 is a plan view showing an arrangement of an adhesive layer, and is a partially enlarged view of a portion Q shown in FIG. 1. 5 is a flowchart showing a procedure of a method for manufacturing a substrate with an adhesive layer. The top view explaining the preparation process of an adhesive tape. The front view explaining the preparation process of an adhesive tape. The front view which shows an example (the division | segmentation method of an adhesive layer) of the preparation process of an adhesive tape. The front view which shows an example (the formation method of an adhesive layer) of the preparation process of an adhesive tape. The front view explaining a sticking process (before sticking). The front view explaining a sticking process. The front view explaining the transfer process of an adhesive layer. The front view explaining the sticking process of the substrate with an adhesion layer to an adherend. The front view explaining the sticking process (before sticking) concerning the modification of the manufacturing method of the substrate with an adhesion layer. The front view explaining the sticking process concerning the modification of the manufacturing method of the substrate with an adhesion layer. The front view explaining the transfer process of the adhesion layer concerning the modification of the manufacturing method of the substrate with an adhesion layer. The perspective view which shows the modification 1 of an adhesive layer. The perspective view which shows the modification 2 of an adhesive layer. The perspective view which shows the modification 3 of an adhesive layer. The top view which shows the example of application of the board | substrate with an adhesive layer. FIG. 1 is a perspective view showing a printing system as an example of an adherend to which a substrate with an adhesive layer is attached. FIG. 1 is a perspective view showing a personal computer as an example of an adherend to which a substrate with an adhesive layer is attached.

  Hereinafter, the present embodiment will be described. The present embodiment described below does not unduly limit the content of the present invention described in the claims. In addition, all of the configurations described in the present embodiment are not necessarily essential components of the invention.

(Embodiment)
1. Configuration of Substrate with Adhesive Layer The configuration of the substrate with an adhesive layer according to an embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3. FIG. FIG. 1 is a plan view showing a substrate with an adhesive layer. FIG. 2 is a front view showing a substrate with an adhesive layer. FIG. 3 is a plan view showing the arrangement of the adhesive layer, and is a partially enlarged view of a portion Q shown in FIG.

  As shown in FIGS. 1 and 2, a substrate 1 with an adhesive layer of the present embodiment includes a substrate 2 serving as a base material, and a plurality of adhesive layers 3 intermittently arranged on the substrate 2. ing. Here, “intermittently arranged” refers to a state in which there is a gap between adjacent adhesive layers 3 and a plurality of adhesive layers 3 are arranged.

  The substrate 2 is a plate made of, for example, stainless steel and has a first surface 2f which is one main surface and a second surface 2r which is a main surface opposite to the first surface 2f. The substrate 2 has a rectangular shape in plan view, and includes two outer edges 2a and 2b facing the long side and two outer edges 2c and 2d facing the short side. The plurality of adhesive layers 3 are intermittently arranged on the first surface 2f of the substrate 2. The substrate 2 has a function as a so-called nameplate that is provided with a display mark (not shown) such as a logo mark or a character string on the second surface 2r and is visible. Further, on the second surface 2r of the substrate 2, a translucent overcoating member made of a transparent resin or the like may be provided as a protection member for the display mark.

  The plurality of adhesive layers 3 are intermittently arranged on the first surface 2f of the substrate 2. The plurality of adhesive layers 3 are arranged in an arrangement area 5 set in the first surface 2 f of the substrate 2. In the drawing, the arrangement area 5 is indicated by a black hatched area surrounded by a two-dot chain line. As shown in FIG. 3, each of the plurality of adhesive layers 3 has a rectangular shape having a side length w1 in a plan view, and a distance w2 between the adhesive layers 3 adjacent to each other. They are arranged with a gap (interval). The plurality of adhesive layers 3 are configured to have, for example, a side length w1 of about 0.5 mm and a thickness of about 50 μm.

  The outer edge of the disposition area 5 where the plurality of adhesive layers 3 are provided is disposed inside the outer edges 2a, 2b, 2c, and 2d of the substrate. Here, as shown in FIG. 3, the inventor has set a distance S between the outer edge of the arrangement region 5 of the plurality of adhesive layers 3 and the outer edges 2a, 2b, 2c, 2d of the substrate 2 to be 0.1 mm or more and 0 mm or more. It has been found that the thickness is preferably not more than 0.5 mm. As described above, by setting the distance S between the outer edge of the arrangement region 5 of the plurality of adhesive layers 3 and the outer edge of the substrate 2 to 0.1 mm or more and 0.5 mm or less, the substrate 1 with the adhesive layer In the case where the substrate 2 is adhered to the substrate 2, the area of the disposition region 5 is ensured so that the adhesive strength of the adhesive layer 3 to an adherend (not shown) is secured, while the outer edges 2 a, 2 b, 2 c, and 2 d of the substrate 2 are separated. The sticking layer 3 can be prevented from protruding.

  In addition, the substrate 1 with the adhesive layer includes a plurality of substrates 2 provided on the first surface 2f of the substrate 2 with the second surface 2r of the substrate 2 provided with the logo mark, the character string, and the like arranged on the front side which is the viewing side. Functions as a so-called nameplate attached to the adherend by the adhesive layer 3 of the above. As described above, in the substrate 1 with the adhesive layer, the outer edge of the arrangement region 5 of the plurality of adhesive layers 3 intermittently disposed is inside the outer edges 2a, 2b, 2c, 2d of the substrate 2. Accordingly, it is possible to prevent the adhesive layer 3 from protruding from the outer edges 2a, 2b, 2c, 2d of the substrate 2. Thereby, the design of the substrate 1 with the adhesive layer can be improved, such as improving the appearance of the adherend when attached to the adherend (not shown).

2. Next, a method for manufacturing the substrate 1 with an adhesive layer will be described with reference to FIGS. 4 and 5 to 11. FIG. 4 is a flowchart illustrating a procedure of a method for manufacturing a substrate with an adhesive layer. 5 to 11 are process diagrams sequentially illustrating the manufacturing process of the substrate with an adhesive layer. Specifically, FIG. 5 is a plan view illustrating a step of preparing an adhesive tape. FIG. 6 is a front view illustrating a step of preparing an adhesive tape. FIG. 7 is a front view showing an example of a step of preparing an adhesive tape (method of dividing an adhesive layer). FIG. 8 is a front view showing an example of a step of preparing an adhesive tape (a method of forming an adhesive layer). FIG. 9 is a front view illustrating the attaching step (before attaching). FIG. 10 is a front view illustrating the attaching step. FIG. 11 is a front view illustrating a step of transferring an adhesive layer.

  Hereinafter, the procedure of the method for manufacturing the substrate 1 with the adhesive layer will be described with reference to the flowchart of FIG. Note that elements constituting the above-described substrate 1 with an adhesive layer will be described using the same reference numerals. The method for manufacturing the substrate 1 with an adhesive layer includes a step of preparing a substrate (Step S101), a step of preparing an adhesive tape (Step S103), a step of attaching an adhesive tape to the substrate (Step S105), Transferring the layer (Step S106). In addition, following the process from step S101 to step S106, a process (step S110) of attaching the manufactured substrate 1 with an adhesive layer to an adherend may be added.

  First, in the step of preparing a substrate (step S101), a logo mark, a character string, and the like are formed on the second surface 2r of the substrate 2 having a rectangular planar shape. Display marks such as a logo mark and a character string can be formed by an inkjet method, a printing method, a transfer method, or the like. Then, the substrate 2 (see FIG. 9) is prepared in which the second surface 2r side is adhered to, for example, a PET (Polyethylene terephthalate) tape 8 as a mount. Here, it is preferable that the PET tape 8 has such a light transmissivity that a display mark such as a logo mark or a character string formed on the second surface 2r of the substrate 2 can be read. Note that the substrate 2 (see FIG. 9) in which the second surface 2r of the substrate 2 formed in a character shape (for example, E or O) is attached to the PET tape 8 can also be prepared.

  Next, in the step of preparing an adhesive tape (step S103), as shown in FIGS. 5 and 6, an adhesive tape 10 having a plurality of adhesive layers 13 arranged on a base 11 is prepared. Each of the adhesive layers 13 has a rectangular shape with a side length w1 in a plan view, and is formed so as to have a gap of a distance w2 which is a distance between the adhesive layers 13 adjacent to each other. . The pressure-sensitive adhesive tape 10 is formed such that the width (length w1) of the pressure-sensitive adhesive layer 13 is smaller than the distance (distance w2) between the adjacent pressure-sensitive adhesive layers 13 in plan view. Specifically, the plurality of adhesive layers 13 are configured to have, for example, w1 of about 0.5 mm and a thickness of about 50 μm.

  Here, the divided adhesive layer 13 of the adhesive tape 10 can be formed by the following method. First, a method 1 for forming the adhesive layer 13 will be described with reference to FIG. In the method 1 for forming the adhesive layer 13, the base 11 on which the adhesive material (adhesive layer) 15 is provided on one surface is prepared. Then, as shown in FIG. 7, the adhesive material 15 is divided by pressing or sliding (push-pull) a blade 17 such as a cutter against the adhesive material 15, and the individual adhesive layers 13 are formed. be able to.

  At this time, the tip of the blade 17 penetrates the adhesive material (adhesive layer) 15 and is pressed so as to reach the middle of the base 11. In other words, the adhesive (adhesive layer) 15 is fully cut, and the substrate 11 supporting the adhesive (adhesive layer) 15 is cut in half. By using such a cutting method, it is possible to easily form a plurality of pressure-sensitive adhesive layers 13 that are reliably divided and intermittently arranged.

  The adhesive layer 13 of the adhesive tape 10 can be formed by, for example, a so-called laser fusing method in which a laser beam is moved while irradiating the adhesive material (adhesive layer) 15 instead of the blade 17 described above. At this time, the laser beam is irradiated so as to reach the middle of the base 11, and the adhesive material (adhesive layer) 15 is full-cut and supports the adhesive material (adhesive layer) 15, as in the case of the blade 17 described above. The base 11 is half-cut.

  Next, a second method of forming the adhesive layer 13 will be described with reference to FIG. In the method 2 for forming the adhesive layer 13, as shown in FIG. 8, a plurality of adhesive materials 19 are ejected onto the substrate 11 of the adhesive tape 10a by using, for example, an inkjet method or a dispensing method. Of the adhesive layer 13a can be formed. FIG. 8 illustrates an ink-jet method, in which an adhesive material 19 is discharged from a nozzle 18 to form an adhesive layer 13 a on the base 11.

  In the step of transferring the adhesive layer to the substrate described later (step S106), the adhesive layers 13 and 13a are transferred to the substrate 2 serving as the base material of the substrate 1 with the adhesive layer, and the adhesive layer 3 of the substrate 1 with the adhesive layer is transferred. Becomes

  In addition, the adhesive layer 13 of the adhesive tape 10 is not limited to the method 1 and the method 2 described above, and is formed by a printing method of printing an adhesive material by screen printing or the like using a print mask, although not shown. Can also. Thus, the adhesive layer 13 intermittently arranged can be easily formed by the printing method.

  Next, in the step of attaching an adhesive tape to the substrate (step S105), as shown in FIG. 9, the first surface 2f of the substrate 2 having the second surface 2r side attached to the PET tape 8 as a mount is attached to the adhesive tape 10 as shown in FIG. The substrate 2 is moved in the direction of arrow 6 in the figure toward the plurality of adhesive layers 13. Then, as shown in FIG. 10, the plurality of adhesive layers 13 of the adhesive tape 10 are brought into contact with the first surface 2 f of the substrate 2, and the plurality of adhesive layers 13 and the first surface 2 f of the substrate 2 are in an adhesive state. Is pressed with a predetermined pressure so that The material of the substrate 11 and the material of the substrate 2 in the adhesive tape 10 are set so that the adhesive strength between the substrate 11 and the adhesive layer 13 is smaller than the adhesive strength between the substrate 2 and the adhesive layer 13. ing.

  Here, the outer edges 2 c and 2 d of the substrate 2 are arranged between the adhesive layers 13 adjacent to each other on the adhesive tape 10. Although not shown, the outer edges 2a and 2b (see FIG. 1) of the substrate 2 are similarly arranged between the adjacent adhesive layers 13 of the adhesive tape 10. Thereby, the adhesive layer 13 on the outer edges 2a, 2b, 2c, 2d of the substrate 2 is eliminated, so that the amount of the adhesive layer 13 (the adhesive layer 3) protruding from the substrate 2 can be reduced.

  Next, in the step of transferring the adhesive layer to the substrate (Step S106), as shown in FIG. 11, the substrate 2 including the PET tape 8 is moved in the direction indicated by the arrow 7 in FIG. Then, the adhesive tape 10 and the substrate 2 which have been in the adhesive state are peeled off. Here, as described above, the material of the base 11 of the adhesive tape 10 is selected so that the adhesive strength between the base 11 and the adhesive layer 13 of the adhesive tape 10 is smaller than the adhesive strength between the substrate 2 and the adhesive layer 13. Further, by setting the material of the substrate 2, the plurality of adhesive layers 13 of the adhesive tape 10 are separated from the base 11 of the adhesive tape 10 while being adhered to the substrate 2 side. That is, the adhesive layer 13 of the adhesive tape 10 is transferred from the adhesive tape 10 to become the plurality of adhesive layers 3 of the substrate 2. By the above procedure, the substrate 1 with the adhesive layer adhered to the PET tape 8 is formed.

  As a next step, as shown in FIG. 12, it is possible to proceed to a step (step S110) of attaching the substrate 1 with the adhesive layer manufactured by the above-described steps S101 to S106 to the adherend. . FIG. 12 is a front view illustrating a step of attaching a substrate with an adhesive layer to an adherend.

  In the step of attaching the substrate 1 with the adhesive layer to the adherend (Step S110), as shown in FIG. 12, the adhesive is formed in the concave portion 52 provided in the adherend 51 of the adherend 50. The substrate 1 with a layer is attached. The substrate with an adhesive layer 1 attached to the PET tape 8 is attached to the adherend 50 by attaching the plurality of adhesive layers 3 attached to the substrate 2 to the bottom of the concave portion 52. Then, the substrate 1 with the adhesive layer is exposed by peeling off the PET tape 8 from the substrate 2 as shown by an arrow 9 in the figure, thereby exposing the second surface 2r of the substrate 2, that is, a display mark such as a logo mark or a character string, It can have a function as a nameplate.

  According to such a method of manufacturing the substrate 1 with the adhesive layer, the adhesive layer 3 is transferred to the substrate 2 from the adhesive tape 10 on which the plurality of adhesive layers 13 are intermittently arranged, so that the adhesive layer 3 is attached to the adherend 50. The substrate 1 with an adhesive layer that can be attached can be easily manufactured by a simple process.

  Further, by transferring the adhesive layer 3 from the adhesive tape 10 on which the plurality of adhesive layers 13 are intermittently arranged to the substrate 2, even if the substrate 2 has an irregular outer shape, The adhesive layer 3 protruding from the outer edge can be reduced, and the substrate 1 with the adhesive layer can be easily manufactured without deteriorating the design property at the time of sticking to the adherend 50.

  Further, by disposing the outer edges 2a, 2b, 2c, 2d of the substrate 2 between the adjacent adhesive layers 13 of the adhesive tape 10, the adhesive from the outer edges 2a, 2b, 2c, 2d of the substrate 2 is formed. The amount of protrusion of the layer 3 can be reduced, and the substrate 1 with an adhesive layer can be easily manufactured without deteriorating the design property at the time of sticking to the adherend 50.

3. Modified Example of Method for Manufacturing Substrate with Adhesive Layer Next, a modified example of the method for manufacturing a substrate with an adhesive layer will be described below with reference to FIGS. 13, 14, and 15. FIG. 13 is a front view illustrating an attaching step (before attaching) according to a modified example of the method for manufacturing a substrate with an adhesive layer. FIG. 14 is a front view illustrating a bonding step according to a modification of the method for manufacturing a substrate with an adhesive layer. FIG. 15 is a front view illustrating a step of transferring an adhesive layer according to a modification of the method for manufacturing a substrate with an adhesive layer. Note that this modified example is different from the method of manufacturing the substrate 1 with an adhesive layer according to the above-described embodiment in that, for example, the pressing plate 21 of the adhesive tape 10 shown in FIG. 13 is used. In the following description, the different steps will be mainly described, and the same steps and configurations as those in the above-described embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  In the present modification, as shown in FIG. 13, the adhesive tape 10 is partially covered with a press plate 21 having an opening surface at a position along the outer edges 2a, 2b, 2c, 2d of the substrate 2 in plan view. ing. That is, the plurality of adhesive layers 13 provided on the adhesive tape 10 partially or entirely overlap with the adhesive layer 13k located inside the opening surface of the pressing plate 21 in plan view. And the adhesive layer 13n arranged as described above. Then, in this modification, the substrate 2 attached to the PET tape 8 as the mount is moved in the direction of the arrow 6 in the figure toward the plurality of adhesive layers 13k of the adhesive tape 10. Note that the opening surface of the holding plate 21 is provided so as to be located slightly outside the outer edges 2a, 2b, 2c, and 2d of the substrate 2. That is, the opening surface of the holding plate 21 can function as a guide wall when the substrate 2 moves.

  The substrate 2 affixed to the PET tape 8 moves along the opening surface of the holding plate 21, and as shown in FIG. 14, the substrate 2 adheres to the plurality of adhesive layers 13 k of the adhesive tape 10 located at the opening surface portion of the holding plate 21. And the substrate 2 are in contact with each other. At this time, the opening surface of the holding plate 21 can function as a guide wall when the substrate 2 moves. Then, the substrate 2 is pressed with a predetermined pressure so that the plurality of adhesive layers 13k and the substrate 2 are in an adhesive state. As in the above-described embodiment, the material of the substrate 11 of the adhesive tape 10 and the material of the substrate 2 are such that the adhesive strength between the substrate 11 of the adhesive tape 10 and the adhesive layer 13k is higher than that of the substrate 2 and the adhesive layer 13k. Each is set so as to be smaller than the adhesive strength.

  Next, as shown in FIG. 15, the substrate 2 including the PET tape 8 is moved in the direction indicated by the arrow 7 in the figure, and the adhesive tape 10 and the substrate 2 that have been in the adhesive state via the plurality of adhesive layers 13k are separated. Peel off. Here, as described above, the material of the base 11 of the adhesive tape 10 is selected so that the adhesive strength between the base 11 of the adhesive tape 10 and the adhesive layer 13k is smaller than the adhesive strength between the substrate 2 and the adhesive layer 13k. Further, by setting the material of the substrate 2, the plurality of adhesive layers 13 k of the adhesive tape 10 are peeled from the base 11 of the adhesive tape 10 while being adhered to the substrate 2 side. That is, the adhesive layer 13 k of the adhesive tape 10 is transferred from the adhesive tape 10 to become the plurality of adhesive layers 3 of the substrate 2. By the above procedure, the substrate 1 with the adhesive layer adhered to the PET tape 8 is formed.

  At this time, the plurality of adhesive layers 13n located on the outer edges 2a, 2b, 2c, and 2d sides of the substrate 2 are not transferred to the substrate 2 because they are pressed by the pressing plate 21. Thus, the holding plate 21 also has a function as a so-called stripper plate. That is, since the adhesive layer 3 is not provided on the outer edge of the substrate 2, the adhesive layer 3 protrudes from the outer edge of the substrate 2 when the substrate 1 with the adhesive layer is attached to an adherend (not shown). Can be prevented. This makes it possible to improve the appearance of the substrate with an adhesive layer 1 when attached to an adherend (not shown), and to improve the design of the adherend.

4. Modified Example of Adhesive Layer In the above-described embodiments and modified examples, the shape of the plurality of adhesive layers 3 has been described as a rectangular shape (square) in plan view. Is not limited to this. Hereinafter, a modified example of the adhesive layer 13 of the adhesive tape 10 that is transferred to the substrate 2 and becomes the adhesive layer 3 will be described with reference to FIGS. 16, 17, and 18. FIG. 16 is a perspective view showing Modification Example 1 of the adhesive layer. FIG. 17 is a perspective view showing Modification Example 2 of the adhesive layer. FIG. 18 is a perspective view showing Modified Example 3 of the adhesive layer.

  As shown in FIG. 16, the pressure-sensitive adhesive layer 13c according to the first modification is formed in a circular shape in plan view, that is, in a columnar shape on the base 11c. The plurality of adhesive layers 13c are provided with a gap between adjacent adhesive layers 13c.

  As shown in FIG. 17, the pressure-sensitive adhesive layer 13d according to Modification 2 is formed in a rhombic shape in plan view, that is, a quadrangular prism shape on the base 11d. The plurality of adhesive layers 13d are arranged with a gap between adjacent adhesive layers 13d.

  As shown in FIG. 18, the pressure-sensitive adhesive layer 13e according to Modification 3 is formed in a trapezoidal shape in a sectional view. The plurality of adhesive layers 13d are arranged with a gap between adjacent adhesive layers 13d. Although FIG. 18 shows a trapezoidal shape in which the cross-sectional area on the top side is small, a trapezoidal shape in which the cross-sectional area on the base 11e side is small may be used.

5. Modifications of Substrate Constituting Adhesive Layer Substrate Further, in the above-described embodiments and modifications, the case where the outer shape of the substrate 2 composing the substrate 1 having the adhesive layer has a rectangular shape in plan view. Although described as an example, the present invention is not limited to this. As shown in FIG. 19, the outer shape of the substrate 2 constituting the substrate 1 with the adhesive layer is, for example, a substrate 22 having an alphabet “E” or a substrate 23 having an alphabet “O”. Can be. FIG. 19 is a plan view showing an application example of the substrate 1 with an adhesive layer.

  Thus, even if it has a complicated outer shape or a curved outer shape, a plurality of adhesive layers 3 (see FIG. 1) can be formed by transfer, and are equivalent to the embodiment and the modified examples. The effect can be achieved. When such substrates 22 and 23 are used, the attachment portion of the adherend (not shown) is provided with a concave portion along the outer shape of the substrates 22 and 23, into which the substrates 22 and 23 are inserted and attached. Is preferred. By doing so, the appearance can be further improved.

6. Printing System as Adherend Next, a printing system as an example of an adherend to which the substrate 1 with an adhesive layer is attached will be described with reference to FIG. FIG. 20 is a perspective view showing a printing system as an example of an adherend to which a substrate with an adhesive layer is attached. In the following description, the side in the direction of gravity may be referred to as “lower side” or “lower side” or “downward”, and the opposite side may be referred to as “upper side” or “upper side” or “upper side”.

  As shown in FIG. 20, a printing system 1000 is a multifunction peripheral having a printing function in addition to an image reading function, and includes a document reading apparatus 100 arranged on an upper side and a printing apparatus 110 arranged on a lower side. Have. That is, the printing system 1000 has a configuration in which the printing device 110 and the document reading device 100 are sequentially stacked.

  The printing device 110 is an ink jet printer that records images such as characters and photographs by discharging ink onto paper. The housing 111 forms an exterior of the printing device 110, and an operation device disposed on the top of the housing 111. The printing apparatus 110 includes a sheet cassette 113 provided from a central portion to a lower portion of the printing device 110. In the following description, the side on which the operation unit 112 is provided may be referred to as the front, the side opposite to the front may be referred to as the back, and the side intersecting the front and the back may be referred to as the side.

  The paper cassettes 113 are arranged in four in the up-down direction, and paper is stored in each of them in a stacked state. Further, on the upper side of the sheet cassette 113 and on the right side of the operation unit 112, there is provided a discharge unit 114 for discharging sheets on which images such as characters and photographs are recorded. That is, the upper and right corners of the printing device 110 are provided with a space for providing the discharge unit 114. For this reason, the lower and right corners of the document reading device 100 are floating from the printing device 110 due to the space for providing the discharge unit 114.

  The document reading apparatus 100 includes a paper feed tray 101 on which a document is set, an ADF (Auto Document Feeder) 200 that transports the document from the paper feed tray 101 along a predetermined transport path, and an image of the document that is transported from the ADF 200. And a discharge tray 102 for discharging a document from which an image has been read. The ADF 200 has a document transport unit 205 that is disposed on the upper surface of the scanner unit 300 and transports a document therein. On the front of the ADF 200, a removable front cover 201 is provided. An openable and closable side cover 231 is provided on the side of the ADF 200.

  In such a printing system 1000, the above-described substrate 1 with an adhesive layer is attached to an attaching portion 117 provided on the front side of a housing 111 forming an exterior of the printing apparatus 110, for example, as a nameplate for displaying a logo mark or the like. Have been. As described above, the substrate 1 with the adhesive layer can prevent the adhesive layer 3 from protruding, function as a nameplate having excellent design, and improve the design of the printing system 1000.

7. Next, a personal computer as an example of an adherend to which the substrate 1 with an adhesive layer is attached will be described with reference to FIG. FIG. 21 is a perspective view showing a personal computer as an example of an adherend to which a substrate with an adhesive layer is attached. Note that the personal computer 1100 illustrated in FIG. 21 is an example of an electronic device.

  In this figure, a personal computer 1100 includes a main body 1104 having a keyboard 1102 and a display unit 1106 having a display (not shown). The display unit 1106 has a hinge structure with respect to the main body 1104. It is supported rotatably through the. In such a personal computer 1100, the above-described substrate 1 with an adhesive layer is attached to the outer surface (adhering portion) 1108 of the display unit 1106 as a nameplate for displaying a logo mark or the like. In addition, the substrate 1 with an adhesive layer may be attached to the outer surface (adhering portion) 1108, or may be attached to the concave portion (not shown) provided on the outer surface 1108 as an attaching portion.

  As described above, the substrate 1 with the adhesive layer attached thereto can prevent the adhesive layer 3 from protruding, function as a nameplate having excellent design, and improve the design of the personal computer 1100. it can.

  As the adherend including the substrate 1 with the adhesive layer, in addition to the printing system 1000 in FIG. 20 and the personal computer 1100 in FIG. 21, for example, an ink jet discharge device (for example, an ink jet printer), a television, a video camera, and a video Tape recorders, car navigation systems, electronic organizers (including those with communication functions), electronic dictionaries, workstations, videophones, TV monitors for security, medical equipment, fish finder, instruments (eg, instruments for vehicles, aircraft, ships) ), Flight simulator, seismometer, inclinometer, robot, drone, etc.

  The substrate 1 with the adhesive layer, the method of manufacturing the substrate 1 with the adhesive layer, the printing system 1000 as an adherend including the substrate 1 with the adhesive layer, and the personal computer 1100 have been described based on the illustrated embodiment. The invention is not limited to this, and the configuration of each unit can be replaced with any configuration having a similar function. Further, other arbitrary components may be added to the present invention.

  Hereinafter, the content derived from the above-described embodiment will be described as each aspect.

  [Aspect 1] The method for producing a substrate with an adhesive layer according to this aspect includes a step of preparing a substrate, a step of preparing an adhesive tape having a plurality of intermittently arranged adhesive layers, and Transferring the adhesive layer to the substrate.

  According to this aspect, by transferring the adhesive layer from the adhesive tape in which the plurality of adhesive layers are intermittently arranged to the substrate, a substrate with an adhesive layer that can be attached to an adherend can be easily formed by a simple process. Can be manufactured.

  Further, by transferring the adhesive layer from the adhesive tape in which a plurality of adhesive layers are intermittently arranged to the substrate, even if the substrate has an irregular outer shape, the adhesive layer protruding from the outer edge of the substrate may be formed. It is possible to reduce the number of the substrates, improve the appearance at the time of sticking to the adherend, and easily manufacture a substrate with an adhesive layer that does not impair the design.

  [Aspect 2] In the method for manufacturing a substrate with an adhesive layer according to the above aspect, the adhesive tape preferably has a width of the adhesive layer smaller than an interval between the adjacent adhesive layers in plan view.

  According to this aspect, by arranging the outer edge of the substrate between the adjacent adhesive layers, the amount of the adhesive layer protruding from the outer edge of the substrate can be reduced. A substrate with an adhesive layer that does not impair the design of the substrate can be easily manufactured.

  [Aspect 3] In the method for producing a substrate with an adhesive layer according to the above aspect, in the adhesive tape, the adhesive layer is provided on a substrate, the adhesive layer is fully cut, and the substrate is half-cut. Is preferred.

  According to this aspect, the pressure-sensitive adhesive layer is full-cut, and the base supporting the pressure-sensitive adhesive layer is half-cut, so that the pressure-sensitive adhesive layer intermittently arranged can be easily formed.

  [Aspect 4] In the method for producing a substrate with an adhesive layer according to the above aspect, the adhesive tape is preferably such that the adhesive layer is provided on a substrate, and the adhesive layer is formed by a discharge method. .

  According to this aspect, the intermittently arranged adhesive layer can be easily formed on the base by a discharging method for discharging the adhesive material, for example, an ink jet method or a dispensing method.

  [Aspect 5] In the method for producing a substrate with an adhesive layer according to the above aspect, it is preferable that the adhesive tape has the adhesive layer disposed on a substrate, and the adhesive layer is formed by a printing method. .

  According to this aspect, by disposing the adhesive material on the base by the printing method, the intermittently arranged adhesive layer can be easily formed.

  [Aspect 6] A substrate with an adhesive layer according to this aspect includes a substrate and a plurality of adhesive layers intermittently arranged on the substrate, and an area where the plurality of adhesive layers are arranged in a plan view. Is disposed inside the outer edge of the substrate.

  According to this aspect, since the outer edge of the area where the plurality of adhesive layers are intermittently arranged is inside the outer edge of the substrate, it is possible to prevent the adhesive layer from protruding from the outer edge of the substrate. Thus, it is possible to provide a substrate with an adhesive layer, which can improve the design at the time of sticking to an adherend.

  [Aspect 7] In the substrate with an adhesive layer according to the above aspect, a distance between an outer edge of an area where the plurality of adhesive layers are provided and an outer edge of the substrate is preferably 0.1 mm or more and 0.5 mm or less. .

  According to this aspect, the distance between the outer edge of the area where the adhesive layer is provided and the outer edge of the substrate is set to 0.1 mm or more and 0.5 mm or less, thereby ensuring the adhesive strength of the adhesive layer and the outer edge of the substrate. The sticking out of the pressure-sensitive adhesive layer can be prevented.

  [Aspect 8] An adherend according to this aspect includes the substrate with an adhesive layer according to any of the above aspects, and an attaching portion to which the substrate with an adhesive layer is attached. I do.

  According to this aspect, by using the above-described substrate with an adhesive layer, it is possible to eliminate the adhesive layer protruding from the substrate with the adhesive layer attached to the attaching portion, and to provide an adherend having excellent design. be able to.

  DESCRIPTION OF SYMBOLS 1 ... board | substrate with an adhesive layer, 2 ... board | substrate, 2a, 2b, 2c, 2d ... outer edge, 2f ... 1st surface, 2r ... 2nd surface, 3 ... adhesive layer, 5 ... area | region of adhesion layer, 6, 7 ... arrow, 8 ... PET tape, 9 ... arrow, 10, 10a ... adhesive tape, 11 ... substrate, 13, 13a ... adhesive layer, 15 ... adhesive material, 17 ... knife, 18 ... nozzle, 19 ... adhesive material, 21 ... Pressing plates, 22, 23: substrate, 1000: printing system, 1100: personal computer, S: distance between substrate and installation area, w1: length of one side of adhesive layer, w2: distance between adhesive layers.

Claims (8)

Preparing a substrate;
A step of preparing an adhesive tape having a plurality of adhesive layers intermittently arranged,
Transferring the adhesive layer from the adhesive tape to the substrate,
A method for producing a substrate with an adhesive layer, comprising: In claim 1,
The pressure-sensitive adhesive tape is a method of manufacturing a substrate with a pressure-sensitive adhesive layer, wherein a width of the pressure-sensitive adhesive layer is smaller than a space between the adjacent pressure-sensitive adhesive layers in plan view. In claim 1 or 2,
The pressure-sensitive adhesive tape, the pressure-sensitive adhesive layer is disposed on a substrate,
A method for producing a substrate with an adhesive layer, wherein the adhesive layer is fully cut and the substrate is half-cut. In claim 1 or 2,
The pressure-sensitive adhesive tape, the pressure-sensitive adhesive layer is disposed on a substrate,
The method for manufacturing a substrate with an adhesive layer, wherein the adhesive layer is formed by a discharge method. In claim 1 or 2,
The pressure-sensitive adhesive tape, the pressure-sensitive adhesive layer is disposed on a substrate,
The method for producing a substrate with an adhesive layer, wherein the adhesive layer is formed by a printing method. Board and
A plurality of adhesive layers intermittently disposed on the substrate,
A substrate with an adhesive layer, wherein an outer edge of a region where the plurality of adhesive layers are provided is disposed inside an outer edge of the substrate in plan view. In claim 6,
A substrate with an adhesive layer, wherein a distance between an outer edge of an area where the plurality of adhesive layers are provided and an outer edge of the substrate is 0.1 mm or more and 0.5 mm or less. A substrate with an adhesive layer according to claim 6 or 7,
Attachment portion on which the substrate with an adhesive layer is attached,
An adherend comprising:

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