JP2019528369A - パルスｄｃ電源 - Google Patents

パルスｄｃ電源 Download PDF

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Publication number
JP2019528369A
JP2019528369A JP2018523526A JP2018523526A JP2019528369A JP 2019528369 A JP2019528369 A JP 2019528369A JP 2018523526 A JP2018523526 A JP 2018523526A JP 2018523526 A JP2018523526 A JP 2018523526A JP 2019528369 A JP2019528369 A JP 2019528369A
Authority
JP
Japan
Prior art keywords
cycle
pulsed
nominal
pulse
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018523526A
Other languages
English (en)
Japanese (ja)
Inventor
ウーヴェ ヘルマンス，
ウーヴェ ヘルマンス，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2019528369A publication Critical patent/JP2019528369A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32944—Arc detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
JP2018523526A 2017-05-10 2017-05-10 パルスｄｃ電源 Pending JP2019528369A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/061190 WO2018206100A1 (en) 2017-05-10 2017-05-10 Pulsed dc power supply

Publications (1)

Publication Number Publication Date
JP2019528369A true JP2019528369A (ja) 2019-10-10

Family

ID=58701624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018523526A Pending JP2019528369A (ja) 2017-05-10 2017-05-10 パルスｄｃ電源

Country Status (5)

Country Link
JP (1) JP2019528369A (zh)
KR (1) KR20180135853A (zh)
CN (1) CN109247032A (zh)
TW (1) TW201909232A (zh)
WO (1) WO2018206100A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022187340A1 (en) * 2021-03-02 2022-09-09 Applied Materials, Inc. Pulsed dc power for deposition of film

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0790573A (ja) * 1993-07-28 1995-04-04 Asahi Glass Co Ltd スパッタリング方法と装置および薄膜の製造方法
JPH08311645A (ja) * 1995-05-19 1996-11-26 Teijin Ltd Ｉｔｏ成膜装置
JP2010031359A (ja) * 2008-07-29 2010-02-12 Sulzer Metaplas Gmbh 大電力パルス化マグネトロンスパッタリング方法および大電力電気エネルギー源
JP2011503362A (ja) * 2007-11-16 2011-01-27 アドバンスト・エナジー・インダストリーズ・インコーポレイテッド 直流を用いるスパッタリング堆積のための方法および装置
JP2011222292A (ja) * 2010-04-09 2011-11-04 Canon Inc プラズマ放電用電源装置および方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69426003T2 (de) * 1993-07-28 2001-05-17 Asahi Glass Co. Ltd., Tokio/Tokyo Verfahren und Vorrichtung zur Kathodenzerstäubung
US9039871B2 (en) * 2007-11-16 2015-05-26 Advanced Energy Industries, Inc. Methods and apparatus for applying periodic voltage using direct current
US9287098B2 (en) * 2012-11-01 2016-03-15 Advanced Energy Industries, Inc. Charge removal from electrodes in unipolar sputtering system
EP2770083B1 (en) * 2013-02-20 2015-11-18 University of West Bohemia in Pilsen High-rate reactive sputtering of dielectric stoichiometric films

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0790573A (ja) * 1993-07-28 1995-04-04 Asahi Glass Co Ltd スパッタリング方法と装置および薄膜の製造方法
JPH08311645A (ja) * 1995-05-19 1996-11-26 Teijin Ltd Ｉｔｏ成膜装置
JP2011503362A (ja) * 2007-11-16 2011-01-27 アドバンスト・エナジー・インダストリーズ・インコーポレイテッド 直流を用いるスパッタリング堆積のための方法および装置
JP2010031359A (ja) * 2008-07-29 2010-02-12 Sulzer Metaplas Gmbh 大電力パルス化マグネトロンスパッタリング方法および大電力電気エネルギー源
JP2011222292A (ja) * 2010-04-09 2011-11-04 Canon Inc プラズマ放電用電源装置および方法

Also Published As

Publication number Publication date
WO2018206100A1 (en) 2018-11-15
CN109247032A (zh) 2019-01-18
KR20180135853A (ko) 2018-12-21
TW201909232A (zh) 2019-03-01

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